CN107529294A - A kind of manufacturing method of PCB and PCB - Google Patents

Abstract

The invention discloses a manufacturing method of a PCB, which relates to the technical field of PCB processing and comprises the following steps: identifying a dry flower risk area; and a choke block group is arranged in the flower drying risk area. After the resin in the prepreg between layers enters the copper-free area in the pressing process, the copper-free area can be fully filled due to the flow guide effect of the choke block group, and further the flow guide effect indirectly improves the fluidity of the resin, so that the circuit gaps in the circuit pattern part can be fully filled by the resin. And then realize effectively preventing the defect that the flower appears futilely in the PCB manufacture process, the yields when promoting PCB preparation. The invention also discloses a PCB, which comprises a circuit pattern area and a flower drying risk area, wherein a choke block group is arranged in the flower drying risk area, the choke block group consists of a plurality of choke block units, gaps are arranged between the adjacent choke block units, the choke block units are made of copper, and the total area of the choke block units is more than twenty percent of the area of the choke block group.

Description

A kind of manufacturing method of PCB and PCB

technical field

The invention relates to the technical field of PCB processing, in particular to a PCB manufacturing method and the PCB.

Background technique

The production of multi-layer PCB is based on the melting and solidification of the resin between the interlayer adhesive sheets during the lamination process. The dry flower (white spot) that appears after PCB lamination is a common defect in PCB production. The form of dry flower is that white spots appear in the dry flower area. The essential reason is that the resin glue in the bonding sheet cannot completely fill the PCB graphic gap. There are many reasons for this phenomenon, such as abnormal lamination equipment, unreasonable lamination program design, low fluidity of the adhesive sheet, unreasonable inner layer graphic design, thick inner layer copper (≥1oz, 1oz is defined as one square One side of the ruler area is covered with copper foil with a weight of 1oz (28.35g) copper layer thickness), the thickness of the butter layer (Butter coat thickness) is insufficient, and so on. The main consequences caused by this defect are: voids appear in the inner layer of the dried flower area, short circuit of the inner layer circuit connection after metallization through the hole, easy delamination after thermal stress, etc.

In response to the above defects, the current practice is to provide buffer materials (aluminum sheet or kraft paper) to the PCB before lamination, so that the PCB is evenly stressed during the lamination process. The current practice can prevent the dry flower problem caused by resins with high fluidity to a certain extent, but for resins with low fluidity, the current practice cannot effectively prevent it. At the same time, the shortcomings of the current method are: in the absence of targeted definition of defects, cushioning materials need to be added, which leads to waste of unnecessary auxiliary materials, and cannot minimize the scrapping caused by pressing dried flowers.

Contents of the invention

An object of the present invention is to provide a PCB manufacturing method, which can effectively prevent the defects of dried flowers in the PCB manufacturing process, and the manufactured PCB has a high rate of good products.

Another object of the present invention is to provide a PCB with less dry flowers inside the PCB and high quality PCB.

For reaching this purpose, the present invention adopts following technical scheme:

On the one hand, a method for manufacturing a PCB is provided, comprising the following steps:

Identify areas of risk for dried flowers;

Set up blocking block groups in the dried flower risk area;

Lamination and subsequent processing procedures.

Specifically, a multi-layer PCB is composed of several core boards and prepregs for curing and bonding adjacent core boards. The core boards are made of prepregs and copper foils arranged on both sides of the prepregs.

According to the CAM (computer Aided Manufacturing, computer-aided manufacturing) data used in PCB design and production, the area prone to dry flowers in the lamination process is identified as the dry flower risk area; or the dry flowers appear in the waste boards produced during the production process The statistics of the area are carried out to further optimize the standard for identifying the risk area of dried flowers.

According to the identified dry flower risk area, a block group is set in the dry flower risk area. During the pressing process, the resin in the prepreg between the layers enters the copper-free area and can fully fill the copper-free area due to the diversion effect of the block group. area, and further indirectly improves the fluidity of the resin due to the diversion effect, so that the circuit gap in the circuit pattern part can also be fully filled with the resin. In order to effectively prevent the defects of dry flowers in the PCB production process, and improve the yield rate of PCB production.

At the same time, it is ensured that there is a certain gap between the boundary of the blocking block group and the boundary of the line graphic area, as a safe distance for shielding the line signal.

Preferably, the step: identifying the risk area of dried flowers is specifically:

Screen out copper-free areas with an area greater than or equal to 900 square millimeters as dry flower risk areas.

Further, according to the CAM data, the copper-free area with an area greater than or equal to 900 square millimeters is selected as the dry flower risk area. Since the physical properties of PCBs with different layers will be different, the appropriate dry flower risk area can be selected according to the specific situation.

Preferably, an area of 800 square millimeters, 810 square millimeters, 820 square millimeters, 830 square millimeters, 840 square millimeters ... 980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters is used as the dry flower risk area .

