CN109451679B - Method for stacking multilayer PCB (printed circuit board) - Google Patents
Method for stacking multilayer PCB (printed circuit board) Download PDFInfo
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- CN109451679B CN109451679B CN201811401642.7A CN201811401642A CN109451679B CN 109451679 B CN109451679 B CN 109451679B CN 201811401642 A CN201811401642 A CN 201811401642A CN 109451679 B CN109451679 B CN 109451679B
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- 238000000034 method Methods 0.000 title claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 63
- 229910052802 copper Inorganic materials 0.000 claims abstract description 63
- 239000010949 copper Substances 0.000 claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- 238000001514 detection method Methods 0.000 claims abstract description 20
- 230000000903 blocking effect Effects 0.000 claims abstract description 16
- 238000010030 laminating Methods 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 10
- 238000000926 separation method Methods 0.000 abstract 3
- 238000009960 carding Methods 0.000 description 4
- 230000004069 differentiation Effects 0.000 description 3
- 239000011120 plywood Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a method for stacking multilayer PCB boards, which comprises the following steps: receiving a stacking instruction, and stacking the PCB according to the stacking instruction; obtaining a pad identification, and performing pad flow blocking treatment on the corresponding PCB according to the pad identification to obtain a pad PCB; acquiring a copper sheet identifier, and performing copper sheet choked flow treatment on the corresponding PCB according to the copper sheet identifier to obtain a copper sheet PCB; respectively carrying out flow choking detection on the bonding pad PCB and the copper sheet PCB, and carrying out prompt marking on the corresponding PCB when the flow choking detection of the bonding pad PCB or the copper sheet PCB is judged to be unqualified; placing a heat conducting plate between adjacent PCB boards, and laminating the stacked PCB boards; and acquiring coding information, and coding and marking the PCB according to the coding information. According to the invention, through the design of carrying out pad flow blocking treatment or copper sheet flow blocking treatment on the PCB, the separation of each laminate is facilitated, the processing error caused by wrong separation is prevented, the quality of the multilayer PCB is improved, and the reduction of the production efficiency caused by difficult separation is prevented.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board), in particular to a method for stacking multiple layers of PCB.
Background
In recent years, with the resurgence of semiconductor industry, the market of circuit board panels is continuously developing, which benefits from two main aspects of power. Firstly, the market space of the circuit board plate application industry is continuously expanded, and the application of the communication industry and the notebook computer industry is promoted, so that the market of a high-end multilayer circuit board is rapidly increased. Meanwhile, the proportion of the digital circuit board for color TV, mobile phone and automobile electronics is also obviously increased, thereby continuously expanding the space of the circuit board industry. Due to the competitive competition of the PCB industry, some PCB factories increase the number of PCB layers or promote the marketing process of FPC with high technical requirements by actively developing new technologies to meet the ever-changing market demands, and therefore, in order to improve the production efficiency of multilayer PCB boards, the problem of stacking thereof in the production process is more and more emphasized by manufacturers.
In the existing multilayer PCB stacking process, the multilayer PCB is stacked and fixed by adopting a covering mode, so that each laminate is difficult to distinguish in the multilayer PCB processing process, and the production efficiency of the multilayer PCB is reduced.
Disclosure of Invention
The invention aims to provide a multilayer PCB stacking method which is easy to distinguish among laminates.
In order to solve the above technical problem, the method for stacking a plurality of layers of PCB boards according to the present invention comprises:
receiving a stacking instruction, and stacking the PCB boards according to the quantity identification stored in the stacking instruction;
obtaining a pad identifier stored in the stacking instruction, and performing pad flow blocking treatment on the PCB according to the pad identifier to obtain a pad PCB;
acquiring a copper sheet identifier stored in the stacking instruction, and performing copper sheet flow blocking treatment on the PCB according to the copper sheet identifier to obtain a copper sheet PCB;
respectively carrying out flow choking detection on the bonding pad PCB and the copper sheet PCB, and carrying out prompt marking on the corresponding PCB when the flow choking detection of the bonding pad PCB or the copper sheet PCB is judged to be unqualified;
placing a heat conducting plate between the adjacent PCB boards, and laminating the stacked PCB boards;
and acquiring coding information stored in the stacking instruction, and coding and marking the PCB according to the coding information.
