CN106163138A - A kind of manufacture method of gold finger plate - Google Patents
A kind of manufacture method of gold finger plate Download PDFInfo
- Publication number
- CN106163138A CN106163138A CN201610737929.1A CN201610737929A CN106163138A CN 106163138 A CN106163138 A CN 106163138A CN 201610737929 A CN201610737929 A CN 201610737929A CN 106163138 A CN106163138 A CN 106163138A
- Authority
- CN
- China
- Prior art keywords
- core material
- district
- copper
- resistance glue
- solder mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 21
- 239000010931 gold Substances 0.000 title claims abstract description 21
- 239000011162 core material Substances 0.000 claims abstract description 99
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 96
- 229910052802 copper Inorganic materials 0.000 claims abstract description 96
- 239000010949 copper Substances 0.000 claims abstract description 96
- 229910000679 solder Inorganic materials 0.000 claims abstract description 44
- 238000003475 lamination Methods 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims description 65
- 238000005530 etching Methods 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 7
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 3
- 239000000084 colloidal system Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses the manufacture method of a kind of gold finger plate, after comprising the steps: to complete the line pattern of the core material having without copper district, in the district without copper of described core material, it is coated with solder mask, and makes the thickness of described solder mask less than the thickness of line layer in described core material；Described core material is carried out together with other central layer lamination treatment.By after the district without copper of core material covers solder mask, core material line layer can be reduced and without thickness difference between copper district, so in follow-up pressing step process, without filling a large amount of resins to without copper district, and the deformation bending occurred without the prepreg between copper district central layer and central layer can be avoided accordingly, the thickness of slab uniformity of wiring board the most obtained is preferable.
Description
Technical field
The present invention relates to wiring board production technical field, especially relate to the manufacture method of a kind of gold finger plate.
Background technology
The manufacture method of existing gold finger plate comprises the steps: one, core material line pattern makes；Two, internal layer
Surface brown process is carried out after central layer optical detection；Three, the central layer after brown processes carries out pressing process.But, due to circuit
Ban Zhongwutong district and You Tong district are due to pad synergistic effect and resin flowing limitation, and wiring board is easily caused line after laminating
Ban Zhongwutong district, road thickness of slab is the thinnest compared with You Tong district, and the overall thickness of slab uniformity of wiring board is poor.
Summary of the invention
Based on this, the invention reside in the defect overcoming prior art, it is provided that the manufacture method of a kind of gold finger plate, it can make
Obtain wiring board lamination back plate thickness uniformity preferable.
Its technical scheme is as follows: the manufacture method of a kind of gold finger plate, comprises the steps: will have the internal layer without copper district
After the line pattern of central layer completes, the district without copper of described core material is coated with solder mask, and makes described welding resistance
The thickness of layer is less than the thickness of line layer in described core material；Described core material is carried out at lamination together with other central layer
Reason.
Wherein in an embodiment, the thickness of described solder mask than the thickness of line layer in described core material little 5～
10μm。
Wherein in an embodiment, described be coated with in the district without copper of described core material solder mask step include as
Lower step: silk-screen solder mask on described core material, and the thickness ratio controlling solder mask in described district without copper is described
Thickness little 5～10 μm of core material upper wiring layer；By exposure imaging etching, the line layer in described core material is appeared
Go out, and the solder mask in described core material Zhong Wutong district is solidify to form described solder mask.
Wherein in an embodiment, the viscosity of described solder mask is 180～230ps.
Wherein in an embodiment, if described core material Zhong Wutong district is positioned at the edges of boards of described core material,
Then the edges of boards at the production unit plate for forming described core material add multiple resistance glue copper billets, and multiple described resistance glue copper billet
It is disposed adjacent with described district without copper.
Wherein in an embodiment, described resistance glue copper billet sets in a row, and described resistance glue copper billet has more than two rows, phase
The described resistance glue copper billet of adjacent row mutually staggers setting.
Wherein in an embodiment, described resistance glue copper billet is discoid and a diameter of 3～8mm, adjacent described resistance glue copper
The spacing of block is 0.2～0.5mm.