At the same time, in order to further improve the yield rate of PCB production and ensure that the production method is suitable for PCBs with different layers, statistics are made on the defective areas of dried flowers during the PCB production process, and the standards for identifying risky areas of dried flowers are further optimized.

Preferably, the step: identifying the risk area of dried flowers is specifically:

If the number of consecutive layers with copper-free areas is more than six layers, and the copper-free areas on adjacent layers have overlapping parts, then the copper-free area of each layer is regarded as the dry flower risk area.

For multi-layer PCBs, if the continuous layers have copper-free areas, and the copper-free areas on adjacent layers have overlapping parts, the sufficient flow of the resin cannot be guaranteed during lamination, and the resin cannot completely fill the copper-free areas and circuit patterns. If there is a gap between the upper lines, the copper-free area on the above-mentioned continuous layer is taken as the dry flower risk area.

The overlapping portion of the copper-free area on the adjacent layer means that when the PCB is laid flat, the projections of the copper-free area on the adjacent layer on the horizontal plane have an overlapping portion.

Preferably, if there are four layers, five layers, six layers, seven layers, eight layers, nine layers... eighteen layers, nineteen layers or twenty layers in the copper-free area, and there are no layers on adjacent layers If the copper area has overlapping parts, the copper-free area of each layer is regarded as the dry flower risk area.

Preferably, the choke block group is composed of several choke block units, gaps are provided between adjacent choke block units, the material of the choke block units is copper, and the total area of the choke block units is the area of the choke block group more than twenty percent.

Further, the baffle block units on adjacent layers are laid at the same position or interlaced, that is, the projections of the baffle block units on adjacent layers on the horizontal plane are completely overlapped or without any crossing area.

Preferably, the baffle block units on adjacent layers may also be arranged in a manner of partially overlapping, that is, the projections of the baffle block units on adjacent layers on the horizontal plane are partially overlapped.

A number of baffle block units are arranged in a suitable way to form a baffle block group. When pressing, the resin flows in the gap between the baffle block units. Since the gap between the baffle block units is similar to forming a diversion groove, the lifting It improves the fluidity of the resin and enriches the directionality of the resin flow, ensuring that the resin can fully fill the copper-free area, and at the same time, the circuit gap in the circuit pattern part can also be fully filled by the resin. The uniformity and extensiveness of resin distribution in the pressing process are further enhanced.

Preferably, the block unit is circular, and the radius of the block unit is less than or equal to 1.27 mm.

The block unit is circular, preferably, the radius of the block unit is 0.90 mm, 0.91 mm, 0.92 mm, 0.93 mm, 0.94 mm, 0.95 mm, ... 1.75 mm, 1.76 mm, 1.77 mm, 1.78 mm, 1.79mm or 1.80mm.

Preferably, the choke block unit is hexagonal, and the distance from the center of the choke block unit to any side of the choke block unit is less than or equal to 1.27 mm.

Further, the baffle block unit can also be in other shapes than circle and hexagon.

Preferably, the center distances between adjacent baffle block units are equal, and the center distance between adjacent baffle block units is less than or equal to M, where M=(2*D+2) millimeters;

Wherein, D is the vertical distance from the center of the baffle block unit to the edge.

Specifically, when the choke block unit is circular, D is the radius of the choke block unit; when the choke block unit is hexagonal, D is the length of the vertical line between the center of the choke block unit and the sideline .

On the other hand, a PCB is provided, including a circuit pattern area and a dry flower risk area, a flow blocking block group is provided in the dry flower risk area, and the flow blocking block group is composed of several flow blocking block units. There are gaps.

The circuit graphic area specifically includes: the area with circuit layout, the area where circuit layout and wiring are carried out according to the previous design, and there are certain gaps between the various lines.

The dry flower risk area is specifically: a copper-free area with an area greater than or equal to 900 square millimeters;

Alternatively, for a multi-layer PCB, if the continuous layers have copper-free areas, and the copper-free areas on adjacent layers have overlapped parts, then the copper-free areas on the above-mentioned continuous layers are risk areas for dry flowers.

Preferably, an area of 800 square millimeters, 810 square millimeters, 820 square millimeters, 830 square millimeters, 840 square millimeters ... 980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters is used as the dry flower risk area .

Further, if there are four, five, six, seven, eight, nine layers...eighteen, nineteen, or twenty layers of continuous layers in the copper-free area, and there are no If the copper area has overlapping parts, the copper-free area of each layer is regarded as the dry flower risk area.

After the resin in the interlayer prepreg enters the copper-free area during the lamination process, the copper-free area can be fully filled due to the flow diversion of the baffle block unit on the baffle block group, and the flow of the resin is further indirectly improved due to the flow diversion property, so that the circuit gap in the circuit pattern part can also be fully filled with resin. Thus, it is possible to effectively prevent the defects of dry flowers in the PCB manufacturing process, and improve the quality of the PCB.

At the same time, it is ensured that there is a certain gap between the boundary of the blocking block group and the boundary of the line graphic area, as a safe distance for shielding the line signal.

