CN107222983B - A kind of pcb board and production method of embedded AlN ceramic insulating radiation module - Google Patents
A kind of pcb board and production method of embedded AlN ceramic insulating radiation module Download PDFInfo
- Publication number
- CN107222983B CN107222983B CN201710434377.1A CN201710434377A CN107222983B CN 107222983 B CN107222983 B CN 107222983B CN 201710434377 A CN201710434377 A CN 201710434377A CN 107222983 B CN107222983 B CN 107222983B
- Authority
- CN
- China
- Prior art keywords
- aln ceramic
- embedded
- core plate
- pcb board
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 230000005855 radiation Effects 0.000 title claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000010949 copper Substances 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 12
- 239000010959 steel Substances 0.000 claims abstract description 12
- 238000012545 processing Methods 0.000 claims abstract description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 18
- 239000010936 titanium Substances 0.000 claims description 18
- 229910052719 titanium Inorganic materials 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 8
- 238000011161 development Methods 0.000 claims description 7
- 239000003814 drug Substances 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000013461 design Methods 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical class [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 description 1
- KVBCYCWRDBDGBG-UHFFFAOYSA-N azane;dihydrofluoride Chemical compound [NH4+].F.[F-] KVBCYCWRDBDGBG-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The present invention discloses the pcb board and production method of a kind of embedded AlN ceramic insulating radiation module, and method is comprising steps of A, carry out windowing processing to FR4 core plate and PP piece；B, FR4 core plate, PP piece, FR4 core plate are carried out in order pre- folded；C, AlN ceramic block is put into the windowing position of FR4 core plate and PP piece；D, it is pressed according to steel plate, aluminium flake, resistance glue release film, pcb board, resistance glue release film, aluminium flake, steel plate sequence.The present invention solve it is existing bury in copper technology, the technical issues of surface can not make figure；The cost of manufacture of the pcb board with heat sinking function is reduced simultaneously.
Description
Technical field
The present invention relates to PCB manufacturing field more particularly to a kind of pcb boards and system of embedded AlN ceramic insulating radiation module
Make method.
Background technique
AlN is the new material that developed recently gets up, and with high temperature resistant, anticorrosive, thermal conductivity is good, thermal expansion coefficient is low
The advantages that, while also there is very high thermal shock resistance and electrical insulating property, it is the encapsulation of integrated circuit substrate material and electronic component
Material, while being also one of the candidate material of high-temperature structural components.
In the market, the PCB type with heat dissipation design mainly has copper base, aluminum substrate, ceramic base to printed circuit board at present
Plate and what is locally radiated bury copper billet circuit board.The metal consumption of metal substrate is at high cost greatly.Ceramic substrate is expensive, and machine adds
Work drilling and big at shape difficulty, using laser drill and cannot need to be cut using circuit-board industry common numerical control device processing
It cuts.Burying copper billet may be implemented for the good radiating module of size design to be directly embedded in plate, can be well solved big on multi-layer PCB board
The problem of power semiconductor locally radiates, but copper billet it is conductive can, figure can not be made on copper billet, if it is desired to insulation module
It with production figure, then needs to bury in the circuit board in completely, while circuit board appearance need to use and arrive FR4 material, can expire by this design
Foot insulation and production graphics request, but heat dissipation effect is had a greatly reduced quality, and it is more to occupy circuit board space.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of embedded AlN ceramic insulating radiation moulds
The pcb board and production method of block, it is intended to solve that existing heat dissipation pcb board is at high cost, is inconvenient to the problems such as making figure.
Technical scheme is as follows:
A kind of PCB plate production method of embedded AlN ceramic insulating radiation module, wherein comprising steps of
A, windowing processing is carried out to FR4 core plate and PP piece；
B, FR4 core plate, PP piece, FR4 core plate are carried out in order pre- folded；
C, AlN ceramic block is put into the windowing position of FR4 core plate and PP piece；
D, it is pressed according to steel plate, aluminium flake, resistance glue release film, pcb board, resistance glue release film, aluminium flake, steel plate sequence.
The PCB plate production method of the embedded AlN ceramic insulating radiation module, wherein the windowing of FR4 core plate and PP piece
Spot size is more unilateral than AlN ceramic block 25 ~ 300 μm big.
