CN2653694Y - Substrates for Image Sensing Chip Packages - Google Patents
Substrates for Image Sensing Chip Packages Download PDFInfo
- Publication number
- CN2653694Y CN2653694Y CNU032720289U CN03272028U CN2653694Y CN 2653694 Y CN2653694 Y CN 2653694Y CN U032720289 U CNU032720289 U CN U032720289U CN 03272028 U CN03272028 U CN 03272028U CN 2653694 Y CN2653694 Y CN 2653694Y
- Authority
- CN
- China
- Prior art keywords
- plate
- image sensing
- metal sheets
- sensing chip
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 56
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 238000004806 packaging method and process Methods 0.000 claims abstract 7
- 239000000463 material Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 2
- 239000008393 encapsulating agent Substances 0.000 claims 4
- 239000000565 sealant Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000084 colloidal system Substances 0.000 abstract 3
- 150000002739 metals Chemical class 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000010410 layer Substances 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
A substrate for packaging an image sensor chip. In order to provide a semiconductor package component for reducing the volume of an image sensor, improving the quality of the image sensor and reducing the production cost of the image sensor, the utility model is provided, which comprises a plurality of metal sheets and a sealing colloid which are symmetrically arranged; the plurality of metal sheets which are symmetrically arranged are provided with a first plate and a second plate with different heights and a third plate which is connected with the first plate and the second plate, so that the plurality of metal sheets which are arranged mutually form a groove for arranging the image sensing chip at the central part; the sealing colloid covers and fixes a plurality of symmetrical metal sheets to form an upper surface and a lower surface, and the upper surfaces of the first plate and the second plate of the metal sheets are exposed from the upper surface of the sealing colloid.
Description
Technical field
The utility model belongs to the parts of encapsulated semiconductor, particularly a kind of substrate that is used for the image sensing wafer encapsulation.
Background technology
As shown in Figure 1, the applicant comprises sheet metal 10, flange layer 16 and the photic zone 22 that arrange several spaces in the image sensor of 91/03/27 No. 091203873 patent application that proposes.
Sheet metal 10 forms first plate 12 and second plate 14 of differing heights.
Flange layer 16 is periphery and the bottom surface that is formed at several sheet metals 10, and top and the following of second plate 14 of first plate 12 of sheet metal 10 exposed by flange layer 16, and forms disposal area 20 in order to ccontaining image sensing wafer 18 with number sheet metals 10.
Photic zone 22 is to be covered on flange layer 16 tops, in order to cover image sensing wafer 18, makes image sensing wafer 18 can see through photic zone 22 and receives the light signal.
Only, though aforesaid image sensor can reach the effect and the purpose of its creation.So, the highly quite high flange layer 16 of essential formation in its whole knot with so that photic zone 22 is provided with thereon, can cover image sensing wafer 18.So, it can't reach compact demand.And first plate, 12 junctions of flange layer 16 and sheet metal 10 near the right angle state, more easily keep impurity (particle), not only cause being difficult for of cleaning on the processing procedure, and easily have influence on the quality of image sensor.
Summary of the invention
The purpose of this utility model provides a kind of substrate that is used for the image sensing wafer encapsulation that reduces image sensor volume, raising image sensor quality, reduces the image sensor production cost.
The utility model comprises sheet metal and the adhesive body that several are arranged symmetrically; The 3rd plate that several sheet metals of arranging symmetrically are provided with first and second plate of differing heights and connect first and second plate makes several sheet metals of arranging mutually form the groove that image sensing wafer is set in central part; Adhesive body is coated and fixed several symmetrical sheet metals and forms upper and lower surface, and the top upper surface by adhesive body of first and second plate of several sheet metals is exposed.
Wherein:
Several sheet metals of arranging mutually are provided with the intermediate plate that image sensing wafer can be set in the groove that central part forms.
The intermediate plate bottom surface is exposed by the adhesive body lower surface.
The following of several sheet metal second plates exposed by the adhesive body lower surface.
The sealing system is several symmetrical sheet metals that are coated and fixed with industrial plastic material ejection formation.
Second plate of the sheet metal that is exposed by the upper surface of adhesive body is electrically connected image sensing wafer by several wires.
Because the utility model comprises sheet metal and adhesive body that several are arranged symmetrically; The 3rd plate that several sheet metals of arranging symmetrically are provided with first and second plate of differing heights and connect first and second plate makes several sheet metals of arranging mutually form the groove that image sensing wafer is set in central part; Adhesive body is coated and fixed several symmetrical sheet metals and forms upper and lower surface, and the top upper surface by adhesive body of first and second plate of several sheet metals is exposed.Because sheet metal forms the groove that image sensing wafer is set, during encapsulation, image sensing wafer can be arranged in the groove, photic zone then is arranged on first plate of sheet metal, so because of needn't on adhesive body, forming the height that flange layer can reduce the overall package body in addition, to reach compact purpose; The 3rd plate of first and second plate of connection of sheet metal is skewed, can reduce the residual of impurity and be convenient to and remove, and improves its process quality.Not only reduce the image sensor volume, and improve image sensor quality, reduction image sensor production cost, thereby reach the purpose of this utility model.
Description of drawings
Fig. 1, be known image sensor structure schematic sectional view.
Fig. 2, be the utility model structural representation cutaway view.
Fig. 3, be several sheet metal structure schematic sectional views of the utility model.
