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CN2465329Y - an image sensor - Google Patents

an image sensor Download PDF

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Publication number
CN2465329Y
CN2465329Y CN01202030U CN01202030U CN2465329Y CN 2465329 Y CN2465329 Y CN 2465329Y CN 01202030 U CN01202030 U CN 01202030U CN 01202030 U CN01202030 U CN 01202030U CN 2465329 Y CN2465329 Y CN 2465329Y
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image sensor
substrate
image
processing unit
signal
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杜修文
陈文铨
何孟南
黄宴程
刘福洲
陈立桓
李武祥
邱咏盛
叶乃华
李文赞
蔡孟儒
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Kingpak Technology Inc
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Kingpak Technology Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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Abstract

An image sensor comprises a substrate connected with a printed circuit board, an integrated circuit arranged on the first surface of the substrate and connected with the signal input end of the substrate, an image sensing chip connected with the signal input end of the substrate and arranged above the integrated circuit to form a stack with the integrated circuit, and a light transmission layer covering the image sensing chip to enable the image sensing chip to receive image signals through the light transmission layer and convert the image signals into electric signals to be transmitted to the substrate, so that the image sensing chip of an image sensing product and the integrated circuit are integrated and stacked.

Description

一种影像感测器an image sensor

本实用新型涉及一种影像感测器，尤指一种用来将具有不同功能的集成电路与影像感测芯片封装在一封装体上，可减少封装基板并将具有各种不同功能的集成电路与影像感测芯片整合封装的影像感测器。The utility model relates to an image sensor, in particular to an integrated circuit with different functions and an image sensing chip packaged on a package body, which can reduce the number of packaging substrates and has various functions. An image sensor integrated with an image sensor chip.

一般用来接收一影像信号的影像感测器，将影像信号转换为电信号传递到印刷电路板上，再与其他集成电路进行连接，使其具有不同的功能。例如，其与数字信号处理器(Digital signal Processor)连接，用以处理影像感测器所产生的信号，或可与微控制器(Micro Controller)或中央处理器(CPU)等连接，而产生不同的功能。The image sensor is generally used to receive an image signal, converts the image signal into an electrical signal and transmits it to the printed circuit board, and then connects with other integrated circuits to make it have different functions. For example, it is connected with a digital signal processor (Digital signal Processor) to process the signal generated by the image sensor, or it can be connected with a microcontroller (Micro Controller) or a central processing unit (CPU) to generate different signals. function.

然而，现有的影像感测器都是单独封装制成的，因此，与其搭配的各种集成电路必须单独封装，再将封装完成的影像感测器及各种信号处理单元连接在印刷电路板上，再由导线将其连接整合使用。由于各信号处理单元与影像感测器分别封装，必须各使用一基板及一封装材料，造成生产成本无法有效地降低，且将各信号处理单元设置在印刷电路板上时，所需印刷电路板的面积较大，而无法达到轻、薄、短小的需求。However, the existing image sensors are all individually packaged. Therefore, the various integrated circuits that match them must be packaged separately, and then the packaged image sensors and various signal processing units are connected to the printed circuit board. , and then connected by wires for integrated use. Since each signal processing unit and image sensor are packaged separately, a substrate and a packaging material must be used respectively, resulting in that the production cost cannot be effectively reduced, and when each signal processing unit is arranged on a printed circuit board, the required printed circuit board The area is relatively large, but it cannot meet the requirements of lightness, thinness, and shortness.

本实用新型的主要目的在于提供一种影像感测器，其具有减少封装构件的功效，使封装成本降低。The main purpose of the present invention is to provide an image sensor, which has the effect of reducing packaging components and reducing the packaging cost.

本实用新型的另一目的在于提供一种影像感测器，其有减化生产过程，使其在制造上更为便利。Another object of the present invention is to provide an image sensor, which can simplify the production process and make it more convenient to manufacture.

本实用新型的又一目的在于提供一种影像感测器，其可降低影像感测产品的面积大小。Another object of the present invention is to provide an image sensor, which can reduce the size of the image sensing product.

本实用新型的再一目的在于提供一种影像感测器，其可降低影像感测产品封装、测试成本。Another object of the present invention is to provide an image sensor, which can reduce packaging and testing costs of image sensing products.

