CN2708500Y - Integrated circuit chip construction - Google Patents

Abstract

A package of an integrated circuit chip comprises: a carrier having a top surface, a bottom surface and a chamber, wherein: the chamber has an opening, the top surface is disposed at the periphery of the opening and is respectively provided with a plurality of welding areas and a plurality of non-welding areas, the welding areas and the non-welding areas are arranged adjacently, and each welding area is provided with a welding pad; a chip fixed in the chamber, the chip having a plurality of bonding pads; a plurality of bonding wires electrically connected to the bonding pads of the bonding area on the carrier and the bonding pads of the chip respectively; a cover for sealing the opening of the chamber; a supporting body clamped between the plurality of non-welding areas on the top surface of the bearing body and the cover; an adhesive distributed at the joint of the cover and the carrier for fixing the cover on the carrier.

Description

Integrated circuit chip construction

technical field

The utility model relates to the assembly of integrated circuit chips, in particular to a small-sized integrated circuit assembly structure.

Background technique

Commonly used small-scale integrated circuit chip structure structure, as the Taiwan patent announcement No. 152172 invented by the inventor, please refer to shown in Figure 1, its main structure includes a carrier (1), a container (2), the container The chamber has an opening (3), and a plurality of welding pads (4) are arranged on the periphery of the opening (3); a chip (5) is fixed in the chamber (2); a plurality of welding wires (6) are respectively electrically Connect the solder pad (4) on the carrier with the chip (5); an adhesive (7), spread on the periphery of the opening (3); a cover (8), fixed with the adhesive (7) , and can close the opening (3) of the chamber (2); because the welding pads (4) for each of the welding wires (6) are moved from the interior of the chamber (2) to the opening of the chamber (2) (3), the chamber (2) no longer needs to reserve an operating space for the wire bonding machine, so the size of the structure can be reduced.

However, when the cover (8) is used to seal the chamber opening (3) in this design, the welding wire (6) and the welding pad (4) will be directly contacted and squeezed by the cover (8), causing the welding wire to be damaged or the welding wire (6) The bonding pad (4) falls off, which makes the chip (5) unable to operate normally, reduces the yield rate of the structure, and increases the production cost.

Utility model content

The main purpose of the present invention is to provide a structure of an integrated circuit chip, which can greatly reduce the volume of its structure.

Another object of the present invention is to provide a structure of an integrated circuit chip, which avoids damage to bonding wires.

In order to achieve the above object, the structure of a kind of integrated circuit chip provided by the utility model includes:

A carrier has a top surface, a bottom surface and a chamber, the chamber has an opening, the top surface is divided into a plurality of welding areas and a plurality of non-welding areas on the periphery of the opening, the welding areas and the The non-welding areas are arranged adjacently;

A chip is fixed in the chamber, and the chip has a plurality of bonding pads;

A plurality of welding wires are respectively electrically connected to the welding area on the carrier and the welding pad of the chip;

a cover for closing the opening of the chamber;

A supporting body is sandwiched between some non-welding areas on the top surface of the carrier and the cover.

An adhesive is distributed at the joint between the cover and the carrier, for fixing the cover to the carrier.

Wherein the cover has a bottom surface and a top surface, and the supporting body is protruded on the bottom surface of the cover.

Wherein the supporting body is a non-welding area integrally protruding from the top surface of the open carrier.

Wherein the supporting body is generally a frame body, and the frame body has a hollow area for overlapping with the opening. The bottom surface of the frame body is protrudingly provided with a number of protrusions, and the frame body is attached to these protrusions by the protrusions. non-welded area.

Wherein the chamber has a bottom and a side wall, the side wall surrounds the periphery of the bottom, and forms the opening above the bottom surface of the carrier.

in:

The carrier includes a plate-shaped body and a frame body, the plate-shaped body has a bottom surface and a top surface, and the top surface is provided with a waterproof layer made of metal material;

The frame body has a top surface, a bottom surface and a hollow area passing through the top surface and the bottom surface. The hollow area of the frame body and the top surface of the plate-shaped body can form a chamber for containing the wafer.