Preferably, the material of the choke block unit is copper, the total area of the choke block unit is more than 20% of the area of the choke block group, the choke block unit is circular, and the radius of the choke block unit is less than or equal to 1.27 millimeters;

Alternatively, the choke block unit is hexagonal, and the distance from the center of the choke block unit to any side of the choke block unit is less than or equal to 1.27 mm.

When the block unit is circular, preferably, the radius of the block unit is 0.90 mm, 0.91 mm, 0.92 mm, 0.93 mm, 0.94 mm, 0.95 mm, ... 1.75 mm, 1.76 mm, 1.77 mm, 1.78 mm , 1.79mm or 1.80mm.

Further, the baffle block unit can also be in other shapes than circle and hexagon.

Preferably, the center distances between adjacent baffle block units are equal, and the center distance between adjacent baffle block units is less than or equal to M, where M=(2*D+2) millimeters;

Wherein, D is the vertical distance from the center of the baffle block unit to the edge.

Specifically, when the choke block unit is circular, D is the radius of the choke block unit; when the choke block unit is hexagonal, D is the length of the vertical line between the center of the choke block unit and the sideline .

Beneficial effects of the present invention: after the resin in the interlayer prepreg enters the copper-free area during the lamination process, the copper-free area can be fully filled due to the diversion effect of the flow blocking block group, and the flow of the resin is further indirectly improved due to the diversion effect property, so that the circuit gap in the circuit pattern part can also be fully filled with resin. In order to effectively prevent the defects of dry flowers in the PCB production process, and improve the yield rate of PCB production.

Due to the function of the block group, the resin can fully fill the copper-free area and the circuit gap in the circuit pattern part, which improves the quality of the PCB product.

Description of drawings

Fig. 1 is the flow chart diagram of PCB manufacturing method;

Figure 2 is an exploded view of the PCB (when the choke block unit is circular);

Fig. 3 is a schematic structural view of the choke block group (when the choke block unit is circular);

Fig. 4 is a schematic diagram of the structure of the circuit pattern area and the dried flower risk area on the core board;

Figure 5 is an exploded view of the PCB (when the block unit is hexagonal);

Fig. 6 is a schematic structural view of the choke block group (when the choke block unit is hexagonal);

In the picture:

1. Line graphics area;

2. Dried flower risk area;

3. A block group; 301. A block unit.

detailed description

The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

Embodiment one

As shown in Figure 1-4, a PCB manufacturing method includes the following steps:

Dried flower risk areas are identified2;

Set up a block group 3 in the dried flower risk area 2;

Lamination and subsequent processing procedures.

Specifically, a multi-layer PCB is composed of several core boards and prepregs for curing and bonding adjacent core boards. The core boards are made of prepregs and copper foils arranged on both sides of the prepregs.

According to the CAM (computer Aided Manufacturing, computer-aided manufacturing) data used in PCB design and production, the area prone to dry flowers during the lamination process is identified as the dry flower risk area 2; or the waste boards produced during the production process appear The area of dried flowers will be counted to further optimize the criteria for identifying the risk area 2 of dried flowers.

According to the identified dry flower risk area 2, a flow blocking block group 3 is set in the dry flower risk area 2. After the resin in the interlayer prepreg enters the copper-free area during the pressing process, due to the flow diversion of the flow blocking block group 3, it can Fully fill the copper-free area, and further indirectly improve the fluidity of the resin due to the diversion effect, so that the circuit gap in the circuit pattern part can also be fully filled by the resin. In order to effectively prevent the defects of dry flowers in the PCB production process, and improve the yield rate of PCB production.

At the same time, it is ensured that there is a certain gap between the boundary of the blocking block group 3 and the boundary of the line graphic area 1 as a safe distance for shielding the line signal.

Dried flower risk areas 2 are identified specifically as:

According to the CAM data, the copper-free area with an area greater than or equal to 900 square millimeters is selected as the dry flower risk area 2.

Preferably, an area of 800 square millimeters, 810 square millimeters, 820 square millimeters, 830 square millimeters, 840 square millimeters ... 980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters is used as the dry flower risk area 2.

At the same time, in order to further improve the yield rate of PCB production and ensure that the production method is suitable for PCBs with different layers, statistics are made on the defective areas of dried flowers during the PCB production process, and the standard for identifying the risk area 2 of dried flowers is further optimized.

The choke block group 3 is made up of several choke block units 301, a gap is provided between adjacent choke block units 301, the material of the choke block units 301 is copper, and the total area of the choke block units 301 is the choke block group 3 More than 20 percent of the area.

Several baffle block units 301 form the baffle block group 3 in a suitable arrangement, and the resin flows in the gaps between the baffle block units 301 during pressing, because the gaps between the baffle block units 301 are similar to forming a flow guide Therefore, the fluidity of the resin is improved and the directionality of the resin flow is enriched to ensure that the resin can fully fill the copper-free area, and at the same time, the circuit gap in the circuit pattern part can also be fully filled by the resin. The uniformity and extensiveness of resin distribution in the pressing process are further enhanced.

