CN2620951Y - Image sensor with a hollow groove on the substrate - Google Patents

Abstract

An image sensor with a substrate having a hollow groove. In order to provide an image sensor which reduces material cost, production cost, volume, weight, thinness, shortness, heat dissipation effect, product quality, wire arc of routing and process capability, the utility model provides a substrate, a metal sheet, an image sensing chip, a plurality of wires and a light transmission layer; the substrate is provided with an upper surface forming a first contact, a lower surface forming a second contact and a hollow groove penetrating from the upper surface to the lower surface; the metal sheet is arranged on the lower surface of the substrate and is positioned at the hollow-out groove position of the substrate so as to form a groove together with the hollow-out groove of the substrate; the image sensing chip is provided with a plurality of welding pads which are arranged in the groove and are positioned on the metal sheet; a plurality of wires electrically connecting the bonding pads of the image sensor chip to the first contacts on the upper surface of the substrate; the transparent layer covers the upper surface of the substrate to cover the image sensor chip.

Description

Image sensor with a hollow groove on the substrate

technical field

The utility model belongs to an image sensor, in particular to an image sensor with a base plate provided with a hollow groove.

Background technique

General sensors can be used to sense signals that are either light signals or sound signals. The image sensor is used to receive light signals or image signals. After receiving the light signal, the light signal can be converted into an electrical signal through the image sensor, and transmitted to the circuit board through the substrate.

As shown in FIG. 1 , a conventional image sensor includes a substrate 10 , a flange layer 18 , an image sensing chip 26 , a plurality of wires 28 and a transparent layer 34 .

The substrate has a first surface 12 forming a signal input terminal 15 and a second surface 14 forming a signal output terminal 16 .

The flange layer 18 has an upper surface 20 and a lower surface 22 fixed on the first surface 12 of the substrate 10 and forming a groove 24 with the substrate 10 .

The image sensor chip 26 is disposed in the groove 24 formed by the substrate 10 and the flange layer 18 , and is fixed on the first surface 12 of the substrate 10 .

The plurality of wires 28 have a first terminal 30 electrically connected to the image sensor chip 26 and a second terminal 32 electrically connected to the signal input terminal 15 of the substrate 10 .

The transparent layer 34 is disposed on the upper surface 20 of the flange layer 18 .

Conventional image sensors have the following disadvantages:

1. The substrate 10 is a ceramic substrate or an FR4 printed circuit board, on which circuits are planted to form the signal input terminal 15 and the signal output terminal 16. Because the size of the overall substrate 10 is large and the required material cost is high, the packaging cost is quite high.

2. A distance for wire bonding must be formed between the substrate 10 and the flange layer 18 . Therefore, the packaging volume is large and cannot meet the requirement of lightness, thinness and compactness.

3. The image sensing chip 26 is disposed on the substrate 10, which has a poor heat dissipation effect.

4. A plurality of wires 28 are bonded to the substrate 10 , and the arcs of the wires are relatively large, resulting in low process capability.

Contents of the invention

The purpose of this utility model is to provide a substrate with hollowed-out grooves that reduces material costs, reduces production costs, is small in size, light and short, improves heat dissipation effects, improves product quality, reduces wire arcs, and improves process capabilities. detector.

The utility model includes a substrate, a metal sheet, an image sensing chip, a plurality of wires and a light-transmitting layer; the substrate is provided with an upper surface forming a first contact, a lower surface forming a second contact, and a hollow penetrating from the upper surface to the lower surface groove; the metal sheet is arranged on the lower surface of the substrate, and is located at the position of the hollow groove of the substrate, so as to form a groove with the hollow groove of the substrate; the image sensing chip is provided with a plurality of welding pads, which are arranged in the groove, and It is located on the metal sheet; a plurality of wires are electrically connected to the welding pad of the image sensing chip to the first contact point on the upper surface of the substrate; the light-transmitting layer is set on the upper surface of the substrate to cover the image sensing chip.

in:

The metal sheet is glued on the lower surface of the substrate by glue.

The transparent layer is transparent glass.

The light-transmitting layer is adhered and covered on the upper surface of the substrate by adhesive covering the plurality of wires.

Since the utility model includes a substrate, a metal sheet, an image sensing chip, a plurality of wires and a light-transmitting layer; hollow groove; the metal sheet is arranged on the lower surface of the substrate, and is located at the position of the hollow groove of the substrate to form a groove with the hollow groove of the substrate; the image sensing chip is provided with a plurality of welding pads, which are arranged in the groove, and located on the metal sheet; a plurality of wires electrically connect the pads of the image sensing chip to the first contact on the upper surface of the substrate; the light-transmitting layer is covered on the upper surface of the substrate to cover the image sensing chip. In the utility model, when the circuit is implanted on the substrate to form the first and second contacts, the substrate provided with hollow grooves can reduce the number of ceramic or FR4 printed circuit boards used, and the image sensing chip is arranged on the On a metal sheet with a large area, the packaging cost can be effectively reduced; the wiring is placed on the upper surface of the substrate with a hollow groove, which can reduce the distance between the substrate and the image sensor chip, effectively reducing the packaging volume, so as to achieve thinness and shortness To meet the needs; directly setting the image sensor chip on the metal sheet can improve its heat dissipation effect; bonding multiple wires on the upper surface of the substrate with hollow grooves can effectively reduce the line arc and improve its process capability. It not only reduces material costs, lowers production costs, is small in size, light and thin, but also improves heat dissipation, improves product quality, reduces wire arcs, and improves process capabilities, thereby achieving the purpose of the utility model.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional image sensor structure.