It also includes a connection device, which includes a plurality of through holes connecting the non-welding area on the top surface of the frame to the bottom surface of the frame, and a plurality of metal pins, one end of each pin is sandwiched and fixed between the bottom surface of the frame and the bottom of the frame. The top surfaces of the plates are electrically connected to the through hole, and the other ends of the pins are located outside the carrier and bent into a predetermined shape.

It also includes a connecting device, which is used to electrically connect the welding area of the carrier to the outside of the carrier.

Wherein the connecting device is a plurality of through holes opened on the periphery of the carrier, and the through holes connect the welding areas and the bottom surface of the carrier.

The connecting device includes a plurality of metal pins, one end of each pin is electrically connected to the welding area of the carrier, and the other end is located outside the carrier and bent into a predetermined shape.

Wherein the welding area is a welding pad.

Description of drawings

Below, enumerate the preferred embodiment of the present utility model, and cooperate with following accompanying drawing to describe in detail later, wherein:

Figure 1 is a typical integrated circuit chip structure.

Fig. 2 is a cross-sectional view of the first preferred embodiment of the utility model.

Fig. 3 is a perspective view of the cover in the first preferred embodiment of the present invention.

Fig. 4 is a top view of the first preferred embodiment of the present invention, wherein the cover has been removed.

Fig. 5 is a cross-sectional combined view of the second preferred embodiment of the present invention.

Fig. 6 is a top view of the second preferred embodiment of the present invention, wherein the cover has been removed.

Fig. 7 is a sectional combined view of the third preferred embodiment of the present invention.

Fig. 8 is a top view of the third preferred embodiment of the present invention, wherein the cover has been removed.

Fig. 9 is a perspective view of the support body of the fourth preferred embodiment of the present invention.

Detailed ways

Please refer to Fig. 2 to shown in Fig. 4, the structure (10) of a kind of integrated circuit chip provided by the first preferred embodiment of the present utility model, it mainly comprises a carrier (11), a chip (12), a plurality of The welding wire (13), a cover (14), a support (15), an adhesive (16) and a connecting device (17), wherein:

The carrier (11) can be made of insulating materials such as plastic, glass fiber, reinforced plastic, ceramics, etc., and has a top surface (11a), a bottom surface (11b) and a chamber (11c). The chamber (11c) has a bottom (11d), a side wall (11e), the side wall (11e) surrounds the periphery of the bottom (11d), and forms an opening (11f) above the top surface (11a) , the periphery of the opening (11f) is divided into a plurality of welding areas (11g) and a majority of non-welding areas (11h), and the welding areas (11g) and the non-welding areas (11h) are arranged adjacently, each of the above The welding area (11g) can be a welding pad.

The wafer (12) is adhesively fixed on the bottom (11d) of the chamber (11c), and the surface of the wafer (12) has a plurality of welding pads (12a).

Each of the welding wires (13) is made of metal materials with good conductivity such as aluminum or gold, and it utilizes a wire bonder (not shown in the figure) to be connected to the welding pad (12a) of the chip with its one end earlier , and then connect the other end to the welding area (11g) of the carrier (11) in a horizontally extending manner.

The cover (14) has a top surface (14a) and a bottom surface (14b), which is used to close the opening (11f) of the chamber (11c) to protect the wafer (12) from external force damage or foreign matter contamination .

The support body (15) is integrally formed and protruded on the periphery of the bottom surface (14b) of the cover (14). When the cover (14) closes the opening (11f) of the chamber (11c), the support body (15 ) is attached to several non-welding areas (11h) on the periphery of the opening (11f) with its lower end.

The adhesive (16) is distributed on the junction of the cover (14) and the carrier (11), and is used to cover and protect the joints of the welding wires (13) and the welding areas (11g), and make The cover (14) is affixed to the carrier (11), and fills and seals the gap between the carrier (11) and the cover (14) formed by the supports (15) to seal the container. chamber (11c) effect.

