CN2765329Y - Image sensor - Google Patents

Abstract

An image sensor, in order to provide a light and thin and small sensor with reliable use and convenient manufacture, the utility model is provided, which comprises a substrate, a flange layer, an image sensing chip forming a plurality of welding pads, a plurality of wires, a plurality of spherical media, a euphotic layer and a sealing adhesive layer; the substrate is provided with an upper surface and a lower surface, and a plurality of first electrodes are formed on the lower surface of the substrate; the flange layer is arranged on the upper surface of the substrate and forms a groove with the substrate, and a plurality of second electrodes which correspond to and are electrically connected with the plurality of first electrodes on the substrate are formed on the flange layer; the image sensing chip is arranged on the upper surface of the substrate and is positioned in the groove; several wires electrically connected to the bonding pads of the image sensor chip and the second electrodes on the flange layer; the spherical media are respectively arranged on the welding pads of the image sensing chip; the euphotic layer is covered above the plurality of spherical media to cover the image sensing chip; the sealant layer covers the plurality of wires and is used for fixing the euphotic layer.

Description

image sensor

technical field

The utility model belongs to sensors, in particular to an image sensor.

Background technique

As shown in FIG. 1 , an existing image sensor includes a substrate 10 , a flange layer 18 , an image sensing chip 26 , several wires 28 and a light-transmitting layer 34 .

The substrate 10 has a first surface 12 forming a first contact 15 and a second surface 14 forming a second contact 16 .

The flange layer 18 has an upper surface 20 and a lower surface 22 . The lower surface 22 of the flange layer 18 is adhesively fixed on the first surface 12 of the substrate 10 and forms an accommodating chamber 24 with the substrate 10 .

The image sensor chip 26 is disposed in the accommodating chamber 24 formed by the substrate 10 and the flange layer 18 , and is fixed on the first surface 12 of the substrate 10 .

The wires 28 have a first terminal 30 electrically connected to the image sensor chip 26 and a second terminal 32 electrically connected to the signal input terminal 15 of the substrate 10 .

The transparent layer 34 is adhered to the upper surface 20 of the flange layer 18 .

However, since the periphery of the existing image sensor substrate 10 is provided with the flange layer 18, it is impossible to accommodate a larger image sensor chip 26 on the substrate 10 of a fixed size, or the volume of the image sensor cannot be reduced. zoom out. Moreover, in the wire bonding of the existing image sensor, the distance between the flange layer 18 and the image sensor chip 26 is often limited, which makes the wire bonding operation difficult to perform, thereby reducing the production yield of the product.

Contents of the invention

The purpose of the utility model is to provide an image sensor which is light, thin, small in size, reliable in use and easy to manufacture.

The utility model comprises a substrate, a flange layer, an image sensing chip forming several welding pads, several wires, several spherical media, a light-transmitting layer and a sealant layer; the substrate is provided with upper and lower surfaces, and the lower surface of the substrate forms A plurality of first electrodes; the flange layer is arranged on the upper surface of the substrate and forms a groove with the substrate, and a plurality of second electrodes corresponding to and electrically connected to the plurality of first electrodes on the substrate are formed on the flange layer; an image sensing chip It is arranged on the upper surface of the substrate and is located in the groove; the several wires are respectively electrically connected between the several welding pads of the image sensing chip and the several second electrodes on the flange layer; several spherical dielectrics are respectively arranged on the On several welding pads of the image sensing chip; the light-transmitting layer is covered on several spherical media to cover the image sensing chip; the sealing glue layer wraps several wires and is used to fix the light-transmitting layer.

in:

The spherical medium is a metal ball.

The light-transmitting layer is light-transmitting glass.

Several wires are bonded to the pads of the image sensing chip through the second electrodes on the flange layer.