Preferably, the step of performing pad flow blocking processing on the PCB according to the pad identifier includes:
and acquiring the layer number stored in the pad identifier, and welding the pads of the flow choking blocks on the PCB with the corresponding layer number according to the layer number to obtain the pad PCB.
Preferably, the step of performing copper sheet flow blocking treatment on the PCB corresponding to the copper sheet identifier includes:
acquiring the layer number stored in the copper sheet mark, fixing the copper sheet of the choke block on the PCB with the corresponding layer number according to the layer number,
and performing exhaust treatment on the PCB with the corresponding layers according to a preset interval to obtain the pad PCB.
Preferably, the step of performing exhaust treatment on the PCB boards with the corresponding number of layers according to a preset interval includes:
every 50mm, designing an exhaust duct with the width of 2mm and the angle of 45 degrees between the board edges on the PCB with the corresponding layer number so as to finish the exhaust treatment of the PCB.
Preferably, the step of respectively performing the flow-blocking detection on the pad PCB and the copper-clad PCB includes:
respectively obtaining characteristic parameter values of the pad PCB and the copper sheet PCB, wherein the characteristic parameter values at least comprise one of resistance, impedance or thickness;
judging whether the acquired characteristic parameter value is within a preset parameter value range;
if so, judging that the choked flow detection corresponding to the PCB is qualified;
and if not, determining that the choked flow detection corresponding to the PCB is unqualified.
Preferably, after the step of performing the prompt marking on the corresponding PCB, the method further includes:
and when the prompt mark is marked on the PCB, judging that the quality of the corresponding PCB is unqualified, and replacing the unqualified PCB.
Preferably, the step of code marking the PCB board according to the code information includes:
respectively acquiring the plate name, the plate function and the plate number stored in the coding information;
and manufacturing a coding strip according to the name of the board body, the function of the board body and the serial number of the board body, and adhering the coding strip on the PCB.
Preferably, before the step of obtaining the pad identifier stored in the stack instruction, the method further includes:
when the quantity mark is six layers, the PCB directly carries out pad treatment on the PCB at the second layer and the fifth layer, and directly carries out copper sheet treatment on the PCB at the third layer and the fourth layer so as to complete the stacking of the PCB.
Preferably, before the step of obtaining the pad identifier stored in the stack instruction, the method further includes:
when the quantity sign is eight layers, directly to the second floor and seventh layer the PCB board carries out the pad and handles to directly to the third layer, fourth layer, fifth layer and sixth layer the PCB board carries out the copper skin and handles, in order to accomplish right the stacking of PCB board.
Preferably, the lamination method adopted for laminating the stacked PCB boards is hot melting or riveting.
Compared with the related art, the method for stacking the multilayer PCB has the following beneficial effects: through the acquisition of pad sign is carried out in order to adopt automatic mode of piling up the stacking of PCB board, the effectual production efficiency that improves the multilayer PCB board, through right the PCB board carries out the design that the pad choked flow was handled or the copper sheet choked flow is handled, has effectually made things convenient for distinguishing between each plywood, has prevented because the processing error that the wrong differentiation leads to, has improved the quality of multilayer PCB board, has prevented because the reduction of the production efficiency that is difficult for distinguishing to lead to, through right the PCB board carries out the design that the choked flow detected, the effectual production quality that ensures the multilayer PCB board, and through right the acquisition of coding information and right the coding mark of PCB board, the effectual pursuit to the multilayer PCB board after producing of having made things convenient for.
Drawings
Fig. 1 is a flowchart of a method for stacking multiple PCB boards according to a first embodiment of the present invention;
fig. 2 is a flowchart of a method for stacking multiple PCB boards according to a second embodiment of the present invention;
fig. 3 is a flowchart of a method for stacking multiple PCB boards according to a third embodiment of the present invention.
