CN105101683A - Multilayer heavy copper circuit board and manufacturing method thereof - Google Patents
Multilayer heavy copper circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN105101683A CN105101683A CN201510478410.1A CN201510478410A CN105101683A CN 105101683 A CN105101683 A CN 105101683A CN 201510478410 A CN201510478410 A CN 201510478410A CN 105101683 A CN105101683 A CN 105101683A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- copper circuit
- heavy copper
- bonding sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 102
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 102
- 239000010949 copper Substances 0.000 title claims abstract description 102
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 37
- 230000004888 barrier function Effects 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 abstract description 14
- 229920005989 resin Polymers 0.000 abstract description 14
- 238000002360 preparation method Methods 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a multilayer heavy copper circuit board and a manufacturing method thereof. The manufacturing method of the multilayer heavy copper circuit board comprises the following steps that multiple heavy copper circuit board core boards comprising multiple internal layer lines and core board insulating layers, and multiple insulating layer are provided; bonding sheets fill in the multiple internal layer lines of each heavy copper circuit board core board in a pressing mode; the multiple internal layer lines of each heavy copper circuit board core board are ensured to be filled and leveled up by the bonding sheets; each heavy copper circuit board core board in which the bonding sheets are filled and each insulating layer are laminated in an alternating way in turn, and a heavy copper board used for manufacturing an external layer line is arranged at the external surface of the outermost insulating layer to perform secondary pressing; and the heavy copper board is etched so that manufacturing of the external layer line is completed. The invention also provides the multilayer heavy copper circuit board manufactured by the manufacturing method. The multilayer heavy copper circuit board is manufactured by two times of pressing so that problems of resin holes and non-uniform thickness in a conventional pressing mode can be solved, and reliability can be enhanced.
Description
Technical field
The present invention relates to multilayer circuit board manufacture technology field, particularly, relate to a kind of multi-layer thick copper circuit board and preparation method thereof.
Background technology
It is first place layers of copper on the insulating layer that the circuit of circuit board (PrintedCircuitBoard, PCB) makes, then is etched away by unnecessary copper by etching method, the line pattern required for formation.Pcb board is divided into one side pcb board and double-sided PCB board, and one side pcb board refers to be furnished with circuit in the one side of insulating substrate, and double-sided PCB board refers to be evenly equipped with circuit on the two sides of insulating substrate.No matter be one side pcb board or double-sided PCB board, all may have multilayer line, be separated by insulating barrier between adjacent line layer.
Heavy copper circuit board (HeavyCopperPCB) refers to that heavy copper circuit board is widely used in the electronic assemblies fields such as communication, computer, electrical equipment, medical treatment, computer, space flight and aviation and war products containing the multilayer circuit board thick more than 3 ounces of copper.
Heavy copper circuit board is larger compared to common circuit board making difficulty, and specialized requirement is higher.For two-layer double-sided PCB board, existing manufacture method is: make ground floor circuit, be specially and be placed in layers of copper in one deck respectively on the two sides of insulating substrate, then carries out circuit etching respectively according to the circuit of design, completes the making of ground floor circuit; Then by by glass cloth base material be coated in the prepreg that on glass cloth base material, heat-curing resin is formed and be placed on internal layer copper; Outer copper is placed on prepreg and carries out pressing, make to be coated in the Clearance Flow between the resin inner layer copper on glass cloth base material by pressing, between internal layer copper and outer copper, form the resin bed of insulation.
If the Thickness Ratio of internal layer copper is comparatively large, then the gap between internal layer copper is larger.In bonding processes, often to occur between internal layer copper that filler amount is inadequate or insufficient and occur that product thickness is uneven or lamination is empty, if the excessive yield that will have a strong impact on follow-up circuit and make of plank thickness distribution difference, as insufficient in the resin filling between internal layer circuit, directly affect the reliability of product.
In order to avoid the problems referred to above as far as possible, usually adopt high one deck prepreg containing glue or multilayer prepreg to carry out pressing, but still thoroughly cannot solve the problem of thickness of slab lack of homogeneity and filler defect.Its main cause is because circuit board copper is thick comparatively large, needs enough glue amounts (i.e. amount of resin) and fill in bonding processes; In addition, in bonding processes, be also the important factor in order affecting heavy copper circuit board thickness of slab uniformity and filling effect to the amount of flow of the resin of filling between gap and flowing time.Adopt existing method to be pressed together between internal layer copper and outer copper and form resin bed, due to the impact by high temperature in the characteristic of resin thermosets and bonding processes, the flowing of resin has regional extent, can not unconfinedly flow, the Thickness Ratio of adding internal layer copper is comparatively large, adopts traditional pressing mode just inevitably to there will be thickness of slab lack of homogeneity and above-mentioned filler defect.
