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CN2638245Y - Image sensor module - Google Patents

Image sensor module Download PDF

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Publication number
CN2638245Y
CN2638245Y CNU032720270U CN03272027U CN2638245Y CN 2638245 Y CN2638245 Y CN 2638245Y CN U032720270 U CNU032720270 U CN U032720270U CN 03272027 U CN03272027 U CN 03272027U CN 2638245 Y CN2638245 Y CN 2638245Y
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plate
image sensor
light
metal sheets
printed circuit
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Expired - Fee Related
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CNU032720270U
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Chinese (zh)
Inventor
谢志鸿
吴志成
张呈豪
吕建贤
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Kingpak Technology Inc
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Kingpak Technology Inc
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Priority to CNU032720270U priority Critical patent/CN2638245Y/en
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Abstract

An image sensor module. The utility model provides a sensor module group which reduces the volume, improves the quality and reduces the production cost, and provides the utility model, which comprises a plurality of metal sheets which are symmetrically arranged, a sealing colloid, an image sensing wafer, a plurality of leads, a euphotic layer, a printed circuit board, a lens base and a lens cone; the metal sheet is provided with a first plate, a second plate and a third plate, wherein the first plate and the second plate are different in height, and the third plate is connected with the first plate and the second plate so as to form a groove for arranging the image sensing chip; the sealing colloid covers and fixes a plurality of symmetrical metal sheets to form an upper surface and a lower surface, and the upper surfaces of the first plate and the second plate are exposed from the upper surface of the sealing colloid; a plurality of wires electrically connected to the image sensor chip and the second board; the light-transmitting layer system is arranged on the first plate in a covering manner; the printed circuit board is provided with a through groove with the size slightly larger than that of the light-transmitting layer, is arranged above the first plate and is electrically connected with the first plate; the lens base is arranged on the printed circuit board; the lens cone is screwed in the lens base and forms an accommodating chamber provided with a light hole and an aspheric lens.

Description

影像感测器模组Image Sensor Module

技术领域technical field

本实用新型属于感测器模组,特别是一种影像感测器模组。The utility model belongs to a sensor module, in particular to an image sensor module.

背景技术Background technique

如图1所示,习知的影像感测器模组包括数个相互间隔排列的金属片10、凸缘层16、影像感测晶片18、印刷电路板19、透光层22、镜座24及镜筒27。As shown in FIG. 1 , a conventional image sensor module includes several metal sheets 10 arranged at intervals, a flange layer 16 , an image sensing chip 18 , a printed circuit board 19 , a light-transmitting layer 22 , and a mirror seat 24 And lens barrel 27.

金属片10形成有不同高度的第一板12及第二板14。The metal sheet 10 is formed with a first plate 12 and a second plate 14 of different heights.

凸缘层16系形成于数个金属片10的周缘及底面,使金属片10的第一板12的上面及第二板14的下面由凸缘层16露出,凸缘层16与数个金属片10形成用以容置影像感测晶片18的容置区20。The flange layer 16 is formed on the periphery and the bottom surface of several metal sheets 10, so that the top of the first plate 12 and the bottom of the second plate 14 of the metal sheet 10 are exposed by the flange layer 16, and the flange layer 16 is connected with several metal sheets 10. The sheet 10 forms an accommodating area 20 for accommodating the image sensing chip 18 .

印刷电路板19上设有主动元件21及被动元件23;印刷电路板19与数个金属片10的第二板14下面电连接。The active element 21 and the passive element 23 are arranged on the printed circuit board 19 ;

透光层22系盖设于凸缘层16上方,用以覆盖住影像感测晶片18,以使影像感测晶片18可透过透光层22接收光讯号。The transparent layer 22 is disposed on the flange layer 16 to cover the image sensing chip 18 so that the image sensing chip 18 can receive light signals through the transparent layer 22 .

镜座24系设置于凸缘层16上,其内形成贯通的容室25,于容室25周边形成有内螺纹26。The mirror base 24 is disposed on the flange layer 16 , and a through chamber 25 is formed therein, and an internal thread 26 is formed around the chamber 25 .