Wherein in an embodiment, described resistance glue copper billet is 5mm, and the spacing of adjacent described resistance glue copper billet is 0.25mm.
Wherein in an embodiment, if described core material Zhong Wutong district is positioned at the edges of boards of described core material,
Then the edges of boards at the production unit plate for forming described core material add multiple resistance glue copper billets method particularly includes: make institute
State in the line pattern file processes of core material, if determining described core material Zhong Wutong district to be positioned at described core material
Edges of boards time, then in described line pattern file add hinder glue point corresponding with described resistance glue copper billet, and described resistance glue point and
Described district without copper is disposed adjacent；According to described line pattern file by outside the line layer of described core material and described core material
The resistance glue copper billet enclosed is formed by exposure imaging etching together.
Wherein in an embodiment, it is respectively positioned on described if determining the Wu Tongqu of the core material of adjacent layer in wiring board
During the same edges of boards region of wiring board, then the resistance added in described line pattern file corresponding with the core material of adjacent layer
Glue point mutually staggers setting.
Below in conjunction with technique scheme, principle, the effect of the present invention are further illustrated:
1, the production method of above-mentioned wiring board, by, after the district without copper of core material covers solder mask, reducing
Core material line layer and without thickness difference between copper district, so in follow-up pressing step process, it is not necessary to fills without copper district
A large amount of resins, and the deformation bending occurred without the prepreg between copper district central layer and central layer can be avoided accordingly, so at lamination
The thickness of slab uniformity of the wiring board obtained by afterwards is preferable.
2, on core material, the viscosity of silk-screen solder mask is 180～230ps, so at the district without copper of core material silk-screen
After solder mask, it is avoided that solder mask flowed before precuring and causes thickness of slab non-uniform phenomenon.
3, the thickness of solder mask 5～10 μm less than the thickness of core material line layer accordingly, and through follow-up lamination treatment
After, the thickness of slab entirety uniformity of finally obtained wiring board is preferable.
If 4 core material Zhong Wutong districts are positioned at the edges of boards of core material, then for forming described core material
The edges of boards of production unit plate add multiple resistance glue copper billets, and resistance glue copper billet is disposed adjacent with Wu Tongqu.Plate at production unit plate
The resistance glue copper billet that limit is arranged is avoided that and runs off in lamination process to edges of boards without the prepreg colloid in copper district, so can make
Core material is preferable with other central layer lamination back plate thickness entirety uniformity.
5, resistance glue copper billet sets in a row, and resistance glue copper billet has more than two rows, and the resistance glue copper billet of adjacent row mutually staggers and sets
Put.Resistance glue copper billet is discoid and a diameter of 3～8mm, and the spacing of adjacent resistance glue copper billet is 0.2～0.5mm.Preferably, resistance glue
Copper billet is 5mm, and the spacing of adjacent resistance glue copper billet is 0.25mm.So, resistance glue copper billet can preferably be avoided without the semi-solid preparation in copper district
Sheet colloid runs off to edges of boards in lamination process.
If 6 determine the Wu Tongqu of the core material of adjacent layer in wiring board is respectively positioned on the same edges of boards of described wiring board
During region, then the resistance glue point added in described line pattern file corresponding with the core material of adjacent layer mutually staggers and sets
Put.The most just it can be avoided that the edges of boards of adjacent layer core material are hindered glue copper billet weight after lamination without what periphery, copper district added
Folded phenomenon, thus avoid the thickness inhomogeneity that resistance glue copper billet overlapping phenomenon is caused.
Accompanying drawing explanation
Fig. 1 is the manufacture method flow chart one of gold finger plate described in the embodiment of the present invention；
Fig. 2 is the manufacture method flowchart 2 of gold finger plate described in the embodiment of the present invention；
Fig. 3 is the schematic diagram that core material described in the embodiment of the present invention is filled with solder mask；
Fig. 4 is to be added with resistance glue copper billet schematic diagram outside core material described in the embodiment of the present invention.
Description of reference numerals:
10, base material, 11, line layer, 12, Wu Tongqu, 20, solder mask, 30, core material, 40, production unit plate, 50, resistance
Glue copper billet.