Fig. 4, be image sensor structure schematic sectional view with the utility model encapsulation.
Fig. 5, for the utility model structural representation cutaway view (bottom surface of sheet metal second plate and intermediate plate is exposed by the lower surface of adhesive layer).
Embodiment
As shown in Figure 2, the utility model comprises sheet metal 30 and the adhesive body 31 that several are arranged symmetrically.
As shown in Figure 3, the 3rd plate 36 that several sheet metals 30 (Leadfram) of arranging symmetrically are provided with first plate 32, second plate 34 of differing heights and connect first and second plate 32,34 makes several sheet metals of arranging mutually 30 establish the groove 38 of intermediate plate 40 in central part forms.
As shown in Figure 4, when encapsulating with the utility model, image sensing wafer 43 is arranged on the intermediate plate 40 of sheet metal 30, be electrically connected on second plate 34 of image sensing wafer 43 and sheet metal 30 by several wires 46, be passed on the sheet metal 30 in order to signal image sensing wafer 43, photic zone 48 is covered on first plate 32 of sheet metal 30, image sensing wafer 30 is covered, make image sensing wafer 43 can see through photic zone 48 and receive the light signal.So, can electrically connect with printed circuit board (PCB) (figure does not show) by first plate 32 of sheet metal 30.
As shown in Figure 5, the bottom surface that also can make second plate 34 of sheet metal 30 and intermediate plate 40 is exposed by the lower surface of adhesive layer 31, and second plate 34 of sheet metal 30 and printed circuit board (PCB) (figure shows) are electrically connected.So, can increase the radiating effect of image sensing wafer 43.
As mentioned above, the utlity model has following advantage:
1, because sheet metal 30 forms the groove 38 that image sensing wafer 33 is set, image sensing wafer 33 can be arranged in the groove 38, photic zone 37 then can be arranged on first plate 32 of sheet metal 30, so because of needn't on adhesive body 31, forming the height that flange layer can reduce the overall package body in addition, to reach compact purpose.
2, the 3rd plate 36 of first and second plate 32,34 of the connection of sheet metal 30 is skewed, can reduce the residual of impurity (particle) and be convenient to and remove, to reach the purpose that improves its process quality.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032720289U CN2653694Y (en) | 2003-06-17 | 2003-06-17 | Substrates for Image Sensing Chip Packages |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032720289U CN2653694Y (en) | 2003-06-17 | 2003-06-17 | Substrates for Image Sensing Chip Packages |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2653694Y true CN2653694Y (en) | 2004-11-03 |
Family
ID=34330827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032720289U Expired - Fee Related CN2653694Y (en) | 2003-06-17 | 2003-06-17 | Substrates for Image Sensing Chip Packages |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2653694Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100485893C (en) * | 2005-09-09 | 2009-05-06 | 鸿富锦精密工业（深圳）有限公司 | Producing process for video sensing chip packaging and structure |
| CN100555643C (en) * | 2005-08-12 | 2009-10-28 | 鸿富锦精密工业（深圳）有限公司 | Image sensing chip packaging structure and use the numerical camera mould of this structure |
-
2003
- 2003-06-17 CN CNU032720289U patent/CN2653694Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100555643C (en) * | 2005-08-12 | 2009-10-28 | 鸿富锦精密工业（深圳）有限公司 | Image sensing chip packaging structure and use the numerical camera mould of this structure |
| CN100485893C (en) * | 2005-09-09 | 2009-05-06 | 鸿富锦精密工业（深圳）有限公司 | Producing process for video sensing chip packaging and structure |
| US7592197B2 (en) | 2005-09-09 | 2009-09-22 | Altus Technology Inc. | Image sensor chip package fabrication method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1231964C (en) | Semiconductor device with a plurality of transistors | |
| CN2653694Y (en) | Substrates for Image Sensing Chip Packages | |
| CN1897288A (en) | Image sensed-measuring chip packing structure | |
| CN1873992A (en) | Package of image sensor, and packaging procedure | |
| CN2641835Y (en) | image sensor | |
| CN100350619C (en) | Image sensor and packaging method thereof | |
| CN2401992Y (en) | Plastic packaging structure for photo-sensing chip packaging | |
| CN2530351Y (en) | image sensor | |
| CN2631044Y (en) | Image sensor | |
| CN2648606Y (en) | Image Sensor Chip Scale Package Structure | |
| CN2678142Y (en) | Packaging structure of light sensing chip | |
| CN2849971Y (en) | Protective structure of photosensitive chip | |
| CN2638245Y (en) | Image sensor module | |
| CN2470959Y (en) | stacked image sensor | |
| CN1577875A (en) | Horizontal control image sensing chip packaging structure and packaging method thereof | |
| CN2641822Y (en) | Integrated circuit package components | |
| CN2465329Y (en) | an image sensor | |
| CN2664201Y (en) | Image sensor that improves the pass rate of wire bonding | |
| CN2638244Y (en) | Image sensor package structure | |
| CN1362737A (en) | Semiconductor package with glue overflow prevention device | |
| CN2598144Y (en) | Image sensor packaged by image sensing chip with transparent layer | |
| CN2664203Y (en) | Image sensor package structure | |
| CN2765327Y (en) | Module card | |
| CN2909531Y (en) | memory card structure | |
| CN2664079Y (en) | Compact memory card structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041103 |