CN111863800A - An optoelectronic integrated LED lamp bead packaging structure and method - Google Patents

Abstract

The invention discloses a photoelectric integrated LED lamp bead packaging structure and a method, wherein the photoelectric integrated LED lamp bead packaging structure comprises a substrate, wherein a first surface and a second surface opposite to the first surface of the substrate are both provided with a conducting layer, and the conducting layer on the first surface is electrically connected with the conducting layer on the second surface; the conducting layer on the first surface is electrically connected with an electrode of a control chip; the conducting layer on the second surface is electrically connected with an LED light-emitting chip; the two insulation covers are respectively covered on the first surface and the second surface, a metal layer is fixed on the outer side surface of the insulation cover covered on the first surface, and the metal layer is electrically connected with the conducting layer on the first surface. The control chip and the light-emitting chip are respectively packaged and are electrically connected by utilizing a plurality of conductive materials, so that the LED lamp is compact in structure, small in size and low in cost.

Description

An optoelectronic integrated LED lamp bead packaging structure and method

technical field

The invention relates to LED lamp bead packaging, in particular to an optoelectronic integrated LED lamp bead packaging structure and method.

Background technique

LED lamp bead packaging refers to the packaging of light-emitting chips and control chips, which is currently used in packaging methods. The LED lamp bead in the prior art only has the package of the light-emitting chip, and the package does not integrate the control chip. It is only during the use of the lamp bead that the packaged lamp bead and the control chip are assembled in the application circuit, and the external control chip is used to control the LED. Lamp beads are controlled. The solution of the external control chip is bulky, loose in structure, long in assembly process and high in cost.

SUMMARY OF THE INVENTION

In order to solve the above-mentioned defects of the prior art, the present invention provides an optoelectronic integrated LED lamp bead packaging structure and method. The present invention separately encapsulates the control chip and the light-emitting chip, and uses a plurality of conductive materials to electrically connect the two, with a compact structure. Small size and low cost.

In order to achieve the above technical purpose, the present invention adopts the following technical scheme: an optoelectronic integrated LED lamp bead packaging structure, comprising:

A substrate, a first surface of the substrate and a second surface opposite to the first surface are provided with a conductive layer, the conductive layer on the first surface and the conductive layer on the second surface Layer electrical connection;

The conductive layer on the first surface is electrically connected to the electrodes of the control chip; the conductive layer on the second surface is electrically connected to the LED light-emitting chip;

Two insulating covers, the two insulating covers are respectively covered on the first surface and the second surface, and a metal layer is fixed on the outer side of the insulating covers covered on the first surface, The metal layer is electrically connected to the conductive layer on the first side.

Further, two ends of the first surface are respectively fixed with a lower conductive layer, and two ends of the second surface are respectively fixed with an upper conductive layer.

Further, the cross-sectional length of the upper conductive layer is greater than the cross-sectional length of the lower conductive layer.

Further, two ends of the substrate are respectively provided with first through holes along the thickness direction thereof, and first connection posts are arranged in the first through holes, and the first connection posts connect the lower conductive layer and the lower conductive layer at the same end. The upper conductive layer is electrically connected.

Further, first conductive sheets are fixed on both of the lower conductive layers, and the electrodes of the control chip are fixed on the two first conductive sheets.

Further, a first insulating cover is fixed on the first surface, the first insulating cover covers the control chip, and both ends of the first insulating cover are provided with second through holes, the A second connection post is arranged in the second through hole, and the second connection post electrically connects the metal layer and the lower conductive layer at the same end.

Further, second conductive sheets are fixed on both of the upper conductive layers, and the LED light-emitting chip is fixed on the two second conductive sheets.

Further, a second insulating cover is fixed on the second surface, and the second insulating cover covers the LED light-emitting chip.

An optoelectronic integrated LED lamp bead packaging method, further comprising the following steps:

providing a substrate;

Conductive layers are respectively formed on the front and back sides of the substrate, and the conductive layers on the front and back sides are connected by filling conductive substances through first through holes, wherein the first through holes are opened on the substrate;

On the back conductive layer of the substrate, the electrodes of the control chip are fixedly connected through conductive materials;

The backside of the substrate is wrapped with an insulating material, and a metal layer is arranged on the insulating material, wherein a hole is punched on the insulating material and filled with conductive material to lead out the electrodes of the control chip to the metal layer ;

The LED light-emitting chip is fixedly connected on the front conductive layer of the substrate through a conductive adhesive material;

The front side of the substrate is wrapped with an insulating substance.

