CN2519418Y - Image sensor - Google Patents

Abstract

An image sensor. In order to provide a sensor which is easy to manufacture, reduces the production cost, can package image sensing chips with different dimensions and specifications and keeps the same specification package volume, the utility model is provided, which comprises a substrate, a flange layer, an image sensing chip, a plurality of wires and a euphotic layer; the substrate is provided with a first surface and a second surface which are formed to be electrically connected to the signal output end of the printed circuit board; the flange layer has an upper surface for forming a signal input terminal electrically connected to the signal output terminal on the first surface of the substrate and a lower surface for fixing to the second surface of the substrate, and forming a groove with the substrate; the image sensor chip is disposed in the recess formed by the substrate and the flange layer, and fixed on the second surface of the substrate; the plurality of wires have a first terminal electrically connected to the image sensor chip and a second terminal electrically connected to the signal input terminal on the upper surface of the flange layer; the transparent layer is disposed on the upper surface of the flange layer.

Description

image sensor

technical field

The utility model belongs to sensors, in particular to an image sensor.

Background technique

As shown in FIG. 1 , a conventional image sensor includes a substrate 10 , a flange layer 18 , an image sensing chip 26 , a plurality of wires 28 and a transparent layer 34 .

The substrate 10 has a first surface 12 and a second surface 14 .

The first surface 12 forms a signal output terminal 15 for electrically connecting to a printed circuit board. A signal input terminal 16 is formed on the second surface 14 .

The flange layer 18 has an upper surface 20 and a lower surface 22 . The lower surface 22 is adhesively fixed to the second surface 14 of the substrate 10 and forms a groove 24 with the substrate 10 .

The image sensing chip 26 is disposed in the groove 24 formed by the substrate 10 and the flange layer 18 , and is fixed on the second surface 14 of the substrate 10 .

The plurality of wires 28 have a first terminal 30 and a second terminal 32 . The first terminal 30 is electrically connected to the image sensor chip 26 , and the second terminal 32 is electrically connected to the signal input terminal 16 of the substrate 10 .

The transparent layer 34 is disposed on the upper surface 20 of the flange layer 18 .

In this conventional image sensor, when the size of the image sensor chip 26 is relatively large, and a plurality of wires 28 are to be electrically connected to the signal input terminal 16 of the substrate 10, it will cause inconvenience in the manufacturing process, or even Since the wire bonding operation cannot be performed, the size of the substrate 10 must be increased to increase the space for wire bonding. In this way, the packaging volume of the entire image sensor chip will be larger, causing discomfort in use.

Contents of the invention

The purpose of the utility model is to provide an image sensor which is easy to manufacture, reduces production cost, can package image sensing chips of different sizes and specifications, and maintains the package volume of the same specification.

The utility model includes a substrate, a flange layer, an image sensing chip, a plurality of wires and a light-transmitting layer; the substrate is provided with a first surface and a second surface formed to be electrically connected to the signal output end of the printed circuit board; the flange layer is provided with Form the upper surface of the signal input end electrically connected to the signal output end of the first surface of the substrate and the lower surface for fixing on the second surface of the substrate, and form a groove with the substrate; the image sensing chip is arranged on the substrate and the flange layer In the formed groove, and fixed on the second surface of the substrate; a plurality of wires have a first terminal electrically connected to the image sensor chip and a second terminal electrically connected to the signal input terminal on the upper surface of the flange layer; The optical layer is disposed on the upper surface of the flange layer.

in:

The upper surface of the flange layer is coated with a part of the adhesive layer for adhering to the transparent layer, and the part without the adhesive layer is formed with a signal input end for electrically connecting with the second ends of a plurality of wires.

The transparent layer is transparent glass.

The signal output end formed on the first surface of the substrate is provided with metal balls for electrically connecting to the printed circuit board.

The signal input terminal formed on the upper surface of the flange layer is electrically connected to the signal output terminal on the first surface of the substrate through the flange layer and the side of the substrate.

Since the utility model includes a substrate, a flange layer, an image sensing chip, a plurality of wires and a light-transmitting layer; the substrate is provided with a first surface and a second surface formed to be electrically connected to the signal output end of the printed circuit board; the flange layer is provided with There is an upper surface of a signal input end electrically connected to the signal output end of the first surface of the substrate and a lower surface for fixing on the second surface of the substrate, and forms a groove with the substrate; the image sensor chip is arranged on the substrate and the flange In the groove formed by the layer, and fixed on the second surface of the substrate; the plurality of wires have a first terminal electrically connected to the image sensor chip and a second terminal electrically connected to the signal input terminal on the upper surface of the flange layer; The transparent layer is disposed on the upper surface of the flange layer. When assembling, the image sensing chip is first adhered and fixed on the second surface of the substrate, and then the first ends of the plurality of wires are welded on the image sensing chip and the second ends are welded to the upper surface of the flange layer. The signal input end, and then the light-transmitting layer is glued and fixed on the upper surface of the flange layer; since a plurality of wires are electrically connected to the signal input end on the upper surface of the flange layer, and do not occupy the surface of the groove, the flange layer The size of the groove formed with the substrate for accommodating the image sensing chip can be close to the size of the image sensing chip, that is, a smaller size substrate can be selected to package the image sensing chip of the same size, thereby obtaining a smaller volume image The sensor package and reduce the material cost of the substrate; the groove of the same size substrate can also be equipped with an image sensor chip with a smaller size close to its size, so it can be applied to different image sensor chip size specifications at the same time The packaging makes it more convenient in material procurement; and the method of bonding multiple wires on the upper surface of the flange layer is more convenient in the manufacturing process than the method of bonding wires on the substrate, so it can reduce production costs and produce good quality. Rate. Not only is it convenient to manufacture and reduce production cost, but also it can package image sensing chips of different sizes and specifications while maintaining the same packaging volume, so as to achieve the purpose of the utility model.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional image sensor structure.

