CN100487881C - Method for return repairing image sensing mould set and clamp therewith - Google Patents
Method for return repairing image sensing mould set and clamp therewith Download PDFInfo
- Publication number
- CN100487881C CN100487881C CNB2005100223689A CN200510022368A CN100487881C CN 100487881 C CN100487881 C CN 100487881C CN B2005100223689 A CNB2005100223689 A CN B2005100223689A CN 200510022368 A CN200510022368 A CN 200510022368A CN 100487881 C CN100487881 C CN 100487881C
- Authority
- CN
- China
- Prior art keywords
- pcb board
- wafer
- storage tank
- base plate
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000003860 storage Methods 0.000 claims description 26
- 238000010926 purge Methods 0.000 claims description 16
- 230000008439 repair process Effects 0.000 claims description 9
- 230000002950 deficient Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- 238000007664 blowing Methods 0.000 abstract 1
- 239000000428 dust Substances 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 24
- 230000000875 corresponding effect Effects 0.000 description 11
- 238000005538 encapsulation Methods 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 230000001939 inductive effect Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000368 destabilizing effect Effects 0.000 description 2
- 238000011990 functional testing Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000012958 reprocessing Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 206010020751 Hypersensitivity Diseases 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 208000026935 allergic disease Diseases 0.000 description 1
- 208000003464 asthenopia Diseases 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000009610 hypersensitivity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention is concerned with the reworking method for image inducting module, including the following steps: 1) removes the clamp to separate the camera lens module group of the camera module group and PCB board fixing with the camera wafer; 2) fixes the PCB on the clamp and emerges the wafer; 3) blows the dust on the wafer inducting area by the blowing equipment; 4) sets the camera lens on the PCB board. The invention can improve the reworking effect efficiently, and reduce the eye tire of the operator.
Description
[technical field]
The invention relates to a kind of repair method of image sensing module and reprocess anchor clamps.
[background technology]
In the field of semiconductor packages, the encapsulation of image sensing module is a kind of more special packaged type, in view of the high accuracy of its sensitive chip, to the hypersensitivity of grit, so for the technological requirement of its encapsulation very high standard is arranged.
The CMOS camera is in the process of encapsulation, need under the environment of high-cleanness, high, operate (ten grades), but because destabilizing factors such as environment, equipment, in the process of personnel's operation, the difficult intrusion of avoiding small pollutant, after flowing out, this series products after tested the time, will show the phenomenon of stain, dirty or dirty point at corresponding position indicator.In addition, when semiconductor packages need adopt ACF conducting resinl hot pressing mode to carry out the signal transmission, also be easy to generate unusual.
1): the encapsulation of CMOS camera will be finished with interior environment at ten grades, exactly a naked sensitization wafer is fixed on the pcb board by D/B technology (promptly by being exclusively used in the solid brilliant machine of fixing naked wafer), stamp gold thread (signal of sensitive chip is transferred on the pcb board) by W/B (promptly on naked wafer, drawing the equipment nation line machine of gold thread or silver-colored line), again the camera lens module is installed on the pcb board that posts chip, behind the products solidifying, go to pre-subsides of ACF and hot pressing FPC operation, the functional test of being correlated with then, by observing computer test platform display image effect, judge the quality of camera.Comprising: shooting is unusual, stain, dirty, dirty point, phenomenon such as fuzzy.For all bad, in view of material, processing cost higher, it is impossible that these type of product are scrapped, have the relevant bad method of removing in the industry, a base of starting shooting such as cutting with a knife, by microscopic examination wafer photosensitive area surface, with the sticking grit that removes photosensitive area of viscose glue rod, carry out the encapsulation of camera lens more simultaneously again.Because the difficulty that small product size is less, remove encapsulation is big, through the viscose glue rod is reprocessed after the not high factor of yield, so success rate and efficient that lifting is reprocessed are very important.