To sum up, the present invention has achieved the following technical effects:

1. In the present invention, a first connection post made of conductive material is drilled on the substrate to electrically connect the two conductive layers on the front and back sides. The first connection post is penetrated in the substrate, does not occupy extra space, and is small in size;

2. In the present invention, the electrode of the control chip is fixed on the lower conductive layer through the conductive material, the LED light-emitting chip is electrically connected through the lower conductive layer, the first connection post and the upper conductive layer, and the electrode of the control chip is pulled through the transition of the lower conductive layer. to the outside of the entire package structure, making the entire electrical connection firm and stable;

3. In the present invention, the insulating cover is fixed on the reverse side of the substrate, and the second connecting column is pierced on the insulating cover. It is led out to the outside of the insulating cover, and is fixed and electrically connected to the metal layer to realize the external connection of the control chip;

4. In the present invention, the control chip and the light-emitting chip are packaged together to form an integrated type, which makes the installation and use more convenient, the overall volume is small, the structure is compact, the assembly process is shortened, and the cost is low.

Description of drawings

1 is a schematic cross-sectional view of a package structure provided by an embodiment of the present invention;

Figure 2 is a front perspective view when encapsulated;

FIG. 3 is a schematic diagram of the packaging step.

Detailed ways

The present invention will be further described in detail below with reference to the accompanying drawings.

This specific embodiment is only an explanation of the present invention, and it does not limit the present invention. Those skilled in the art can make modifications without creative contribution to the present embodiment as required after reading this specification, but as long as the rights of the present invention are used All claims are protected by patent law.

Example:

As shown in Figure 1, an optoelectronic integrated LED lamp bead packaging structure, including

The substrate 1, the first surface of the substrate 1 and the second surface opposite to the first surface are provided with conductive layers; specifically, a lower conductive layer 3 is fixed at both ends of the first surface, and both ends of the second surface are respectively An upper conductive layer 2 is respectively fixed, wherein, in this embodiment, the cross-sectional length of the upper conductive layer 2 is greater than the cross-sectional length of the lower conductive layer 3, that is, the distance between the two lower conductive layers 3 is larger, which is convenient for corresponding fixing. For the electrodes of the control chip 4 , the distance between the two upper conductive layers 2 is relatively small, which is convenient for correspondingly fixing the LED light-emitting chip 11 .

Still further, the conductive layer on the first side is electrically connected to the conductive layer on the second side. That is, the two ends of the substrate 1 are respectively provided with first through holes along the thickness direction thereof, and the first through holes are provided with first connection pillars 8 , the first connection pillars 8 are conductive substances, and the first connection pillars 8 connect the bottom of the same end The conductive layer 3 and the upper conductive layer 2 are electrically connected to realize the electrical connection between the control chip 4 and the LED light-emitting chip 11 .

The conductive layer on the first surface is electrically connected to the electrode 5 of the control chip 4; specifically, the control chip 4 refers to an electrical parameter control chip, and a first conductive sheet 6 is fixed on the two lower conductive layers 3, and the electrode of the control chip 4 is 5 is fixed on the two first conductive sheets 6, so that the control chip 4 is electrically connected to the LED light-emitting chip 11 through the first conductive sheet 6, the lower conductive layer 3, and the first connection post 8.

The conductive layer on the second surface is electrically connected to the LED light-emitting chip 11; specifically, the second conductive sheets 12 are fixed on the two upper conductive layers 2, and the LED light-emitting chip 11 is fixed on the two second conductive sheets 12. The two conductive sheets 12 , the upper conductive layer 2 , and the first connection post 8 are electrically connected to the control chip 4 .

Two insulating covers, the two insulating covers are respectively covered on the first surface and the second surface, the outer side of the insulating cover covered on the first surface is fixed with a metal layer 10, and the metal layer 10 is connected to the first surface. The conductive layers are electrically connected.

Specifically, a first insulating cover 7 is fixed on the first surface, the first insulating cover 7 covers the control chip 4, and both ends of the first insulating cover 7 are provided with second through holes, and the second through holes are provided with There is a second connection post 9, which is made of conductive material, and electrically connects the metal layer 10 at the same end with the lower conductive layer 3, so as to lead the electrodes of the control chip 4 to the outside of the insulating cover. A second insulating cover 13 is fixed on the second surface, the second insulating cover 13 covers the LED light-emitting chip 11 , and the second insulating cover 13 is made of a light-transmitting insulating material.

In another embodiment, an optoelectronic integrated LED lamp bead packaging method is provided. As shown in FIG. 2 , IC solidification→plastic sealing and leveling→grinding laser drilling→filling laser holes→bottom pad front RGB solidification→ Silicone lamination.

