CN2603519Y - Image sensor with coating layer - Google Patents

Abstract

An image sensor with a coating layer. In order to provide an image sensor that can fix the flange layer firmly, is convenient to manufacture, avoids glue overflow and improves the quality, the utility model discloses, it includes a substrate, a coating layer, a flange layer, an image sensing chip, a plurality of wires and a euphotic layer; the substrate is provided with an upper surface and a lower surface; a plurality of first contacts protruding from the upper surface are formed on the upper surface, so that a gap is formed between adjacent first contacts, and a plurality of second contacts are formed on the lower surface; the coating layer is coated in the gap between the upper surface of the substrate and the adjacent first contact, so that the upper surface becomes a flat surface; the flange layer is fixed on the coating layer on the upper surface of the substrate and forms a groove with the substrate; the image sensing chip provided with a plurality of welding pads is fixed on the upper surface of the substrate and is positioned in the groove; the plurality of wires are electrically connected between the welding pads of the image sensing chip and the first contacts of the substrate; the transparent layer covering the image sensor chip covers the flange layer.

Description

Image sensor with coating layer

technical field

The utility model belongs to an image sensor, in particular to an image sensor with a coating layer.

Background technique

General sensors can be used to sense the signal of light signal or sound signal. The image sensor is used to receive light signals or image signals. After receiving the light signal, the light signal can be converted into an electrical signal through the image sensor, and transmitted to the circuit board through the substrate.

As shown in FIG. 1 , a conventional image sensor includes a substrate 10 , a flange layer 18 , an image sensing chip 26 , a plurality of wires 28 and a transparent layer 34 .

The substrate 10 has an upper surface 12 forming a first contact 15 and a lower surface 14 forming a second contact 16 .

The flange layer 18 has a first surface 20 and a second surface 22 fixed on the upper surface 12 of the substrate 10 and forming a groove 24 with the substrate 10 .

The image sensor chip 26 is disposed in the groove 24 formed by the substrate 10 and the flange layer 18 , and fixed on the upper surface 12 of the substrate 10 .

The plurality of wires 28 have a first terminal 30 electrically connected to the image sensor chip 26 and a second terminal 32 electrically connected to the first contact 15 of the substrate 10 .

The transparent layer 34 is adhered on the first surface 20 of the flange layer 18 .

As shown in FIG. 2 , the first contact 15 of the substrate 10 protrudes from the upper surface 12 of the substrate 10, thereby causing a gap 29 between adjacent first contacts 15, so that the flange layer 18 is adhered to the substrate 10 with adhesive. When it is applied, if the amount of glue is not controlled properly, it will flow out from the gap, which will cause product pollution. Furthermore, due to the existence of the gap 29 , when the flange layer 18 adheres to the substrate 10 , the structure is unstable and easily damaged.

Contents of the invention

The purpose of the utility model is to provide an image sensor with a coating layer which can fix the flange layer firmly, facilitate manufacture, avoid glue overflow, and improve quality.

The utility model comprises a substrate, a coating layer, a flange layer, an image sensing chip, a plurality of wires and a light-transmitting layer; the substrate is provided with an upper surface and a lower surface; A gap is formed between the adjacent first contacts, and a plurality of second contacts are formed on the lower surface; the coating layer is coated on the upper surface of the substrate in the gap adjacent to the first contacts, so that the upper surface becomes a flat surface; the flange layer is fixed On the coating layer on the upper surface of the substrate, and form a groove with the substrate; the image sensing chip with a plurality of pads is fixed on the upper surface of the substrate and located in the groove; a plurality of wires are electrically connected to the image sensing chip Between the welding pad and the first contact point of the substrate; the light-transmitting layer covering the image sensing chip is covered on the flange layer.

in:

The coating layer is insulating green paint.

The flange layer is fixed on the base plate by means of compression molding.

The light-transmitting layer is light-transmitting glass.