The PCB plate production method of the embedded AlN ceramic insulating radiation module, wherein also wrapped after the step D
It includes:
E, the pcb board after pressing is subjected to drilling and copper-coating.
The PCB plate production method of the embedded AlN ceramic insulating radiation module, wherein also wrapped after the step E
It includes:
F, pcb board is produced into L1 and L4 layer pattern through pad pasting, exposure, development, etching process.
The PCB plate production method of the embedded AlN ceramic insulating radiation module, wherein also wrapped after the step F
It includes:
G, pcb board is dipped into except in titanium liquid medicine.
The PCB plate production method of the embedded AlN ceramic insulating radiation module, wherein in the step G, pass through leaching
Bubble processing, removes the titanium layer of 100 ~ 200 nm thickness of AlN ceramic block bottom.
The PCB plate production method of the embedded AlN ceramic insulating radiation module, wherein also wrapped after the step G
It includes:
H, pcb board is successively subjected to anti-welding, text, surface treatment, forming processes, forms final pcb board finished product.
The PCB plate production method of the embedded AlN ceramic insulating radiation module, wherein the AlN ceramic block and FR4
Core plate uniform thickness.
The PCB plate production method of the embedded AlN ceramic insulating radiation module, wherein also wrapped before the step A
It includes:
The location hole of windowing is drilled out in FR4 core plate and PP on piece using X-RAY machine.
A kind of pcb board, wherein be made of described in any item PCB plate production methods as above.
The utility model has the advantages that the present invention solve it is existing bury in copper technology, the technical issues of surface can not make figure；It drops simultaneously
The low cost of manufacture of the pcb board with heat sinking function.
Detailed description of the invention
Fig. 1 is a kind of process of the PCB plate production method preferred embodiment of embedded AlN ceramic insulating radiation module of the present invention
Figure.
Fig. 2 is the windowing portion structure schematic diagram in the present invention.
Fig. 3 is the structural schematic diagram of the AlN ceramic block in the present invention.
Fig. 4 is the pre- stack structure schematic diagram in the present invention.
Fig. 5 is the pressing structure schematic diagram in the present invention.
Specific embodiment
The present invention provides the pcb board and production method of a kind of embedded AlN ceramic insulating radiation module, to make mesh of the invention
, technical solution and effect it is clearer, clear, the present invention is described in more detail below.It should be appreciated that described herein
Specific embodiment be only used to explain the present invention, be not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is that a kind of PCB plate production method of embedded AlN ceramic insulating radiation module of the present invention is preferably real
Apply the flow chart of example, as shown, itself comprising steps of
S1, windowing processing is carried out to FR4 core plate and PP piece；
S2, FR4 core plate, PP piece, FR4 core plate are subjected to pre- fold in order；
S3, the windowing position that AlN ceramic block is put into FR4 core plate and PP piece；
S4, it is pressed according to steel plate, aluminium flake, resistance glue release film, pcb board, resistance glue release film, aluminium flake, steel plate sequence.
In the present invention, AlN ceramic block (i.e. AlN ceramic insulating radiation module) is embedded in pcb board, such pcb board just has
For heat sinking function, while AlN ceramic block surface has insulation effect, can make metallic pattern, so occupying pcb board space
It is few, it is suitble to the localized heat transfer application of high power small size.Pcb board processing and fabricating of the invention is simple, reduces cost of manufacture, and
Figure can be made on AlN ceramic block surface, and it is small to occupy PCB space.
Specifically, in step sl, windowing processing first is carried out to FR4 core plate and PP piece.
Wherein windowing processing, which refers to, produces windowing position in FR4 core plate and PP on piece, to be embedded in AlN ceramic block.And
And the windowing position of FR4 core plate and PP piece needs to correspond to, so that AlN ceramic block to be correctly installed to windowing position.
Further, as shown in Fig. 2, 1 size of windowing position of FR4 core plate and PP piece it is more unilateral than AlN ceramic block 30 it is big by 25 ~
300 μm, that is to say, that by taking width as an example, the width at the windowing position 1 of FR4 core plate and PP piece is bigger than the width of AlN ceramic block 30
50 ~ 600 μm, to make AlN ceramic block 30 that there is enough embedded spaces.
For the combination reliability for ensuring embedded AlN ceramic block 30 and FR4 core plate, FR4 core plate and PP piece open a window the four of position 1
A angle is preferably provided to arc-shaped, and the angle R is 0.8mm.