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
In order to facilitate a better understanding of the invention, the invention will be further explained below with reference to the accompanying drawings of embodiments. Embodiments of the present invention are shown in the drawings, but the present invention is not limited to the preferred embodiments described above. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Referring to fig. 1, a flowchart of a method for stacking a plurality of PCB boards according to a first embodiment of the present invention includes:
step S10, receiving a stacking instruction, and stacking PCB boards according to the quantity identification stored in the stacking instruction;
the stacking instruction can be transmitted in a voice signal, wireless signal or message instruction mode, the stacking instruction is used for informing a system that a current user has a stacking requirement and needs to produce a multilayer PCB, the quantity identifier can be stored and transmitted in a numerical value or letter mode, for example, the quantity identifier can be numbers such as 2, 3, 4 and 5, preferably, the quantity identifier can also be stored in a letter mode such as A, B, C, D, and when the quantity identifier is D, the corresponding number of layers is determined to be 4;
step S20, obtaining pad identification stored in the stacking instruction, and performing pad flow blocking treatment on the PCB according to the pad identification to obtain a pad PCB;
the pad identification can be stored in the stacking instruction by adopting a voice mark, a header mark or a mark at a preset position, and the pad identification stores corresponding numerical value information which is the number of layers required to be subjected to flow-resisting carding of the pad, so that subsequent distinction among laminates is effectively facilitated, and the production efficiency of the PCB for multiple times is improved;
step S30, obtaining a copper sheet identification stored in the stacking instruction, and performing copper sheet flow blocking treatment on the PCB board according to the copper sheet identification to obtain a copper sheet PCB;
the copper sheet identification can also be stored in the stacking instruction by adopting a voice mark, a header mark or a mark at a preset position, corresponding numerical value information is stored in the copper sheet identification, and the numerical value information is the number of layers required to be subjected to the copper sheet flow-blocking carding, so that the subsequent distinction among the laminates is effectively facilitated, the production efficiency of the PCB for multiple times is improved, preferably, the information stored in the copper sheet identification is different from the information stored in the pad identification, and the repeated flow-blocking treatment of the PCB on the same layer is effectively prevented;
step S40, respectively performing flow-resisting detection on the pad PCB and the copper sheet PCB, and when the flow-resisting detection of the pad PCB or the copper sheet PCB is judged to be unqualified, performing prompt marking on the corresponding PCB;
the detection method comprises the steps of detecting whether the bonding pad PCB and the copper sheet PCB meet qualified conditions or not, preferably prompting staff to replace the PCB with the number of layers which corresponds to the PCB with unqualified quality, wherein the flow resistance detection is used for detecting whether the bonding pad PCB and the copper sheet PCB meet qualified conditions or not so as to guarantee the quality of the produced multilayer PCB;
step S50, placing a heat conducting plate between the adjacent PCB boards, and laminating the stacked PCB boards;
the heat conducting plate is placed, so that the heat transfer effect in the process of laminating the PCB is effectively facilitated, the laminating efficiency of the PCB is improved, and the stability of the structure between each layer plate and the stability of the integral structure of the multilayer PCB are improved through the laminating design of the PCB;
step S60, acquiring coding information stored in the stacking instruction, and coding and marking the PCB according to the coding information;
the PCB board is provided with a plurality of layers of PCB boards, wherein the PCB boards are provided with a plurality of layers of PCB boards, and the PCB boards are arranged in the PCB boards;
in this embodiment, through the acquisition of pad sign is gone on in order to adopt the automatic mode of piling up the stacking of PCB board, the effectual production efficiency that improves the multilayer PCB board, through right the PCB board carries out the design that pad choked flow was handled or the copper sheet choked flow is handled, has effectually made things convenient for distinguishing between each plywood, has prevented because the processing error that the wrong differentiation leads to, has improved the quality of multilayer PCB board, has prevented because the reduction of the production efficiency that is difficult for distinguishing to lead to, through right the PCB board carries out the design that the choked flow detected, the effectual production quality that ensures the multilayer PCB board, and through right the acquisition of coding information and right the code mark of PCB board, the effectual pursuit to the multilayer PCB board after producing of having made things convenient for.