Detailed description of the invention
Below embodiments of the invention are described in detail:
Embodiment one
As it is shown in figure 1, the manufacture method of gold finger plate of the present invention, comprise the steps:
Step S101, the line pattern of making core material；
The manufacture method of the line pattern of core material is obtained by exposure imaging etching step, for prior art, this
Bright do not repeat at this.
Step S102, in the district without copper of described core material, it is coated with solder mask, and makes the thickness of described solder mask
Less than the thickness of line layer in described core material；
By covering after solder mask in the district without copper of core material, core material line layer can be reduced and without copper district between
Thickness difference, so in follow-up pressing step process, it is not necessary to fills a large amount of resins to without copper district, and can avoid Wu Tongqu accordingly
The deformation bending that prepreg between central layer and central layer occurs.
Step S103, described core material is carried out together with other central layer lamination treatment.
Lamination treatment is also prior art, and the present invention does not repeats at this.
The manufacture method of above-mentioned gold finger plate, by filling resistance in the district without copper of core material before lamination
Layer, and the thickness of slab uniformity of wiring board obtained after lamination is preferable.
Embodiment two
Referring to Fig. 2, the described solder mask step that is coated with in the district without copper of described core material comprises the steps:
Step S201, the line pattern of making core material；
Step S202, on described core material silk-screen solder mask, and control solder mask in described district without copper
Thickness is than thickness little 5～10 μm of described core material upper wiring layer；
Wherein, on core material, the viscosity of silk-screen solder mask is 180～230ps, so at the Wu Tongqu of core material
After silk-screen solder mask, it is avoided that solder mask flowed before precuring and causes thickness of slab non-uniform phenomenon.And how at central layer
Upper silk-screen solder mask, and how to control the thickness of silk-screen solder mask, it being prior art, the present invention does not goes to live in the household of one's in-laws on getting married at this
State.
Step S203, by exposure imaging etching, the line layer 11 in described core material is manifested, and will be described interior
The solder mask in floor central layer Zhong Wutong district 12 solidify to form described solder mask 20 (referring to Fig. 3)；
Due to without 5～10 μs less than the thickness of core material upper wiring layer 11 of the thickness of the solder mask of silk-screen in copper district 12
M, solder mask is solidified on, without after in copper district 12, forming solder mask 20 and being close on base material 10, and the thickness of solder mask 20 is corresponding
5～10 μm less than the thickness of core material line layer 11, and after follow-up lamination treatment, the plate of finally obtained wiring board
Thick overall uniformity is preferable.
Step S204, described core material is carried out together with other central layer lamination treatment.
In embodiments of the present invention, if described core material 30 Zhong Wutong district 12 is positioned at the edges of boards of described core material 30
Time, then the edges of boards multiple resistance glue copper billets 50 of interpolation at the production unit plate 40 for forming described core material 30 (refer to figure
, and multiple described resistance glue copper billet 50 is disposed adjacent with described district without copper 12 4).At the resistance glue that the edges of boards of production unit plate 40 are arranged
Copper billet 50 is avoided that and runs off in lamination process to edges of boards without the prepreg colloid in copper district 12, so can make core material
30 is preferable with other central layer lamination back plate thickness entirety uniformity.
Wherein, described resistance glue copper billet 50 sets in a row, and described resistance glue copper billet 50 has more than two rows, adjacent row described
Resistance glue copper billet 50 mutually staggers setting.Described resistance glue copper billet 50 is discoid and a diameter of 3～8mm, adjacent described resistance glue copper billet
The spacing of 50 is 0.2～0.5mm.Preferably, described resistance glue copper billet 50 is 5mm, and the spacing of adjacent described resistance glue copper billet 50 is
0.25mm.So, resistance glue copper billet can preferably be avoided running off to edges of boards in lamination process without the prepreg colloid in copper district.
In embodiments of the present invention, if described core material 30 Zhong Wutong district 12 is positioned at the edges of boards of described core material 30
Time, then the edges of boards at the production unit plate 40 for forming described core material 30 add the concrete grammar of multiple resistance glue copper billets 50
For: make in the line pattern file processes of described core material, if determining described core material Zhong Wutong district to be positioned at institute
When stating the edges of boards of core material, then in described line pattern file, interpolation is corresponding with described resistance glue copper billet hinders glue point, and institute
State resistance glue point to be disposed adjacent with described district without copper；According to described line pattern file by the line layer of described core material with described
The resistance glue copper billet of core material periphery is formed by exposure imaging etching together.
