CN1356723A - 半导体芯片安装基板、电光装置、液晶装置、电致发光装置及电子机器 - Google Patents
半导体芯片安装基板、电光装置、液晶装置、电致发光装置及电子机器 Download PDFInfo
- Publication number
- CN1356723A CN1356723A CN01142471A CN01142471A CN1356723A CN 1356723 A CN1356723 A CN 1356723A CN 01142471 A CN01142471 A CN 01142471A CN 01142471 A CN01142471 A CN 01142471A CN 1356723 A CN1356723 A CN 1356723A
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- China
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- electrode
- liquid crystal
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- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 220
- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 187
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims abstract description 61
- 239000010408 film Substances 0.000 claims description 174
- 239000000463 material Substances 0.000 claims description 52
- 238000005401 electroluminescence Methods 0.000 claims description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 9
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 150000004706 metal oxides Chemical class 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000013508 migration Methods 0.000 abstract description 36
- 230000005012 migration Effects 0.000 abstract description 36
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 239000007769 metal material Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 126
- 239000003566 sealing material Substances 0.000 description 21
- 238000011109 contamination Methods 0.000 description 17
- 230000005684 electric field Effects 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 15
- 239000011159 matrix material Substances 0.000 description 11
- 101100119847 Phaeodactylum tricornutum FCPE gene Proteins 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 6
- 239000003086 colorant Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 230000010365 information processing Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 2
- XGZGDYQRJKMWNM-UHFFFAOYSA-N tantalum tungsten Chemical compound [Ta][W][Ta] XGZGDYQRJKMWNM-UHFFFAOYSA-N 0.000 description 2
- -1 APC and Cr Chemical class 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000382 optic material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
- H10K59/1795—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP365715/00 | 2000-11-30 | ||
JP2000365715 | 2000-11-30 | ||
JP2001317142A JP3757840B2 (ja) | 2000-11-30 | 2001-10-15 | 半導体チップ実装基板、電気光学装置、液晶装置、エレクトロルミネッセンス装置及び電子機器 |
JP317142/01 | 2001-10-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1356723A true CN1356723A (zh) | 2002-07-03 |
CN1331219C CN1331219C (zh) | 2007-08-08 |
Family
ID=26604990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011424710A Expired - Lifetime CN1331219C (zh) | 2000-11-30 | 2001-11-29 | 半导体芯片安装基板、电光装置、液晶装置、电致发光装置及电子机器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6809390B2 (zh) |
JP (1) | JP3757840B2 (zh) |
KR (1) | KR100467383B1 (zh) |
CN (1) | CN1331219C (zh) |
TW (1) | TW530274B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100435378C (zh) * | 2004-07-09 | 2008-11-19 | 友达光电股份有限公司 | 有机电激发光显示装置 |
CN101650488A (zh) * | 2008-08-12 | 2010-02-17 | 三星电子株式会社 | 液晶显示装置及制造该液晶显示装置的方法 |
CN107085333A (zh) * | 2017-07-06 | 2017-08-22 | 上海天马微电子有限公司 | 一种阵列基板及显示面板 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7126161B2 (en) * | 1998-10-13 | 2006-10-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having El layer and sealing material |
JP2002268079A (ja) * | 2001-03-09 | 2002-09-18 | Seiko Epson Corp | 電気光学装置と電子機器 |
JP4068942B2 (ja) * | 2001-12-17 | 2008-03-26 | セイコーエプソン株式会社 | 電気光学装置及びその製造方法、並びに電子機器 |
JP3748075B2 (ja) * | 2002-08-30 | 2006-02-22 | セイコーエプソン株式会社 | 電子モジュール及びその製造方法並びに電子機器 |
JP2004247373A (ja) * | 2003-02-12 | 2004-09-02 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP3770240B2 (ja) | 2003-02-20 | 2006-04-26 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
TWI266108B (en) | 2003-05-01 | 2006-11-11 | Seiko Epson Corp | Electrical wiring structure, manufacturing method of electrical c wiring structure, substrate for optical device having electrical wiring structure and electro-optical device, and method for manufacturing electro-optical device |
JP4518747B2 (ja) * | 2003-05-08 | 2010-08-04 | 三洋電機株式会社 | 有機el表示装置 |
KR101001549B1 (ko) * | 2003-11-20 | 2010-12-17 | 삼성모바일디스플레이주식회사 | 유기 전계 발광 소자 |
US7027044B2 (en) * | 2004-02-20 | 2006-04-11 | Au Optronics Corporation | Power line arrangement for electroluminescence display devices |
JP4393253B2 (ja) * | 2004-04-05 | 2010-01-06 | シャープ株式会社 | 液晶表示装置およびその製造方法 |
US8344410B2 (en) | 2004-10-14 | 2013-01-01 | Daktronics, Inc. | Flexible pixel element and signal distribution means |
EP1648033A3 (en) * | 2004-10-14 | 2008-04-23 | LG Electronics Inc. | Organic Electro-Luminescence display device and method of fabricating the same |
US7893948B1 (en) * | 2004-10-14 | 2011-02-22 | Daktronics, Inc. | Flexible pixel hardware and method |
US8001455B2 (en) * | 2004-10-14 | 2011-08-16 | Daktronics, Inc. | Translation table |
US7868903B2 (en) * | 2004-10-14 | 2011-01-11 | Daktronics, Inc. | Flexible pixel element fabrication and sealing method |
JP4600263B2 (ja) * | 2005-12-06 | 2010-12-15 | エプソンイメージングデバイス株式会社 | 電気光学装置および電子機器 |
JP2007250519A (ja) * | 2006-03-14 | 2007-09-27 | Samsung Sdi Co Ltd | 有機電界発光表示装置 |
KR100914784B1 (ko) * | 2006-05-17 | 2009-08-31 | 엘지디스플레이 주식회사 | 전계발광소자 및 그 제조방법 |
US8446445B2 (en) * | 2006-09-27 | 2013-05-21 | Casio Computer Co., Ltd. | Exposure device, image forming apparatus and method for operating exposure device |
US7968382B2 (en) * | 2007-02-02 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
JP5264535B2 (ja) * | 2009-01-30 | 2013-08-14 | キヤノン株式会社 | 表示装置 |
JP5270497B2 (ja) * | 2009-09-02 | 2013-08-21 | シャープ株式会社 | 半導体装置およびその電力供給方法 |
JP5452290B2 (ja) * | 2010-03-05 | 2014-03-26 | ラピスセミコンダクタ株式会社 | 表示パネル |
KR101064430B1 (ko) * | 2010-04-13 | 2011-09-14 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시장치 |
KR102156341B1 (ko) * | 2013-11-21 | 2020-09-15 | 엘지디스플레이 주식회사 | 디스플레이 장치 |
US20180364514A1 (en) * | 2015-08-26 | 2018-12-20 | Sharp Kabushiki Kaisha | Display device |
JP2017181594A (ja) * | 2016-03-28 | 2017-10-05 | パナソニック液晶ディスプレイ株式会社 | 表示装置 |
CN109285873B (zh) * | 2018-10-24 | 2020-11-24 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2516688B2 (ja) * | 1989-08-02 | 1996-07-24 | シャープ株式会社 | 液晶表示装置 |
JPH0493826A (ja) | 1990-08-03 | 1992-03-26 | Olympus Optical Co Ltd | カメラの巻き上げ装置 |
JPH05158056A (ja) * | 1991-12-04 | 1993-06-25 | Advantest Corp | 液晶表示素子の画素欠陥を検出する方法 |
JPH07199224A (ja) * | 1994-01-11 | 1995-08-04 | Fujitsu Ltd | Tftマトリクス基板 |
JP2555987B2 (ja) * | 1994-06-23 | 1996-11-20 | 日本電気株式会社 | アクティブマトリクス基板 |
JPH0895075A (ja) * | 1994-09-26 | 1996-04-12 | Sanyo Electric Co Ltd | 液晶表示装置 |
JP2871592B2 (ja) | 1996-05-14 | 1999-03-17 | 凸版印刷株式会社 | 表示装置用電極基板 |
JPH1152405A (ja) | 1997-07-30 | 1999-02-26 | Nanotsukusu Kk | 液晶表示素子 |
JP2000009808A (ja) * | 1998-06-25 | 2000-01-14 | Seiko Epson Corp | 半導体装置および液晶駆動装置 |
KR100590746B1 (ko) * | 1998-11-06 | 2006-10-04 | 삼성전자주식회사 | 서로다른공통전압을가지는액정표시장치 |
JP2000275666A (ja) | 1999-03-25 | 2000-10-06 | Hitachi Ltd | 液晶表示装置 |
JP2000284261A (ja) * | 1999-03-29 | 2000-10-13 | Seiko Epson Corp | 液晶装置及び電子機器 |
-
2001
- 2001-10-15 JP JP2001317142A patent/JP3757840B2/ja not_active Expired - Lifetime
- 2001-11-29 KR KR10-2001-0074827A patent/KR100467383B1/ko active IP Right Grant
- 2001-11-29 CN CNB011424710A patent/CN1331219C/zh not_active Expired - Lifetime
- 2001-11-29 TW TW090129568A patent/TW530274B/zh not_active IP Right Cessation
- 2001-11-30 US US09/999,207 patent/US6809390B2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100435378C (zh) * | 2004-07-09 | 2008-11-19 | 友达光电股份有限公司 | 有机电激发光显示装置 |
CN101650488A (zh) * | 2008-08-12 | 2010-02-17 | 三星电子株式会社 | 液晶显示装置及制造该液晶显示装置的方法 |
US8395735B2 (en) | 2008-08-12 | 2013-03-12 | Samsung Display Co., Ltd. | Liquid crystal display device and method of manufacturing the same |
CN101650488B (zh) * | 2008-08-12 | 2015-04-15 | 三星显示有限公司 | 液晶显示装置及制造该液晶显示装置的方法 |
CN107085333A (zh) * | 2017-07-06 | 2017-08-22 | 上海天马微电子有限公司 | 一种阵列基板及显示面板 |
CN107085333B (zh) * | 2017-07-06 | 2021-02-02 | 上海天马微电子有限公司 | 一种阵列基板及显示面板 |
Also Published As
Publication number | Publication date |
---|---|
TW530274B (en) | 2003-05-01 |
JP3757840B2 (ja) | 2006-03-22 |
KR100467383B1 (ko) | 2005-01-24 |
US6809390B2 (en) | 2004-10-26 |
CN1331219C (zh) | 2007-08-08 |
US20020088984A1 (en) | 2002-07-11 |
KR20020042480A (ko) | 2002-06-05 |
JP2002229474A (ja) | 2002-08-14 |
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