Referring to fig. 2, a flowchart of a method for stacking a plurality of PCB boards according to a second embodiment of the present invention includes the steps of:
step S11, receiving a stacking instruction, and stacking PCB boards according to the quantity identification stored in the stacking instruction;
the stacking instruction can be transmitted in a voice signal, wireless signal or message instruction mode, the stacking instruction is used for informing a system that a current user has a stacking requirement and needs to produce a multilayer PCB, the quantity identifier can be stored and transmitted in a numerical value or letter mode, for example, the quantity identifier can be numbers such as 2, 3, 4 and 5, preferably, the quantity identifier can also be stored in a letter mode such as A, B, C, D, and when the quantity identifier is D, the corresponding number of layers is determined to be 4;
step S21, obtaining a pad identifier stored in the stacking instruction, and obtaining a layer value stored in the pad identifier;
the pad identification can be stored in the stacking instruction by adopting a voice mark, a header mark or a mark at a preset position, and the pad identification stores corresponding numerical value information which is the number of layers required to be subjected to flow-resisting carding of the pad, so that subsequent distinction among laminates is effectively facilitated, and the production efficiency of the PCB for multiple times is improved;
step S31, welding the flow blocking blocks on the PCB with the corresponding layer number according to the layer number to obtain the pad PCB;
step S41, obtaining a copper sheet identifier stored in the stacking instruction, obtaining a layer number value stored in the copper sheet identifier, and fixing the choke block on the PCB with the corresponding layer number according to the layer number value;
the copper sheet identification can also be stored in the stacking instruction by adopting a voice mark, a header mark or a mark at a preset position, corresponding numerical value information is stored in the copper sheet identification, and the numerical value information is the number of layers required to be subjected to the copper sheet flow-blocking carding, so that the subsequent distinction among the laminates is effectively facilitated, the production efficiency of the PCB for multiple times is improved, preferably, the information stored in the copper sheet identification is different from the information stored in the pad identification, and the repeated flow-blocking treatment of the PCB on the same layer is effectively prevented;
step S51, performing exhaust treatment on the PCB with the corresponding layers according to preset intervals to obtain the pad PCB;
specifically, the step of performing exhaust treatment on the PCB with the corresponding number of layers includes:
every 50mm, designing an exhaust groove with the width of 2mm and the angle of 45 degrees between the edges of the PCB on the PCB with the corresponding layers to finish the exhaust treatment of the PCB;
preferably, when the vent groove is set in this step, when an avoidance mark exists on the inner layer, the position of the vent groove is automatically adjusted to prevent damage to the avoidance. When the upper surface and the lower surface of the same core plate are simultaneously designed to be copper sheet choked, the exhaust grooves are not allowed to coincide;
step S61, respectively performing flow-resisting detection on the pad PCB and the copper sheet PCB, and when the flow-resisting detection of the pad PCB or the copper sheet PCB is judged to be unqualified, performing prompt marking on the corresponding PCB;
the detection method comprises the steps of detecting whether the bonding pad PCB and the copper sheet PCB meet qualified conditions or not, preferably prompting staff to replace the PCB with the number of layers which corresponds to the PCB with unqualified quality, wherein the flow resistance detection is used for detecting whether the bonding pad PCB and the copper sheet PCB meet qualified conditions or not so as to guarantee the quality of the produced multilayer PCB;
preferably, in this embodiment, after the step of performing the prompt marking on the corresponding PCB, the method further includes:
when the prompt mark is marked on the PCB, judging that the quality of the corresponding PCB is unqualified, and replacing the unqualified PCB;
step S71, placing a heat conducting plate between the adjacent PCB boards, and laminating the stacked PCB boards;
the heat conducting plate is placed, so that the heat transfer effect in the process of laminating the PCB is effectively facilitated, the laminating efficiency of the PCB is improved, and the stability of the structure between each layer plate and the stability of the integral structure of the multilayer PCB are improved through the laminating design of the PCB;
specifically, the lamination mode adopted for laminating the stacked PCB boards is hot melting or riveting;
step S81, acquiring coding information stored in the stacking instruction, and coding and marking the PCB according to the coding information;
the PCB board is provided with a plurality of layers of PCB boards, wherein the PCB boards are provided with a plurality of layers of PCB boards, and the PCB boards are arranged in the PCB boards;