The choke block unit 301 is circular, and the radius of the choke block unit 301 is less than or equal to 1.27 mm.

The block unit 301 is circular, preferably, the radius of the block unit 301 is 0.90 mm, 0.91 mm, 0.92 mm, 0.93 mm, 0.94 mm, 0.95 mm, ... 1.75 mm, 1.76 mm, 1.77 mm, 1.78 mm mm, 1.79 mm or 1.80 mm.

The center distances between adjacent choke block units 301 are equal, and the center distance between adjacent choke block units 301 is less than or equal to M, M=(2*D+2) millimeters; wherein, D is a choke block The vertical distance from the center of cell 301 to the edge.

Further, the choke block unit 301 may also be in other shapes than circular.

Embodiment two

As shown in Fig. 1 and Fig. 4-6, a method for manufacturing a PCB includes the following steps:

Dried flower risk areas are identified2;

Set up a block group 3 in the dried flower risk area 2;

Lamination and subsequent processing procedures.

Specifically, a multi-layer PCB is composed of several core boards and prepregs for curing and bonding adjacent core boards. The core boards are made of prepregs and copper foils arranged on both sides of the prepregs.

According to the CAM (computer Aided Manufacturing, computer-aided manufacturing) data used in PCB design and production, the area prone to dry flowers during the lamination process is identified as the dry flower risk area 2; or the waste boards produced during the production process appear The area of dried flowers will be counted to further optimize the criteria for identifying the risk area 2 of dried flowers.

According to the identified dry flower risk area 2, a flow blocking block group 3 is set in the dry flower risk area 2. After the resin in the interlayer prepreg enters the copper-free area during the pressing process, due to the flow diversion of the flow blocking block group 3, it can Fully fill the copper-free area, and further indirectly improve the fluidity of the resin due to the diversion effect, so that the circuit gap in the circuit pattern part can also be fully filled by the resin. In order to effectively prevent the defects of dry flowers in the PCB production process, and improve the yield rate of PCB production.

At the same time, it is ensured that there is a certain gap between the boundary of the blocking block group 3 and the boundary of the line graphic area 1 as a safe distance for shielding the line signal.

Dried flower risk areas 2 are identified specifically as:

If the number of consecutive layers with copper-free areas is more than six, and the copper-free areas on adjacent layers have overlapped parts, then the copper-free area of each layer is regarded as dry flower risk area 2.

For multi-layer PCBs, if the continuous layers have copper-free areas, and the copper-free areas on adjacent layers have overlapping parts, the sufficient flow of the resin cannot be guaranteed during lamination, and the resin cannot completely fill the copper-free areas and circuit patterns. For the gap between the upper lines, the copper-free area on the above-mentioned continuous layer is regarded as the dry flower risk area 2.

The overlapping portion of the copper-free area on the adjacent layer means that when the PCB is laid flat, the projections of the copper-free area on the adjacent layer on the horizontal plane have an overlapping portion.

Preferably, if there are four layers, five layers, six layers, seven layers, eight layers, nine layers... eighteen layers, nineteen layers or twenty layers in the copper-free area, and there are no layers on adjacent layers If the copper area has overlapping parts, the copper-free area of each layer is regarded as the dry flower risk area 2.

The choke block group 3 is made up of several choke block units 301, a gap is provided between adjacent choke block units 301, the material of the choke block units 301 is copper, and the total area of the choke block units 301 is the choke block group 3 More than 20 percent of the area.

Further, the baffle block units 301 on adjacent layers are laid at the same position or staggered, that is, the projections of the baffle block units 301 on adjacent layers on the horizontal plane are completely overlapped or without any crossing area.

Several baffle block units 301 form the baffle block group 3 in a suitable arrangement, and the resin flows in the gaps between the baffle block units 301 during pressing, because the gaps between the baffle block units 301 are similar to forming a flow guide Therefore, the fluidity of the resin is improved and the directionality of the resin flow is enriched to ensure that the resin can fully fill the copper-free area, and at the same time, the circuit gap in the circuit pattern part can also be fully filled by the resin. The uniformity and extensiveness of resin distribution in the pressing process are further enhanced.

The choke block unit 301 is hexagonal, and the distance from the center of the choke block unit 301 to any side of the choke block unit 301 is less than or equal to 1.27 mm.

Further, the choke block unit 301 may also be other shapes than the hexagon.

The center distances between adjacent choke block units 301 are equal, and the center distance between adjacent choke block units 301 is less than or equal to M, M=(2*D+2) millimeters; wherein, D is a choke block The vertical distance from the center of cell 301 to the edge.

Embodiment three

As shown in Fig. 1 and Fig. 4-6, a method for manufacturing a PCB includes the following steps:

Dried flower risk areas are identified2;

Set up a block group 3 in the dried flower risk area 2;

Lamination and subsequent processing procedures.

Specifically, a multi-layer PCB is composed of several core boards and prepregs for curing and bonding adjacent core boards. The core boards are made of prepregs and copper foils arranged on both sides of the prepregs.

According to the CAM (computer Aided Manufacturing, computer-aided manufacturing) data used in PCB design and production, the area prone to dry flowers during the lamination process is identified as the dry flower risk area 2; or the waste boards produced during the production process appear The area of dried flowers will be counted to further optimize the criteria for identifying the risk area 2 of dried flowers.

According to the identified dry flower risk area 2, a flow blocking block group 3 is set in the dry flower risk area 2. After the resin in the interlayer prepreg enters the copper-free area during the pressing process, due to the flow diversion of the flow blocking block group 3, it can Fully fill the copper-free area, and further indirectly improve the fluidity of the resin due to the diversion effect, so that the circuit gap in the circuit pattern part can also be fully filled by the resin. In order to effectively prevent the defects of dry flowers in the PCB production process, and improve the yield rate of PCB production.

At the same time, it is ensured that there is a certain gap between the boundary of the blocking block group 3 and the boundary of the line graphic area 1 as a safe distance for shielding the line signal.

Dried flower risk areas 2 are identified specifically as:

According to the CAM data, the copper-free area with an area greater than or equal to 900 square millimeters is selected as the dry flower risk area 2.

Preferably, an area of 800 square millimeters, 810 square millimeters, 820 square millimeters, 830 square millimeters, 840 square millimeters ... 980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters is used as the dry flower risk area 2.

At the same time, in order to further improve the yield rate of PCB production and ensure that the production method is suitable for PCBs with different layers, statistics are made on the defective areas of dried flowers during the PCB production process, and the standard for identifying the risk area 2 of dried flowers is further optimized.

The choke block group 3 is made up of several choke block units 301, a gap is provided between adjacent choke block units 301, the material of the choke block units 301 is copper, and the total area of the choke block units 301 is the choke block group 3 More than 20 percent of the area.

Several baffle block units 301 form the baffle block group 3 in a suitable arrangement, and the resin flows in the gaps between the baffle block units 301 during pressing, because the gaps between the baffle block units 301 are similar to forming a flow guide Therefore, the fluidity of the resin is improved and the directionality of the resin flow is enriched to ensure that the resin can fully fill the copper-free area, and at the same time, the circuit gap in the circuit pattern part can also be fully filled by the resin. The uniformity and extensiveness of resin distribution in the pressing process are further enhanced.

The choke block unit 301 is hexagonal, and the distance from the center of the choke block unit 301 to any side of the choke block unit 301 is less than or equal to 1.27 mm.

Further, the choke block unit 301 may also be other shapes than the hexagon.

The center distances between adjacent choke block units 301 are equal, and the center distance between adjacent choke block units 301 is less than or equal to M, M=(2*D+2) millimeters; wherein, D is a choke block The vertical distance from the center of cell 301 to the edge.

Embodiment Four

As shown in Figure 1-4, a PCB manufacturing method includes the following steps:

Dried flower risk areas are identified2;

Set up a block group 3 in the dried flower risk area 2;

Lamination and subsequent processing procedures.

Specifically, a multi-layer PCB is composed of several core boards and prepregs for curing and bonding adjacent core boards. The core boards are made of prepregs and copper foils arranged on both sides of the prepregs.

According to the CAM (computer Aided Manufacturing, computer-aided manufacturing) data used in PCB design and production, the area prone to dry flowers during the lamination process is identified as the dry flower risk area 2; or the waste boards produced during the production process appear The area of dried flowers will be counted to further optimize the criteria for identifying the risk area 2 of dried flowers.

According to the identified dry flower risk area 2, a flow blocking block group 3 is set in the dry flower risk area 2. After the resin in the interlayer prepreg enters the copper-free area during the pressing process, due to the flow diversion of the flow blocking block group 3, it can Fully fill the copper-free area, and further indirectly improve the fluidity of the resin due to the diversion effect, so that the circuit gap in the circuit pattern part can also be fully filled by the resin. In order to effectively prevent the defects of dry flowers in the PCB production process, and improve the yield rate of PCB production.

At the same time, it is ensured that there is a certain gap between the boundary of the blocking block group 3 and the boundary of the line graphic area 1 as a safe distance for shielding the line signal.

Dried flower risk areas 2 are identified specifically as:

If the number of consecutive layers with copper-free areas is more than six, and the copper-free areas on adjacent layers have overlapped parts, then the copper-free area of each layer is regarded as dry flower risk area 2.

For multi-layer PCBs, if the continuous layers have copper-free areas, and the copper-free areas on adjacent layers have overlapping parts, the sufficient flow of the resin cannot be guaranteed during lamination, and the resin cannot completely fill the copper-free areas and circuit patterns. For the gap between the upper lines, the copper-free area on the above-mentioned continuous layer is regarded as the dry flower risk area 2.