Further, the AlN ceramic block 30 and FR4 core plate uniform thickness.That is, the AlN ceramic block 30 and FR4 core plate
Thickness it is identical.In addition, the copper layer thickness phase of the layers of copper on its two sides of AlN ceramic block 30 and FR4 core plate and FR4 core plate two sides
Together.In this way during the processing such as subsequent progress graphic making, it is just able to maintain consistency.
The AlN ceramic block 30, structure is as shown in figure 3, it successively includes: layers of copper 12, titanium layer 11, aln layer
10, titanium layer 11, layers of copper 12.That is, the two sides of AlN ceramic block 30 is layers of copper 12, and thickness is identical, and the center portion thereof is divided into nitrogen
Change aluminium layer 10.
Wherein, the AlN ceramic block 30 is preferably DPC type ceramic block, the DPC(direct copper plating) type ceramic block, it fits
Together in the heat dissipation scene of the pcb board in the present invention, have many advantages, such as perfect heat-dissipating, low manufacture cost.
And FR4 core plate (two-sided) its structure then successively includes: the first layers of copper, PP, the second layers of copper, the first layers of copper therein and
Second copper layer thickness is identical, and corresponding identical as the two sides copper layer thickness of AlN ceramic block 30.The FR4 core plate has high Tg(glass
Glass temperature), specifically, Tg >=170 DEG C, with enough stability.
It can first carry out inner figure production to the FR4 core plate, i.e., by above-mentioned FR4 core plate according to design parameter, through applying
The processes such as film, exposure, development, etching produce L2, L3 layer pattern.L1, L4 layers of copper are protected in inner figure manufacturing process
Layer avoids L1, L4 layers of layers of copper when etching from being etched.
PP piece in the present invention refers to the PP piece that gel content is greater than 68%；It can effectively combine two pieces of FR4 core plates, bonding
Power is strong.
Further, before the step S1 further include:
The location hole of windowing is drilled out in FR4 core plate and PP on piece using X-RAY machine.
FR4 core plate and PP piece can be positioned using the location hole, carry out subsequent pressing to facilitate, avoid
During the pressing process, each layer positioning is inaccurate.
In the step S2, as shown in figure 4, FR4 core plate 20, PP piece, FR4 core plate 20 are carried out in order pre- folded.
In the present invention, conventional copper foil+PP lay-up method is not used, but is folded using two FR4 core plate combination PP pieces
It closes.This is because need to open a window to copper foil using conventional lay-up method (copper foil, PP, FR4 core plate, PP, copper foil), and copper foil is very
Thin (thickness is only 12 ~ 35 μm), easily causes copper foil wrinkle in the process of windowing, and copper foil is also easy to slide during the pressing process
It is dynamic to cause deviation.And it can solve the above problem using core plate lay-up method (FR4 core plate+PP piece+FR4 core plate) of the invention.
In the step S3, due to having carried out windowing processing in FR4 core plate and PP on piece before, so this step can
AlN ceramic block 30 is embedded into the windowing position of FR4 core plate and PP piece.
In the step S4, as shown in figure 5, according to steel plate 33, aluminium flake 32, resistance glue release film 31, pcb board 34, resistance glue
Release film 31, aluminium flake 32, steel plate 33 sequence pressed.Pcb board 34 therein, which refers in step S3, is embedded in AlN ceramic block
30 FR4 core plate and the composite structure of PP piece.
Resistance glue release film 31 therein refers to that resin resistant to high temperature stops release film, can be used for barrier resin spilling, avoids
Pollute plate face.
In addition, further preferably polished with the sand paper of 800 ~ 1200 mesh (such as 1000 mesh) pcb board after pressing,
To polish off the glue of AlN ceramic block and the extra overflow in FR4 plate junction out.
Further, after the step S4 further include:
S5, the pcb board after pressing is subjected to drilling and copper-coating.
Further, after the step S5 further include:
S6, pcb board is produced into L1 and L4 layer pattern through pad pasting, exposure, development, etching process.
That is, being to carry out outer graphics production, specifically by above-mentioned pcb board according to design parameter, through pasting in step s 6
The processes such as film, exposure, development, etching produce L1, L4 layer pattern.
Further, after the step S6 further include:
S7, pcb board is dipped into except in titanium liquid medicine.
Pcb board is dipped into the titanium layer that AlN ceramic block bottom is removed except being in titanium liquid medicine by this step.
Preferably, in the step S7, by immersion treatment, remove AlN ceramic block bottom (i.e. upper and lower surface) 100 ~
The titanium layer of 200 nm thickness leads to short circuit to avoid its residual.
Soaking time in the present invention preferably remains between 5 ~ 20s, to remove 100~200 nm titanium of AlN ceramic block
Layer, avoids the residual because of titanium from leading to short circuit.The etch-rate for referring to selective etching titanium except titanium liquid medicine, inhibiting copper
Chemical grinding liquid, main component be hydrogen peroxide and inorganic acid mixture.Specifically, by mass percentage, it is described
Except titanium liquid medicine contains: 10 ~ 19% hydrogen peroxide, 4 ~ 25% acid ammonium fluorides (ammonium acid fluoride and fluoram), 10% or less sulfuric acid remain
Remaining part is divided into water.
Further, after the step S7 further include:
S8, pcb board is successively subjected to anti-welding, text, surface treatment, forming processes, forms final pcb board finished product.
Method of the invention is described in detail below by a specific embodiment.
Step 1: sawing sheet: selecting two-sided FR4 core plate, the PP piece of a kind of high Tg (Tg >=170 DEG C), cut according to design size
It cuts；A kind of DPC type AlN ceramic block is selected, the thickness of ceramic block is consistent with FR4 core thickness, the copper thickness and FR4 core plate of ceramic block
Copper is thick consistent, size 7mm × 7mm.
Step 2: inner figure production: by above-mentioned FR4 core plate according to design parameter, through film, exposure, development, etching etc.
Process produces L2, L3 layer pattern.It needs to protect L1, L4 layers of layers of copper in inner figure manufacturing process, L1, L4 layers when avoiding etching
Layers of copper is etched.
Step 3:X-RAY bores target: going out the location hole of FR-4 core plate and PP piece windowing using X-RAY machine drill.
Step 4:FR4 core plate and the windowing of PP piece: above-mentioned FR4 core plate and PP piece are gone out to need to be embedded in AlN using gong machine gong and made pottery
The shape of porcelain block.FR4 core plate and PP piece design window size are more unilateral than the interior AlN ceramic block buried 75 μm big.To ensure embedded AlN
Four angles of the combination reliability of ceramic block and FR4 core plate, FR4 core plate and the windowing of PP piece are designed to arcuation, and the angle R is 0.8mm.
Step 5: pressing: above-mentioned FR4 core plate is pre- folded according to FR4 core plate, PP piece, FR4 core plate sequence, then by AlN ceramic
Block is put into FR4 core plate and PP piece windowing position.Pre- poststack, it is release according still further to steel plate, aluminium flake, resistance glue release film, pcb board, resistance glue
Film, aluminium flake, steel plate sequence are put into press and are pressed.It is hardened with FR4 that with the sand paper of 1000 mesh AlN ceramic block is polished off after pressing
The glue that extra overflow goes out at conjunction.To keep gummosis more abundant, guarantee that windowing gap is filled up, the pressure ratio normal pressures of pressing are big
30psi。
The parameter of pressing is as shown in following table one:
Table one
| Duan Xu | 1 | 2 | 3 | 4 | 5 | 6 |
| Temperature (DEG C) | 140 | 160 | 180 | 200 | 200 | 160 |
| Time (min) | 10 | 10 | 10 | 10 | 135 | 10 |
| Pressure (psi) | 100 | 150 | 380 | 380 | 380 | 2000 |
Specific pressing formula is as follows: first segment: rising to 140 DEG C, heating-up time 10min from room temperature, pressure is from normal pressure liter
To 100psi；Second segment: 160 DEG C are risen to from 140 DEG C, heating-up time 10min, pressure rises to 150psi from 100psi；Third section:
180 DEG C are risen to from 160 DEG C, heating-up time 10min, pressure rises to 380psi from 150psi；4th section: rising to 200 from 180 DEG C
DEG C, heating-up time 10min, pressure 380psi；5th section: 200 DEG C constant temperature keeps 135min, pressure 380psi；6th section: from
200 DEG C are down to 160 DEG C, and temperature fall time 10min, pressure is down to 200psi from 380psi.
Step 6: by the pcb board after above-mentioned pressing according to design parameter through drilling, copper-coating.
Step 7: outer graphics production: above-mentioned pcb board is according to design parameter, through processes such as pad pasting, exposure, development, etchings
Produce L1, L4 layer pattern.After etching, pcb board is dipped into except in titanium liquid medicine, soaking time keeps 10s, AlN ceramic is removed
The titanium layer of 150 nm of block bottom avoids the residual because of titanium from leading to short circuit.
Step 8: by above-mentioned pcb board through anti-welding, text, surface treatment, molding, forming final pcb board finished product.
The present invention also provides a kind of pcb boards, and PCB plate production method as described above is used to be made.
In conclusion the present invention solve it is existing bury in copper technology, the technical issues of surface can not make figure；It drops simultaneously
The low cost of manufacture of the pcb board with heat sinking function.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of PCB plate production method of embedded AlN ceramic insulating radiation module, which is characterized in that comprising steps of
A, windowing processing is carried out to FR4 core plate and PP piece；
B, FR4 core plate, PP piece, FR4 core plate are carried out in order pre- folded；
C, AlN ceramic block is put into the windowing position of FR4 core plate and PP piece；
D, it is pressed according to steel plate, aluminium flake, resistance glue release film, pcb board, resistance glue release film, aluminium flake, steel plate sequence；
Four angles at the windowing position are arranged to arc-shaped；
The layers of copper on AlN ceramic block two sides is identical as the copper thickness on FR4 core plate two sides；
The AlN ceramic block is DPC type ceramic block.
2. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 1, which is characterized in that
The windowing spot size of FR4 core plate and PP piece is more unilateral than AlN ceramic block 25 ~ 300 μm big.
3. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 1, which is characterized in that institute
After stating step D further include:
E, the pcb board after pressing is subjected to drilling and copper-coating.
4. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 3, which is characterized in that institute
After stating step E further include:
F, pcb board is produced into L1 and L4 layer pattern through pad pasting, exposure, development, etching process.
5. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 4, which is characterized in that institute
After stating step F further include:
G, pcb board is dipped into except in titanium liquid medicine.
6. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 5, which is characterized in that institute
It states in step G, by immersion treatment, removes the titanium layer of 100 ~ 200 nm thickness of AlN ceramic block bottom.
7. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 5, which is characterized in that institute
After stating step G further include:
H, pcb board is successively subjected to anti-welding, text, surface treatment, forming processes, forms final pcb board finished product.
8. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 1, which is characterized in that institute
State AlN ceramic block and FR4 core plate uniform thickness.
9. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 1, which is characterized in that institute
Before stating step A further include:
The location hole of windowing is drilled out in FR4 core plate and PP on piece using X-RAY machine.
10. a kind of pcb board, which is characterized in that be made of such as the described in any item PCB plate production methods of claim 1 ~ 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710434377.1A CN107222983B (en) | 2017-06-09 | 2017-06-09 | A kind of pcb board and production method of embedded AlN ceramic insulating radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710434377.1A CN107222983B (en) | 2017-06-09 | 2017-06-09 | A kind of pcb board and production method of embedded AlN ceramic insulating radiation module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107222983A CN107222983A (en) | 2017-09-29 |
| CN107222983B true CN107222983B (en) | 2019-05-03 |
Family
ID=59947589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710434377.1A Active CN107222983B (en) | 2017-06-09 | 2017-06-09 | A kind of pcb board and production method of embedded AlN ceramic insulating radiation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107222983B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109699115B (en) * | 2017-10-23 | 2020-06-23 | 苏州旭创科技有限公司 | Optical module |
| CN108040430B (en) * | 2017-10-25 | 2020-01-14 | 江门崇达电路技术有限公司 | Manufacturing method of copper-buried circuit board slotted hole |
| CN107708315B (en) * | 2017-10-31 | 2020-01-17 | 江苏贺鸿电子有限公司 | Ceramic-embedded heat dissipation circuit board and preparation method thereof |
| CN108172675A (en) * | 2017-10-31 | 2018-06-15 | 马瑞利汽车零部件(芜湖)有限公司 | Heat dissipation structure of automobile lamp PCB board |
| CN108055763A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN108650781A (en) * | 2018-06-20 | 2018-10-12 | 景旺电子科技(龙川)有限公司 | A kind of heat-radiating substrate and preparation method thereof embedding copper-based IMS |
| CN112566388B (en) * | 2019-09-10 | 2022-04-12 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN110621123A (en) * | 2019-09-19 | 2019-12-27 | 生益电子股份有限公司 | Manufacturing method of heat-conducting PCB and PCB |
| CN110519912B (en) * | 2019-09-19 | 2020-11-06 | 生益电子股份有限公司 | PCB manufacturing method with embedded heat conductor and PCB |
| CN110785028A (en) * | 2019-11-05 | 2020-02-11 | 景旺电子科技(龙川)有限公司 | Manufacturing method of PCB embedded with ceramic chip and PCB |
| CN112040673B (en) * | 2020-06-05 | 2022-02-22 | 景旺电子科技(龙川)有限公司 | Circuit board manufacturing method |
| CN114698255A (en) * | 2020-12-25 | 2022-07-01 | 华中科技大学 | A kind of printed circuit board and preparation method |
| US11412618B2 (en) | 2020-12-29 | 2022-08-09 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
| US11439018B2 (en) | 2020-12-29 | 2022-09-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
| CN113630986A (en) * | 2021-07-14 | 2021-11-09 | 广东世运电路科技股份有限公司 | Ceramic-embedded PCB and manufacturing method and application thereof |
| CN114828406A (en) * | 2022-03-18 | 2022-07-29 | 诚亿电子（嘉兴）有限公司 | High-flatness ceramic block embedded PCB and preparation process thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103378014A (en) * | 2012-04-13 | 2013-10-30 | 旭德科技股份有限公司 | Package carrier and method for manufacturing the same |
| CN106550558A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of pressing preparation method of embedding ceramic pcb board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100352317C (en) * | 2002-06-07 | 2007-11-28 | 松下电器产业株式会社 | Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment |
-
2017
- 2017-06-09 CN CN201710434377.1A patent/CN107222983B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103378014A (en) * | 2012-04-13 | 2013-10-30 | 旭德科技股份有限公司 | Package carrier and method for manufacturing the same |
| CN106550558A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of pressing preparation method of embedding ceramic pcb board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107222983A (en) | 2017-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107222983B (en) | A kind of pcb board and production method of embedded AlN ceramic insulating radiation module | |
| CN107018621B (en) | A method of burying copper billet in printed circuit board | |
| US9307651B2 (en) | Fabricating process of embedded circuit structure | |
| CN103687312B (en) | Gold-plated method for manufacturing circuit board | |
| CN108040416A (en) | A kind of production method of double-face aluminium substrate | |
| CN102438413A (en) | Second-order stepped groove bottom graphical printed board and processing method thereof | |
| CN102917554B (en) | Manufacturing method of multilayer double-copper conductor plate | |
| CN104270888A (en) | High-density package substrate on-hole disk product and preparation method thereof | |
| CN101351088B (en) | Embedded circuit structure and process thereof | |
| CN108650781A (en) | A kind of heat-radiating substrate and preparation method thereof embedding copper-based IMS | |
| WO2022156321A1 (en) | Method for manufacturing high-density interconnect circuit board | |
| CN101998777A (en) | Fabrication method for interlayer conduction of metal aluminum base printed circuit board | |
| CN109068491B (en) | A kind of aluminum substrate processing technology | |
| CN103874327A (en) | Copper-clad plate and manufacturing method thereof | |
| CN105131897B (en) | High heat conductive insulating Adhesive composition, high thermal conductivity aluminum matrix plate and its preparation technology | |
| JP2009064806A (en) | Circuit board and method of manufacturing the same, and semiconductor module | |
| CN112533355A (en) | PCB with embedded copper block and manufacturing method thereof | |
| CN107734864A (en) | A kind of straight etching technique of pcb board | |
| CN103260345B (en) | A kind of Metal Substrate metal-clad foil plate and preparation method thereof | |
| CN105338735B (en) | A kind of mixing material printed wiring board new producing method | |
| CN103987211A (en) | Efficient cooling aluminum substrate based on enlarged aluminum-based face and manufacturing method thereof | |
| CN206024252U (en) | Circuit board | |
| US7504148B2 (en) | Printed circuit board structure and manufacturing method thereof | |
| CN104284530B (en) | The method that no core plate technique makes printed circuit board | |
| CN115315076A (en) | Multilayer pcb manufacturing method of embedded heat dissipation pipeline |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |