CN102917554A - Manufacturing method of multilayer double-copper conductor plate - Google Patents
Manufacturing method of multilayer double-copper conductor plate Download PDFInfo
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- CN102917554A CN102917554A CN2012103961660A CN201210396166A CN102917554A CN 102917554 A CN102917554 A CN 102917554A CN 2012103961660 A CN2012103961660 A CN 2012103961660A CN 201210396166 A CN201210396166 A CN 201210396166A CN 102917554 A CN102917554 A CN 102917554A
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 33
- 239000010949 copper Substances 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000004020 conductor Substances 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000012937 correction Methods 0.000 claims abstract description 16
- 238000003801 milling Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 239000011265 semifinished product Substances 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 238000005498 polishing Methods 0.000 claims abstract description 3
- 238000005530 etching Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- 238000003475 lamination Methods 0.000 claims description 7
- 238000005253 cladding Methods 0.000 claims description 5
- 241001074085 Scophthalmus aquosus Species 0.000 claims description 4
- 230000002378 acidificating effect Effects 0.000 claims description 4
- BESJRHHIPGWPTC-UHFFFAOYSA-N azane;copper Chemical compound N.[Cu] BESJRHHIPGWPTC-UHFFFAOYSA-N 0.000 claims description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 241000500881 Lepisma Species 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 3
- 238000007688 edging Methods 0.000 claims description 3
- 238000002203 pretreatment Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 101
- 230000008569 process Effects 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 3
- 238000005553 drilling Methods 0.000 abstract 5
- 239000002344 surface layer Substances 0.000 abstract 3
- 238000003486 chemical etching Methods 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000012792 core layer Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000004807 localization Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method of a multilayer double-copper conductor plate. The manufacturing method comprises the steps of: providing engineering data, cutting according to the engineering data and manufacturing an inner layer graph of a core plate; browning the inner layer graph and copper plates, taking two layers of copper plates as a surface layer and carrying out assembling and positioning on the copper plates for primary pressing according to preset stacking; carrying out positioning hole drilling, milling, edge polishing and correction hole drilling on the core plate and obtaining surface graph pre-increase data through the correction hole drilling process, wherein expanding/shrinking data are expanding/shrinking data of the laminated inner layer graph and are used as pre-expanding values of the engineering data of the surface layer graph and other inner layer graphs except the outer layer; manufacturing the surface graph of the core plate by using a chemical etching method; carrying out joint filling and abrading on the surface layer graph of the core plate by using layer insulation resin; carrying out secondary pressing on the core plate as well as an inner layer single sheet, a semi-cured sheet, an outer layer cover plate and/or a cover foil to obtain a semi-finished product; and carrying out subsequent hole drilling, outer layer graph manufacturing, surface processing and molding milling on the semi-finished product, wherein expanding/shrinking data of the outer layer graph are obtained through the correction hole drilling process.
Description
Technical field
The present invention relates to printed circuit board and make the field, more particularly, the present invention relates to a kind of pair of copper core method for producing multi-layer board.
Background technology
The characteristics such as metallic plate possesses heat conduction, thermal diffusivity is good, thermal expansivity is little, dimensional stability is high and shielding is good.When current densities is higher, there are double sided SMT (surface mounting technology) requirement or through-hole mounting element more, and to heat radiation or the dimensional stability printed board of having relatively high expectations, and the manufacturing and designing of some other particular electrical subsystems, can preferably adopt the metal-cored multi-layer sheet of high heat-conducting type, realize the centre that is about to preferably metallic plate embedding of thermal conductivity multilayer printed board.Metal core layer then is typically designed to bus plane or the electric stratum of printed board.Prepare metal-cored multi-layer sheet conventional method and be the figure that the method for milling by brill first obtains metal core layer, again with metal core layer and internal layer monolithic, prepreg, outer cladding plate or cover paper tinsel and carry out one step press, then carry out the follow-up conventional manufacturing process such as outer graphics making, welding resistance character, surface treatment and finished product milling, thereby obtain metal-cored multilayer printed board.Core metal sheet number of plies amount can be individual layer or multilayer (being no less than 2 layers).
The common metal plate material has copper, aluminium, iron, steel, cover copper indium watt etc., and wherein, copper coin and modern printed board large-scale production equipment compatibility are better, so copper coin is the preferred material of metal-cored multiple sliding cover.
Double-deck copper coin also is a typical metal-cored Multilayer Structure as metal-cored multi-layer sheet, and for two copper core multi-layer sheet, the making thinking of prior art also is the one step press method.