An image sensor, which includes a substrate, an image sensing chip forming several welding pads, several wires, several spherical media, a light-transmitting layer and a sealant layer; the substrate is provided with an upper surface and a lower surface, and the lower surface of the substrate is A plurality of first electrodes are formed, and a plurality of second electrodes corresponding to and electrically connected to the plurality of first electrodes on the lower surface are formed on the upper surface of the substrate; the image sensing chip is arranged on the upper surface of the substrate; the electrical connections of the plurality of wires are respectively Between several soldering pads of the image sensing chip and several second electrodes on the upper surface of the substrate; several spherical media are respectively arranged on several soldering pads of the image sensing chip; the light-transmitting layer is covered on the several spherical media , so as to cover the image sensing chip; the sealant layer covers several wires and is used to fix the light-transmitting layer.

The spherical medium is a metal ball.

The light-transmitting layer is light-transmitting glass.

Several wires are wire-bonded from the second electrodes on the upper surface of the substrate to the welding pads of the image sensing chip.

Since the utility model includes a substrate, a flange layer, an image sensing chip forming several welding pads, several wires, several spherical media, a light-transmitting layer and a sealant layer; the substrate is provided with upper and lower surfaces, and the lower surface of the substrate is A plurality of first electrodes are formed; the flange layer is arranged on the upper surface of the substrate and forms a groove with the substrate, and a plurality of second electrodes corresponding to and electrically connected to the plurality of first electrodes on the substrate are formed on the flange layer; image sensing The chip is arranged on the upper surface of the substrate and is located in the groove; the several wires are respectively electrically connected between the several welding pads of the image sensing chip and the several second electrodes on the flange layer; several spherical dielectrics are respectively arranged On several welding pads of the image sensing chip; the light-transmitting layer is covered on several spherical mediums to cover the image sensing chip; the sealant layer covers several wires and is used to fix the light-transmitting layer. Several wires are electrically connected between the pads of the image sensing chip and the second electrodes on the flange layer, so that the wires at the pads are relatively flat without breakage, and the package height can be reduced; It is convenient for the wire bonding operation; the spherical medium is set on the image sensor chip to prevent the light-transmitting layer from being laminated to the wire; the use of the spherical medium to support the light-transmitting layer can make the light-transmitting layer more smooth. Not only light, thin and small, but also reliable in use and convenient to manufacture, so as to achieve the purpose of the utility model.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional image sensor structure.

Fig. 2 is a schematic cross-sectional view of the structure of Embodiment 1 of the present utility model.

Fig. 3 is a schematic cross-sectional view of the second embodiment of the utility model.

Detailed ways

Embodiment one

As shown in FIG. 2 , the present invention includes a substrate 40 , a flange layer 42 , an image sensing chip 44 , several wires 46 , several spherical media 47 , a transparent layer 48 and a sealant layer 50 .

The substrate 40 has an upper surface 52 and a lower surface 54 . Several first electrodes 56 are formed on the lower surface 54 .

The flange layer 42 is disposed on the upper surface 52 of the substrate 40 and forms a groove 58 with the substrate 40 . A plurality of second electrodes 60 corresponding to and electrically connected to the plurality of first electrodes 56 on the substrate 40 are formed on the flange layer 42 .

The image sensing chip 44 forms a plurality of bonding pads 62 , and the image sensing chip 44 is disposed on the upper surface 52 of the substrate 40 and located in the groove 58 .

Several wires 46 are electrically connected between the bonding pads 62 of the image sensing chip 44 and the second electrodes 60 on the flange layer 42 , and are bonded to the image sensing chip 44 by wire bonding from the second electrodes 60 on the bump layer 42 Therefore, the wire 46 at the position of the welding pad 62 is relatively flat without any breakage.

The spherical media 47 are metal balls respectively disposed on the bonding pads 62 of the image sensing chip 40 .

The light-transmitting layer 48 covers the light-transmitting glass above the spherical media 47 to cover the image sensing chip 40 .

The sealant layer 50 covers the plurality of wires 46 and is used for fixing the transparent layer 48 .

Embodiment two

As shown in FIG. 3 , the present invention includes a substrate 40 a , an image sensing chip 44 , several wires 46 , several spherical media 47 , a transparent layer 48 and a sealant layer 50 .

The substrate 40a has an upper surface 52 and a lower surface 54 . The lower surface 54 forms a plurality of first electrodes 56 , and the upper surface 52 forms a plurality of second electrodes 60 corresponding to and electrically connected to the plurality of first electrodes 56 on the lower surface 54 .

The image sensing chip 44 forms a plurality of bonding pads 62 , and the image sensing chip 44 is disposed on the upper surface 52 of the substrate 40 a.

Several wires 46 are electrically connected between the pads 62 of the image sensor chip 44 and the corresponding second electrodes 60 on the upper surface 52 of the substrate 40a, and are bonded to the image by wire bonding from the second electrodes 60 on the substrate 40a. On the bonding pad 62 of the sensing chip 44 , the wire 46 located at the bonding pad 62 is relatively flat without any breakage.

The spherical media 47 are metal balls respectively disposed on the bonding pads 62 of the image sensor chip 40a.

The light-transmitting layer 48 covers the light-transmitting glass above the spherical media 47 to cover the image sensing chip 40 .

The sealant layer 50 covers the plurality of wires 46 and is used for fixing the transparent layer 48 .

As mentioned above, the utility model has the following advantages:

1. In the present invention, the substrate 40a or the flange layer 42 is wire-bonded to the pad 62 of the image sensing chip 44. Therefore, the wires 46 on the image sensing chip 44 will be relatively flat, which can reduce the package height and use The wire 46 is not easily broken.

2. The wire 46 is wire-bonded on the substrate 40a or the flange layer, which facilitates the wire-bonding operation.

3. A spherical medium 47 is provided on the image sensor chip 44 to prevent the transparent layer 48 from being pressed against the wire 46 .

4. Using the spherical medium 47 to support the light-transmitting layer 48 can make the light-transmitting layer 48 more smooth.

Claims (8)

1. An image sensor, which includes a substrate, a flange layer, an image sensing chip forming several welding pads, several wires electrically connected to several welding pads of the image sensing chip, a light-transmitting layer and a sealing adhesive layer; the substrate is provided with upper and lower surfaces; the flange layer is arranged on the upper surface of the substrate and forms a groove with the substrate; the image sensor chip is arranged on the upper surface of the substrate and is located in the groove; the light-transmitting layer covers Image sensing chip; the sealant layer covers several wires and is used to fix the light-transmitting layer; it is characterized in that several first electrodes are formed on the lower surface of the substrate; the flange layer is formed on the corresponding and electrically connected to Several second electrodes of several first electrodes on the substrate; the other ends of several wires are respectively electrically connected to several second electrodes on the flange layer; several spherical dielectrics are respectively arranged on the welding pads of the image sensing chip; The layer cover is arranged on several spherical mediums. 2. The image sensor according to claim 1, wherein the spherical medium is a metal ball. 3. The image sensor according to claim 1, wherein the transparent layer is transparent glass. 4. The image sensor according to claim 1, wherein the plurality of wires are wire-bonded from the second electrode on the flange layer to the bonding pad of the image sensor chip. 5. An image sensor, which includes a substrate, an image sensing chip forming several welding pads, several wires electrically connected to the several welding pads of the image sensing chip, a light-transmitting layer and a sealant layer; the substrate There are upper and lower surfaces; the image sensor chip is set on the upper surface of the substrate; the light-transmitting layer covers the image-sensing chip; the sealant layer covers several wires and is used to fix the light-transmitting layer; its characteristics A plurality of first electrodes are formed on the lower surface of the substrate, and a plurality of second electrodes corresponding to and electrically connected to the plurality of first electrodes on the lower surface are formed on the upper surface of the substrate; the other ends of the plurality of wires are respectively electrically connected to the substrate There are several second electrodes on the surface; several spherical dielectrics are respectively arranged on the pads of the image sensing chip; the light-transmitting layer is covered on the several spherical dielectrics. 6. The image sensor according to claim 5, wherein the spherical medium is a metal ball. 7. The image sensor according to claim 5, wherein the transparent layer is transparent glass. 8. The image sensor according to claim 5, wherein the plurality of wires are wire-bonded from the second electrode on the upper surface of the substrate to the pads of the image sensor chip.

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