preferably, in this step, the step of coding and marking the PCB board includes:
respectively acquiring the plate name, the plate function and the plate number stored in the coding information;
manufacturing a coding strip according to the plate name, the plate function and the plate number, and adhering the coding strip on the PCB;
in this embodiment, through the acquisition of pad sign is gone on in order to adopt the automatic mode of piling up the stacking of PCB board, the effectual production efficiency that improves the multilayer PCB board, through right the PCB board carries out the design that pad choked flow was handled or the copper sheet choked flow is handled, has effectually made things convenient for distinguishing between each plywood, has prevented because the processing error that the wrong differentiation leads to, has improved the quality of multilayer PCB board, has prevented because the reduction of the production efficiency that is difficult for distinguishing to lead to, through right the PCB board carries out the design that the choked flow detected, the effectual production quality that ensures the multilayer PCB board, and through right the acquisition of coding information and right the code mark of PCB board, the effectual pursuit to the multilayer PCB board after producing of having made things convenient for.
Referring to fig. 3, a flowchart of a method for stacking a plurality of PCB boards according to a third embodiment of the present invention includes the steps of:
step S12, receiving a stacking instruction, and stacking PCB boards according to the quantity identification stored in the stacking instruction;
step S22, when the number marks are six layers, directly performing pad processing on the PCB of the second layer and the fifth layer;
step S32, directly carrying out copper sheet processing on the PCB boards of the third layer and the fourth layer to complete the stacking of the PCB boards;
step S42, when the number mark is eight layers, directly performing pad processing on the PCB of the second layer and the seventh layer;
step S52, directly carrying out copper sheet treatment on the PCB of the third layer, the fourth layer, the fifth layer and the sixth layer to complete the stacking of the PCB;
in the embodiment, through the design of carrying out the solder pad flow blocking treatment or the copper sheet flow blocking treatment on the PCB, the PCB effectively facilitates the distinguishing of the laminates, prevents the processing error caused by the wrong distinguishing, improves the quality of the multilayer PCB, and prevents the reduction of the production efficiency caused by the difficult distinguishing.
The above-described embodiments describe the technical principles of the present invention, and these descriptions are only for the purpose of explaining the principles of the present invention and are not to be construed as limiting the scope of the present invention in any way. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (7)
1. A method for stacking multilayer PCB boards is characterized by comprising the following steps:
receiving a stacking instruction, and stacking the PCB boards according to the quantity identification stored in the stacking instruction;
obtaining a pad identifier stored in the stacking instruction, and performing pad flow blocking treatment on the PCB according to the pad identifier to obtain a pad PCB;
the step of performing pad flow blocking treatment on the PCB according to the pad identification comprises the following steps:
acquiring the layer number stored in the pad identifier, and performing pad welding on the flow choking blocks on the PCB with the corresponding layer number according to the layer number to obtain the pad PCB;
acquiring a copper sheet identifier stored in the stacking instruction, and performing copper sheet flow blocking treatment on the PCB according to the copper sheet identifier to obtain a copper sheet PCB; the step of performing copper sheet flow blocking treatment on the PCB according to the copper sheet identification comprises the following steps:
acquiring the layer number stored in the copper sheet mark, fixing the copper sheet of the choke block on the PCB with the corresponding layer number according to the layer number,
performing exhaust treatment on the PCB with the corresponding number of layers according to a preset interval to obtain the pad PCB;
respectively carrying out flow choking detection on the bonding pad PCB and the copper sheet PCB, and carrying out prompt marking on the corresponding PCB when the flow choking detection of the bonding pad PCB or the copper sheet PCB is judged to be unqualified;
placing a heat conducting plate between the adjacent PCB boards, and laminating the stacked PCB boards;
acquiring coding information stored in the stacking instruction, and coding and marking the PCB according to the coding information;
the step of performing exhaust treatment on the PCB with the corresponding number of layers according to the preset interval comprises the following steps of:
every 50mm, designing an exhaust duct with the width of 2mm and the angle of 45 degrees between the board edges on the PCB with the corresponding layer number so as to finish the exhaust treatment of the PCB.
