CN210271595U - LED display screen module stacked and packaged according to blocks - Google Patents
LED display screen module stacked and packaged according to blocks Download PDFInfo
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- CN210271595U CN210271595U CN201921357316.0U CN201921357316U CN210271595U CN 210271595 U CN210271595 U CN 210271595U CN 201921357316 U CN201921357316 U CN 201921357316U CN 210271595 U CN210271595 U CN 210271595U
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- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000010147 laser engraving Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses a pile up LED display screen module of encapsulation according to piece, LED display screen module include the light transmissivity screen base plate on display screen surface pile up ruddiness LED layer, green glow LED layer, blue light LED layer and be located with arbitrary order in proper order on the light transmissivity screen base plate ruddiness LED layer green glow LED layer LED light emitting control device layer on the blue light LED layer, ruddiness LED layer comprises the ruddiness LED chip chunk that can wholly shift and place, the green glow LED layer comprises the green glow LED chip chunk that can wholly shift and place, the blue light LED layer comprises the blue light LED chip chunk that can wholly shift and place.
Description
Technical Field
The utility model relates to a chip package technical field, concretely relates to pile up LED display screen module of encapsulation according to piece.
Background
The LED color screen has the advantages of high reaction speed, high power-saving light-emitting efficiency, active light emission and the like. In particular, the effects of virtual reality such as AR and VR can be realized, and the effects are the main force of displaying the virtual reality backwards. However, at present, the MiNi LED or the MiCRO LED is limited by the wire bonding or the flip-chip process, and is limited in the pixel, and P0.8, i.e., the distance between each center point, can be about 0.8 mm. In the prior art, when an LED display screen module is manufactured, because an independent single LED chip is absorbed and then is integrally transferred (mass transfer), the problems of how to make the distance between the LED chips arranged on the LED display screen module small and how to fix the crystals at the small distance exist.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in providing a pile up LED display screen module of encapsulation according to the piece, overcome prior art LED display screen packaging technology and cause the pixel interval too big, display resolution is lower relatively, the not fine and smooth defect inadequately of display effect.
The utility model discloses a solve the technical scheme that above-mentioned technical problem adopted and be:
an LED display screen module packaged by block stacking comprises a light-transmitting screen substrate on the surface of a display screen, wherein a red light LED layer, a green light LED layer, a blue light LED layer and an LED light-emitting control device layer positioned on the red light LED layer, the green light LED layer and the blue light LED layer are sequentially stacked on the light-transmitting screen substrate in any order, the red light LED layer is composed of red light LED chip blocks capable of being integrally transferred and placed, the green light LED layer is composed of green light LED chip blocks capable of being integrally transferred and placed, the blue light LED layer is composed of blue light LED chip blocks capable of being integrally transferred and placed, the light-transmitting screen substrate, the red light LED layer, the green light LED layer, the blue light LED layer and the LED light-emitting control device layer are connected through a shadowless glue layer in a curing mode, and conductive films or alloy films or etching are laid on the red light LED layer, the green light LED layer, the blue light LED layer and the LED light-emitting control device layer And (4) a line.
According to an embodiment of the present invention, the red LED chip block, the green LED chip block and the blue LED chip block are respectively composed of 10 × 10, 20 × 20, 30 × 30 or 40 × 40 LED chips.
According to the utility model discloses an embodiment, ruddiness LED chip module piece green glow LED chip module piece with blue light LED chip module piece adopts photomask technical manufacturing.
According to the utility model discloses an embodiment the ruddiness LED layer the green glow LED layer with the periphery on blue light LED layer is provided with shallow channel.
According to the utility model discloses an embodiment the ruddiness LED chip chunk the green glow LED chip chunk with the periphery of blue light LED chip chunk is provided with shallow channel.
According to the utility model discloses an embodiment be provided with shallow channel around the LED chip.
According to the utility model discloses an embodiment, ruddiness LED layer green glow LED layer the anodal homopolar connection of LED chip on the blue light LED layer, ruddiness LED layer green glow LED layer each line or each row of LED chip's negative pole homopolar connection on the blue light LED layer.
According to the utility model discloses an embodiment, the electrically conductive line is formed by laser engraving.
Utility model's beneficial effect: the utility model discloses a according to the new technology of LED chip of arranging of LED chip chunk, just so reduced the technical degree of difficulty that carries out the huge volume and shift when making LED display screen module, can reduce LED chip interval simultaneously, reduce the solid brilliant degree of difficulty of underspaced LED chip, improve the resolution ratio of display screen to make the display effect better fine and smooth, increase the reliability of product simultaneously, the display screen module size is more random, the concatenation still less, the cost of labor is lower.
Drawings
The advantages and mode of realisation of the invention will become more apparent hereinafter by describing in detail the invention with reference to the attached drawings, wherein the content shown in the drawings is only for explaining the invention, without constituting any limitation to the meaning of the invention, in which:
fig. 1 is a schematic diagram of a stacking structure of LED display screen modules of the present invention;
FIG. 2 is a schematic diagram of the connection mode of the pins of the LED chip according to the present invention;
fig. 3 is a schematic view of the red, blue and green LED layer of the present invention.
Detailed Description
As shown in fig. 1, fig. 2 and fig. 3, the LED display screen module packaged by block stacking of the present invention comprises a light transmission screen substrate 11 on the surface of the display screen, a red LED layer 13, a green LED layer 16, a blue LED layer 19, and LED light emitting control device layers 22 on the red LED layer 13, the green LED layer 16 and the blue LED layer 19 are sequentially stacked in any order on the light transmission screen substrate 11, the red LED layer 13 is composed of a red LED chip block 131 capable of being integrally transferred and placed, the green LED layer 16 is composed of a blue LED chip block 161 capable of being integrally transferred and placed, the light transmission LED layer 19 is composed of a blue LED chip block 191 capable of being integrally transferred and placed, the light transmission screen substrate 11, the red LED layer 13, the green LED layer 16, the blue LED layer 19 and the LED light emitting control device layers 22 are connected by a light transmission layer 12, a shadowless glue layer 15, a shadowless glue layer 18 and a shadowless glue layer 21 through curing, the red LED layer 12, the green LED layer 16, the blue LED layer 19 and the LED light-emitting control device layer 22 are respectively coated with a metal film 14, a metal film 17 and a metal film 20, the metal film 23 forms a conductive circuit by carving or etching the metal film or the alloy film, and the conductive circuit is formed by laser carving. The LED light-emitting control device layer 22 is covered with an encapsulation glue layer 24. The red LED chip block 131, the green LED chip block 161, and the blue LED chip block 191 are formed by 10 × 10, 20 × 20, 30 × 30, or 40 × 40 LED chips, respectively, or are formed as a matrix module with any X rows by Y rows. The red LED chip block 131, the green LED chip block 161, and the blue LED chip block 191 are manufactured using a photomask technique. Shallow channels are provided at the peripheries of the red LED layer 13, the green LED layer 16, and the blue LED layer 19. Shallow channels are provided at the peripheries of the red LED chip block 131, the green LED chip block 161, and the blue LED chip block 191. Shallow trenches are provided around the LED chips. The anodes of the LED chips on the red LED layer 13, the green LED layer 16 and the blue LED layer 19 are connected in a common mode, and the cathodes of the LED chips on each row or each column on the red LED layer 13, the green LED layer 16 and the blue LED layer 19 are connected in a common mode.
The metal film 23 or the alloy film is formed by using a vacuum sputtering method, the metal film 23 can be a copper film, a tin film, an aluminum film, a gold film and the like, then a circuit is engraved in a laser engraving method, redundant metal is removed to form a circuit, so that each layer of LED chips are conducted and connected, and the packaging without welding wires is realized.
The present invention can be implemented by various modifications without departing from the spirit and spirit of the present invention, and the above description is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the present invention, and all the equivalent structural changes made by using the contents of the present invention and the accompanying drawings are included in the scope of the present invention.
Claims (8)
1. An LED display screen module packaged by block stacking is characterized in that: comprises a light transmission screen substrate on the surface of a display screen, a red light LED layer, a green light LED layer, a blue light LED layer and an LED light-emitting control device layer which is positioned on the red light LED layer, the green light LED layer and the blue light LED layer are sequentially stacked on the light transmission screen substrate in any order,
the light-transmitting screen substrate, the red light LED layer, the green light LED layer, the blue light LED layer and the LED light-emitting control device layer are connected through a shadowless glue layer in a curing mode, and conductive circuits formed by carving or etching metal films or alloy films are laid on the red light LED layer, the green light LED layer, the blue light LED layer and the LED light-emitting control device layer.
2. The tile stack packaged LED display screen module of claim 1, wherein: the red LED chip module, the green LED chip module and the blue LED chip module are respectively composed of 10 × 10, 20 × 20, 30 × 30 or 40 × 40 LED chips.
3. The tile stack packaged LED display screen module of claim 1, wherein: the red light LED chip module, the green light LED chip module and the blue light LED chip module are manufactured by adopting a photomask technology.
4. The tile stack packaged LED display screen module of claim 1, wherein: shallow channels are arranged on the peripheries of the red light LED layer, the green light LED layer and the blue light LED layer.
5. The tile stack packaged LED display screen module of claim 1, wherein: shallow channels are arranged on the peripheries of the red light LED chip module, the green light LED chip module and the blue light LED chip module.
6. The tile stack packaged LED display screen module of claim 2, wherein: shallow channels are arranged around the LED chips.
7. The tile stack packaged LED display screen module of claim 1, wherein: the LED structure comprises a red light LED layer, a green light LED layer and a blue light LED layer, wherein the red light LED layer, the green light LED layer and the blue light LED layer are connected through the common anode of LED chips, and the red light LED layer, the green light LED layer and the blue light LED layer are connected through the common cathode of each row or each column of LED chips.
8. The tile stack packaged LED display screen module of claim 1, wherein: the conductive lines are formed by laser engraving.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921357316.0U CN210271595U (en) | 2019-08-21 | 2019-08-21 | LED display screen module stacked and packaged according to blocks |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921357316.0U CN210271595U (en) | 2019-08-21 | 2019-08-21 | LED display screen module stacked and packaged according to blocks |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210271595U true CN210271595U (en) | 2020-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921357316.0U Active CN210271595U (en) | 2019-08-21 | 2019-08-21 | LED display screen module stacked and packaged according to blocks |
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| CN (1) | CN210271595U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110428749A (en) * | 2019-08-21 | 2019-11-08 | 深圳市洁简达创新科技有限公司 | A kind of LED display module and packaging method by block stacked package |
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2019
- 2019-08-21 CN CN201921357316.0U patent/CN210271595U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110428749A (en) * | 2019-08-21 | 2019-11-08 | 深圳市洁简达创新科技有限公司 | A kind of LED display module and packaging method by block stacked package |
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