镜筒27系设置于镜座24的容室25内,其设有对应并螺锁于镜座24的内螺纹26上的外螺纹28,镜筒27内形成有贯通的容置室17,并于容置室17内由上而下设有透光孔29及非球面镜片11。The lens barrel 27 is arranged in the chamber 25 of the mirror base 24, and it is provided with an external thread 28 corresponding to and screwed on the internal thread 26 of the mirror base 24. The lens barrel 27 is formed with a through accommodation chamber 17, and A light-transmitting hole 29 and an aspheric lens 11 are arranged in the accommodating chamber 17 from top to bottom.

惟,习知的影像感测器模组虽可达到其创作的功效及目的,然,其整体结构中必须形成高度颇高的凸缘层16,用以使透光层22设置于其上,方可将影像感测晶片18覆盖住。如此,使其无法达到轻薄短小的需求;且凸缘层16与金属片10的第一板12交接处为直角状态,较易藏有杂质(particle),不但造成制程上清洗不易,且易影响到影像感测器模组的品质。However, although the known image sensor module can achieve its creative effect and purpose, a rather high flange layer 16 must be formed in its overall structure, so that the light-transmitting layer 22 is arranged on it. Only then can the image sensor chip 18 be covered. In this way, it is impossible to meet the requirements of lightness, thinness and shortness; and the junction of the flange layer 16 and the first plate 12 of the metal sheet 10 is at a right angle, which is easy to contain impurities (particles), which not only makes it difficult to clean during the manufacturing process, but also easily affects to the quality of the image sensor module.

发明内容Contents of the invention

本实用新型的目的是提供一种减小体积、提高品质、降低生产成本的影像感测器模组。The purpose of the utility model is to provide an image sensor module with reduced volume, improved quality and reduced production cost.

本实用新型包括数个相互对称排列的金属片、封胶体、影像感测晶片、数条导线、透光层、印刷电路板、镜座及镜筒;数个相互对称排列的金属片设有不同高度的第一、二板及连接第一、二板的第三板,使数个相互排列的金属片于中央部位形成凹槽;封胶体包覆固定数个相互对称的金属片而形成上、下表面,并使数金属片的第一、二板的上面由封胶体的上表面露出;影像感测晶片设于数个金属片所形成的凹槽内;数条导线系电连接于影像感测晶片及金属片的第二板上;透光层系盖设于数个金属片的第一板上;印刷电路板设有尺寸略大于透光层的透空槽,其设于金属片的第一板上方,并与每一第一板电连接,使影像感测晶片可透过透光层及透空槽接收光讯号;镜座形成有贯通的容室,于容室周边形成有内螺纹,其系设置于印刷电路板上;镜筒系设置于镜座的容室内,其设有对应并螺锁于镜座的内螺纹上的外螺纹,镜筒内形成贯通的容置室,并于容置室内由上而下设置透光孔及非球面镜片。The utility model comprises several symmetrically arranged metal sheets, sealing colloids, image sensing chips, several wires, a light-transmitting layer, a printed circuit board, a mirror seat and a lens barrel; several mutually symmetrically arranged metal sheets are provided with different The first and second boards with the highest height and the third board connecting the first and second boards make several mutually arranged metal sheets form grooves in the central part; The lower surface of the first and second plates of several metal sheets is exposed from the upper surface of the sealant; the image sensor chip is arranged in the groove formed by several metal sheets; several wires are electrically connected to the image sensor The second board of the test chip and the metal sheet; the light-transmitting layer is covered on the first board of several metal sheets; the printed circuit board is provided with a hollow groove slightly larger than the light-transmitting layer, which is located on the metal sheet above the first plate, and electrically connected with each first plate, so that the image sensor chip can receive light signals through the light-transmitting layer and the hollow groove; The thread is arranged on the printed circuit board; the lens barrel is arranged in the accommodation room of the mirror base, and it is provided with an external thread corresponding to and screwed on the inner thread of the mirror base, and a through accommodation chamber is formed in the lens barrel. In addition, a light-transmitting hole and an aspherical lens are arranged in the accommodation chamber from top to bottom.

其中:in:

数个相互排列的金属片于中央部位形成的凹槽内设有设置影像感测晶片的中间板。A middle plate for setting an image sensing chip is arranged in a groove formed by several metal sheets arranged mutually.

封胶体系以工业塑胶材料射出成型而包覆固定数个相互对称的金属片。The sealing system uses industrial plastic material injection molding to cover and fix several mutually symmetrical metal sheets.

由于本实用新型包括数个相互对称排列的金属片、封胶体、影像感测晶片、数条导线、透光层、印刷电路板、镜座及镜筒;金属片设有不同高度的第一、二板及连接第一、二板的第三板,使数个金属片形成凹槽;封胶体包覆固定数个相互对称的金属片而形成上、下表面,并使数金属片的第一、二板的上面由封胶体的上表面露出;影像感测晶片设于凹槽内;数条导线系电连接于影像感测晶片及金属片的第二板上;透光层系盖设于第一板上;印刷电路板设有尺寸略大于透光层的透空槽,其设于第一板上方并与第一板电连接;镜座设置于印刷电路板上;镜筒螺设于镜座内并形成设置透光孔及非球面镜片的容置室。由于金属片形成设置影像感测晶片的凹槽,可将影像感测晶片设置于凹槽内,而透光层则设置于金属片的第一板上,故因不必另于封胶体上形成凸缘层而可降低整体封装体的高度,以达到轻薄短小的目的;金属片的连接第一、二板的第三板为倾斜状,可降低杂质的残留及便于清除,提高其制程品质。不仅减小体积,而且提高品质、降低生产成本,从而达到本实用新型的目的。Since the utility model includes several symmetrically arranged metal sheets, sealing colloids, image sensing chips, several wires, light-transmitting layers, printed circuit boards, mirror holders and lens barrels; the metal sheets are provided with first, The second board and the third board connecting the first and second boards make several metal sheets form grooves; the sealant wraps and fixes several mutually symmetrical metal sheets to form the upper and lower surfaces, and makes the first of several metal sheets The upper surface of the second board is exposed by the upper surface of the sealant; the image sensing chip is arranged in the groove; several wires are electrically connected to the second board of the image sensing chip and the metal sheet; the light-transmitting layer is covered on the On the first board; the printed circuit board is provided with a transparent groove slightly larger than the light-transmitting layer, which is arranged above the first board and electrically connected with the first board; the mirror base is arranged on the printed circuit board; the lens barrel is screwed on An accommodating chamber for setting the light-transmitting hole and the aspheric lens is formed in the mirror seat. Since the metal sheet forms a groove for setting the image sensing chip, the image sensing chip can be placed in the groove, and the light-transmitting layer is arranged on the first plate of the metal sheet, so there is no need to form a protrusion on the encapsulant. Insulation layer can reduce the height of the overall package, so as to achieve the purpose of lightness and shortness; the third board connecting the first and second boards of the metal sheet is inclined, which can reduce the residue of impurities and facilitate removal, improving its process quality. Not only the volume is reduced, but also the quality is improved and the production cost is reduced, so as to achieve the purpose of the utility model.

附图说明Description of drawings

图1、为习知的影像感测器模组结构示意剖视图。FIG. 1 is a schematic cross-sectional view of a conventional image sensor module structure.

图2、为本实用新型分解结构示意剖视图。Fig. 2 is a schematic sectional view of the exploded structure of the utility model.

图3、为本实用新型结构示意剖视图。Fig. 3 is a schematic cross-sectional view of the structure of the utility model.

具体实施方式Detailed ways

如图2、图3所示,本实用新型包括数个相互对称排列的金属片30、封胶体31、影像感测晶片33、数条导线35、透光层37、印刷电路板39、镜座41及镜筒43。As shown in Figure 2 and Figure 3, the utility model includes several mutually symmetrically arranged metal sheets 30, a sealant 31, an image sensing chip 33, several wires 35, a light-transmitting layer 37, a printed circuit board 39, and a mirror seat 41 and lens barrel 43.

数个相互对称排列的金属片30(Leadfram)设有不同高度的第一板32、第二板34及连接第一、二板32、34的第三板36,使数个相互排列的金属片30于中央部位形成内设中间板40的凹槽38。Several mutually symmetrically arranged metal sheets 30 (Leadfram) are provided with a first plate 32, a second plate 34 of different heights and a third plate 36 connecting the first and second plates 32, 34, so that several mutually arranged metal sheets 30 forms a groove 38 in the central portion of which the middle plate 40 is disposed.

封胶体31系为工业塑胶材料,其系以射出成型方式包覆固定数个相互对称的金属片30而形成上表面42及下表面44,并使数金属片30的第一、二板32、34的上面由封胶体31的上表面42露出。The encapsulant 31 is an industrial plastic material, which covers and fixes several mutually symmetrical metal sheets 30 by injection molding to form an upper surface 42 and a lower surface 44, and makes the first and second plates 32, 32, 34 is exposed by the upper surface 42 of the encapsulant 31 .

影像感测晶片33系设于数个金属片30所形成的凹槽38内,并位于中间板40上方。The image sensor chip 33 is disposed in the groove 38 formed by the metal sheets 30 and located above the middle plate 40 .

数条导线35系电连接于影像感测晶片33及金属片30的第二板34上。Several wires 35 are electrically connected to the image sensing chip 33 and the second board 34 of the metal sheet 30 .

透光层37系盖设于数个金属片30的第一板32上,使影像感测晶片33可透过透光层37接收光讯号。The transparent layer 37 is covered on the first plate 32 of the plurality of metal sheets 30 , so that the image sensing chip 33 can receive light signals through the transparent layer 37 .

印刷电路板39设有尺寸略大于透光层37的透空槽45。印刷电路板39系设于金属片30的第一板32上方,并与每一第一板32电连接,使影像感测晶片33可透过透光层37及透空槽45接收光讯号。The printed circuit board 39 is provided with a hollow groove 45 slightly larger in size than the transparent layer 37 . The printed circuit board 39 is disposed above the first board 32 of the metal sheet 30 and is electrically connected to each first board 32 , so that the image sensor chip 33 can receive light signals through the transparent layer 37 and the hollow slot 45 .

镜座41形成有贯通的容室46,于容室46周边形成有内螺纹48,其系设置于印刷电路板39上。The mirror base 41 is formed with a through chamber 46 , and an internal thread 48 is formed around the chamber 46 , which is arranged on the printed circuit board 39 .

镜筒43系设置于镜座41的容室46内,其设有对应并螺锁于镜座41的内螺纹48上的外螺纹50,镜筒43内形成贯通的容置室52,并于容置室52内由上而下设置透光孔54及非球面镜片56。The lens barrel 43 is arranged in the chamber 46 of the mirror base 41, and it is provided with an external thread 50 corresponding to and screwed on the internal thread 48 of the mirror base 41. A through accommodation chamber 52 is formed in the lens barrel 43. A light transmission hole 54 and an aspheric lens 56 are arranged in the accommodating chamber 52 from top to bottom.

如上所述,本实用新型具有下列优点:As mentioned above, the utility model has the following advantages:

1、由于金属片30形成设置影像感测晶片33的凹槽38,可将影像感测晶片33设置于凹槽38内,而透光层37则可设置于金属片30的第一板32上,故因不必另于封胶体31上形成凸缘层而可降低整体封装体的高度,以达到轻薄短小的目的。1. Since the metal sheet 30 forms a groove 38 for setting the image sensing chip 33, the image sensing chip 33 can be arranged in the groove 38, and the light-transmitting layer 37 can be arranged on the first plate 32 of the metal sheet 30 Therefore, the height of the overall package can be reduced because there is no need to form a flange layer on the sealing body 31, so as to achieve the purpose of lightness, thinness and compactness.

2、金属片30的连接第一、二板32、34的第三板36为倾斜状,可降低杂质(particle)的残留及便于清除,以达到提高其制程品质的目的。2. The third plate 36 connecting the first and second plates 32 and 34 of the metal sheet 30 is inclined, which can reduce the residue of impurities and facilitate removal, so as to improve the process quality.

