CN2391266Y - Ultra-thin light-emitting diode display panel - Google Patents

Abstract

An ultra-thin LED display panel. The utility model provides a simple structure, thin short and small, convenient manufacture, low in production cost, strong market competitiveness's LED display panel, provide the utility model discloses it includes circuit substrate, LED wafer, intermediate plate, panel and transparent adhesive tape, LED wafer connects on circuit substrate with its bottom surface contact, be equipped with the through-hole and the contact of holding LED wafer on the intermediate plate of piling up on circuit substrate, the panel of piling up on the intermediate plate is equipped with the face hole that is greater than the through-hole, transparent adhesive tape fills in panel face hole and intermediate plate through-hole in order to encapsulate LED wafer.

Description

Ultra-thin light-emitting diode display panel

The utility model belongs to a device for displaying variable information, in particular to an ultra-thin light-emitting diode display panel.

As shown in Figure 6 and Figure 7, the light-emitting diode display boards used to display numbers or simple dot graphics on general electrical products or advertising boards are arranged in a matrix on the circuit substrate or arranged with plural numbers of light-emitting diodes "8". The diode chip is used to connect the contacts on the bottom surface of the light emitting diode chip to the circuit substrate, and then the circuit substrate on which the light emitting diode chips have been arranged is installed in the rectangular case cover. The rectangular case cover has a perforation relative to the light-emitting diode chip, and the transparent glue is poured into the rectangular case cover, so that the transparent glue can be filled into the perforation of the rectangular case cover to fill the perforation and fix the circuit board on the Inside the rectangular case cover.

The light-emitting diode display panel with this structure is provided with perforations on its rectangular casing. Therefore, as shown in Figure 8, must be pasted outside the rectangular case cover with adhesive tape before being filled with transparent glue, to seal the perforation, then reverse it, and carry out glue filling by the bottom surface of the rectangular case. In addition, during the setting process of the transparent glue, the circuit substrate must be pressed with a heavy object, so as to prevent the circuit substrate from floating due to buoyancy. After the liquid transparent glue condenses into a solid, the adhesive tape is torn off to make a light-emitting diode display panel.

The light-emitting diode display panel of this conventional structure, because it is packaged with a rectangular case cover, makes the thickness of the light-emitting diode display panel relatively large, and cannot be light, thin and short.

Furthermore, before filling the transparent glue, the perforation of the rectangular shell cover must be sealed with tape, and after the transparent glue is solidified, the tape is torn off again, which causes inconvenience and trouble in the manufacturing process, and increases the manufacturing process. troubled.

In addition, heavy objects must be used to press the circuit board after filling, which will also increase troubles and troubles in the manufacturing process.

In addition, the outermost rectangular case cover of the light-emitting diode display panel of this conventional structure is a plastic case, which is rectangular and three-dimensional, and has a relatively complicated shape, thereby increasing manufacturing costs and reducing market competitiveness.

The purpose of the utility model is to provide an ultra-thin light-emitting diode display panel with simple structure, light weight, short size, convenient manufacture, low production cost and strong market competitiveness.

The utility model comprises a circuit substrate, a plurality of light-emitting diode chips arranged and arranged on the circuit substrate, a middle plate stacked on the circuit substrate, a panel stacked on the middle plate, and a transparent packaging light-emitting diode chip. glue; the bottom and top surfaces of the light-emitting diode chip are respectively provided with contacts, and are connected to the circuit substrate with the contacts on the bottom surface, and wired from the contacts on the top surface; there are a plurality of accommodating arrangements arranged on the circuit substrate on the middle plate The through holes of the upper light-emitting diode chip and the contacts connected by wire bonding; a panel is stacked above the middle plate; a plurality of faces larger than the through holes are provided at the corresponding positions of the panel and the plurality of through holes on the middle plate; transparent glue filling In the gap between the panel surface and the through hole of the middle plate and the light-emitting diode chip.

in:

The face on the panel is a through hole in the shape of a central hole.

The face on the panel is a through hole in the shape of a square hole.

The faces on the panel are numbered through-holes.

Because the utility model includes a circuit substrate, a plurality of light-emitting diode chips, a middle plate, a panel and transparent glue; the bottom and top surfaces of the light-emitting diode chip are respectively provided with contacts, and are connected to the circuit substrate with the contacts on the bottom surface, automatically Its top surface contacts are wired; the middle board stacked on the circuit substrate is provided with through holes for accommodating light-emitting diode chips and contacts connected by wire bonding; the panels stacked on the middle board are connected to the middle board. A surface hole larger than the through hole is provided at the corresponding position of the hole; transparent glue is filled in the surface hole of the panel and the through hole of the middle plate to encapsulate the light-emitting diode chip. The utility model is formed by stacking thinner circuit boards, middle boards and panels, which can reduce the thickness after stacking, making it light, thin and short; the face on the panel is larger than the through hole of the middle board, so that the transparent glue It can be filled into the through hole on the middle plate through the face of the uppermost panel, without the need to seal it with tape and suppress it with heavy objects, which simplifies the manufacturing process and reduces production costs; the outermost panel is flat, and its overall shape It is relatively simple and does not need to set up complex-shaped molds, thereby reducing manufacturing costs and improving market competitiveness. Not only is the structure simple, light and thin, but also convenient to manufacture, low production costs, and strong market competitiveness, thereby achieving the purpose of the utility model.

Fig. 1 is a schematic sectional view of the structure of the utility model.

Fig. 2 is a schematic sectional view of the exploded structure of the utility model.

Fig. 3 is a view to A in Fig. 2 (the face is a round hole-like through hole).

Fig. 4 is a view to A in Fig. 2 (the face is a square hole-like through hole).

Fig. 5 is a view to A in Fig. 2 (the face is a digital-shaped through hole).

FIG. 6 is a schematic cross-sectional view of a structure of a conventional light-emitting diode display panel.

FIG. 7 is a schematic cross-sectional view of the structure of a circuit substrate in a conventional light-emitting diode display panel.

FIG. 8 is a schematic diagram of a conventional light-emitting diode display panel filled with transparent glue.

Below in conjunction with accompanying drawing, the utility model is set forth in further detail.

As shown in FIG. 1 and FIG. 2 , the utility model 10 includes a circuit substrate 1 , a plurality of LED chips 2 , a middle board 3 , a panel 4 and a transparent glue 5 . Contacts 21 and 22 are respectively provided on the bottom and top of the light emitting diode 2 . A plurality of light-emitting diode chips 2 are arranged on the circuit substrate 1 and connected to the circuit substrate 1 through the contacts 21 on the bottom surface. The intermediate board 3 is provided with a plurality of through holes 31 and contacts 32 for accommodating and arranging the light emitting diode chips 2 on the circuit substrate 1 . The intermediate board 3 is stacked above the circuit substrate 1, so that the plurality of light-emitting diode chips 2 arranged on the circuit substrate 1 are respectively located in the corresponding through holes 31 on the intermediate board 3, and on the light-emitting diode chip 2. Wire bonding is used to connect the top surface of the light-emitting diode chip 2 and the contacts 22 and 32 of the middle board 3 . A plurality of face holes 41 that are larger than the through holes 31 are provided at the positions corresponding to the plurality of through holes 31 on the panel 4 and the middle plate 3 . The panels 4 are stacked above the middle panel 3 . The transparent glue 5 is filled in the gap between the face hole 41 of the panel 4 and the through hole 31 of the middle board 3 and the light-emitting diode chip 2 , so as to encapsulate the light-emitting diode chip 2 in the through hole 31 of the middle board 3 .

As mentioned above, the utility model 10 is formed by stacking the circuit substrate 1 , the intermediate board 3 and the panel 4 . The thickness of the circuit substrate 1 , the intermediate board 3 and the panel 4 is very thin, so the thickness after stacking can be reduced to make them light, thin and short.

Furthermore, the face hole 41 on the panel 4 is greater than the through hole 31 of the middle plate 3, so that the transparent glue 5 can be filled into the through hole 31 on the middle plate 3 through the face 41 of the uppermost panel 4, without sealing and sealing with an adhesive tape. Pressing with heavy objects can simplify the manufacturing process and reduce production costs.

The panel 4 located on the outermost layer is in the shape of a flat plate, and its overall shape is relatively simple, so there is no need to set up molds with complex shapes, thereby reducing manufacturing costs and improving market competitiveness.

The face holes 41 on the panel 4 can be through holes of different shapes according to the needs of use. As shown in FIG. 3 , the face hole 41 on the panel 4 is a through hole in the shape of a round hole. Alternatively, as shown in FIG. 4 , the face hole 41 a on the panel 4 is a square hole-shaped through hole. Also as shown in FIG. 5 , the surface holes 41 b on the panel are digital through holes. That is, the faces on the panel can be through-holes of various geometric shapes.

Claims (4)

1. An ultra-thin light-emitting diode display panel, which includes a circuit substrate, a plurality of light-emitting diode chips arranged on the circuit substrate and transparent glue for packaging the light-emitting diode chip; the light-emitting diode chip The bottom and top surfaces are respectively provided with contacts, and are connected to the circuit substrate with the contacts on the bottom surface, and are wired from the contacts on the top surface; it is characterized in that an intermediate board is stacked on the circuit substrate; The through-holes of the light-emitting diode chip on the circuit board and the contacts connected by wires are arranged in a row; a panel is stacked above the middle board; a plurality of through-holes are arranged at the corresponding positions of the panel and the middle board. The surface hole is larger than the through hole; the transparent glue is filled in the gap between the surface hole of the panel and the through hole of the middle plate and the light emitting diode chip. 2. The ultra-thin light-emitting diode display panel according to claim 1, characterized in that the surface holes on the panel are round holes. 3. The ultra-thin light-emitting diode display panel according to claim 1, characterized in that the surface holes on the panel are square holes. 4. The ultra-thin light-emitting diode display panel according to claim 1, characterized in that the faces on the panel are digital through-holes.

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