CN2587061Y - High heat dissipation image sensor - Google Patents

Abstract

An image sensor with high heat dissipation is disclosed. In order to provide an image sensor with simplified packaging process, improved product yield, reduced cost, small volume, light weight, good heat dissipation effect, and long service life, the utility model is provided, which comprises a substrate, a flange layer, an image sensing chip, a plurality of wires and a light transmission layer; the base plate comprises a plurality of metal sheets which are mutually arranged and bilaterally symmetrical and a middle plate positioned between the bilaterally symmetrical metal sheets; the left and right symmetrical metal sheets form a first plate and a second plate with different heights, and the middle plate is lower than the first plate in horizontal height; the flange layer covers the plurality of metal sheets and the middle plate of the substrate, and the upper surface of the first plate, the lower surface of the second plate and the bottom surface of the middle plate of the metal sheets are respectively exposed out of the flange layer; the image sensing chip is arranged on the middle plate of the substrate; a plurality of wires connecting the first plate of the metal sheet and the image sensing sheet; the transparent layer is disposed on the flange layer to cover the image sensing chip.

Description

High heat dissipation image sensor

technical field

The utility model belongs to an image sensor, in particular to an image sensor with high heat dissipation.

Background technique

As shown in FIG. 1 and FIG. 2 , a conventional image sensor includes a plurality of image sensing chips 13, implanted with a substrate 10 surrounded by lines 12 to form a plurality of regions 17 for the image sensing chips 13 to be arranged, and an adhesive 15 The flange layer 14 and the light-transmitting glass 20 are adhered on the substrate 10 and form several hollow areas 16 corresponding to the circuits 12 .

When encapsulating, it is first to provide a plurality of implantation areas 17 surrounded by the circuit 12 for the configuration of the image sensing chip 13; to provide the flange layer 14, and to adhere the flange layer 14 to the substrate 10 by adhesive 15, so that A plurality of image sensing chips 13 on the substrate 10 are exposed from the hollow area 16, and then a plurality of wires 18 are electrically connected to the image sensing chips 13 and the substrate 10, and finally the substrate 10 is cut into single pieces as shown in FIG. The packaging body of the flange layer 14 . As shown in FIG. 3 , the single package is placed in the jig 22 to locate the area for accommodating the light-transmitting glass 20 , and then the light-transmitting glass is sealed on the flange layer 14 by adhesive 24 , And the packaging of the image sensing chip 13 is completed.

Conventional image sensors have the following disadvantages:

1. It is necessary to manufacture the substrate 10 first, implant the circuit 12 on the substrate 10, then manufacture the flange layer 14, and adhere the flange layer 14 to the substrate 10. In this way, the manufacturing process is quite complicated, and the material cost is also high. It is relatively expensive, making its overall manufacturing cost high.

2. After the packaging of the image sensor is completed, it must be cut into a single package. Since the flange layer 14 is adhered to the substrate 10 by the adhesive 15, it is often difficult to cut it into a single package. The glue 15 overflows, thereby affecting the signal transmission of the substrate 10 .

3. The process of covering the light-transmitting glass 20 is carried out after the substrate 10 is cut. At this time, cutting debris is likely to contaminate the image sensing chip 13 , which will affect the yield of the image sensing chip 13 .

Contents of the invention

The purpose of the utility model is to provide a high heat dissipation image sensor which simplifies the packaging process, improves product yield, reduces cost, is small in size, light in weight, good in heat dissipation effect and long in service life.

The utility model includes a substrate, a flange layer, an image sensing chip, a plurality of wires and a light-transmitting layer; the substrate includes a plurality of symmetrical metal sheets arranged mutually and an intermediate plate located between the left and right symmetrical metal sheets; the left and right symmetrical metal sheets The first and second boards of different heights are formed, and the level of the middle board is lower than that of the first board; the flange layer covers a plurality of metal sheets and the middle board of the substrate, and makes the first board surface of the metal The lower surface of the second board and the bottom surface of the middle board are respectively exposed by the flange layer; the image sensing chip is arranged on the middle board of the substrate; a plurality of wires are connected to the first board of the metal sheet and the image sensing board; the light-transmitting layer is arranged on the raised board. On the edge layer to cover the image sensing chip.

in:

The flange layer is injection molded with thermoplastic.