2): semiconductor packages industry (comprising camera) generally adopts ACF glue (Anisotropically conductive glue) after hot pressing when carrying out the transmission of point-to-point signal, realizes the purpose of transmission.Because equipment, personnel's destabilizing factor, the influence of undesirable elements such as the temperature inequality of hot pressing, point-to-point off normal is easy to cause the signal transmission to interrupt, thereby produces the operation irregularity of product.At this badness, the general way of tearing connection that adopts in the industry, the cull with cleaning fluid cleaning weld uses new raw material to come pressure welding again, and this method can not effectively be utilized the raw material that take off once more, so that production cost improves.
[summary of the invention]
The object of the present invention is to provide a kind of can the raising to reprocess efficient and the anchor clamps that guarantee to reprocess the repair method of the image sensing module of stablizing yields and be exclusively used in this method.
The object of the present invention is achieved like this: the repair method of this image sensing module comprises the steps: 1) the camera lens module of camera module and the pcb board that is fixed with the camera wafer are separated; 2) be fixed on isolated pcb board on the purge anchor clamps and make outside wafer is exposed to; 3) blow down grit on this wafer photosensitive region by the clean air pressure gun of vacuum ionic; 4) non-defective unit camera lens module is installed on the pcb board.
Described step 3) is to carry out under microscopical assisting.
These purge anchor clamps comprise base plate and cover plate, recessed at least one the wafer storage tank that is provided with of this base plate, also be concaved with the pcb board storage tank that is used for ccontaining pcb board on the described base plate, described wafer storage tank is connected with the pcb board storage tank, the intersection of this two storage tank is formed with step, and the degree of depth of this wafer storage tank is less than the degree of depth of pcb board storage tank, this cover plate runs through and is provided with at least one through hole, this through hole also aligns mutually with the wafer storage tank is corresponding one by one, and the correspondence position of this cover plate and base plate is provided with adapting device.
Adapting device on the described base plate is at least two reference columns, and the adapting device on the cover plate is at least two location holes, and reference column is corresponding one by one with location hole and match.
Compared with prior art, the present invention has following advantage: the present invention can effectively improve the efficient of reprocessing, and guarantees to reprocess stable yields, and can reduce personnel operation and treat the damage ratio of reprocessing product, reduces operator's eye fatigue degree.
[description of drawings]
Fig. 1 is the remover-and-replacer stereogram of invention.
Fig. 2 is the stereogram of another angle of remover-and-replacer of the present invention.
Fig. 3 is the partial enlarged drawing at A indication place among Fig. 2.
Fig. 4 is the stereogram that the remover-and-replacer of the present invention of image sensing module is installed.
Fig. 5 is the three-dimensional exploded view of remover-and-replacer of the present invention.
Fig. 6 is the partial enlarged drawing at B indication place among Fig. 5.
Fig. 7 is the three-dimensional exploded view of purge anchor clamps of the present invention.
Fig. 8 is the three-dimensional exploded view after pcb board of the present invention is installed to the purge anchor clamps.
Fig. 9 is a flow chart of the present invention.
[embodiment]
See also Fig. 1 to Fig. 9, the repair method of image sensing module of the present invention is to be used for the camera module that contains camera wafer and camera lens module is reprocessed.This repair method be by remover-and-replacer make the pcb board that is fixed with the camera wafer and camera lens mould splits from, utilize the pcb board that the purge anchor clamps fixedly pull down and make outside the camera wafer is exposed to, utilize ion wind gun to blow grit on this wafer photosensitive region off.
This remover-and-replacer comprises cover plate, take-up housing, slide block, base plate, slide bar assembly and blade.Cover plate 1 is tabular, and its middle position runs through and is provided with " ten " font handle hole 11, and lid is established and is installed on the take-up housing 2.Take-up housing 2 is installed on the base plate 7, it is provided with the groove of " ten " font, this groove comprises middle body 21 and divides the first, second, third and the 4th guide channel 22,23,24,25 that is in these four sides of middle body, this middle body 21 is concaved with holddown groove 211, interior core main part 26 is installed in this holddown groove 211 by securing member, and should be concaved with first location notch 262 that is used for placement part image sensing module by the top surface 261 of core main part 26 in being somebody's turn to do.