The overlapping portion of the copper-free area on the adjacent layer means that when the PCB is laid flat, the projections of the copper-free area on the adjacent layer on the horizontal plane have an overlapping portion.

Preferably, if there are four layers, five layers, six layers, seven layers, eight layers, nine layers... eighteen layers, nineteen layers or twenty layers in the copper-free area, and there are no layers on adjacent layers If the copper area has overlapping parts, the copper-free area of each layer is regarded as the dry flower risk area 2.

The choke block group 3 is made up of several choke block units 301, a gap is provided between adjacent choke block units 301, the material of the choke block units 301 is copper, and the total area of the choke block units 301 is the choke block group 3 More than 20 percent of the area.

Further, the baffle block units 301 on adjacent layers are laid at the same position or staggered, that is, the projections of the baffle block units 301 on adjacent layers on the horizontal plane are completely overlapped or without any crossing area.

Several baffle block units 301 form the baffle block group 3 in a suitable arrangement, and the resin flows in the gaps between the baffle block units 301 during pressing, because the gaps between the baffle block units 301 are similar to forming a flow guide Therefore, the fluidity of the resin is improved and the directionality of the resin flow is enriched to ensure that the resin can fully fill the copper-free area, and at the same time, the circuit gap in the circuit pattern part can also be fully filled by the resin. The uniformity and extensiveness of resin distribution in the pressing process are further enhanced.

The choke block unit 301 is circular, and the radius of the choke block unit 301 is less than or equal to 1.27 mm.

The block unit 301 is circular, preferably, the radius of the block unit 301 is 0.90 mm, 0.91 mm, 0.92 mm, 0.93 mm, 0.94 mm, 0.95 mm, ... 1.75 mm, 1.76 mm, 1.77 mm, 1.78 mm mm, 1.79 mm or 1.80 mm.

The center distances between adjacent choke block units 301 are equal, and the center distance between adjacent choke block units 301 is less than or equal to M, M=(2*D+2) millimeters; wherein, D is a choke block The vertical distance from the center of cell 301 to the edge.

Further, the choke block unit 301 may also be in other shapes than circular.

Embodiment five

As shown in Figure 1-6, a PCB manufacturing method includes the following steps:

Dried flower risk areas are identified2;

Set up a block group 3 in the dried flower risk area 2;

Lamination and subsequent processing procedures.

Specifically, a multi-layer PCB is composed of several core boards and prepregs for curing and bonding adjacent core boards. The core boards are made of prepregs and copper foils arranged on both sides of the prepregs.

According to the identified dry flower risk area 2, a flow blocking block group 3 is set in the dry flower risk area 2. After the resin in the interlayer prepreg enters the copper-free area during the pressing process, due to the flow diversion of the flow blocking block group 3, it can Fully fill the copper-free area, and further indirectly improve the fluidity of the resin due to the diversion effect, so that the circuit gap in the circuit pattern part can also be fully filled by the resin. In order to effectively prevent the defects of dry flowers in the PCB production process, and improve the yield rate of PCB production.

Above-mentioned choke block group 3 is made up of several choke block units 301, is provided with gap between adjacent choke block units 301, and the material of choke block unit 301 is copper, and the total area of choke block unit 301 is choke block unit 301. Twenty percent or more of the area of Group 3. Further, the baffle block units 301 on adjacent layers are laid at the same position or staggered, that is, the projections of the baffle block units 301 on adjacent layers on the horizontal plane are completely overlapped or without any crossing area.

Embodiment six

As shown in Figure 1-4, a PCB manufacturing method includes the following steps:

Dried flower risk areas are identified2;

Set up a block group 3 in the dried flower risk area 2;

Lamination and subsequent processing procedures.

Above-mentioned choke block group 3 is made up of several circular choke block units 301, is provided with gap between adjacent choke block units 301, and the material of choke block unit 301 is copper, and the total area of choke block unit 301 is resistance The area of the flow block group 3 is more than 20%, and the radius of the flow block unit 301 is less than or equal to 1.27 mm.

The center distances between adjacent choke block units 301 are equal, and the center distance between adjacent choke block units 301 is less than or equal to M, M=(2*D+2) millimeters; wherein, D is a choke block The vertical distance from the center of cell 301 to the edge.

Embodiment seven

As shown in Fig. 1 and Fig. 4-6, a method for manufacturing a PCB includes the following steps:

Dried flower risk areas are identified2;

Set up a block group 3 in the dried flower risk area 2;

Lamination and subsequent processing procedures.

Above-mentioned choke block group 3 is made up of several regular hexagonal choke block units 301, is provided with gap between adjacent choke block units 301, and the material of choke block unit 301 is copper, and the total area of choke block unit 301 is The area of the choke block group 3 is more than 20%, and the distance from the center of the choke block unit 301 to any side of the choke block unit 301 is less than or equal to 1.27 mm.

The center distances between adjacent choke block units 301 are equal, and the center distance between adjacent choke block units 301 is less than or equal to M, M=(2*D+2) millimeters; wherein, D is a choke block The vertical distance from the center of cell 301 to the edge.

