CN2638245Y - Image sensor module - Google Patents
Image sensor module Download PDFInfo
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- CN2638245Y CN2638245Y CNU032720270U CN03272027U CN2638245Y CN 2638245 Y CN2638245 Y CN 2638245Y CN U032720270 U CNU032720270 U CN U032720270U CN 03272027 U CN03272027 U CN 03272027U CN 2638245 Y CN2638245 Y CN 2638245Y
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- 239000002184 metal Substances 0.000 claims abstract description 50
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 238000001746 injection moulding Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000004308 accommodation Effects 0.000 description 5
- 239000000565 sealant Substances 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型属于感测器模组,特别是一种影像感测器模组。The utility model belongs to a sensor module, in particular to an image sensor module.
背景技术Background technique
如图1所示,习知的影像感测器模组包括数个相互间隔排列的金属片10、凸缘层16、影像感测晶片18、印刷电路板19、透光层22、镜座24及镜筒27。As shown in FIG. 1 , a conventional image sensor module includes several metal sheets 10 arranged at intervals, a flange layer 16 , an image sensing chip 18 , a printed circuit board 19 , a light-transmitting layer 22 , and a mirror seat 24 And lens barrel 27.
金属片10形成有不同高度的第一板12及第二板14。The metal sheet 10 is formed with a first plate 12 and a second plate 14 of different heights.
凸缘层16系形成于数个金属片10的周缘及底面,使金属片10的第一板12的上面及第二板14的下面由凸缘层16露出,凸缘层16与数个金属片10形成用以容置影像感测晶片18的容置区20。The flange layer 16 is formed on the periphery and the bottom surface of several metal sheets 10, so that the top of the first plate 12 and the bottom of the second plate 14 of the metal sheet 10 are exposed by the flange layer 16, and the flange layer 16 is connected with several metal sheets 10. The sheet 10 forms an accommodating area 20 for accommodating the image sensing chip 18 .
印刷电路板19上设有主动元件21及被动元件23;印刷电路板19与数个金属片10的第二板14下面电连接。The active element 21 and the passive element 23 are arranged on the printed circuit board 19 ;
透光层22系盖设于凸缘层16上方,用以覆盖住影像感测晶片18,以使影像感测晶片18可透过透光层22接收光讯号。The transparent layer 22 is disposed on the flange layer 16 to cover the image sensing chip 18 so that the image sensing chip 18 can receive light signals through the transparent layer 22 .
镜座24系设置于凸缘层16上,其内形成贯通的容室25,于容室25周边形成有内螺纹26。The mirror base 24 is disposed on the flange layer 16 , and a through chamber 25 is formed therein, and an internal thread 26 is formed around the chamber 25 .
镜筒27系设置于镜座24的容室25内,其设有对应并螺锁于镜座24的内螺纹26上的外螺纹28,镜筒27内形成有贯通的容置室17,并于容置室17内由上而下设有透光孔29及非球面镜片11。The lens barrel 27 is arranged in the chamber 25 of the mirror base 24, and it is provided with an external thread 28 corresponding to and screwed on the internal thread 26 of the mirror base 24. The lens barrel 27 is formed with a through accommodation chamber 17, and A light-transmitting hole 29 and an aspheric lens 11 are arranged in the accommodating chamber 17 from top to bottom.
惟,习知的影像感测器模组虽可达到其创作的功效及目的,然,其整体结构中必须形成高度颇高的凸缘层16,用以使透光层22设置于其上,方可将影像感测晶片18覆盖住。如此,使其无法达到轻薄短小的需求;且凸缘层16与金属片10的第一板12交接处为直角状态,较易藏有杂质(particle),不但造成制程上清洗不易,且易影响到影像感测器模组的品质。However, although the known image sensor module can achieve its creative effect and purpose, a rather high flange layer 16 must be formed in its overall structure, so that the light-transmitting layer 22 is arranged on it. Only then can the image sensor chip 18 be covered. In this way, it is impossible to meet the requirements of lightness, thinness and shortness; and the junction of the flange layer 16 and the first plate 12 of the metal sheet 10 is at a right angle, which is easy to contain impurities (particles), which not only makes it difficult to clean during the manufacturing process, but also easily affects to the quality of the image sensor module.
发明内容Contents of the invention
本实用新型的目的是提供一种减小体积、提高品质、降低生产成本的影像感测器模组。The purpose of the utility model is to provide an image sensor module with reduced volume, improved quality and reduced production cost.