Slide bar assembly 8 has four, and these four slide bar assemblies and four slide blocks connect one to one.Each slide bar assembly 8 includes slide bar fixed head 81, slider block 82, slide bar handle 83,84,85,86, connecting rod 87 and slide bar guide pillar 88, this slide bar fixed head 81 is installed in installation region corresponding on the base plate 7 by screw rod, this slider block 82 is fixed on this slide bar fixed head 81, this slide bar handle 83,84,85,86 are installed on the slider block 82 by fulcrum is rotatable, one end of its head end and connecting rod 87 is rotationally connected, one end of the other end of connecting rod 87 and slide bar guide pillar 88 is rotationally connected, the other end of slide bar guide pillar 88 is fixedly connected with corresponding slide block, thereby when pulling slide bar handle 83,84,85,86 o'clock, but transmission slide bar guide pillar moves forward and backward in horizontal direction, thereby drives corresponding slide block 3,4,5,6 move horizontally in guide channel.Because interior core annex 61 is fixedlyed connected with adjusting slider 6, and adjusting slider 6 is connected with a slide bar assembly 8, institute so that the inner core mould can in clamped position (promptly core annex and inner core membrane module piece together one complete in the core keeper) and released position (promptly core annex leave the inner core membrane module and be convenient to inductive module 10 taking-ups) between conversion.
After this remover-and-replacer assembles, take-up housing 2 is fixed on the middle position of base plate 7, four slide bar assemblies 8 be installed on the base plate and divide be in take-up housing around, each slide block connects with corresponding slide bar assembly and places corresponding guide channel, each blade was in a side of image sensing module in 9 minutes and aims at the camera lens of camera and the bonding plane of PCB, in the present embodiment, each blade all is positioned at the top of core main part and core annex top surface.
When of the action of the first cutting knife slide block 3 by the slide bar handle, its blade has contacted the inductive module for the treatment of dismounting, and the camera lens of camera and the bonding plane of PCB have been cut, this moment, the slide bar guide pillar arrived maximum movement travel, this moment second, the 3rd cutting knife slide block 4, two blades of 5 are pind down under the effect of slide bar guide pillar separately and can't be near products, this moment this first cutting knife slide block 3 a left side, right flank is respectively with second, the 3rd cutting knife slide block 4,5 contacts, the left side of this first cutting knife slide block 3, right flank plays the effect of stop surface, and it has stoped second simultaneously, the 3rd cutting knife slide block 4,5 action; When second, third cutting knife slide block 4,5 action earlier; then this second, third cutting knife slide block 4,5 has served as stop surface with the side that the first cutting knife slide block 3 contacts; make the blade 9 of the first cutting knife slide block 3 can't touch goods; thereby but shield jig is being subjected to bad external force to do the time spent; the situation that can stop to cause blade to clash into mutually and damage blade; guarantor work fail safe also also can make the product can be not impaired without reason.
The motion process of this remover-and-replacer is as follows:
1. still image inductive module, this moment, each slide bar handle was in origin position, and this inductive module 10 is put upside down to be placed in (pcb board is up) location notch, and slide bar handle 86 advances, and fixes product 10.
2. cut image sensing module one, because product 10 has been fixed, earlier with slide bar handle 83 forward impelling, during to spacing can't the propelling, cutting knife 9 cuts the one side of product 10 earlier, after determining to put in place, slide bar handle 83 is withdrawn into the position of initial point again.
3. cut image sensing module two, this moment, the one side of product was cut, when product is cut last synchronously, simultaneously slide bar handle 84,85 is advanced, two cutting knifes 9 will cut the two sides in addition of product simultaneously simultaneously, utilize this method, and the camera wafer that is encapsulated on the pcb board can be subjected to the monolateral distortion of pcb board, and the phenomenon that the wafer that causes comes off is withdrawn into origin position with slide bar handle 84,85 again.
4. take out the image sensing module, after product cuts three, another side is easier to draw back, so cutting of four sides just seems that some is unnecessary, at last slide bar handle 86 is drawn back, interior core keeper is corresponding separately, with tweezers product is taken out, the entire exercise process that anchor clamps are fixed, cut, taken out finishes, the circulation running.
See also Fig. 7 and Fig. 8, these purge anchor clamps comprise cover plate 10 and base plate 20, and the middle position of this cover plate 10 runs through and is provided with four through holes 101, and these four through holes, 101 rectangular distributions, and four corners of this cover plate 10 are equipped with location hole 102.Base plate 20 is provided with wafer storage tank 201 and pcb board storage tank 202, this wafer storage tank 201 and pcb board storage tank 202 all are recessed into setting from the top surface 204 of this base plate 20, and the degree of depth of this wafer storage tank 201 makes the intersection of this wafer storage tank 201 and pcb board storage tank 202 form step less than the degree of depth of pcb board storage tank 202.In addition, the position of four of this base plate 20 corresponding location holes 102 of corner is provided with reference column 203.
When these purge anchor clamps use, camera wafer 30 and pcb board 40 are positioned on the base plate 20, wafer 30 up and be placed in the wafer storage tank 201, pcb board 40 is placed in the pcb board storage tank 202 and the edge card of this pcb board 40 invests the top surface 204 of base plate 20; Four through holes 101 with cover plate 10 are enclosed within respectively on the reference column 203 of base plate 20 then, and cover plate 10 pushes down the edge of pcb board 40, and wafer 30 is exposed to that pcb board 40 is then hidden by cover plate fully in the through hole 101 of cover plate 10, and is convenient to purge; At last, utilize the surface of this wafer photosensitive region of the clean air pressure gun purge of ion, thereby blow down the grit of this wafer surface.
The clean air pressure gun of ion can be filled into the grit more than 0.1 micron, and the wind-force size of this air pressure gun can regulate voluntarily, and the tuyere of air pressure gun then can be changed according to product demand.The microscopically that operates in that utilizes the clean air pressure gun of ion to carry out purge is finished, and microscopical multiple is regulated according to the density and the size of camera pixel, and generally its multiple adjustable range is 45X～225X, wherein preferably 125X.
With embodiment repair method of the present invention is described below:
Execution mode: under ten grades clean environment, prepare the camera module of pending cleaning, adopt the image sensing module remover-and-replacer of having looked after and guided, with the product remover-and-replacer of packing into, by remover-and-replacer the separated into two parts of packaged camera module, a part is the camera lens module, another part is pcb board and is fixed on camera wafer on this pcb board, again with the fixing pcb board marginal portion and making outside the camera wafer is exposed to of purge anchor clamps, regulate the clean air pressure gun of vacuum ionic, the wafer photosensitive area part that purge is polluted by grit under microscope (125x is advisable), the cleanliness factor and the outward appearance formedness of product checked in the cleaning back, and be last, change non-defective unit camera lens module, be stained with AB glue in lacquer disk(-sc) after, the camera lens module that is stained with glue encapsulates on the purge anchor clamps, after 75 ℃ of bakings of baking box 90min oven dry, this non-defective unit camera lens module is fixed on the pcb board, the a whole set of encapsulation flow process of cleaning is finished, and carries out follow-up functional test operation again, the effect that test is cleaned.
Claims (4)
1. the repair method of an image sensing module is characterized in that: comprise the steps: 1) the camera lens module of camera module and the pcb board that is fixed with the camera wafer are separated; 2) be fixed on isolated pcb board on the purge anchor clamps and make outside wafer is exposed to; 3) blow down grit on this wafer photosensitive region by the clean air pressure gun of vacuum ionic; 4) non-defective unit camera lens module is installed on the pcb board.
2. the repair method of image sensing module as claimed in claim 1 is characterized in that: described step 3) is to carry out under microscopical assisting.
3. purge anchor clamps that are exclusively used in the described method of claim 1, it is characterized in that: it comprises base plate and cover plate, recessed at least one the wafer storage tank that is provided with of this base plate, also be concaved with the pcb board storage tank that is used for ccontaining pcb board on the described base plate, described wafer storage tank is connected with the pcb board storage tank, the intersection of this two storage tank is formed with step, and the degree of depth of this wafer storage tank is less than the degree of depth of pcb board storage tank, this cover plate runs through and is provided with at least one through hole, this through hole also aligns mutually with the wafer storage tank is corresponding one by one, and the correspondence position of this cover plate and base plate is provided with adapting device.
4. purge anchor clamps as claimed in claim 3 is characterized in that: the adapting device on the described base plate is at least two reference columns, and the adapting device on the cover plate is at least two location holes, and reference column is corresponding one by one with location hole and match.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100223689A CN100487881C (en) | 2005-12-17 | 2005-12-17 | Method for return repairing image sensing mould set and clamp therewith |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100223689A CN100487881C (en) | 2005-12-17 | 2005-12-17 | Method for return repairing image sensing mould set and clamp therewith |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1983535A CN1983535A (en) | 2007-06-20 |
| CN100487881C true CN100487881C (en) | 2009-05-13 |
Family
ID=38165954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100223689A Expired - Fee Related CN100487881C (en) | 2005-12-17 | 2005-12-17 | Method for return repairing image sensing mould set and clamp therewith |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100487881C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102298223B (en) * | 2010-06-26 | 2014-03-12 | 比亚迪股份有限公司 | Method for recycling poorly pressed flexible printed circuit (FPC) |
| CN110936624B (en) * | 2018-09-21 | 2021-08-06 | 宁波舜宇光电信息有限公司 | Repairing device and method for camera module |
| CN110732760A (en) * | 2019-11-18 | 2020-01-31 | 中国航发贵州黎阳航空动力有限公司 | kinds of panel part positioning welding anchor clamps |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2638245Y (en) * | 2003-06-17 | 2004-09-01 | 胜开科技股份有限公司 | Image sensor module |
| CN1527653A (en) * | 2003-03-04 | 2004-09-08 | 胜开科技股份有限公司 | Image sensor removal method |
-
2005
- 2005-12-17 CN CNB2005100223689A patent/CN100487881C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527653A (en) * | 2003-03-04 | 2004-09-08 | 胜开科技股份有限公司 | Image sensor removal method |
| CN2638245Y (en) * | 2003-06-17 | 2004-09-01 | 胜开科技股份有限公司 | Image sensor module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1983535A (en) | 2007-06-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205997290U (en) | A kind of coordinate truss-like injection molding mechanical arm with vision guide positioning function | |
| CN102252611B (en) | Geometric positioning method | |
| CN109421200A (en) | A kind of hot-pressing forming system and method for shelly-shaped dental appliance large-scale production | |
| CN204820153U (en) | A production equipment for automatic detection and distribution of continuous injection molding products | |
| CN204602651U (en) | A kind of AOI checkout equipment | |
| CN100487881C (en) | Method for return repairing image sensing mould set and clamp therewith | |
| CN208621870U (en) | A kind of vertical machine of full-automatic backlight group | |
| CN107328337A (en) | A kind of car headlamp lamp assembly simulates entrucking detection means | |
| CN216862083U (en) | Film tearing device | |
| CN206583818U (en) | A kind of printing packaging product defects detecting system based on machine vision | |
| CN101927433B (en) | Numerical control special fixture for milling ledge | |
| CN208437499U (en) | A kind of stamping die with flatness detection structure | |
| CN203085946U (en) | Defective product cutting device applicable to wire harness processing industry | |
| CN108246643B (en) | A kind of the industry mechanical arm processing rejected product statistic device and method synchronous based on construction | |
| CN206154427U (en) | Device is cut to cup dress product | |
| CN218700556U (en) | Plastic mould ejection mechanism | |
| CN221649451U (en) | Detection jig for producing plastic parts of electric vehicle | |
| CN112414319A (en) | Equipment for detecting complex appearance profile of part based on machine vision | |
| CN220049890U (en) | Screw fastener cold heading forming device | |
| CN219043676U (en) | Automobile trunk guide rail burr milling and opening detecting integrated equipment | |
| CN222471569U (en) | Automatic pin penetrating processing equipment | |
| CN222269073U (en) | Full-automatic welding equipment for miniature terminal for automobile | |
| CN222358967U (en) | Residual removing mechanism for top crack of liquid crystal glass | |
| CN221840350U (en) | Automobile casting quality inspection machine | |
| CN109719569B (en) | Automatic case lid processing equipment of gearbox |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150906 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150906 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: BYD Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co.,Ltd. Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090513 Termination date: 20211217 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |