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CN110016203B - 树脂组合物 - Google Patents

树脂组合物 Download PDF

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Publication number
CN110016203B
CN110016203B CN201811622499.4A CN201811622499A CN110016203B CN 110016203 B CN110016203 B CN 110016203B CN 201811622499 A CN201811622499 A CN 201811622499A CN 110016203 B CN110016203 B CN 110016203B
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CN
China
Prior art keywords
resin composition
mass
component
resin
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811622499.4A
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English (en)
Chinese (zh)
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CN110016203A (zh
Inventor
川合贤司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
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Ajinomoto Co Inc
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Filing date
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Publication of CN110016203A publication Critical patent/CN110016203A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
CN201811622499.4A 2018-01-09 2018-12-28 树脂组合物 Active CN110016203B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018001501A JP7296191B2 (ja) 2018-01-09 2018-01-09 硬化性樹脂組成物、樹脂シート、プリント配線板及び半導体装置
JP2018-001501 2018-01-09

Publications (2)

Publication Number Publication Date
CN110016203A CN110016203A (zh) 2019-07-16
CN110016203B true CN110016203B (zh) 2023-10-31

Family

ID=67188709

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811622499.4A Active CN110016203B (zh) 2018-01-09 2018-12-28 树脂组合物

Country Status (4)

Country Link
JP (2) JP7296191B2 (ja)
KR (2) KR102752113B1 (ja)
CN (1) CN110016203B (ja)
TW (1) TWI811275B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7296191B2 (ja) * 2018-01-09 2023-06-22 味の素株式会社 硬化性樹脂組成物、樹脂シート、プリント配線板及び半導体装置
CN110804412B (zh) * 2019-12-02 2021-11-05 中国科学院深圳先进技术研究院 一种高频低损耗绝缘胶膜材料及其制备方法
JP7259783B2 (ja) * 2020-02-27 2023-04-18 味の素株式会社 樹脂組成物
JP2021172756A (ja) * 2020-04-27 2021-11-01 味の素株式会社 樹脂組成物

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103351578A (zh) * 2013-07-19 2013-10-16 广东生益科技股份有限公司 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
TW201418357A (zh) * 2012-07-31 2014-05-16 Ajinomoto Kk 樹脂組成物
CN105323960A (zh) * 2014-08-01 2016-02-10 味之素株式会社 电路板及其制造方法
JP2016027097A (ja) * 2014-06-30 2016-02-18 味の素株式会社 樹脂組成物
JP2016084413A (ja) * 2014-10-27 2016-05-19 味の素株式会社 樹脂組成物
JP2016108268A (ja) * 2014-12-05 2016-06-20 新日鉄住金化学株式会社 ヒドロキシ樹脂、その製造方法、エポキシ樹脂組成物及びその硬化物
CN106256862A (zh) * 2015-06-22 2016-12-28 味之素株式会社 树脂组合物
JP2017036403A (ja) * 2015-08-11 2017-02-16 味の素株式会社 樹脂組成物
CN106467653A (zh) * 2015-08-19 2017-03-01 新日铁住金化学株式会社 阻燃性环氧树脂组合物、预浸料、绝缘片、粘着片、层叠板、密封材料、浇铸材料及固化物
CN107022169A (zh) * 2015-12-25 2017-08-08 味之素株式会社 树脂组合物
CN107129589A (zh) * 2016-02-29 2017-09-05 味之素株式会社 带支撑体的树脂片

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007308640A (ja) 2006-05-19 2007-11-29 Kyocera Chemical Corp 積層板用樹脂組成物、有機基材プリプレグ、金属張積層板およびプリント配線板
JP2009185170A (ja) 2008-02-06 2009-08-20 Kyocera Chemical Corp プリプレグ、金属張り積層板およびプリント配線板
TWI494364B (zh) 2009-01-30 2015-08-01 Ajinomoto Kk Resin composition
JP6123152B2 (ja) * 2010-12-08 2017-05-10 味の素株式会社 樹脂組成物
TW201817807A (zh) 2012-05-31 2018-05-16 日商味之素股份有限公司 樹脂組成物
JP6497652B2 (ja) 2015-04-15 2019-04-10 京セラ株式会社 封止用エポキシ樹脂成形材料及び電子部品
JP2017052884A (ja) 2015-09-10 2017-03-16 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP7296191B2 (ja) * 2018-01-09 2023-06-22 味の素株式会社 硬化性樹脂組成物、樹脂シート、プリント配線板及び半導体装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201418357A (zh) * 2012-07-31 2014-05-16 Ajinomoto Kk 樹脂組成物
CN103351578A (zh) * 2013-07-19 2013-10-16 广东生益科技股份有限公司 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
JP2016027097A (ja) * 2014-06-30 2016-02-18 味の素株式会社 樹脂組成物
CN105323960A (zh) * 2014-08-01 2016-02-10 味之素株式会社 电路板及其制造方法
JP2016084413A (ja) * 2014-10-27 2016-05-19 味の素株式会社 樹脂組成物
JP2016108268A (ja) * 2014-12-05 2016-06-20 新日鉄住金化学株式会社 ヒドロキシ樹脂、その製造方法、エポキシ樹脂組成物及びその硬化物
CN106256862A (zh) * 2015-06-22 2016-12-28 味之素株式会社 树脂组合物
JP2017036403A (ja) * 2015-08-11 2017-02-16 味の素株式会社 樹脂組成物
CN106467653A (zh) * 2015-08-19 2017-03-01 新日铁住金化学株式会社 阻燃性环氧树脂组合物、预浸料、绝缘片、粘着片、层叠板、密封材料、浇铸材料及固化物
CN107022169A (zh) * 2015-12-25 2017-08-08 味之素株式会社 树脂组合物
CN107129589A (zh) * 2016-02-29 2017-09-05 味之素株式会社 带支撑体的树脂片

Also Published As

Publication number Publication date
TW201936771A (zh) 2019-09-16
CN110016203A (zh) 2019-07-16
TWI811275B (zh) 2023-08-11
JP7296191B2 (ja) 2023-06-22
KR102752113B1 (ko) 2025-01-10
KR20250010112A (ko) 2025-01-20
KR20190084890A (ko) 2019-07-17
JP2019119819A (ja) 2019-07-22
JP2022003125A (ja) 2022-01-11
JP7272392B2 (ja) 2023-05-12

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