CN2638243Y - Image sensor module structure - Google Patents

Abstract

The utility model provides an image sensor module structure, it including: a substrate including a plurality of metal sheets arranged at intervals, the substrate having an upper surface and a lower surface, the lower surface forming a cavity, the upper surface having an opening communicating with the cavity, each metal sheet having a first plate and a second plate of different heights, the first and second plates exposing the lower surface; a flange layer integrally formed on the periphery of the upper surface of the substrate to form a chamber with the substrate, wherein the chamber is provided with internal threads; an image sensing chip arranged in the recess of the substrate and electrically connected with the first plate; a light-transmitting layer arranged on the upper surface of the substrate and covering the opening; and a lens cone, which is provided with an upper end surface and a lower end surface, and is internally provided with a light-transmitting area, and an external thread is formed between the upper end surface and the lower end surface so as to be screwed with the internal thread of the flange layer. Therefore, the utility model discloses can simplify the spare part, make manufacturing, equipment and dismantlement more convenient.

Description

The image sensor modular construction

Technical field

The utility model is a kind of image sensor modular construction, refers in particular to a kind of image sensor modular construction of simplifying spare part and being convenient to make, assembling and dismantling.

Background technology

See also Fig. 1, be the schematic diagram of known image sensor modular construction, it includes:

One microscope base 10, it is provided with a upper surface 12, a lower surface 14 and an accommodation chamber 16 by 12 perforation lower surfaces 14, upper surface, and the accommodation chamber 16 of microscope base 10 is formed with internal thread 18; One lens barrel 20, it is provided with an external screw thread 22, be placed in this accommodation chamber 16 by the upper surface 12 of microscope base 10, and with internal thread 18 screw locks of microscope base 10, and from top to bottom be provided with a transparent area 24, aspherical lens 26 and infrared ray filter glass 28 in the lens barrel 20;

One image sensor 30, it is provided with a substrate 31, and it is a printed circuit board (PCB), and it is provided with one first 32 and 1 second 33, the first 32 and is provided with 34, the second 33 of first contacts and is provided with second contact 35; One flange layer 36, it is the shaped as frame shape and is arranged at surface of first base 32 peripheries; One image sensing wafer 37, it is located on the surface of first base 32, and is electrically connected with first contact 34 of substrate by plural wires 38; And a photic zone 39, glutinous being located on the flange layer 36 is in order to cover image sensing wafer 37 and plural wires 38.

Image sensor 30 is sticked together the lower surface 14 of being fixed in microscope base 10 by photic zone 39, and by adjusting the degree of depth that lens barrel 20 and microscope base 10 screw togather, with the focal length of 39 of the photic zones of the aspherical lens 26 of control lens barrel 20 and image sensor 30.

But above-mentioned known image sensor modular construction has following shortcoming when assembling, that is:

1. image sensor 30 is attached to against photic zone 39 on the lower surface 14 of microscope base 10, therefore, when in this module uses the situation of damage being arranged, can't substitute image sensor 30, and entire module must be scrapped, and will cause the waste of resource.

2. photic zone 39 is attached to viscose on the lower surface 14 of microscope base 10, and viscose easily pollutes photic zone 39 surfaces on processing procedure, and it is bad to cause the light signal to receive.

3. when carrying out the assembling of module, photic zone 39 must carry out contraposition with aspherical lens 26 accurately, and fixes with the viscose adhesive means, in case contraposition precision to some extent during deviation, entire module just can't be gone again and be re-assemblied, and must be scrapped.

4. microscope base 10 must be set separately, in order to lens barrel 20 and image sensor 30 are combined.

5. the substrate of image sensor 30 is a printed circuit board (PCB), the manufacturing cost height.

Summary of the invention

Supervise in this, creator of the present utility model this in the spirit of keeping on improving, innovate breakthrough, and create image sensor modular construction of the present utility model, it can simplify the module spare part, it is more convenient that it is made.

Main purpose of the present utility model is to provide a kind of image sensor modular construction, and it has the effect of simplifying the module spare part, to reach the purpose that reduces production costs.

Another purpose of the present utility model is to provide a kind of image sensor modular construction, and it has the effect that reduces product size, to reach compact purpose.