Because the utility model includes a substrate, a coating layer, a flange layer, an image sensing chip, a plurality of wires and a light-transmitting layer; A gap is formed between adjacent first contacts, and a plurality of second contacts are formed on the lower surface; the coating layer is coated on the upper surface of the substrate in the gap adjacent to the first contacts, so that the upper surface becomes a flat surface; the flange layer It is fixed on the coating layer on the upper surface of the substrate and forms a groove with the substrate; the image sensor chip with a plurality of pads is fixed on the upper surface of the substrate and located in the groove; a plurality of wires are electrically connected to the image sensor Between the welding pad of the chip and the first contact point of the substrate; the light-transmitting layer covering the image sensing chip is covered on the flange layer. The upper surface of the substrate is made flat by the coating layer, so that the flange layer can be stably fixed on the substrate, and the situation of overflowing glue can be avoided, making it more practical. Not only can the flange layer be fixed stably, and the manufacture is convenient, but also avoid glue overflow and improve the quality, so as to achieve the purpose of the utility model.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional image sensor structure.

FIG. 2 is a schematic perspective view of a conventional image sensor structure.

Fig. 3 is a schematic perspective view of the structure of the utility model.

Fig. 4 is a schematic perspective view of the structure of the substrate of the present invention.

Detailed ways

As shown in FIGS. 3 and 4 , the present invention includes a substrate 40 , a coating layer 42 , a flange layer 44 , an image sensing chip 46 , a plurality of wires 48 and a transparent layer 50 .

The substrate 40 is provided with upper and lower surfaces 52, 54; the upper surface 52 forms a plurality of first contacts 56 protruding from the upper surface 52, so that gaps are formed between adjacent first contacts 56, and the lower surface 54 forms a plurality of second contacts 58 . The first and second contact points 56, 58 are fixed on the upper and lower surfaces 52, 54 of the substrate 40 by means of coating. Therefore, the adjacent first contact points 56 protrude from the upper surface 52, so that the adjacent first contact points 56 protrude from the upper surface 52, so that the adjacent first contact points A gap 60 is formed between a contact 56 .

The coating layer 42 is insulating green paint, which is coated in the gap 60 adjacent to the first contact 56 on the upper surface 52 of the substrate 40 to make the upper surface 52 a flat surface.

The flange layer 44 is adhered and fixed on the coating layer 42 on the upper surface 52 of the substrate 40 by means of compression molding, and forms a groove 62 with the substrate 40 .

The image sensor chip 46 with a plurality of bonding pads 64 is fixed on the upper surface 52 of the substrate 40 and located in the groove 62 .

The plurality of wires 48 are electrically connected between the pads 64 of the image sensor chip 46 and the first contact 56 of the substrate 40 .

The light-transmitting layer 50 is light-transmitting glass covering the flange layer 44 to cover the image sensing chip 46 so that the image sensing chip 46 can receive light signals through the light-transmitting layer 50 .

In this way, the flange layer 44 can be stably fixed on the base plate 40 , making it more convenient to manufacture, and avoiding glue overflow, making it more practical.

Claims (4)

1, a kind of image sensor with coating layer, it comprises substrate, flange layer, image sensing wafer, plural wires and photic zone; Substrate is provided with upper and lower surface; Form first contact of a plurality of protrusion upper surfaces on the upper surface, make between adjacent first contact and form the gap; Lower surface forms a plurality of second contacts; Flange layer is fixedly arranged on the upper surface of substrate and with substrate and forms groove; The image sensing wafer that is provided with a plurality of weld pads is fixed on the upper surface of base plate and is positioned at groove; Plural wires system is electrically connected between first contact of the weld pad of image sensing wafer and substrate; Using the printing opacity series of strata that cover image sensing wafer is covered on the flange layer; It is characterized in that being coated with in the gap between adjacent first contact of upper surface of described substrate and use the coating layer that makes upper surface become flat surface; The flange series of strata are fixedly arranged on the coating layer of upper surface of base plate.

2, the image sensor with coating layer according to claim 1 is characterized in that described coating layer is the green lacquer of insulation.

3, the image sensor with coating layer according to claim 1 is characterized in that described flange series of strata are fixed on the substrate in the pressing mold mode.

4, the image sensor with coating layer according to claim 1 is characterized in that described photic zone is a transparent glass.

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