本实用新型的目的是通过如下技术方案来实现的：一种影像感测器，它连接在印刷电路板上，其包括：The purpose of this utility model is achieved through the following technical solutions: a kind of image sensor, it is connected on the printed circuit board, and it comprises:

一设有一第一表面及一第二表面的基板，该第一表面有一信号输入端，该第二表面有一用来与印刷电路板连接的信号输出端；A substrate with a first surface and a second surface, the first surface has a signal input terminal, and the second surface has a signal output terminal for connecting with a printed circuit board;

一设置在基板的第一表面上的集成电路，与基板的信号输入端连接；an integrated circuit disposed on the first surface of the substrate, connected to the signal input end of the substrate;

一连接在基板的信号输入端的影像感测芯片，其设置在信号处理单元上方，与信号处理单元为堆叠形态；An image sensor chip connected to the signal input end of the substrate, which is arranged above the signal processing unit and stacked with the signal processing unit;

一覆盖在影像感测芯片上方的透光层，影像感测芯片是透过该透光层接收影像信号，并将影像信号转换为电信号传递到基板上的。A light-transmitting layer covering the image sensing chip, the image sensing chip receives image signals through the light-transmitting layer, converts the image signals into electrical signals and transmits them to the substrate.

所述的基板的第二表面的信号输出端为用来与印刷电路板连接的球栅阵列金属球；所述的集成电路为信号处理单元；所述的信号处理单元为用来处理影像感测芯片的信号数字信号处理器(Digital Signal Processor)；所述的信号处理单元为微控制器(Micro controller)；所述的信号处理单元为中央处理器(CPU)；所述的透光层为透光玻璃；所述的基板的第一表面周缘有一凸缘层，透光层设置在该凸缘层上；所述的透光层为透明胶体；所述的透光层为ㄇ形的透明胶体，其具有用来将其固定在基板的第一表面上的支撑柱。The signal output end of the second surface of the substrate is a ball grid array metal ball used to connect with the printed circuit board; the integrated circuit is a signal processing unit; the signal processing unit is used to process image sensing The signal digital signal processor (Digital Signal Processor) of chip; Described signal processing unit is microcontroller (Micro controller); Described signal processing unit is central processing unit (CPU); Described transparent layer is transparent Light glass; the first surface periphery of the substrate has a flange layer, and the light-transmitting layer is arranged on the flange layer; the light-transmitting layer is a transparent colloid; the light-transmitting layer is a ㄇ-shaped transparent colloid , which has support posts for securing it on the first surface of the substrate.

由于将影像感测芯片与集成电路整合封装，本实用新型具有如下的优点：Since the image sensor chip and the integrated circuit are integrated and packaged, the utility model has the following advantages:

1、可减少使用基板的材料，可有效降低影像感测产品的制造成本。1. The material used for the substrate can be reduced, which can effectively reduce the manufacturing cost of the image sensing product.

2、可降低影像感测产品面积大小。2. It can reduce the area size of image sensing products.

3、因仅有一封装体，因此测试用具仅需一套，可降低测试成本。3. Because there is only one package, only one set of test tools is needed, which can reduce the test cost.

4、两个芯片仅需一道封装便可制成，可有效降低封装成本。4. Two chips can be manufactured with only one package, which can effectively reduce the package cost.

下面结合附图对本实用新型作进一步的详细说明。Below in conjunction with accompanying drawing, the utility model is described in further detail.

图1为本实用新型一种影像感测器的第一实施例示意图。FIG. 1 is a schematic diagram of a first embodiment of an image sensor of the present invention.

图2为本实用新型一种影像感测器的第二实施例示意图。FIG. 2 is a schematic diagram of a second embodiment of an image sensor of the present invention.

图3为本实用新型一种影像感测器的第三实施例示意图。FIG. 3 is a schematic diagram of a third embodiment of an image sensor of the present invention.

图4为本实用新型一种影像感测器的第四实施例示意图。FIG. 4 is a schematic diagram of a fourth embodiment of an image sensor of the present invention.

如图1所示，该堆叠封装构造包括有：As shown in Figure 1, the stacked package structure includes:

一基板10，其设有一第一表面12及一在第一表面12相反侧的一第二表面14，第一表面12有一信号输入端16，第二表面14有一信号输出端18，信号输出端18为球栅阵列金属球，用来连接在印刷电路板20上，将基板10的信号传递到印刷电路板20；A substrate 10, which is provided with a first surface 12 and a second surface 14 on the opposite side of the first surface 12, the first surface 12 has a signal input terminal 16, the second surface 14 has a signal output terminal 18, the signal output terminal 18 is a ball grid array metal ball, which is used to connect to the printed circuit board 20 and transmit the signal of the substrate 10 to the printed circuit board 20;

一集成电路22，其可为信号处理单元[如，数字信号处理器(DigitalSignal Processor)或微处理器(Micro Processor)或中央处理器CPU等]，其设置在基板10的第一表面12上，且由金属线24以打线方式连接在基板10的信号输入端16，使集成电路22与基板10连接，用来将集成电路22的信号传递到基板10；An integrated circuit 22, which can be a signal processing unit [such as a digital signal processor (Digital Signal Processor) or a microprocessor (Micro Processor) or a central processing unit CPU, etc.], which is arranged on the first surface 12 of the substrate 10, And the metal wire 24 is connected to the signal input terminal 16 of the substrate 10 by wire bonding, so that the integrated circuit 22 is connected to the substrate 10, and is used to transmit the signal of the integrated circuit 22 to the substrate 10;

一影像感测芯片26，其设置在集成电路22上方，与集成电路22形成堆叠形态，为避免影像感测芯片26压到位于集成电路22上的金属线24，将一间隔器28设置在集成电路22与影像感测芯片26间，使其间形成一空间30，而金属线24则恰位于空间30内。影像感测芯片26由金属线32电连接在基板10的信号输入端16，使其连接在基板10上，而将影像感测芯片26的信号传递到基板10。若集成电路22为数字信号处理器(DigitalSignal Processor)，可用来将影像感测芯片26的信号予以处理，再传递到电路板20上；An image sensor chip 26 is arranged above the integrated circuit 22 and forms a stacked form with the integrated circuit 22. In order to prevent the image sensor chip 26 from being pressed against the metal wire 24 on the integrated circuit 22, a spacer 28 is arranged on the integrated circuit 22. A space 30 is formed between the circuit 22 and the image sensor chip 26 , and the metal wire 24 is just located in the space 30 . The image sensor chip 26 is electrically connected to the signal input end 16 of the substrate 10 by the metal wire 32 , so that it is connected to the substrate 10 , and the signal of the image sensor chip 26 is transmitted to the substrate 10 . If the integrated circuit 22 is a digital signal processor (Digital Signal Processor), it can be used to process the signal of the image sensor chip 26, and then transmit it to the circuit board 20;

一凸缘层34，为框形结构，其设置在基板10的第一表面12，用来将集成电路22与影像感测芯片26包围住；A flange layer 34 is a frame structure, which is arranged on the first surface 12 of the substrate 10, and is used to surround the integrated circuit 22 and the image sensor chip 26;

一透光层36，为透光玻璃，其覆盖在凸缘层34上，用来将影像感测芯片26及集成电路22密封住，使影像感测芯片26可通过透光层36接收影像信号，并将影像信号转换为电信号传递到基板10上。A light-transmitting layer 36 is light-transmitting glass, which covers the flange layer 34 and is used to seal the image sensing chip 26 and the integrated circuit 22, so that the image sensing chip 26 can receive image signals through the light-transmitting layer 36 , and convert the image signal into an electrical signal and transmit it to the substrate 10 .

如图2所示，为本实用新型的第二实施例，该集成电路22设有导电金属38，以覆晶方式(Flip Chip)与基板10的信号输入端16连接，使集成电路22与基板10连接；该影像感测芯片26由金属线32以打线方式连接在基板10的信号输入端16。As shown in Figure 2, it is the second embodiment of the present utility model, the integrated circuit 22 is provided with conductive metal 38, is connected with the signal input end 16 of the substrate 10 in a flip chip mode (Flip Chip), so that the integrated circuit 22 and the substrate 10 connection; the image sensor chip 26 is connected to the signal input end 16 of the substrate 10 by wire bonding.

如图3所示，为本实用新型的第三实施例，透光层为透明胶体40，当集成电路22与影像感测芯片26堆叠在基板10上，并完成与基板10的连接后，用透明胶体40覆盖住影像感测芯片26与集成电路22，使影像感测芯片26通过透明胶体40接收影像信号，而将影像信号转换为电信号传递到基板10，再由集成电路22予以处理。As shown in Figure 3, it is the third embodiment of the present utility model, the light-transmitting layer is a transparent colloid 40, when the integrated circuit 22 and the image sensing chip 26 are stacked on the substrate 10, and after the connection with the substrate 10 is completed, use The transparent colloid 40 covers the image sensor chip 26 and the integrated circuit 22 , so that the image sensor chip 26 receives the image signal through the transparent colloid 40 , and converts the image signal into an electrical signal, transmits it to the substrate 10 , and then is processed by the integrated circuit 22 .

如图4所示，透光层为ㄇ形状的透明胶体40，其具有支撑柱42，用来将透光层固定在基板10的第一表面12上，ㄇ形状的透明胶体40可用压模或射出的方式形成。所以，将集成电路22以覆晶方式连接在基板10上，与基板10完成连接后，将影像感测芯片26堆叠在集成电路22上，而以打线方式将金属线32连接在基板10上后，再将ㄇ形状透明胶体40直接覆盖在基板10的第一表面12，即可将影像感测芯片26与集成电路22密封住，使影像感测芯片26可以通过ㄇ形状的透明胶体接收影像信号，并将影像信号转换为电信号传递到基板10。As shown in Figure 4, the light-transmitting layer is a transparent colloid 40 in the shape of ㄇ, which has a support column 42 for fixing the light-transmitting layer on the first surface 12 of the substrate 10, and the transparent colloid 40 in the shape of ㄇ can be molded or molded. Formed by injection. Therefore, the integrated circuit 22 is connected to the substrate 10 in a flip-chip manner, and after the connection with the substrate 10 is completed, the image sensor chip 26 is stacked on the integrated circuit 22 , and the metal wire 32 is connected to the substrate 10 by wire bonding. Finally, the ㄇ-shaped transparent colloid 40 is directly covered on the first surface 12 of the substrate 10, so that the image sensing chip 26 and the integrated circuit 22 can be sealed, so that the image sensing chip 26 can receive images through the ㄇ-shaped transparent colloid. signal, and convert the image signal into an electrical signal and transmit it to the substrate 10.

Claims (10)

1、一种影像感测器，其特征在于：它包括：1. An image sensor, characterized in that: it comprises: 一设有一第一表面及一第二表面的基板，该第一表面有一信号输入端，该第二表面有一用来与印刷电路板连接的信号输出端；A substrate with a first surface and a second surface, the first surface has a signal input terminal, and the second surface has a signal output terminal for connecting with a printed circuit board; 一设置在基板的第一表面上、与基板的信号输入端连接的集成电路；an integrated circuit disposed on the first surface of the substrate and connected to the signal input terminal of the substrate; 一连接在基板信号输入端且堆叠设置在信号处理单元上方的影像感测芯片；an image sensor chip connected to the signal input end of the substrate and stacked above the signal processing unit; 一覆盖在影像感测芯片上方的透光层，影像感测芯片是透过该透光层接收影像信号，并将影像信号转换为电信号传递到基板上的。A light-transmitting layer covering the image sensing chip, the image sensing chip receives image signals through the light-transmitting layer, converts the image signals into electrical signals and transmits them to the substrate. 2、如权利要求1所述的一种影像感测器，其特征在于：所述的基板的第二表面的信号输出端为用来与印刷电路板连接的球栅阵列金属球。2 . The image sensor according to claim 1 , wherein the signal output terminal on the second surface of the substrate is a ball grid array metal ball for connecting with a printed circuit board. 3、如权利要求1所述的一种影像感测器，其特征在于：所述的集成电路为信号处理单元。3. The image sensor as claimed in claim 1, wherein said integrated circuit is a signal processing unit. 4、如权利要求3所述的一种影像感测器，其特征在于：所述的信号处理单元为用来处理影像感测芯片信号的数字信号处理器。4. The image sensor according to claim 3, wherein the signal processing unit is a digital signal processor for processing signals of the image sensor chip. 5、如权利要求3所述的一种影像感测器，其特征在于：所述的信号处理单元为微控制器。5. The image sensor according to claim 3, wherein the signal processing unit is a microcontroller. 6、如权利要求3所述的一种影像感测器，其特征在于：所述的信号处理单元为中央处理器。6. The image sensor according to claim 3, wherein the signal processing unit is a central processing unit. 7、如权利要求1所述的一种影像感测器，其特征在于：所述的透光层为透光玻璃。7. The image sensor as claimed in claim 1, wherein the light-transmitting layer is light-transmitting glass. 8、如权利要求1所述的一种影像感测器，其特征在于：所述的基板的第一表面周缘有一透光层设置在其上的凸缘层。8. An image sensor as claimed in claim 1, characterized in that a flange layer with a light-transmitting layer disposed on the periphery of the first surface of the substrate. 9、如权利要求1所述的一种影像感测器，其特征在于：所述的透光层为透明胶体。9. The image sensor as claimed in claim 1, wherein the transparent layer is transparent colloid. 10、如权利要求1所述的一种影像感测器，其特征在于：所述的透光层为ㄇ形的透明胶体，其具有用来将其固定在基板的第一表面上的支撑柱。10. The image sensor according to claim 1, wherein the light-transmitting layer is a ㄇ-shaped transparent colloid, which has support posts for fixing it on the first surface of the substrate .
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811444A (en) * 2012-11-07 2014-05-21 环旭电子股份有限公司 Electronic apparatus, system in package module and method for manufacturing system in package module
CN103838362A (en) * 2012-11-27 2014-06-04 原相科技股份有限公司 Gesture reorganization device and combined optical device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811444A (en) * 2012-11-07 2014-05-21 环旭电子股份有限公司 Electronic apparatus, system in package module and method for manufacturing system in package module
CN103811444B (en) * 2012-11-07 2016-11-23 环旭电子股份有限公司 The manufacture method of electronic installation, system-in-package module and system-in-package module
CN103838362A (en) * 2012-11-27 2014-06-04 原相科技股份有限公司 Gesture reorganization device and combined optical device
CN103838362B (en) * 2012-11-27 2017-10-03 原相科技股份有限公司 Gesture recognition device and combined optical device
CN107589842A (en) * 2012-11-27 2018-01-16 原相科技股份有限公司 Combined optical device

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