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CA990413A - Low modulus film as a barrier to prevent flow of adhesive into recessed areas in flexible circuits - Google Patents

Low modulus film as a barrier to prevent flow of adhesive into recessed areas in flexible circuits

Info

Publication number
CA990413A
CA990413A CA164,219A CA164219A CA990413A CA 990413 A CA990413 A CA 990413A CA 164219 A CA164219 A CA 164219A CA 990413 A CA990413 A CA 990413A
Authority
CA
Canada
Prior art keywords
barrier
adhesive
low modulus
prevent flow
recessed areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA164,219A
Other versions
CA164219S (en
Inventor
E. Curtis Johnson
Russell D. Klint
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Buckbee Mears Co
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Application granted granted Critical
Publication of CA990413A publication Critical patent/CA990413A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CA164,219A 1972-07-17 1973-02-21 Low modulus film as a barrier to prevent flow of adhesive into recessed areas in flexible circuits Expired CA990413A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27219872A 1972-07-17 1972-07-17

Publications (1)

Publication Number Publication Date
CA990413A true CA990413A (en) 1976-06-01

Family

ID=23038817

Family Applications (1)

Application Number Title Priority Date Filing Date
CA164,219A Expired CA990413A (en) 1972-07-17 1973-02-21 Low modulus film as a barrier to prevent flow of adhesive into recessed areas in flexible circuits

Country Status (8)

Country Link
JP (1) JPS4951561A (en)
BE (1) BE797750A (en)
CA (1) CA990413A (en)
DE (1) DE2333445A1 (en)
FR (1) FR2193301B1 (en)
GB (1) GB1419027A (en)
IT (1) IT991068B (en)
NL (1) NL7304482A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107529294A (en) * 2017-09-27 2017-12-29 生益电子股份有限公司 A kind of manufacturing method of PCB and PCB

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3322772C2 (en) * 1983-06-24 1986-05-22 Didier-Werke Ag, 6200 Wiesbaden Composite film for lining liquid containers
WO2017026208A1 (en) 2015-08-10 2017-02-16 株式会社村田製作所 Resin multilayer substrate and method for manufacturing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107529294A (en) * 2017-09-27 2017-12-29 生益电子股份有限公司 A kind of manufacturing method of PCB and PCB

Also Published As

Publication number Publication date
IT991068B (en) 1975-07-30
JPS4951561A (en) 1974-05-18
NL7304482A (en) 1974-01-21
GB1419027A (en) 1975-12-24
FR2193301B1 (en) 1977-02-04
BE797750A (en) 1973-10-04
FR2193301A1 (en) 1974-02-15
DE2333445A1 (en) 1974-01-31

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