2. The method of claim 1, wherein the step of performing choked flow detection on the land PCB and the copper PCB, respectively, comprises:
respectively obtaining characteristic parameter values of the pad PCB and the copper sheet PCB, wherein the characteristic parameter values at least comprise one of resistance, impedance or thickness;
judging whether the acquired characteristic parameter value is within a preset parameter value range;
if so, judging that the choked flow detection corresponding to the PCB is qualified;
and if not, determining that the choked flow detection corresponding to the PCB is unqualified.
3. The method of claim 1, wherein after the step of hinting the corresponding PCB, the method further comprises:
and when the prompt mark is marked on the PCB, judging that the quality of the corresponding PCB is unqualified, and replacing the unqualified PCB.
4. The method for stacking multi-layered PCB boards as recited in claim 1, wherein the step of code marking the PCB boards according to the code information comprises:
respectively acquiring the plate name, the plate function and the plate number stored in the coding information;
and manufacturing a coding strip according to the name of the board body, the function of the board body and the serial number of the board body, and adhering the coding strip on the PCB.
5. The method of claim 1, wherein prior to the step of obtaining the pad identification stored in the stacking instruction, the method further comprises:
when the quantity mark is six layers, the PCB directly carries out pad treatment on the PCB at the second layer and the fifth layer, and directly carries out copper sheet treatment on the PCB at the third layer and the fourth layer so as to complete the stacking of the PCB.
6. The method of claim 1, wherein prior to the step of obtaining the pad identification stored in the stacking instruction, the method further comprises:
when the quantity sign is eight layers, directly to the second floor and seventh layer the PCB board carries out the pad and handles to directly to the third layer, fourth layer, fifth layer and sixth layer the PCB board carries out the copper skin and handles, in order to accomplish right the stacking of PCB board.
7. The method for stacking multiple layers of PCB boards as claimed in claim 1, wherein the lamination of the stacked PCB boards is performed by hot melting or riveting.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811401642.7A CN109451679B (en) | 2018-11-22 | 2018-11-22 | Method for stacking multilayer PCB (printed circuit board) |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811401642.7A CN109451679B (en) | 2018-11-22 | 2018-11-22 | Method for stacking multilayer PCB (printed circuit board) |
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| CN109451679B true CN109451679B (en) | 2021-03-05 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102301837A (en) * | 2011-05-27 | 2011-12-28 | 华为技术有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN202364482U (en) * | 2011-11-24 | 2012-08-01 | 东莞市康庄电路有限公司 | A PCB multilayer board inner layer graphics processing fixture |
| CN203104951U (en) * | 2013-02-26 | 2013-07-31 | 福清三照电子有限公司 | Printed circuit board (PCB) easily subjected to gummosis |
| CN107529294A (en) * | 2017-09-27 | 2017-12-29 | 生益电子股份有限公司 | A kind of manufacturing method of PCB and PCB |
-
2018
- 2018-11-22 CN CN201811401642.7A patent/CN109451679B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102301837A (en) * | 2011-05-27 | 2011-12-28 | 华为技术有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN202364482U (en) * | 2011-11-24 | 2012-08-01 | 东莞市康庄电路有限公司 | A PCB multilayer board inner layer graphics processing fixture |
| CN203104951U (en) * | 2013-02-26 | 2013-07-31 | 福清三照电子有限公司 | Printed circuit board (PCB) easily subjected to gummosis |
| CN107529294A (en) * | 2017-09-27 | 2017-12-29 | 生益电子股份有限公司 | A kind of manufacturing method of PCB and PCB |
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| CN109451679A (en) | 2019-03-08 |
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