The first plate and the second plate of the metal sheet are connected by the third plate.

The light-transmitting layer is light-transmitting glass.

The transparent layer is transparent colloid.

A plurality of symmetrically arranged metal sheets and an intermediate plate of the base plate are integrally punched and formed by metal.

The middle slab is at the same level as the second slab.

Since the utility model includes a substrate, a flange layer, an image sensing chip, a plurality of wires and a light-transmitting layer; The sheets form the first and second boards of different heights, and the middle board is lower than the first board; the flange layer covers the plurality of metal sheets and the middle board of the substrate, and makes the first board surface of the metal sheet, The lower surface of the second plate and the bottom surface of the middle plate are respectively exposed by the flange layer; the image sensing chip is arranged on the middle plate of the substrate; a plurality of wires are connected to the first plate of the metal sheet and the image sensing piece; the light-transmitting layer is arranged on the middle plate of the substrate on the flange layer to cover the image sensing chip. Because the substrate is composed of a plurality of metal sheets that can output signals, the plurality of metal sheets covering the substrate and the flange layer of the intermediate plate make the upper surface of the first plate, the lower surface of the second plate and the bottom surface of the intermediate plate of the metal sheet respectively The exposure of the flange layer not only saves the cost of conventional wiring on the substrate to effectively reduce the production cost, but also dissipates the heat of the image sensor chip more effectively, so that the heat dissipation effect is better; The image sensing chip is arranged on the middle plate with a lower level, which can reduce the overall package height. It not only simplifies the packaging process, improves product yield, and reduces costs, but also has small volume, light weight, good heat dissipation effect, and long service life, thereby achieving the purpose of the utility model.

Description of drawings

FIG. 1 is a schematic perspective view of a conventional image sensor exploded structure.

FIG. 2 is a schematic cross-sectional view of a conventional image sensor structure.

FIG. 3 is a schematic cross-sectional view of a conventional image sensor structure (after packaging).

Fig. 4 is a schematic sectional view of the structure of the utility model.

Fig. 5 is a schematic cross-sectional view of the structure of the utility model (the light-transmitting layer is a transparent colloid).

Detailed ways

As shown in FIG. 4 , the present invention is used to be disposed on a printed circuit board, which includes a substrate 70 , a flange layer 72 , an image sensing chip 74 , a plurality of wires 76 and a transparent layer 78 .

The substrate 70 is integrally stamped and formed by metal, and it includes a plurality of symmetrical metal sheets 80 arranged mutually and an intermediate plate 81 between the symmetrical metal sheets 80. One plate 82 and the second plate 84, and the first plate 82 and the second plate 84 are connected to each other by the third plate 83, and the level of the middle plate 81 is lower than the first plate 82, in this embodiment , the middle board 81 is at the same level as the second board 84, and the second board 84 is electrically connected to the printed circuit board for transmitting signals to the printed circuit board.

The flange layer 72 is made of thermoplastic plastic through the injection mold and directly connected to a plurality of metal sheets 80 to form a U-shaped shape, and a frame-shaped structure is formed on the periphery of the base plate 70 to form an accommodating area 85 at the position of the middle plate 81, and the flange layer 72 covers a plurality of metal sheets 80, and the first plate 82 and the second plate 84 of the metal sheet 80 are exposed from the flange layer 72, and the bottom of the middle plate 81 also exposes the flange layer 72, that is, the first plate Neither the upper surface of the second board 82 nor the lower surface of the second board 84 is covered by the flange layer 72, so that the lower surface of the second board 84 can be electrically connected to the printed circuit board. The bottom surface of the middle plate 81 exposes the flange layer 72 so as to dissipate the heat effectively and obtain a better heat dissipation effect.