But, adopt the way of one step press to make the printed board of double-deck copper core,, do not grope vertical contraposition existing problems because the thermal expansion coefficient difference of copper coin sandwich layer and other layer base material is larger if there are more materials to carry out harmomegathus.In addition, because the copper coin core layer thickness is common〉150 μ m, more conventional internal layer Copper Foil is thick, the more molten resin of prepreg can flow to the hollow out zone (being generally the dish hole) of copper coin during pressing, cause copper coin hollow out zone packless, and near the local starved of the prepreg should the zone, cause lamination cavity problem.
Summary of the invention
Technical problem to be solved by this invention is for having defects in the prior art, a kind of two copper core method for producing multi-layer boards that can effectively solve vertical contraposition problem and lamination cavity problem being provided.
According to the present invention, a kind of pair of copper core method for producing multi-layer board is provided, it comprises: first step, be used for providing project data, project data comprises out material data, graph data, borehole data and other auxiliary material frock data, and open material by project data, then make the figure of central layer internal layer monolithic; Second step is used for brown inner figure and copper coin, and take two-layer copper coin as the top layer, fills plate and locate one step press by default folded structure, thereby obtain multi-layer coreboard; Third step, be used for central layer is bored location hole, milling, edging, brill correction hole, obtain the top layer figure data that rise in advance by boring the correction hole program, described harmomegathus data are inner figure harmomegathus data behind the lamination, and with in advance the rise value of described harmomegathus data as other inner figure project data outside top layer figure and the top layer; The 4th step is used for adopting method for chemially etching to make central layer top layer figure.The 5th step is for adopting interlaminar insulating resin with the figure joint filling of central layer top layer and polishing; The 6th step is used for central layer and other supporting internal layer monolithic, prepreg, outer cladding plate and/or covers paper tinsel carrying out second pressing, obtains semi-finished product.The 7th step is used for semi-finished product are carried out follow-up boring, outer graphics making, surface treatment, moulding milling; Wherein, the correction hole program that outer graphics harmomegathus data communication device is crossed third step obtains, and with described harmomegathus data creating outer graphics.
Preferably, in first step, make the central layer inner figure by carrying out successively chemical pre-treatment, press mold, UV exposure, development, etching, stripping.
Preferably, in second step, the thickness of every layer of copper coin is 150-400 μ m.
Preferably, in the 4th step, adopt the etching of acidic copper chloride system solution to make figure, and adopt the dry film protection.
Preferably, in the 4th step, adopt the etching of ammonia copper system solution to make figure, and adopt slicker solder protection or separately tin protection.
Preferably, in the 5th step, carry out 1 ~ 5 resin joint filling, until interlaminar insulating resin flushes with copper face or is substantially flush, vacuumize and toast after each joint filling so that inner without empty after toast, then grind smoothly, and carry out rear baking and make hardening of resin.
Preferably, in the 5th step, used interlaminar insulating resin is thermmohardening type Layer increasing method interlaminar insulating resin.
In according to of the present invention pair of copper core method for producing multi-layer board, by carrying out one step press with copper coin as the central layer top layer, and make top layer and other inner figure by the data that rise in advance of obtaining the secondary graphic making by the correction hole program, can solve the vertical contraposition problem of copper coin sandwich layer and other each layer pattern; And, insulating resin joint filling processing is carried out on the central layer top layer can be avoided lamination cavity problem.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed description, will more easily to the present invention more complete understanding be arranged and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows the flow chart according to two copper core method for producing multi-layer boards of the embodiment of the invention.
Need to prove, accompanying drawing is used for explanation the present invention, and unrestricted the present invention.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
In two copper core method for producing multi-layer boards of the embodiment of the invention, can be first with two-layer copper coin (thickness of every layer of copper coin for example is 150-400 μ m) with the pressing of inner figure monolithic, form multi-layer coreboard.Wherein, by bore the harmomegathus value of the secondary graphic making that correction hole obtains on the multi-layer coreboard top layer.Then make central layer top layer figure by this harmomegathus value, and other layer inner figure beyond the central layer, central layer top layer figure adopts method for chemially etching to make.Then adopt insulating resin that joint filling is carried out on the top layer (being the copper coin sandwich layer) of multi-layer coreboard and process, and carry out routine and polish.Multi-layer coreboard and other supporting internal layer monolithic, prepreg, the outer cladding plate that the joint filling that obtains was processed or cover paper tinsel and preset by printed board and fold structure and carry out pressing, the flow process after the pressing routinely method for producing multi-layer board is carried out.
Fig. 1 schematically shows the flow chart of according to an embodiment of the invention pair of copper core method for producing multi-layer board.
As shown in Figure 1, two according to the preferred embodiment of the invention copper core method for producing multi-layer boards comprise:
First step S1: project data is provided, and project data comprises out material data, graph data, borehole data and other auxiliary material frock data; For example, by CAM(computer Aided Manufacturing, computer-aided manufacture) provide out and expect data, graph data, borehole data.Open material by project data, then for example baking remove base material moisture, stablize its size, and make the central layer inner figure.
Wherein, preferably, such as can be by carrying out successively chemical pre-treatment, press mold, UV(ultraviolet ray) operations such as exposure, development, etching, stripping make and obtain the central layer inner figure.
Second step S2: brown inner figure and copper coin increasing its surface roughness, and take two-layer copper coin as the top layer, fill plate and locate one step press by default folded structure, thereby obtain multi-layer coreboard.
Preferably, the thickness of every layer of copper coin for example is 150-400 μ m.The present invention is to the not restriction of the monolithic number of plies of multi-layer coreboard internal layer.
Localization method can be rivet location, four grooves location, Mass method location, hot melt location.Standard-sized plank preferably can adopt four grooves location, rivet location or both combinations, and then four grooves location is carried out brown and processed first at pre-subpunch four slotted eyes of perforating press.The plank of off-standard size preferably adopts the rivet localization method.Wherein, Mass method location need not to rush location hole, is applicable to only have between the double-deck copper coin sandwich layer in multiple-plate default folded structure the situation of a monolithic (1 ~ 2 layer pattern).
Third step S3: central layer is bored location hole, milling, edging, brill correction hole, and obtain the top layer figure data that rise in advance by boring the correction hole program.Here, the corresponding different correction hole programs of the making sheet die size that do not coexist are bored correction hole by this program, to adjust, finally obtain the harmomegathus value of acceptable error scope by X ray (X-ray) measurement update hole site.These harmomegathus data are inner figure harmomegathus data behind the lamination, and with in advance the rise value of described harmomegathus data as other inner figure project data outside top layer figure and the top layer.
The 4th step S4: adopt method for chemially etching to make central layer top layer figure.For example, method for chemially etching comprises the etching of employing acidic copper chloride system solution, also can adopt the etching of ammonia copper system solution.
Preferably, adopt the dry film protection in the situation that adopt the etching of acidic copper chloride system solution to make figure, adopt slicker solder protection or separately tin protection in the situation that adopt the etching of ammonia copper system solution to make figure, thus so that lateral erosion can be controlled littlely.
The 5th step S5: adopt interlaminar insulating resin with the figure joint filling of central layer top layer and polish.
Preferably carry out 1 ~ 5 resin joint filling, until interlaminar insulating resin flushes with copper face or be substantially flush; Vacuumize and toast after each joint filling so that inner without empty after toast, after filling and leading up that its grinding is smooth, and carry out rear baking and make hardening of resin.
Adopt the method for interlaminar insulating resin joint filling can avoid prepreg at copper core dish hole near zone because excessive interlayer cavity problem and the not enough problem that the cavity occurs of dish hole filler of occurring of gummosis.
Preferably, used interlaminar insulating resin is thermmohardening type Layer increasing method interlaminar insulating resin.
The 6th step S6: with central layer and other supporting internal layer monolithic, prepreg, outer cladding plate and/or cover paper tinsel and carry out second pressing, obtain semi-finished product.
The 7th step S7: semi-finished product are carried out the flow processs such as follow-up conventional boring, outer graphics making, surface treatment, moulding milling.Wherein, outer graphics harmomegathus data communication device overcorrect hole program obtains, and with this harmomegathus data creating outer graphics.
In the two copper core method for producing multi-layer boards according to the embodiment of the invention, by carrying out one step press with copper coin as the central layer top layer, and make top layer and other inner figure by the data that rise in advance of obtaining the secondary graphic making by the correction hole program, can solve the vertical contraposition problem of copper coin sandwich layer and other each layer pattern; And, insulating resin joint filling processing is carried out on the central layer top layer can be avoided lamination cavity problem.
Be understandable that, although the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not to limit the present invention.For any those of ordinary skill in the art, do not breaking away from the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (6)
1. two copper core method for producing multi-layer board is characterized in that comprising:
First step is used for providing project data, project data to comprise out material data, graph data, borehole data and other auxiliary material frock data, and opens material by project data, then makes the central layer inner figure;
Second step is used for brown inner figure and copper coin, and take two-layer copper coin as the top layer, fills plate and locate one step press by default folded structure, thereby obtain multi-layer coreboard;
Third step, be used for central layer is bored location hole, milling, edging, brill correction hole, obtain the top layer figure data that rise in advance by boring the correction hole program, described harmomegathus data are inner figure harmomegathus data behind the lamination, and with in advance the rise value of described harmomegathus data as other inner figure project data outside top layer figure and the top layer;
The 4th step is used for adopting method for chemially etching to make central layer top layer figure;
The 5th step is for adopting interlaminar insulating resin with the figure joint filling of central layer top layer and polishing;
The 6th step is used for central layer and other supporting internal layer monolithic, prepreg, outer cladding plate and/or covers paper tinsel carrying out second pressing, obtains semi-finished product;
The 7th step is used for semi-finished product are carried out follow-up boring, outer graphics making, surface treatment, moulding milling; Wherein, the correction hole program that outer graphics harmomegathus data communication device is crossed third step obtains, and with described harmomegathus data creating outer graphics.
2. according to claim 1 pair of copper core method for producing multi-layer board is characterized in that, in first step, makes the central layer inner figure by carrying out successively chemical pre-treatment, press mold, UV exposure, development, etching, stripping.
3. according to claim 1 pair of copper core method for producing multi-layer board is characterized in that, in second step, the thickness of every layer of copper coin is 150-400 μ m.
4. according to claim 1 pair of copper core method for producing multi-layer board is characterized in that, in the 4th step, adopts the etching of acidic copper chloride system solution to make figure, and adopts the dry film protection.
5. according to claim 1 pair of copper core method for producing multi-layer board is characterized in that, in the 4th step, adopts the etching of ammonia copper system solution to make figure, and adopts slicker solder protection or separately tin protection.
6. according to claim 1 pair of copper core method for producing multi-layer board, it is characterized in that, in the 5th step, carry out 1 ~ 5 resin joint filling, until interlaminar insulating resin flushes with copper face or is substantially flush, vacuumize and toast after each joint filling so that inner without the cavity after toast, then grind smoothly, and carry out rear baking and make it to harden.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210396166.0A CN102917554B (en) | 2012-10-17 | 2012-10-17 | Manufacturing method of multilayer double-copper conductor plate |
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| CN201210396166.0A CN102917554B (en) | 2012-10-17 | 2012-10-17 | Manufacturing method of multilayer double-copper conductor plate |
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| CN102917554A true CN102917554A (en) | 2013-02-06 |
| CN102917554B CN102917554B (en) | 2015-07-08 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103237423A (en) * | 2013-04-28 | 2013-08-07 | 无锡江南计算技术研究所 | Indium tile copper interlayer graph making method for multilayer printed board |
| CN105072824A (en) * | 2015-07-27 | 2015-11-18 | 广州杰赛科技股份有限公司 | Manufacture method of embedded circuit board |
| CN105636345A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Multilayer PCB core material expansion and shrinkage matching method |
| CN107567191A (en) * | 2017-09-21 | 2018-01-09 | 江门崇达电路技术有限公司 | It is a kind of to improve the process that precision is bored outside mechanical blind hole plate |
| CN108601247A (en) * | 2013-05-22 | 2018-09-28 | 株式会社村田制作所 | resin multilayer substrate |
| CN110996564A (en) * | 2019-12-30 | 2020-04-10 | 惠州市永隆电路有限公司 | Expansion and shrinkage control method for PCB (printed circuit board) multilayer board |
| CN112888197A (en) * | 2020-12-28 | 2021-06-01 | 深圳市深联电路有限公司 | Thick copper back plate and manufacturing method thereof |
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| TWI578872B (en) | 2015-07-22 | 2017-04-11 | 乾坤科技股份有限公司 | Multi-layer wire structure of pcb, magnetic element and manufacturing method thereof |
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| CN105636345A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Multilayer PCB core material expansion and shrinkage matching method |
| CN107567191A (en) * | 2017-09-21 | 2018-01-09 | 江门崇达电路技术有限公司 | It is a kind of to improve the process that precision is bored outside mechanical blind hole plate |
| CN110996564A (en) * | 2019-12-30 | 2020-04-10 | 惠州市永隆电路有限公司 | Expansion and shrinkage control method for PCB (printed circuit board) multilayer board |
| CN112888197A (en) * | 2020-12-28 | 2021-06-01 | 深圳市深联电路有限公司 | Thick copper back plate and manufacturing method thereof |
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| CN102917554B (en) | 2015-07-08 |
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