Fig. 2 is a schematic sectional view of the exploded structure of the utility model.

Fig. 3 is a schematic sectional view of the structure of the utility model.

Detailed ways

As shown in FIGS. 2 and 3 , the present invention includes a substrate 40 , a metal sheet 42 , an image sensing chip 44 , a plurality of wires 58 and a transparent layer 46 .

The substrate 40 has an upper surface 48 forming the first contact 54 , a lower surface 50 forming the second contact 56 , and a hollow groove 52 penetrating from the upper surface 48 to the lower surface 50 . The second contact 56 is electrically connected to the first contact 54 .

The metal sheet 42 is glued on the lower surface 50 of the substrate 40 by an adhesive 60 , and is positioned at the hollowed groove 52 of the substrate 40 to form a groove 55 with the hollowed groove 52 of the substrate 40 .

The image sensor chip 44 is provided with a plurality of welding pads 57 , which are disposed in the groove 55 and located on the metal sheet 42 .

The plurality of wires 58 are used to electrically connect the bonding pads 57 of the image sensing chip 44 to the first contacts 54 on the upper surface 48 of the substrate 40 .

The light-transmitting layer 46 is light-transmitting glass, which is adhered and covered on the upper surface 48 of the substrate 40 by the glue 62 covering the plurality of wires 58, so that the image sensing chip 44 is covered, so that the image sensing chip 44 receives light signals through the transparent layer 46 .

During encapsulation, as shown in FIG. 3 , first, the metal sheet 42 is adhered to the lower surface 50 of the substrate 40 by adhesive 60 , and must be located below the hollow groove 52 , so that the substrate 40 forms a groove 55 ; the image sensing chip 44 Set in the groove 55 and on the metal sheet 42; a plurality of wires 58 are used to electrically connect the welding pad 57 of the image sensor chip 44 to the first contact 54 of the upper surface 48 of the substrate 40; the glue 62 Coated on the upper surface 48 of the substrate 40, so as to cover the plurality of wires 58; and also adhere the transparent layer 46 to the upper surface 48 of the substrate 40 by the adhesive 62, so as to cover the image sensor chip 44 , so that the image sensing chip 44 receives light signals through the light-transmitting layer 46 ; finally, ball grid array metal balls 64 can be formed on the second contact 56 on the lower surface 50 of the substrate 40 . If so, the utility model package is completed.

As mentioned above, the utility model has the following advantages:

1. When laying lines on the substrate 40 to form the first contact 54 and the second contact 56, the substrate 40 provided with the hollow groove 52 can reduce the number of ceramic or FR4 printed circuit boards used, and the image sense The test chip 44 is arranged on the metal sheet 42 with a large area, which can effectively reduce the packaging cost.

2. Bonding the wires 58 on the upper surface 48 of the substrate 40 can reduce the distance between the substrate 40 and the image sensing chip 44 , effectively reducing the packaging volume, so as to meet the requirement of lightness, thinness and compactness.

3. The image sensor chip 44 is directly arranged on the metal sheet 42, which can improve its heat dissipation effect.

4. Bonding a plurality of wires 58 on the upper surface of the substrate 40 with hollow grooves 52 can effectively reduce wire arcs and improve the process capability.

Claims (4)

1. An image sensor with a substrate provided with a hollow groove, which includes a substrate, an image sensing chip, a plurality of wires and a light-transmitting layer; the substrate is provided with an upper surface forming a first contact and a lower surface forming a second contact The image sensing chip is provided with a plurality of soldering pads; a plurality of wires are electrically connected to the first contact point on the upper surface of the substrate from the soldering pads of the image sensing chip; The hollow groove on the surface; the metal sheet forming a groove with the hollow groove of the substrate is arranged at the position of the hollow groove on the lower surface of the substrate; the image sensing chip is arranged in the groove and is located on the metal sheet; the light-transmitting layer is a cover It is arranged on the upper surface of the substrate so as to cover the image sensing chip. 2. The image sensor with a hollowed-out groove on the substrate according to claim 1, wherein the metal sheet is adhered on the lower surface of the substrate by glue. 3. The image sensor with hollow grooves on the substrate according to claim 1, wherein the light-transmitting layer is light-transmitting glass. 4. The image sensor with hollow grooves on the substrate according to claim 1 or 3, characterized in that the light-transmitting layer is covered on the upper surface of the substrate by adhesive covering a plurality of wires superior.

Images