The main function of the connecting device (17) is to connect each of the welding areas (11g) on the carrier (11) to the outside of the carrier (11); in this embodiment, the connecting device (17) is set on The plurality of through holes (17a) on the periphery of the carrier (11), these through holes (17a) connect the welding areas (11g) and the bottom surface (11b) of the carrier (11), thus when the structure is assembled When on an external circuit board, solder can be used to connect the through holes (17a), so that the circuit of the chip (12) is conducted with the circuit of the circuit board.

By above-mentioned combination, the structure of this integrated circuit chip, when its cover (14) closes this opening (11f), by the isolation of this support body (15), can avoid that this cover (14) directly extrudes each this bonding wire ( 13) and the connection of each of the welding areas (11g), destroying their connection causes each of the welding lines (13) to break away from each of the welding areas (11g), and the support (15) causes the covering (14) and The gaps between the periphery of the opening (11f) can be filled and sealed by the adhesive (16), so as to maintain the sealing effect of the chamber (11c).

Please refer to Fig. 5 and shown in Fig. 6, the structure (20) of a kind of integrated circuit chip provided by the second preferred embodiment of the utility model, it mainly comprises a carrier (21), a chip (22), most welding Line (23), a cover (24), a support (25), an adhesive (26) and a connecting device (27), its difference with the previous embodiment is:

The carrier (21) includes a plate (28) and a frame (29), the plate (28) has a top surface (28a) and a bottom surface (28b), and the top surface (28a) A waterproof layer (28c) made of metal material is arranged; and the frame body (29) has a top surface (29a), a bottom surface (29b) and a hollow area (29c) passing through the top and bottom surfaces, wherein the The top surface (29a) of the frame body (29) is provided with a plurality of welding areas (29d) and non-welding areas (29e), and the welding areas (29d) and the non-welding areas (29e) are arranged adjacently, and the frame Body (29) bottom surface (29b) is then fixed on the waterproof layer (28c) of this plate-shaped body (28) top surface (28a), thus, the hollow area (29c) of this frame body (29) and this plate The top surface (28a) of the shape body (28) can form a chamber (21a) for the accommodation of the wafer (22).

Secondly, the support body (25) is composed of a plurality of protruding posts (25a), and each protruding post (25a) is integrally formed and protruded on several non-welding areas (29e) on the top surface (29a) of the frame body (29). , when the cover (24) closes the opening of the chamber (29d), the support (25) is attached to several non-welding areas (29e) on the top surface (29a) with its upper end, so that when the When the cover (24) closes the opening, the isolation of the support body (25) can prevent the cover (24) from directly extruding the joints of the welding wires (23) and the welding areas (29e).

Furthermore, in this embodiment, the connection device (27) includes a plurality of through holes (27a) connecting the top surface (29a) of the frame (29) from the welding area (29d) to the bottom surface of the frame (29), And a plurality of metal pins (27b), one end of each of the pins (27b) is clamped and fixed between the bottom surface (29b) of the frame body (29) and the top surface (28a) of the plate-shaped body (28), and It is electrically connected with the through hole (27a), and the other end of each pin (27b) is located outside the carrier (21) and bent into a predetermined shape.

Please refer to Fig. 7, shown in 8, the structure (30) of a kind of integrated circuit chip provided by the third preferred embodiment of the utility model, it mainly comprises a carrier (31), a chip (32), a plurality of Welding wire (33), a cover (34), a support body (35), an adhesive (36) and a connecting device (37), its main difference with the aforementioned each embodiment is:

The supporting body (35) is composed of a plurality of columns (35a), and each columnar body (35a) is fixed to some non-welding areas on the periphery of the opening of the carrier (31) by the adhesive (36) or other means. (31a), when the cover (34) closes the chamber opening of the carrier (31), the support (35) is sandwiched between the non-welding areas (31a) and the cover (34), When the cover (34) closes the chamber opening of the carrier (31), the isolation of the support body (35) can prevent the cover (34) from directly extruding each of the welding wires (33) and each of the The junction of the welding zone (31b).

Secondly, in this embodiment, the connection device (37) includes a plurality of metal pins (37a), one end of each pin (37a) is electrically connected to the soldering area (31b) of the carrier (31) , and the other end is located outside the carrier (31) and bent into a predetermined shape.

Please refer to Fig. 9, the integrated circuit chip structure provided by the fourth preferred embodiment of the present invention, its main difference from the third embodiment is:

The supporting body is a frame body (41) having a top surface (41a) and a bottom surface (41b). There is a hollow area (41c) in the frame body for overlapping with the opening. The frame body (41) The bottom surface (41b) is protruded with several bosses (41d), and the frame body (41) is attached to the non-welding areas with the bosses (41d), and the gap between it and the carrier is filled with the adhesive Sealing, the cover is fitted and fixedly connected to the top surface (41a) of the frame body (41) to close the chamber, so as to prevent the cover from directly pressing the joints of each of the welding lines and each of the welding areas.

The above is only a preferred feasible embodiment of the utility model, so all equivalent structural changes made by applying the specification of the utility model and the scope of the patent application should be included in the patent scope of the utility model.

Claims (11)

1. A kind of structure of integrated circuit chip, it is characterized in that, comprises: A carrier has a top surface, a bottom surface and a chamber, the chamber has an opening, the top surface is divided into a plurality of welding areas and a plurality of non-welding areas on the periphery of the opening, the welding areas and the The non-welding areas are arranged adjacently; A chip is fixed in the chamber, and the chip has a plurality of bonding pads; A plurality of welding wires are respectively electrically connected to the welding area on the carrier and the welding pad of the chip; a cover to close the chamber opening; A supporting body is sandwiched between some non-welding areas on the top surface of the carrier and the cover. An adhesive is distributed on the junction of the cover and the carrier. 2 . The integrated circuit chip assembly according to claim 1 , wherein the cover has a bottom surface and a top surface, and the support body is protruded from the bottom surface of the cover. 3 . 3 . The assembly of integrated circuit chips according to claim 1 , wherein the supporting body is a non-welding area integrally protruding from the top surface of the open carrier. 4 . 4. The structure of the integrated circuit chip according to claim 1, wherein the supporting body is generally a frame body, a hollow area is provided in the frame body, overlapping with the opening, and the bottom surface of the frame body is protruded. There are several protrusions, and the frame body is attached to the non-welding areas by the protrusions. 5. The structure of the integrated circuit chip according to claim 1, wherein the chamber has a bottom and a side wall, and the side wall surrounds the periphery of the bottom and is formed above the bottom surface of the carrier The opening. 6. The structure of the integrated circuit chip according to claim 1, wherein: The carrier includes a plate-shaped body and a frame body, the plate-shaped body has a bottom surface and a top surface, and the top surface is provided with a waterproof layer made of metal material; The frame body has a top surface, a bottom surface and a hollow area passing through the top surface and the bottom surface. The hollow area of the frame body and the top surface of the plate-like body form a chamber for containing the wafer. 7. According to the structure of the integrated circuit chip according to claim 6, it is characterized in that it also includes a connection device, which includes a plurality of through holes connecting the non-welding area on the top surface of the frame to the bottom surface of the frame, and a plurality of Metal pins, one end of each pin is clamped and fixed between the bottom surface of the frame and the top surface of the plate-shaped body, and is electrically connected to the through hole, and the other end of each pin is located outside the carrier and bent into a predetermined shape. 8 . The structure of the integrated circuit chip according to claim 1 , further comprising a connection device for electrically connecting the carrier pad to the outside of the carrier. 9 . 9. According to the structure of the integrated circuit chip according to claim 8, wherein the connecting device is a plurality of through holes opened on the periphery of the carrier, and the through holes connect the soldering regions and the carrier. bottom surface. 10. The structure of the integrated circuit chip according to claim 8, wherein the connection device includes a plurality of metal pins, one end of each pin is electrically connected to the soldering area of the carrier, and the other One end is located outside the carrier and bent into a predetermined shape. 11. The structure of the integrated circuit chip according to claim 1, wherein the welding area is a welding pad.

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