CN2785142Y - Image sensor package structure - Google Patents

Abstract

The utility model relates to an image sensor packaging structure, it is a side shape including a base plate, is equipped with an upper surface and a lower surface, and this upper surface is formed with a plurality of first electrodes, and this lower surface is formed with a plurality of second electrode electricity and is connected to this first electrode. The four bumps are respectively arranged at four angular positions of the upper surface of the substrate. An image sensing chip is arranged on the upper surface of the substrate. A plurality of wires for electrically connecting the image sensing chip to the corresponding first electrodes; a glue layer is coated on the upper surface of the substrate along the periphery of the four bumps to surround the image sensing chip and cover part of the wires positioned on the periphery of the substrate. A transparent layer covering the four bumps for covering the image sensor.

Description

Image sensor package structure

technical field

The utility model relates to an image sensor package structure, in particular to a light, thin and small package structure, which can effectively improve its reliability.

Background technique

Please refer to FIG. 1 , which is a cross-sectional view of an existing image sensor package structure, which includes a substrate 10, which is provided with a first surface 12 and a second surface 14, and the first surface 12 is formed with first contacts 15 , the second surface 14 is formed with a second connection 16; a flange layer 18 is provided with an upper surface 20 and a lower surface 22, the lower surface 22 is adhered and fixed on the first surface 12 of the substrate 10, and forms a container with the substrate 10 Set chamber 24; An image sensor chip 26 is arranged in the accommodation chamber 24 that substrate 10 and flange layer 18 form, and is fixed on the first surface 12 of substrate 10; A plurality of wires 28, it has a first Terminal 30 and a second terminal 32, the first terminal 30 is electrically connected to the image sensor chip 26, the second terminal 32 is electrically connected to the signal input terminal 15 of the substrate 10; and a light-transmitting layer 34 is adhered to the flange upper surface 20 of layer 18 .

In the aforementioned image sensor package structure, since the periphery of the substrate 10 is provided with the flange layer 18 , it cannot accommodate a larger image sensor chip 26 on the substrate 10 with a fixed size, or the package volume cannot be reduced. In addition, during wire bonding, the distance between the flange layer 18 and the image sensor chip 26 is often limited, making it difficult to perform the wire bonding operation, thereby reducing the production yield of the product.

new content

The main purpose of the present invention is to provide an image sensor packaging structure, which has the effect of reducing product size, so as to achieve the purpose of lightness, thinness and compactness.

Another object of the present invention is to provide an image sensor packaging structure, which has the effect of facilitating wire bonding, so as to achieve the purpose of more convenient manufacture.

In order to achieve the above-mentioned purpose, the utility model is characterized in that it includes a substrate in the shape of a square, with an upper surface and a lower surface, the upper surface is formed with a plurality of first electrodes, and the lower surface is formed with a plurality of second electrodes electrically connected to the first electrode. The four bumps are respectively arranged at four corners of the upper surface of the substrate. An image sensing chip is disposed on the upper surface of the substrate. A plurality of wires are used to electrically connect the image sensing chip to the corresponding first electrode; a glue layer is coated on the upper surface of the substrate along the periphery of the four bumps to surround the image sensing chip, And cover part of the wires located around the substrate. A light-transmitting layer is set on the four protrusions and is used to cover the image sensor.

If so, it can have the purpose of being thin, light, small and convenient to manufacture.

Description of drawings

FIG. 1 is a view of a conventional image sensor package structure.

FIG. 2 is a cross-sectional view of the packaging structure of the image sensor of the present invention.

FIG. 3 is a first schematic top view of the package structure of the image sensor of the present invention.

FIG. 4 is a second schematic top view of the package structure of the image sensor of the present invention.

Description of figure number

Known map number

Substrate 10 First Surface 12 Second Surface 14

First Contact 15 Second Surface 14 Second Contact 16

Flange layer 18 upper surface 20 lower surface 22

Accommodating chamber 24 image sensor chip 26 wire 28

First endpoint 30 Second endpoint 32 Transparent layer 34

Drawing number of this utility model

Substrate 40 Bump 42 Image sensor chip 44

Multiple wires 46 Adhesive layer 48 Transparent layer 50

Upper surface 52 Lower surface 54 First electrode 56

Second Electrode 58 Conductive Material 60 Solder Pad 62

Detailed ways

Please refer to FIG. 2, which is a cross-sectional view of the image sensor package structure of the present invention, which includes a substrate 40, four bumps 42, an image sensor chip 44, a plurality of wires 46, a glue layer 48 and a light-transmitting layer 50;

Please refer to FIG. 3 and FIG. 4, wherein the substrate 40 is provided with an upper surface 52 and a lower surface 54, the upper surface 52 is formed with a plurality of first electrodes 56, the lower surface 54 is formed with a plurality of second electrodes 58, and the periphery of the substrate 40 A conductive material 60 is formed for electrically connecting the corresponding first electrode 56 and the second electrode 58 .

The four protrusions 42 are respectively disposed at four corners of the upper surface 52 of the substrate 40 .

The image sensor chip 44 is disposed on the upper surface 52 of the substrate 40 , and a plurality of bonding pads 62 are formed around it.

The plurality of wires 46 are used to electrically connect the bonding pads 62 of the image sensor chip 44 to the corresponding first electrodes 56 .

An adhesive layer 48 is coated on the upper surface 52 of the substrate 40 along the periphery of the four bumps 42 to surround the image sensor chip 44 and cover part of the wires 46 located around the substrate 40 . and

A light-transmitting layer 50 is light-transmitting glass, which is glued on the top of the four bumps 42 by the adhesive layer 48 to cover the image sensing chip 44 .

If so, the utility model has the following advantages:

1. Since the present utility model only sets the bumps 42 on the four corners of the substrate, the substrate 40 can obtain a larger space utilization rate. Therefore, a smaller size can be used on the image sensor chip package with a fixed size. The substrate can not only effectively reduce the production cost, but also have a smaller sealing volume.

2. Since the adhesive layer 48 is coated after the wire bonding, the wire bonding operation can be facilitated and the wire bonding yield can be effectively improved.

The specific embodiments proposed in the detailed description of the preferred embodiments are only for the ease of explaining the technical content of the creation, and the utility model is not limited to the embodiments in a narrow sense. All situations according to the spirit of the utility model and the following claims The implementation of various changes all belongs to the scope of the present utility model.

Claims (4)

1. an image sensor packaging structure is characterized in that, includes:

One substrate, it is a square shape, is provided with a upper surface and a lower surface, and this upper surface is formed with a plurality of first electrodes, and this lower surface is formed with a plurality of second electrodes and is electrically connected to this first electrode;

Four projections are located at the position, four angles of the upper surface of this substrate respectively;

One image sensing chip, it is arranged at the upper surface position of this substrate;

Many leads, it is in order to be electrically connected this image sensing chip to this corresponding first electrode;

One glue-line, it is prolonging the upper surface that this substrate is coated in these four projection peripheries, and this image sensing chip is centered on, and covers the lead that partly is positioned at this substrate periphery; And

One photic zone, it is covered on this four projection tops, in order to this image sensing chip is covered.

2. image sensor packaging structure as claimed in claim 1 is characterized in that, is formed with electric conducting material around this substrate, with the conducting so that corresponding this first electrode is connected with this second electrode.

3. image sensor packaging structure as claimed in claim 1 is characterized in that, this photic zone is a transparent glass.

4. image sensor packaging structure as claimed in claim 1 is characterized in that, this photic zone is adhered to this four projection tops by this glue-line.

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