Embodiment eight

As shown in Figure 2-4, a PCB includes a circuit pattern area 1 and a dried flower risk area 2, and the dried flower risk area 2 is provided with a flow blocking block group 3, and the flow blocking block group 3 is composed of several flow blocking block units 301, There are gaps between adjacent choke block units 301 , the choke block units 301 are made of copper, and the total area of the choke block units 301 is more than 20% of the area of the choke block group 3 .

The circuit pattern area 1 is specifically: an area with a circuit layout, an area where the circuit layout and wiring are performed according to the previous design, and there is a certain gap between each circuit.

Specifically, a multi-layer PCB is composed of several core boards and prepregs for curing and bonding adjacent core boards. The core boards are made of prepregs and copper foils arranged on both sides of the prepregs.

Dried flower risk area 2 is specifically: a copper-free area with an area greater than or equal to 900 square millimeters.

Preferably, an area of 800 square millimeters, 810 square millimeters, 820 square millimeters, 830 square millimeters, 840 square millimeters ... 980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters is used as the dry flower risk area 2.

The choke block unit 301 is circular, and the radius of the choke block unit 301 is less than or equal to 1.27 mm.

Preferably, the radius of the choke block unit 301 is 0.90 mm, 0.91 mm, 0.92 mm, 0.93 mm, 0.94 mm, 0.95 mm, ... 1.75 mm, 1.76 mm, 1.77 mm, 1.78 mm, 1.79 mm or 1.80 mm.

The center distances between adjacent choke block units 301 are equal, and the center distance between adjacent choke block units 301 is less than or equal to M, M=(2*D+2) millimeters; wherein, D is a choke block The vertical distance from the center of cell 301 to the edge.

Further, the choke block unit 301 may also be in other shapes than circular.

Embodiment nine

As shown in Figure 2-4, a PCB includes a circuit pattern area 1 and a dried flower risk area 2, and the dried flower risk area 2 is provided with a flow blocking block group 3, and the flow blocking block group 3 is composed of several flow blocking block units 301, There are gaps between adjacent choke block units 301 , the choke block units 301 are made of copper, and the total area of the choke block units 301 is more than 20% of the area of the choke block group 3 .

The circuit pattern area 1 is specifically: an area with a circuit layout, an area where the circuit layout and wiring are performed according to the previous design, and there is a certain gap between each circuit.

Specifically, a multi-layer PCB is composed of several core boards and prepregs for curing and bonding adjacent core boards. The core boards are made of prepregs and copper foils arranged on both sides of the prepregs.

For multi-layer PCBs, if the continuous layers have copper-free areas, and the copper-free areas on adjacent layers have overlapped parts, then the copper-free areas on the above-mentioned continuous layers are dry flower risk areas 2.

Further, if there are four, five, six, seven, eight, nine layers...eighteen, nineteen, or twenty layers of continuous layers in the copper-free area, and there are no If the copper area has overlapping parts, the copper-free area of each layer is regarded as the dry flower risk area 2.

The choke block unit 301 is circular, and the radius of the choke block unit 301 is less than or equal to 1.27 mm. The center distances between adjacent choke block units 301 are equal, and the center distance between adjacent choke block units 301 is less than or equal to M, M=(2*D+2) millimeters; wherein, D is a choke block The vertical distance from the center of cell 301 to the edge.

Preferably, the radius of the choke block unit 301 is 0.90 mm, 0.91 mm, 0.92 mm, 0.93 mm, 0.94 mm, 0.95 mm, ... 1.75 mm, 1.76 mm, 1.77 mm, 1.78 mm, 1.79 mm or 1.80 mm.

Further, the choke block unit 301 may also be in other shapes than circular.

Embodiment ten

As shown in Figure 4-6, as shown in Figure 2-4, a PCB includes a circuit pattern area 1 and a dried flower risk area 2, and the dried flower risk area 2 is provided with a blocking block group 3, and the blocking block group 3 consists of A plurality of choke block units 301 are formed, and gaps are provided between adjacent choke block units 301. The material of the choke block units 301 is copper, and the total area of the choke block units 301 is the percentage of the area of the choke block group 3 twenty or more.

The circuit pattern area 1 is specifically: an area with a circuit layout, an area where the circuit layout and wiring are performed according to the previous design, and there is a certain gap between each circuit.

Specifically, a multi-layer PCB is composed of several core boards and prepregs for curing and bonding adjacent core boards. The core boards are made of prepregs and copper foils arranged on both sides of the prepregs.

Dried flower risk area 2 is specifically: a copper-free area with an area greater than or equal to 900 square millimeters.

Preferably, an area of 800 square millimeters, 810 square millimeters, 820 square millimeters, 830 square millimeters, 840 square millimeters ... 980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters is used as the dry flower risk area 2.

The choke block unit 301 is hexagonal, and the distance from the center of the choke block unit 301 to any side of the choke block unit 301 is less than or equal to 1.27 mm. The center distances between adjacent choke block units 301 are equal, and the center distance between adjacent choke block units 301 is less than or equal to M, M=(2*D+2) millimeters; wherein, D is a choke block The vertical distance from the center of cell 301 to the edge.

Further, the choke block unit 301 may also be other shapes than the hexagon.

Embodiment Eleven

As shown in Figure 4-6, as shown in Figure 4-6, as shown in Figure 2-4, a PCB includes a circuit pattern area 1 and a dried flower risk area 2, and a block group is arranged in the dried flower risk area 2 3. The choke block group 3 is composed of several choke block units 301. There are gaps between adjacent choke block units 301. The material of the choke block units 301 is copper, and the total area of the choke block units 301 is Twenty percent or more of the area of block group 3.

The circuit pattern area 1 is specifically: an area with a circuit layout, an area where the circuit layout and wiring are performed according to the previous design, and there is a certain gap between each circuit.

Specifically, a multi-layer PCB is composed of several core boards and prepregs for curing and bonding adjacent core boards. The core boards are made of prepregs and copper foils arranged on both sides of the prepregs.

For multi-layer PCBs, if the continuous layers have copper-free areas, and the copper-free areas on adjacent layers have overlapped parts, then the copper-free areas on the above-mentioned continuous layers are dry flower risk areas 2.

Further, if there are four, five, six, seven, eight, nine layers...eighteen, nineteen, or twenty layers of continuous layers in the copper-free area, and there are no If the copper area has overlapping parts, the copper-free area of each layer is regarded as the dry flower risk area 2.

The choke block unit 301 is hexagonal, and the distance from the center of the choke block unit 301 to any side of the choke block unit 301 is less than or equal to 1.27 mm. The center distances between adjacent choke block units 301 are equal, and the center distance between adjacent choke block units 301 is less than or equal to M, M=(2*D+2) millimeters; wherein, D is a choke block The vertical distance from the center of cell 301 to the edge.

Further, the choke block unit 301 may also be other shapes than the hexagon.

Apparently, the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, rather than limiting the implementation of the present invention. For those of ordinary skill in the art, other changes or changes in different forms can be made on the basis of the above description. It is not necessary and impossible to exhaustively list all the implementation manners here. All modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the claims of the present invention.

Claims (10)

1. A manufacturing method of PCB, is characterized in that, comprises the following steps: Dried flower risk areas are identified (2); A blocking block group (3) is arranged in the dried flower risk area (2). 2. The manufacturing method of PCB according to claim 1, characterized in that, said step: identifying the dried flower risk area (2) is specifically: A copper-free area with an area greater than or equal to 900 square millimeters is selected as the dried flower risk area (2). 3. The manufacturing method of PCB according to claim 1, characterized in that, said step: identifying the dried flower risk area (2) is specifically: If the number of consecutive layers with copper-free regions is more than six layers, and the copper-free regions on adjacent layers have overlapping parts, then the copper-free regions of each layer are used as the dry flower risk region (2). 4. The manufacturing method of PCB according to claim 1, characterized in that, the choke block group (3) is composed of several choke block units (301), and one of the adjacent choke block units (301) There is a gap between them, the material of the choke block unit (301) is copper, and the total area of the choke block unit (301) is more than 20% of the area of the choke block group (3) . 5. The manufacturing method of PCB according to claim 4, characterized in that, the choke block unit (301) is circular, and the radius of the choke block unit (301) is less than or equal to 1.27 mm. 6. The manufacturing method of PCB according to claim 4, characterized in that, the choke block unit (301) is hexagonal, and the center of the choke block unit (301) reaches the choke block unit The distance of any side of (301) is less than or equal to 1.27 mm. 7. The manufacturing method of PCB according to claim 5 or 6, characterized in that, the center distances between adjacent said choke block units (301) are equal, and the adjacent said choke block units (301) The center distance between them is less than or equal to M, M=(2*D+2) mm; Wherein, D is the vertical distance from the center to the edge of the baffle block unit (301). 8. A PCB, characterized in that it includes a circuit pattern area (1) and a dried flower risk area (2), the dried flower risk area (2) is provided with a block group (3), and the block group (3) It is composed of several choke block units (301), and gaps are provided between adjacent choke block units (301). 9. The PCB according to claim 8, characterized in that, the material of the choke block unit (301) is copper, and the total area of the choke block unit (301) is that of the choke block group (3 ), the choke block unit (301) is circular, and the radius of the choke block unit (301) is less than or equal to 1.27 mm; Alternatively, the choke block unit (301) is hexagonal, and the distance from the center of the choke block unit (301) to any side of the choke block unit (301) is less than or equal to 1.27 millimeters. 10. The PCB according to claim 9, characterized in that, the center distances between adjacent said choke block units (301) are equal, and the center distance between adjacent said choke block units (301) Less than or equal to M, M=(2*D+2) mm; Wherein, D is the vertical distance from the center to the edge of the baffle block unit (301).