Claims (3)

1、一种影像感测器模组,它包括数个相互对称排列的金属片、封胶体、影像感测晶片、数条导线、透光层、印刷电路板、镜座及镜筒;每一金属片设有不同高度的第一、二板;封胶体包覆固定数个相互对称的金属片而形成上、下表面,并使金属片的第一板的上面由封胶体的上表面露出;数条导线系电连接影像感测晶片;镜座形成有贯通的容室,于容室周边形成有内螺纹,其系设置于印刷电路板上;镜筒系设置于镜座的容室内,其设有对应并螺锁于镜座的内螺纹上的外螺纹,镜筒内形成贯通的容置室,并于容置室内由上而下设置透光孔及非球面镜片;其特征在于所述的金属片设有连接第一、二板的第三板,以使数个相互排列的金属片于中央部位形成设置影像感测晶片的凹槽;金属片第二板的上面由封胶体的上表面露出,并与电连接于影像感测晶片的数条导线电连接;透光层系盖设于数个金属片的第一板上;印刷电路板设有尺寸略大于透光层的透空槽;印刷电路板系设于金属片的第一板上方,并与每一第一板电连接,使影像感测晶片可透过透光层及透空槽接收光讯号。1. An image sensor module, which includes several symmetrically arranged metal sheets, a sealing body, an image sensing chip, several wires, a light-transmitting layer, a printed circuit board, a lens holder, and a lens barrel; each The metal sheet is provided with first and second plates of different heights; the sealing body wraps and fixes several mutually symmetrical metal sheets to form the upper and lower surfaces, and the upper surface of the first plate of the metal sheet is exposed from the upper surface of the sealing body; Several wires are electrically connected to the image sensing chip; the mirror base is formed with a through chamber, and an internal thread is formed around the chamber, which is arranged on the printed circuit board; the lens barrel is arranged in the chamber of the mirror holder, and There are external threads corresponding to and screw-locked on the internal threads of the mirror base, and a through accommodating chamber is formed in the lens barrel, and light-transmitting holes and aspheric lenses are arranged in the accommodating chamber from top to bottom; it is characterized in that The metal sheet is provided with a third plate connecting the first and second plates, so that several metal sheets arranged with each other form a groove for setting the image sensor chip in the central part; the upper surface of the second metal sheet is formed by the upper surface The surface is exposed and electrically connected to several wires that are electrically connected to the image sensor chip; the light-transmitting layer is covered on the first plate of several metal sheets; the printed circuit board is provided with a hole slightly larger than the light-transmitting layer groove; the printed circuit board is arranged above the first plate of the metal sheet, and is electrically connected with each first plate, so that the image sensing chip can receive light signals through the light-transmitting layer and the hollow groove. 2、根据权利要求1所述的影像感测器模组,其特征在于所述的数个相互排列的金属片于中央部位形成的凹槽内设有设置影像感测晶片的中间板。2 . The image sensor module according to claim 1 , wherein a middle plate for setting the image sensor chip is arranged in a groove formed in the central portion of the plurality of mutually arranged metal sheets. 3、根据权利要求1所述的影像感测器模组,其特征在于所述的封胶体系以工业塑胶材料射出成型而包覆固定数个相互对称的金属片。3. The image sensor module according to claim 1, wherein the sealing system is formed by injection molding of industrial plastic materials to cover and fix several mutually symmetrical metal sheets.
CNU032720270U 2003-06-17 2003-06-17 Image sensor module Expired - Fee Related CN2638245Y (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100487881C (en) * 2005-12-17 2009-05-13 比亚迪股份有限公司 Method for return repairing image sensing mould set and clamp therewith
CN112154372A (en) * 2019-07-29 2020-12-29 深圳市大疆创新科技有限公司 Shooting equipment, cloud platform device and unmanned aerial vehicle
CN112166375A (en) * 2019-07-29 2021-01-01 深圳市大疆创新科技有限公司 Filming equipment, gimbal devices and drones

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100487881C (en) * 2005-12-17 2009-05-13 比亚迪股份有限公司 Method for return repairing image sensing mould set and clamp therewith
CN112154372A (en) * 2019-07-29 2020-12-29 深圳市大疆创新科技有限公司 Shooting equipment, cloud platform device and unmanned aerial vehicle
CN112166375A (en) * 2019-07-29 2021-01-01 深圳市大疆创新科技有限公司 Filming equipment, gimbal devices and drones

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