Another purpose of the present utility model is to provide a kind of image sensor modular construction, and it can exempt to use printed circuit board (PCB), reaches the purpose that reduces production costs.

For reaching above-mentioned purpose, the technical solution of the utility model is as follows, and a kind of image sensor modular construction is characterized in that, include: a substrate, it includes the sheet metal that arrange a plurality of spaces, and this substrate is provided with a upper surface and a lower surface, and this lower surface forms a depression, this upper surface is provided with an opening and communicates with this depression, this each sheet metal is provided with first plate and second plate of differing heights, and this first plate is exposed by the depression of this substrate, and this second plate is exposed by the lower surface of substrate; One flange layer is integrally formed the upper surface periphery in substrate, makes with this substrate and forms a room, and it is provided with internal thread; One image sensing wafer, it is located in the depression of this substrate, and is electrically connected with this first plate; One photic zone is located at the upper surface of this substrate, and this opening is covered; And a lens barrel, it is provided with a upper surface and a lower surface, and is provided with a transmission region in it, is formed with an external screw thread between this upper surface and this lower surface, uses the internal screw-thread screw with this flange layer.

Therefore, can simplify spare part, make manufacturing, assembling and dismounting more convenient.

The utility model specifically has following advantage:

1. by the externally threaded screw lock mode of the internal thread and the lens barrel of flange layer, can be convenient to the assembling and the dismounting of module, make it can substitute maintenance and change spare part, and reach the effect that resource reclaims.

2. omit the design of known microscope base, have the effect that reduces product size, to reach compact structure.

3. substrate and flange layer are used the design of omitting known microscope base with plastic cement one ejection formation, have the effect of simplifying the module spare part and the effect that reduces the module production cost.

4. substrate and flange layer be with plastic cement one ejection formation, and make substrate be formed with the sheet metal that arrange a plurality of spaces, and so substrate does not then need the higher printed circuit board (PCB) of use cost.

Description of drawings

Fig. 1 is the schematic diagram of known image sensor modular construction.

Fig. 2 is the view sub-anatomy of the utility model image sensor modular construction.

Fig. 3 is the assembled sectional view of the utility model image sensor modular construction.

Fig. 4 is another embodiment cutaway view of the utility model image sensor modular construction.

Figure number explanation of the present utility model

Substrate ... 40 flange layers ... 42 image sensing wafers ... 44

Photic zone ... 46 adhesive bodies ... 47 lens barrels ... 48

Sheet metal ... 50 upper surfaces ... 52 lower surfaces ... 54

Depression ... 56 openings ... 58 first plates ... 60

Second plate ... 62 the 3rd plates ... 64 rooms ... 66

Internal thread ... 68 upper surfaces ... 70 lower surfaces ... 72

External screw thread ... 74 transmission regions ... 76 open-works ... 78

Aspherical lens ... 80 infrared ray filter glass, 82 grooves ... 84

Embodiment

Above-mentioned and other purpose of the present utility model, advantage and characteristic are more understood in depth by the detailed description of following preferred embodiment and with reference to graphic.

See also Fig. 2 and Fig. 3, the utility model includes a substrate 40, a flange layer 42, an image sensing wafer 44, a photic zone 46, an adhesive body 47 and a lens barrel 48, wherein:

Substrate 40 includes the sheet metal 50 that arrange a plurality of spaces, substrate 40 is provided with a upper surface 52 and a lower surface 54, lower surface 54 forms a depression 56, upper surface 52 is provided with an opening 58 and communicates with this depression 56, each sheet metal 50 is provided with first plate 60 and second plate 62 of differing heights, first plate 60 is exposed by the depression 56 of this substrate, this second plate 62 is exposed by the lower surface 54 of substrate, make first plate 60 as signal input end, second plate 62 is as signal output end, and first and second plate 60,62 is connected by one the 3rd plate 64.

Flange layer 42 and substrate 40 are with plastic cement one ejection formation, and upper surface 52 peripheries that it is formed at substrate 40 make and substrate 40 forms a room 66, and it is provided with internal thread 68.