Fig. 2 is a schematic sectional view of the exploded structure of the utility model.

Fig. 3 is a schematic cross-sectional view of the structure of the utility model.

Detailed ways

As shown in FIGS. 2 and 3 , the present invention includes a substrate 40 , a flange layer 42 , an image sensing chip 44 , a plurality of wires 46 and a transparent layer 48 .

The substrate 40 has a first surface 50 and a second surface 52 . A signal output terminal 58 is formed on the first surface 50 . The signal output end 58 is provided with metal balls 54 for electrically connecting to the printed circuit board 56 which are ball grid array metal balls BGA.

The flange layer 42 has an upper surface 60 and a lower surface 62 . The lower surface 62 of the flange layer 42 is adhered and fixed to the second surface 52 of the substrate 40 by the adhesive layer 64 to form a groove 66 with the substrate 40; the upper surface 60 is coated with a part of the adhesive layer for adhering the transparent layer 48 64 , the portion of the upper surface 60 without the adhesive layer is formed with a signal input terminal 68 , and is electrically connected to the signal output terminal 58 of the first surface 50 of the substrate 40 through the flange layer 42 and the side of the substrate 40 .

The image sensor chip 44 is disposed in the groove 66 formed by the substrate 40 and the flange layer 42 , and is adhered and fixed on the second surface 52 of the substrate 40 .

The plurality of wires 46 have a first end point 70 and a second end point 72 . The first terminal 70 is electrically connected to the image sensor chip 44 , and the second terminal 72 is electrically connected to the signal input terminal 68 on the upper surface 60 of the flange layer 42 .

The transparent layer 48 is transparent glass for receiving light signals, and is disposed on the upper surface 60 of the flange layer 42 .

When assembling, the image sensor chip 44 is adhered and fixed on the second surface 52 of the substrate 40 first, and then the first terminal points 70 of the plurality of wires 46 are welded on the image sensor chip 44 and the second terminal points 72 are welded on the image sensor chip 44. The signal input end 68 on the upper surface 60 of the flange layer 42 , and then the transparent layer 48 is adhered and fixed on the upper surface 60 of the flange layer 42 . In this way, the packaging of the image sensing chip is completed.

Since the plurality of wires 46 are electrically connected to the signal input terminal 68 on the upper surface 60 of the flange layer 42 and do not occupy the surface of the groove 66, the flange layer 42 and the substrate 40 are formed to accommodate the image sensing chip. The size of the groove 66 of 44 can be close to the size of the image sensor chip 44, that is, the image sensor chip 44 of the same size can be packaged with a smaller size substrate 40, thereby obtaining a smaller image sensor package and reducing The material cost of the substrate 40 .

Furthermore, since the substrate 40 of the same size can be configured with an image sensing chip with a smaller size or close to its size in the groove 66, it can be suitable for packaging of different image sensing chips 44 at the same time, so that it can It is more convenient to purchase materials.

In addition, the method of bonding the plurality of wires 46 on the upper surface 60 of the flange layer 42 is more convenient in the manufacturing process than the method of bonding the wires 46 on the substrate 40 , so that the production cost and production yield can be reduced.

Claims (5)

1. An image sensor, which includes a substrate, a flange layer, an image sensing chip, a plurality of wires and a light-transmitting layer; the substrate is provided with a first surface and a second surface formed to be electrically connected to a signal output end of a printed circuit board. surface; the flange layer is provided with an upper surface and a lower surface for fixing on the second surface of the substrate, and forms a groove with the substrate; the image sensing chip is arranged in the groove formed by the substrate and the flange layer, and fixed On the second surface of the substrate; a plurality of wires have a first end point and a second end point electrically connected to the image sensing chip; the light-transmitting layer is arranged on the upper surface of the flange layer; it is characterized in that the flange layer The upper surface forms a signal input end electrically connected with the second terminals of the plurality of wires and the signal output end of the first surface of the substrate. 2. The image sensor according to claim 1, characterized in that the upper surface of the flange layer is coated with a part of an adhesive layer for adhering to the light-transmitting layer, and the part without the adhesive layer is formed with a part for bonding with a plurality of The second end of the wire is electrically connected to the signal input end. 3. The image sensor according to claim 1, wherein the transparent layer is transparent glass. 4. The image sensor according to claim 1, wherein the signal output terminal formed on the first surface of the substrate is provided with a metal ball for electrically connecting to a printed circuit board. 5. The image sensor according to claim 1, wherein the signal input terminal formed on the upper surface of the flange layer is electrically connected to the signal output terminal on the first surface of the substrate through the flange layer and the side of the substrate end.

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