The image sensor chip 74 is disposed on the middle plate 81 of the substrate 70 and located in the accommodation area 85 , and a plurality of welding pads 86 are disposed thereon. Since the middle board 81 is lower than the first board 82 , when the image sensing chip 74 is disposed on the middle board 81 , the height of the entire package will be greatly reduced, which can achieve the purpose of lightness and compactness. Moreover, since the middle plate 81 is exposed from the flange layer 72 , the heat of the image sensing chip 74 is transferred to the middle plate 81 and can directly contact the outside air, so that the heat dissipation effect is better.

One end 90 of the plurality of wires 76 is electrically connected to the bonding pad 86 of the image sensing chip 74, and the other end 92 is electrically connected to the first plate 82 of the metal sheet 80, so that the signal of the image sensing chip 74 can be transmitted to the substrate 70 , and transferred to the printed circuit board through the second plate 84 of the substrate 70 .

The light-transmitting layer 78 is light-transmitting glass covering the flange layer 72 for covering the image sensing chip 74 so that the image sensing chip 74 receives light signals through the light-transmitting layer 78 .

As shown in Figure 5, the transparent layer 78a can also be a transparent colloid, which is filled in the accommodation area 85 formed by the flange layer 72, and covers the image sensing chip 74, so that the image sensing chip 74 The optical signal can be received through the transparent layer 78a.

As mentioned above, the utility model has the following advantages:

1. The substrate 70 is composed of a plurality of metal sheets 80, and each metal sheet 80 is used to output signals, which can save the conventional cost of wiring circuits on the substrate, thus effectively reducing the production cost.

2. The required flange layer 72 is directly formed by injection and covers a plurality of metal sheets 80, which can reduce the conventional adhesive process and avoid the glue overflow situation caused by cutting into a single package, which can effectively improve product yield.

3. The image sensor chip 74 is arranged on the middle board 81 with a lower level, which can reduce the overall packaging height.

4. The middle plate 81 is in direct contact with the outside air, which can dissipate the heat of the image sensing chip 74 more effectively, so that the heat dissipation effect is better.

Claims (7)

1. An image sensor with high heat dissipation, which includes a substrate, a flange layer, an image sensing chip, a plurality of wires and a light-transmitting layer; it is characterized in that the substrate includes a plurality of symmetrically arranged metal sheets And the middle plate located between the left and right symmetrical metal sheets; the left and right symmetrical metal sheets form the first and second plates of different heights, and the level of the middle plate is lower than that of the first plate; the flange layer covers the plurality of metal sheets of the base plate and the middle plate, and the upper surface of the first plate, the lower surface of the second plate and the bottom surface of the middle plate of the metal sheet are respectively exposed from the flange layer; the image sensing chip is arranged on the middle plate of the substrate; a plurality of wires are connected to the metal plate A first board and an image sensing sheet; the transparent layer is arranged on the flange layer to cover the image sensing chip. 2. The image sensor with high heat dissipation as claimed in claim 1, wherein the flange layer is formed by injection molding of thermoplastic. 3. The image sensor with high heat dissipation according to claim 1, characterized in that the first plate and the second plate of the metal sheet are connected by a third plate. 4. The image sensor with high heat dissipation according to claim 1, wherein the transparent layer is transparent glass. 5. The image sensor with high heat dissipation according to claim 1, wherein the transparent layer is a transparent colloid. 6 . The image sensor with high heat dissipation according to claim 1 , wherein the plurality of symmetrically arranged metal sheets and the middle plate of the substrate are integrally stamped and formed by metal. 7. The image sensor with high heat dissipation as claimed in claim 1, wherein the level of the middle plate is the same as that of the second plate.

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