Image sensing wafer 44 is located at the depression 56 of this substrate 40, and is electrically connected with first plate 60 of this sheet metal 50 to cover crystal type.

Photic zone 46 is a transparent glass, and its sticking upper surface 52 of being located at substrate 40 covers opening 58, receives the light signal so that image sensing wafer 44 can see through photic zone 46.

Adhesive body 47 is filled in the depression 56 of substrate 40, uses image sensing wafer 44 is coated.

Lens barrel 48 be provided with upper surface 70, a lower surface 72 and in the upper surface 70 and 72 of lower surfaces be formed with an external screw thread 74, and be provided with a transmission region 76 in it, transmission region 76 from top to bottom is formed with open-work 78, aspherical lens 80 and infrared ray filter glass 82 respectively, be formed with a groove 84 in the lower surface 72 of lens barrel 48 in addition, lens barrel 48 is screwed together in the internal thread 68 of flange layer 42 by external screw thread 74, and can adjust distance in room 66.

See also Fig. 4, be structurally improved another embodiment of the utility model image sensor module, wherein photic zone 46 can be combined into single eyeglass with the infrared ray filter glass of lens barrel 48, promptly has a photic zone 46 of infrared ray filter effect, like this, can simplify spare part and overall package processing procedure.

Thereby, the utlity model has following advantage:

1. by the screw lock mode of internal thread 68 with the external screw thread 74 of lens barrel 48 of flange layer 42, can be convenient to the assembling and the dismounting of module, make it can substitute maintenance and change spare part, and reach the effect that resource reclaims.

2. omit the design of known microscope base, have the effect that reduces product size, to reach compact structure.

3. substrate 40 and flange layer 42 are used the design of omitting known microscope base with plastic cement one ejection formation, have the effect of simplifying the module spare part and the effect that reduces the module production cost.

4. substrate 40 and flange layer 42 be with plastic cement one ejection formation, and make substrate be formed with the sheet metal that arrange a plurality of spaces, and so 40 of substrates do not need the higher printed circuit board (PCB) of use cost.

The specific embodiment that is proposed in the detailed description of preferred embodiment is only in order to be easy to illustrate technology contents of the present utility model, be not with the utility model narrow sense be limited to embodiment, all many variations that situation is done enforcement according to spirit of the present utility model and interest field all belongs to scope of the present utility model.

Claims (7)

1. An image sensor module structure, characterized in that it includes: a substrate, which includes a plurality of metal sheets arranged at intervals, the substrate is provided with an upper surface and a lower surface, and the lower surface forms a concave The upper surface is provided with an opening communicating with the recess, and each metal sheet is provided with a first plate and a second plate of different heights, the first plate is exposed from the recess of the base plate, and the second plate is exposed from the base plate The lower surface of the substrate is exposed; a flange layer is integrally formed on the periphery of the upper surface of the substrate to form a chamber with the substrate, which is provided with internal threads; an image sensing chip is arranged in the cavity of the substrate, and electrically connected with the first board; a light-transmitting layer arranged on the upper surface of the substrate to cover the opening; and a lens barrel with an upper end surface and a lower end surface, and a light-transmitting area inside, the An external thread is formed between the upper end surface and the lower end surface, and is screwed with the internal thread of the flange layer. 2 . The image sensor module structure according to claim 1 , wherein the transparent area of the lens barrel is respectively formed with a through hole, an aspheric lens and an infrared filter lens from top to bottom. 3 . The image sensor module structure according to claim 1 , wherein the substrate and the flange layer are integrally injection molded. 4 . 4 . The image sensor module structure according to claim 1 , wherein the image sensor chip is electrically connected to the first plate of the substrate in a flip-chip manner. 5. The image sensor module structure according to claim 1, wherein the transparent layer is transparent glass. 6 . The image sensor module structure according to claim 1 , wherein an encapsulant is provided in the cavity of the substrate to cover the image sensor chip. 7 . 7. The image sensor module structure according to claim 1, wherein the light-transmitting area of the lens barrel is respectively formed with a through-hole and an aspheric lens from top to bottom, and the light-transmitting layer has an infrared filter Translucent layer for light effects.

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