本实用新型包括数个相互对称排列的金属片、封胶体、影像感测晶片、数条导线、透光层、印刷电路板、镜座及镜筒;数个相互对称排列的金属片设有不同高度的第一、二板及连接第一、二板的第三板,使数个相互排列的金属片于中央部位形成凹槽;封胶体包覆固定数个相互对称的金属片而形成上、下表面,并使数金属片的第一、二板的上面由封胶体的上表面露出;影像感测晶片设于数个金属片所形成的凹槽内;数条导线系电连接于影像感测晶片及金属片的第二板上;透光层系盖设于数个金属片的第一板上;印刷电路板设有尺寸略大于透光层的透空槽,其设于金属片的第一板上方,并与每一第一板电连接,使影像感测晶片可透过透光层及透空槽接收光讯号;镜座形成有贯通的容室,于容室周边形成有内螺纹,其系设置于印刷电路板上;镜筒系设置于镜座的容室内,其设有对应并螺锁于镜座的内螺纹上的外螺纹,镜筒内形成贯通的容置室,并于容置室内由上而下设置透光孔及非球面镜片。The utility model comprises several symmetrically arranged metal sheets, sealing colloids, image sensing chips, several wires, a light-transmitting layer, a printed circuit board, a mirror seat and a lens barrel; several mutually symmetrically arranged metal sheets are provided with different The first and second boards with the highest height and the third board connecting the first and second boards make several mutually arranged metal sheets form grooves in the central part; The lower surface of the first and second plates of several metal sheets is exposed from the upper surface of the sealant; the image sensor chip is arranged in the groove formed by several metal sheets; several wires are electrically connected to the image sensor The second board of the test chip and the metal sheet; the light-transmitting layer is covered on the first board of several metal sheets; the printed circuit board is provided with a hollow groove slightly larger than the light-transmitting layer, which is located on the metal sheet above the first plate, and electrically connected with each first plate, so that the image sensor chip can receive light signals through the light-transmitting layer and the hollow groove; The thread is arranged on the printed circuit board; the lens barrel is arranged in the accommodation room of the mirror base, and it is provided with an external thread corresponding to and screwed on the inner thread of the mirror base, and a through accommodation chamber is formed in the lens barrel. In addition, a light-transmitting hole and an aspherical lens are arranged in the accommodation chamber from top to bottom.
其中:in:
数个相互排列的金属片于中央部位形成的凹槽内设有设置影像感测晶片的中间板。A middle plate for setting an image sensing chip is arranged in a groove formed by several metal sheets arranged mutually.
封胶体系以工业塑胶材料射出成型而包覆固定数个相互对称的金属片。The sealing system uses industrial plastic material injection molding to cover and fix several mutually symmetrical metal sheets.
由于本实用新型包括数个相互对称排列的金属片、封胶体、影像感测晶片、数条导线、透光层、印刷电路板、镜座及镜筒;金属片设有不同高度的第一、二板及连接第一、二板的第三板,使数个金属片形成凹槽;封胶体包覆固定数个相互对称的金属片而形成上、下表面,并使数金属片的第一、二板的上面由封胶体的上表面露出;影像感测晶片设于凹槽内;数条导线系电连接于影像感测晶片及金属片的第二板上;透光层系盖设于第一板上;印刷电路板设有尺寸略大于透光层的透空槽,其设于第一板上方并与第一板电连接;镜座设置于印刷电路板上;镜筒螺设于镜座内并形成设置透光孔及非球面镜片的容置室。由于金属片形成设置影像感测晶片的凹槽,可将影像感测晶片设置于凹槽内,而透光层则设置于金属片的第一板上,故因不必另于封胶体上形成凸缘层而可降低整体封装体的高度,以达到轻薄短小的目的;金属片的连接第一、二板的第三板为倾斜状,可降低杂质的残留及便于清除,提高其制程品质。不仅减小体积,而且提高品质、降低生产成本,从而达到本实用新型的目的。Since the utility model includes several symmetrically arranged metal sheets, sealing colloids, image sensing chips, several wires, light-transmitting layers, printed circuit boards, mirror holders and lens barrels; the metal sheets are provided with first, The second board and the third board connecting the first and second boards make several metal sheets form grooves; the sealant wraps and fixes several mutually symmetrical metal sheets to form the upper and lower surfaces, and makes the first of several metal sheets The upper surface of the second board is exposed by the upper surface of the sealant; the image sensing chip is arranged in the groove; several wires are electrically connected to the second board of the image sensing chip and the metal sheet; the light-transmitting layer is covered on the On the first board; the printed circuit board is provided with a transparent groove slightly larger than the light-transmitting layer, which is arranged above the first board and electrically connected with the first board; the mirror base is arranged on the printed circuit board; the lens barrel is screwed on An accommodating chamber for setting the light-transmitting hole and the aspheric lens is formed in the mirror seat. Since the metal sheet forms a groove for setting the image sensing chip, the image sensing chip can be placed in the groove, and the light-transmitting layer is arranged on the first plate of the metal sheet, so there is no need to form a protrusion on the encapsulant. Insulation layer can reduce the height of the overall package, so as to achieve the purpose of lightness and shortness; the third board connecting the first and second boards of the metal sheet is inclined, which can reduce the residue of impurities and facilitate removal, improving its process quality. Not only the volume is reduced, but also the quality is improved and the production cost is reduced, so as to achieve the purpose of the utility model.