Specifically, as shown in Figure 3, the method includes the following steps:

(1) Provide a substrate 1, the substrate 1 is an insulating material, as shown in (1) in FIG. 3;

(2) Making conductive layers on the front and back surfaces of the substrate 1 respectively, and connecting the conductive layers on the front and back surfaces by filling conductive substances through first through holes, wherein the first through holes are opened on the substrate 1; specifically, the front surface corresponds to The second side, the reverse side corresponds to the first side, and the first through hole is filled with conductive material, so as to electrically connect the upper conductive layer 2 and the lower conductive layer 3, as shown in (2) in Figure 3;

(3) On the back conductive layer of the substrate 1, the electrodes of the control chip are fixedly connected by conductive materials; specifically, the electrodes 5 of the control chip 4 are fixed on the first conductive sheet 6, and the first conductive sheet 6 is fixed on the lower conductive layer 3. , as shown in (3) in Figure 3;

(4) The backside of the substrate 1 is wrapped with an insulating material; and a metal layer is arranged on the insulating material, wherein, the insulating material is punched and filled with conductive material to lead the electrodes of the control chip to the metal layer, as shown in Figure 3 ( 4) (5) (6) shown;

(5) On the front conductive layer of the substrate 1, the LED light-emitting chip is fixedly connected through a conductive adhesive material, as shown in (7) in FIG. 3;

(6) The front surface of the substrate 1 is wrapped with an insulating material, as shown in (8) in FIG. 3 .

The above is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Any simple modifications made to the above embodiments according to the technical essence of the present invention, equivalent changes and modifications, belong to the present invention. within the scope of the technical solution of the invention.

Claims (9)

1. An optoelectronic integrated LED lamp bead packaging structure is characterized in that: comprising: A substrate (1), a first surface of the substrate (1) and a second surface opposite to the first surface are provided with a conductive layer, the conductive layer on the first surface and the second surface the conductive layer on the surface is electrically connected; The conductive layer on the first surface is electrically connected to the electrode (5) of the control chip (4); the conductive layer on the second surface is electrically connected to the LED light-emitting chip (11); Two insulating covers, the two insulating covers are respectively covered on the first surface and the second surface, and a metal layer ( 10), the metal layer (10) is electrically connected to the conductive layer on the first surface. 2 . The optoelectronic integrated LED lamp bead packaging structure according to claim 1 , wherein a lower conductive layer ( 3 ) is fixed at both ends of the first surface, respectively, and two lower conductive layers ( 3 ) are fixed on the two ends of the second surface. 3 . The ends are respectively fixed with an upper conductive layer (2). 3 . The optoelectronic integrated LED lamp bead package structure according to claim 2 , wherein the cross-sectional length of the upper conductive layer ( 2 ) is greater than the cross-sectional length of the lower conductive layer ( 3 ). 4 . 4 . The optoelectronic integrated LED lamp bead packaging structure according to claim 3 , wherein the two ends of the substrate ( 1 ) are respectively provided with first through holes along the thickness direction thereof, and the first through holes are respectively formed in the two ends of the substrate ( 1 ). A first connection post (8) is arranged in the hole, and the first connection post (8) electrically connects the lower conductive layer (3) and the upper conductive layer (2) at the same end. 5. The optoelectronic integrated LED lamp bead packaging structure according to claim 4, wherein a first conductive sheet (6) is fixed on both of the two lower conductive layers (3), and the control chip The electrodes (5) of (4) are fixed on the two first conductive sheets (6). 6. An optoelectronic integrated LED lamp bead packaging structure according to claim 5, characterized in that: a first insulating cover (7) is fixed on the first surface, and the first insulating cover (7) The control chip (4) is covered, and both ends of the first insulating cover (7) are provided with second through holes, and second connection posts (9) are arranged in the second through holes. The second connection post (9) electrically connects the metal layer (10) at the same end with the lower conductive layer (3). 7. An optoelectronic integrated LED lamp bead packaging structure according to claim 4, wherein a second conductive sheet (12) is fixed on both of the two upper conductive layers (2), and the LED emits light. Chips (11) are fixed on the two second conductive sheets (12). 8. An optoelectronic integrated LED lamp bead packaging structure according to claim 7, wherein a second insulating cover (13) is fixed on the second surface, and the second insulating cover (13) The LED light-emitting chip (11) is covered and installed. 9. An optoelectronic integrated LED lamp bead packaging method, characterized in that: the method comprises the following steps: providing a substrate (1); Conductive layers are respectively formed on the front and back surfaces of the substrate (1), and the conductive layers on the front and back surfaces are connected by filling conductive substances through first through holes, wherein the first through holes are opened in the substrate (1). )superior; On the backside conductive layer of the substrate (1), the electrodes of the control chip are fixedly connected through a conductive material; The backside of the substrate (1) is wrapped with an insulating substance, and a metal layer is arranged on the insulating substance, wherein, Punch holes on the insulating material and fill conductive materials to lead the electrodes of the control chip to the metal layer; The LED light-emitting chip is fixedly connected on the front conductive layer of the substrate (1) through a conductive adhesive material; The front surface of the substrate (1) is wrapped with insulating substances.

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