CN2612062Y - Image sensor that is immune to side light interference - Google Patents

Abstract

The utility model provides an image sensor ware of preventing side light source interference, for providing an image sensor ware of preventing side light source interference image receiving effect, provides the utility model discloses. It includes a substrate, an image sensing chip and a transparent layer; the substrate is provided with an upper surface on which a plurality of first contacts are formed and a lower surface on which a plurality of second contacts are formed; the image sensing chip is provided with a plurality of welding pads which are arranged on the upper surface of the substrate and are electrically connected to the first connecting points of the substrate; the light transmission layer is in a door shape and consists of a frame body and a cover body covering the frame body, and the frame body is adhered to the upper surface of the substrate; the periphery of the frame body is provided with a protective layer for preventing the interference of the side light source.

Description

Image sensor that is immune to side light interference

technical field

The utility model belongs to an image sensor, in particular to an image sensor capable of preventing side light source interference.

Background technique

General sensors can be used to sense signals that are either light signals or sound signals. The image sensor is used to receive light signals or image signals. After receiving the light signal, the light signal can be converted into an electrical signal through the image sensor, and transmitted to the circuit board through the substrate.

As shown in FIG. 1 , a conventional image sensor includes a substrate 10 , an image sensing chip 20 and a transparent layer 24 .

The substrate 10 has a first surface 12 forming a signal input terminal 16 and a second surface 14 forming a signal output terminal 18 .

The image sensing chip 20 is disposed on the first surface 12 of the substrate 10 and is electrically connected to the substrate 10 .

The transparent layer 24 is adhered on the first surface 12 of the substrate 10 , and a groove 26 is formed in the center thereof, so that the image sensing chip 20 disposed on the substrate 10 is located in the groove 26 of the transparent layer 24 . The image sensing chip 20 can receive light signals through the light-transmitting layer 24 .

However, this type of image sensor has the following disadvantages:

The light-transmitting layer 24 is transparent glass or transparent colloid, so that the light source can enter the groove 26 from all sides, thereby disturbing the image receiving of the image sensing chip 20 .

Contents of the invention

The purpose of the utility model is to provide an image sensor that prevents side light sources from interfering with the image receiving effect.

The utility model includes a substrate, an image sensing chip and a light-transmitting layer; the substrate is provided with an upper surface forming a plurality of first contacts and a lower surface forming a plurality of second contacts; the image sensing chip is provided with a plurality of welding pads, and It is arranged on the upper surface of the substrate and electrically connected to the first contact point of the substrate; the light-transmitting layer is in the shape of a door, and it is composed of a frame body and a cover on the frame body. The frame system is glued to the On the upper surface of the base plate; the peripheral edge of the frame body forms a protective layer to prevent the interference of side light sources.

in:

The image sensing chip is electrically connected to the pad and the first contact point of the substrate through a plurality of wires.

The light-transmitting layer is light-transmitting glass.

The transparent layer is transparent colloid.

The protective layer around the frame body of the light-transmitting layer is formed by atomized rough surface.

Since the utility model includes a substrate, an image sensing chip and a light-transmitting layer; the substrate is provided with an upper surface forming a plurality of first contacts and a lower surface forming a plurality of second contacts; the image sensing chip is provided with a plurality of welding pads, It is arranged on the upper surface of the substrate, and is electrically connected to the first contact point of the substrate; the light-transmitting layer is in the shape of a door, and it is composed of a frame body and a cover on the frame body. On the upper surface of the base plate; a protective layer is formed on the periphery of the frame body to prevent the interference of side light sources. When packaging, a plurality of wires can be bonded on the upper surface of the substrate first, and then when the light-transmitting layer is covered on the substrate, it can facilitate the wire-bonding operation; a protective layer is formed on the periphery of the frame of the light-transmitting layer, It can prevent the side light source from affecting the signal reception of the image sensor chip. It can prevent the side light source from interfering with the image receiving effect, thereby achieving the purpose of the utility model.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional image sensor structure.

Fig. 2 is a schematic sectional view of the structure of the utility model.

Detailed ways

As shown in FIG. 2 , the present invention includes a substrate 30 , an image sensing chip 32 and a transparent layer 34 .

The substrate 30 has an upper surface 36 forming a plurality of first contacts 40 and a lower surface 38 forming a plurality of second contacts 42 .

The image sensing chip 32 is provided with a plurality of welding pads 44, which are arranged on the upper surface 36 of the substrate 30, and electrically connect the welding pads 44 to the first contact 40 of the substrate 30 through a plurality of wires 46, so that the image sensor Signals from the test chip 32 are transmitted to the substrate 30 .

Translucent layer 34 is translucent glass or transparent colloid, and it is the shape of the door character of integral molding, and translucent layer 34 is made of frame body 48 and the cover body 50 that covers on the frame body 48, and frame body 48 is adhesive It is arranged on the upper surface 36 of the substrate 30 to cover the image sensor chip 32, so that the image sensor chip 32 can receive image signals through the cover body 50 of the light-transmitting layer 34, and the periphery of the frame body 48 is thickened with atomization. A protective layer 52 is formed on the surface to prevent interference from side light sources.

As mentioned above, the utility model has the following advantages:

1. A plurality of wires 46 can be bonded on the upper surface 36 of the substrate 30 first, and then the light-transmitting layer 34 is covered on the substrate 30, which facilitates the wire bonding operation.

2. A protective layer 52 is formed on the periphery of the frame body 48 of the transparent layer 34 to prevent side light sources from affecting the signal reception of the image sensing chip 32 .

Claims (5)

1, a kind of image sensor of anti-sidelight source interference, it comprises substrate, image sensing wafer and photic zone; Substrate is provided with upper surface that forms a plurality of first contacts and the lower surface that forms a plurality of second contacts; Image sensing wafer is provided with a plurality of weld pads, and it is to be located on the upper surface of substrate, and is electrically connected on substrate first contact; Photic zone is a door word shape, and it is to be made of frame body and the lid that is covered on the frame body, and the shaped as frame system is glutinous to be located on the upper surface of substrate; It is characterized in that described frame body periphery forms the overcoat in order to prevent that the sidelight source from disturbing.

2, the image sensor of anti-sidelight source interference according to claim 1 is characterized in that described image sensing wafer is electrically connected first contact of weld pad to substrate by plural wires.

3, the image sensor of anti-sidelight source interference according to claim 1 is characterized in that described photic zone is a transparent glass.

4, the image sensor of anti-sidelight source interference according to claim 1 is characterized in that described photic zone is a transparent colloid.

5, the image sensor of anti-sidelight source interference according to claim 1 is characterized in that the protection series of strata of described photic zone frame body periphery form with the atomizing asperities.

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