附图说明Description of drawings
图1、为习知的影像感测器模组结构示意剖视图。FIG. 1 is a schematic cross-sectional view of a conventional image sensor module structure.
图2、为本实用新型分解结构示意剖视图。Fig. 2 is a schematic sectional view of the exploded structure of the utility model.
图3、为本实用新型结构示意剖视图。Fig. 3 is a schematic cross-sectional view of the structure of the utility model.
具体实施方式Detailed ways
如图2、图3所示,本实用新型包括数个相互对称排列的金属片30、封胶体31、影像感测晶片33、数条导线35、透光层37、印刷电路板39、镜座41及镜筒43。As shown in Figure 2 and Figure 3, the utility model includes several mutually symmetrically arranged
数个相互对称排列的金属片30(Leadfram)设有不同高度的第一板32、第二板34及连接第一、二板32、34的第三板36,使数个相互排列的金属片30于中央部位形成内设中间板40的凹槽38。Several mutually symmetrically arranged metal sheets 30 (Leadfram) are provided with a
封胶体31系为工业塑胶材料,其系以射出成型方式包覆固定数个相互对称的金属片30而形成上表面42及下表面44,并使数金属片30的第一、二板32、34的上面由封胶体31的上表面42露出。The
影像感测晶片33系设于数个金属片30所形成的凹槽38内,并位于中间板40上方。The
数条导线35系电连接于影像感测晶片33及金属片30的第二板34上。
透光层37系盖设于数个金属片30的第一板32上,使影像感测晶片33可透过透光层37接收光讯号。The
印刷电路板39设有尺寸略大于透光层37的透空槽45。印刷电路板39系设于金属片30的第一板32上方,并与每一第一板32电连接,使影像感测晶片33可透过透光层37及透空槽45接收光讯号。The printed
镜座41形成有贯通的容室46,于容室46周边形成有内螺纹48,其系设置于印刷电路板39上。The
镜筒43系设置于镜座41的容室46内,其设有对应并螺锁于镜座41的内螺纹48上的外螺纹50,镜筒43内形成贯通的容置室52,并于容置室52内由上而下设置透光孔54及非球面镜片56。The
如上所述,本实用新型具有下列优点:As mentioned above, the utility model has the following advantages:
1、由于金属片30形成设置影像感测晶片33的凹槽38,可将影像感测晶片33设置于凹槽38内,而透光层37则可设置于金属片30的第一板32上,故因不必另于封胶体31上形成凸缘层而可降低整体封装体的高度,以达到轻薄短小的目的。1. Since the
2、金属片30的连接第一、二板32、34的第三板36为倾斜状,可降低杂质(particle)的残留及便于清除,以达到提高其制程品质的目的。2. The
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CNU032720270U CN2638245Y (en) | 2003-06-17 | 2003-06-17 | Image sensor module |
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CNU032720270U CN2638245Y (en) | 2003-06-17 | 2003-06-17 | Image sensor module |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100487881C (en) * | 2005-12-17 | 2009-05-13 | 比亚迪股份有限公司 | Method for return repairing image sensing mould set and clamp therewith |
CN112154372A (en) * | 2019-07-29 | 2020-12-29 | 深圳市大疆创新科技有限公司 | Shooting equipment, cloud platform device and unmanned aerial vehicle |
CN112166375A (en) * | 2019-07-29 | 2021-01-01 | 深圳市大疆创新科技有限公司 | Filming equipment, gimbal devices and drones |
-
2003
- 2003-06-17 CN CNU032720270U patent/CN2638245Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100487881C (en) * | 2005-12-17 | 2009-05-13 | 比亚迪股份有限公司 | Method for return repairing image sensing mould set and clamp therewith |
CN112154372A (en) * | 2019-07-29 | 2020-12-29 | 深圳市大疆创新科技有限公司 | Shooting equipment, cloud platform device and unmanned aerial vehicle |
CN112166375A (en) * | 2019-07-29 | 2021-01-01 | 深圳市大疆创新科技有限公司 | Filming equipment, gimbal devices and drones |
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Granted publication date: 20040901 |