Summary of the invention
The technical problem of resin cavity and the uneven thickness existed in multi-layer thick copper circuit board is made in order to solve above-mentioned traditional pressing mode, the invention provides a kind of multi-layer thick copper circuit board and preparation method thereof, the method effectively can avoid the problem occurring resin cavity and uneven thickness in multi-layer thick copper circuit board manufacturing process.
The invention provides a kind of multi-layer thick copper circuit board, comprise: multiple heavy copper circuit board central layer, multiple insulating barrier, bonding sheet and outer-layer circuit, each described heavy copper circuit board central layer and each described insulating barrier alternately laminated successively, each described heavy copper circuit board central layer comprises central layer insulating barrier and many internal layer circuits, described bonding sheet is filled in many internal layer circuits of described heavy copper circuit board central layer, and described outer-layer circuit is placed in the outer surface of outermost described insulating barrier.
The invention provides a kind of manufacture method of multi-layer thick copper circuit board, comprise the steps:
Step one, provide multiple heavy copper circuit board central layer, multiple insulating barrier, each described heavy copper circuit board central layer comprises many internal layer circuits and central layer insulating barrier;
Step 2, with pressing mode, bonding sheet is filled to many internal layer circuits of each described heavy copper circuit board central layer;
Step 3, determine that many internal layer circuits of each described heavy copper circuit board central layer are filled and led up by described bonding sheet;
Step 4, by fill each described heavy copper circuit board central layer of bonding sheet and each described insulating barrier alternately laminated successively, and the thick copper coin being used for making outer-layer circuit is placed in the outer surface of insulating barrier described in outermost layer, carries out second pressing;
Step 5, described thick copper coin to be etched, complete outer-layer circuit and make.
In a kind of preferred embodiment of a kind of multi-layer thick copper circuit board manufacture method provided by the invention, in step 2, before filling bonding sheet, also comprise and carry out brown process to each described heavy copper circuit board central layer, carrying out brown process is adhesion in order to increase described bonding sheet and described many internal layer circuits when filling bonding sheet.
In a kind of preferred embodiment of a kind of multi-layer thick copper circuit board manufacture method provided by the invention, in step 2, with the parameter of pressing during pressing mode filling bonding sheet be: heating rate 2-3 DEG C/min, pressure 22-28kgf, in step 2, after filling bonding sheet, also comprise solidification process, curing time 60min, temperature 150 DEG C.
In a kind of preferred embodiment of a kind of multi-layer thick copper circuit board manufacture method provided by the invention, described bonding sheet is in semi-cured state.
In a kind of preferred embodiment of a kind of multi-layer thick copper circuit board manufacture method provided by the invention, complete in step 5 the step also comprising anti-welding process and printing word after outer-layer circuit makes.
In a kind of preferred embodiment of a kind of multi-layer thick copper circuit board manufacture method provided by the invention, the thickness of described insulating barrier is 100-200um.
Compared to prior art, multi-layer thick copper circuit board provided by the invention and preparation method thereof has following beneficial effect:
One, make multi-layer thick copper circuit board by twice pressing, avoid the resin cavity of tradition pressure side box-like making multi-layer thick copper circuit board existence and the technical problem of uneven thickness, the reliability making the multi-layer thick copper circuit board obtained is guaranteed.
The bonding sheet of two, filling between many internal layer circuits is semi-cured state, and brown is carried out to each heavy copper circuit board central layer, optimize pressing parameter, bonding processes bonding sheet is fully flowed and complete compact curing, strengthen the adhesion of bonding sheet and many internal layer circuits, and then enhancing thermal endurance, avoid layering.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the flow chart of multi-layer thick copper circuit board manufacture method provided by the invention;
Fig. 2 is the cross-sectional view of multi-layer thick copper circuit board provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Referring to Fig. 1, is the flow chart of multi-layer thick copper circuit board manufacture method provided by the invention.Described multi-layer thick copper circuit board manufacture method, comprises the steps:
S1: multiple heavy copper circuit board central layer, multiple insulating barrier are provided, each described heavy copper circuit board central layer comprises many internal layer circuits and central layer insulating barrier;
Particularly, the thickness of each described insulating barrier is 100-200um.
S2: with pressing mode, bonding sheet is filled to many internal layer circuits of each described heavy copper circuit board central layer;
Particularly, the parameter of pressing is in this step: heating rate 2-3 DEG C/min, pressure 22-28kgf.In the present embodiment, also comprised and carry out brown process to each described heavy copper circuit board central layer before filling bonding sheet, carrying out brown process is adhesion in order to increase described bonding sheet and described many internal layer circuits during follow-up filling bonding sheet; Filling bonding sheet after also comprise solidification process, curing time 60min, temperature 150 DEG C.
S3: determine that many internal layer circuits of each described heavy copper circuit board central layer are filled and led up by described bonding sheet;
S4: by alternately laminated successively to each described heavy copper circuit board central layer and each described insulating barrier of filling bonding sheet, and the thick copper coin being used for making outer-layer circuit is placed in the outer surface of insulating barrier described in outermost layer, carries out second pressing;
S5: etch described thick copper coin, completes outer-layer circuit and makes.
Particularly, the step also comprising anti-welding process and printing word after outer-layer circuit makes is completed.
Referring to Fig. 2, is the cross-sectional view of multi-layer thick copper circuit board provided by the invention.Described multi-layer thick copper circuit board 1, comprise: multiple heavy copper circuit board central layer 11, multiple insulating barrier 13, bonding sheet 15 and outer-layer circuit 17, each described heavy copper circuit board central layer 11 and each described insulating barrier 13 alternately laminated successively, each described heavy copper circuit board central layer 11 comprises central layer insulating barrier 111 and many internal layer circuits 113, described bonding sheet 15 is filled in many internal layer circuits 113 of described heavy copper circuit board central layer 11, and described outer-layer circuit 17 is placed in the outer surface of outermost described insulating barrier 13.
Multi-layer thick copper circuit board 1 provided by the invention and preparation method thereof has following beneficial effect:
One, make multi-layer thick copper circuit board 1 by twice pressing, avoid the resin cavity of tradition pressure side box-like making multi-layer thick copper circuit board existence and the technical problem of uneven thickness, the reliability making the multi-layer thick copper circuit board 1 obtained is guaranteed;
The described bonding sheet 15 of two, filling between described many internal layer circuits 113 is in semi-cured state, and brown is carried out to each described heavy copper circuit board central layer 11, optimize pressing parameter, make bonding processes bonding sheet 15 fully flowing also complete compact curing, strengthen the adhesion of described bonding sheet 15 and described many internal layer circuits 113, and then enhancing thermal endurance, avoid layering.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (7)
1. a multi-layer thick copper circuit board manufacture method, is characterized in that, comprises the steps:
Step one, provide multiple heavy copper circuit board central layer, multiple insulating barrier, each described heavy copper circuit board central layer comprises many internal layer circuits and central layer insulating barrier;
Step 2, with pressing mode, bonding sheet is filled to many internal layer circuits of each described heavy copper circuit board central layer;
Step 3, determine that many internal layer circuits of each described heavy copper circuit board central layer are filled and led up by described bonding sheet;
Step 4, by fill each described heavy copper circuit board central layer of bonding sheet and each described insulating barrier alternately laminated successively, and the thick copper coin being used for making outer-layer circuit is placed in the outer surface of insulating barrier described in outermost layer, carries out second pressing;
Step 5, described thick copper coin to be etched, complete outer-layer circuit and make.
2. multi-layer thick copper circuit board manufacture method according to claim 1, is characterized in that, in step 2, before filling bonding sheet, also comprises and carries out brown process to each described heavy copper circuit board central layer.
3. multi-layer thick copper circuit board manufacture method according to claim 1, it is characterized in that, in step 2, with the parameter of pressing during pressing mode filling bonding sheet be: heating rate 2-3 DEG C/min, pressure 22-28kgf, in step 2, after filling bonding sheet, also comprise solidification process, curing time 60min, temperature 150 DEG C.
4. multi-layer thick copper circuit board manufacture method according to claim 1, it is characterized in that, described bonding sheet is in semi-cured state.
5. multi-layer thick copper circuit board manufacture method according to claim 1, is characterized in that, described in complete after outer-layer circuit makes and also comprise the step of anti-welding process and printing word.
6. multi-layer thick copper circuit board manufacture method according to claim 1, is characterized in that, the thickness of each described insulating barrier is 100-200um.
7. a multi-layer thick copper circuit board, it is characterized in that, comprise multiple heavy copper circuit board central layer, multiple insulating barrier, bonding sheet and outer-layer circuit, each described heavy copper circuit board central layer and each described insulating barrier alternately laminated successively, each described heavy copper circuit board central layer comprises central layer insulating barrier and many internal layer circuits, described bonding sheet is filled in many internal layer circuits of described heavy copper circuit board central layer, and described outer-layer circuit is placed in the outer surface of outermost described insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510478410.1A CN105101683A (en) | 2015-08-06 | 2015-08-06 | Multilayer heavy copper circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510478410.1A CN105101683A (en) | 2015-08-06 | 2015-08-06 | Multilayer heavy copper circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105101683A true CN105101683A (en) | 2015-11-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510478410.1A Pending CN105101683A (en) | 2015-08-06 | 2015-08-06 | Multilayer heavy copper circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN105101683A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636332A (en) * | 2015-12-30 | 2016-06-01 | 深圳市五株科技股份有限公司 | Metal-based circuit board and processing method thereof |
| CN106686912A (en) * | 2016-12-21 | 2017-05-17 | 皆利士多层线路版(中山)有限公司 | Thick-bottom copper multilayered circuit board and preparation method therefor |
| CN108495487A (en) * | 2018-04-16 | 2018-09-04 | 深圳市景旺电子股份有限公司 | A kind of production method of multilayer heavy copper circuit board |
| CN110225650A (en) * | 2019-05-27 | 2019-09-10 | 皆利士多层线路版(中山)有限公司 | Multilayer board and preparation method thereof |
| CN111447750A (en) * | 2020-04-17 | 2020-07-24 | 景旺电子科技(龙川)有限公司 | Manufacturing method of super-thick copper PCB |
| CN115250585A (en) * | 2021-04-28 | 2022-10-28 | 深南电路股份有限公司 | A method of manufacturing a circuit board |
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| CN102883534A (en) * | 2012-09-27 | 2013-01-16 | 沪士电子股份有限公司 | Method for solving problem of voltage loss in inner copper-free area of thick copper printed circuit board |
| CN102984885A (en) * | 2012-11-15 | 2013-03-20 | 广东成德电路股份有限公司 | Laminating method of printed circuit board with ultra-thickness copper foil on the surface of core plate |
| CN103167730A (en) * | 2011-12-14 | 2013-06-19 | 深南电路有限公司 | Thick copper circuit board and manufacturing method thereof |
| CN104519682A (en) * | 2014-12-11 | 2015-04-15 | 广州兴森快捷电路科技有限公司 | Semi-flexible circuit board and preparation method thereof |
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2015
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103167730A (en) * | 2011-12-14 | 2013-06-19 | 深南电路有限公司 | Thick copper circuit board and manufacturing method thereof |
| CN102883534A (en) * | 2012-09-27 | 2013-01-16 | 沪士电子股份有限公司 | Method for solving problem of voltage loss in inner copper-free area of thick copper printed circuit board |
| CN102984885A (en) * | 2012-11-15 | 2013-03-20 | 广东成德电路股份有限公司 | Laminating method of printed circuit board with ultra-thickness copper foil on the surface of core plate |
| CN104519682A (en) * | 2014-12-11 | 2015-04-15 | 广州兴森快捷电路科技有限公司 | Semi-flexible circuit board and preparation method thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636332A (en) * | 2015-12-30 | 2016-06-01 | 深圳市五株科技股份有限公司 | Metal-based circuit board and processing method thereof |
| CN105636332B (en) * | 2015-12-30 | 2019-03-08 | 深圳市五株科技股份有限公司 | Metal-based circuit board and its processing method |
| CN106686912A (en) * | 2016-12-21 | 2017-05-17 | 皆利士多层线路版(中山)有限公司 | Thick-bottom copper multilayered circuit board and preparation method therefor |
| CN106686912B (en) * | 2016-12-21 | 2019-11-29 | 皆利士多层线路版(中山)有限公司 | The preparation method of thick bottom copper multilayer circuit board and thick bottom copper multilayer circuit board |
| CN108495487A (en) * | 2018-04-16 | 2018-09-04 | 深圳市景旺电子股份有限公司 | A kind of production method of multilayer heavy copper circuit board |
| CN110225650A (en) * | 2019-05-27 | 2019-09-10 | 皆利士多层线路版(中山)有限公司 | Multilayer board and preparation method thereof |
| CN111447750A (en) * | 2020-04-17 | 2020-07-24 | 景旺电子科技(龙川)有限公司 | Manufacturing method of super-thick copper PCB |
| CN111447750B (en) * | 2020-04-17 | 2023-05-05 | 景旺电子科技(龙川)有限公司 | Manufacturing method of ultra-thick copper PCB |
| CN115250585A (en) * | 2021-04-28 | 2022-10-28 | 深南电路股份有限公司 | A method of manufacturing a circuit board |
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Application publication date: 20151125 |