In embodiments of the present invention, if determining the Wu Tongqu of the core material of adjacent layer in wiring board to be respectively positioned on described line
During the same edges of boards region of road plate, then the resistance glue added in described line pattern file corresponding with the core material of adjacent layer
Put setting of mutually staggering.The most just it can be avoided that the resistance glue copper billet that the edges of boards of adjacent layer core material are added without periphery, copper district exists
Overlapping phenomenon after lamination, thus avoid the thickness inhomogeneity that resistance glue copper billet overlapping phenomenon is caused.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic executed in example is all described, but, as long as the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but also
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that, come for those of ordinary skill in the art
Saying, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. the manufacture method of a gold finger plate, it is characterised in that comprise the steps:
After the line pattern of the core material having without copper district is completed, it is coated with in the district without copper of described core material
Solder mask, and make the thickness of described solder mask less than the thickness of line layer in described core material；
Described core material is carried out together with other central layer lamination treatment.
The manufacture method of gold finger plate the most according to claim 1, it is characterised in that the thickness ratio of described solder mask is described
The thickness of line layer little 5～10 μm in core material.
The manufacture method of gold finger plate the most according to claim 2, it is characterised in that the described nothing at described core material
Copper district is coated with solder mask step comprise the steps:
Silk-screen solder mask on described core material, and control the thickness of solder mask in described district without copper than described internal layer
Thickness little 5～10 μm of central layer upper wiring layer；
By exposure imaging etching, the line layer in described core material is manifested, and by described core material Zhong Wutong district
Solder mask solidify to form described solder mask.
The manufacture method of gold finger plate the most according to claim 3, it is characterised in that the viscosity of described solder mask is
180～230ps.
5. according to the manufacture method of the gold finger plate described in any one of Claims 1 to 4, it is characterised in that if described internal layer core
When plate Zhong Wutong district is positioned at the edges of boards of described core material, then at the plate of the production unit plate for forming described core material
Multiple resistance glue copper billets are added on limit, and multiple described resistance glue copper billet is disposed adjacent with described district without copper.
The manufacture method of gold finger plate the most according to claim 5, it is characterised in that described resistance glue copper billet sets in a row,
And described resistance glue copper billet has more than two rows, the described resistance glue copper billet of adjacent row mutually staggers setting.
The manufacture method of gold finger plate the most according to claim 5, it is characterised in that described resistance glue copper billet be discoid,
And a diameter of 3～8mm, the spacing of adjacent described resistance glue copper billet is 0.2～0.5mm.
The manufacture method of gold finger plate the most according to claim 7, it is characterised in that described resistance glue copper billet is 5mm, adjacent
The spacing of described resistance glue copper billet is 0.25mm.
The manufacture method of gold finger plate the most according to claim 5, it is characterised in that if in described core material without copper
When district is positioned at the edges of boards of described core material, then the edges of boards at the production unit plate for forming described core material add multiple
Resistance glue copper billet method particularly includes:
Make in the line pattern file processes of described core material, if determining described core material Zhong Wutong district to be positioned at institute
When stating the edges of boards of core material, then in described line pattern file, interpolation is corresponding with described resistance glue copper billet hinders glue point, and institute
State resistance glue point to be disposed adjacent with described district without copper；
According to described line pattern file by resistance glue copper billet one peripheral with described core material for the line layer of described core material
Rise and formed by exposure imaging etching.
The manufacture method of gold finger plate the most according to claim 9, it is characterised in that if determining in wiring board adjacent
When the Wu Tongqu of the core material of layer is respectively positioned on the same edges of boards region of described wiring board, then in the core material phase with adjacent layer
The resistance glue point added in the described line pattern file answered mutually staggers setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610737929.1A CN106163138A (en) | 2016-08-26 | 2016-08-26 | A kind of manufacture method of gold finger plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610737929.1A CN106163138A (en) | 2016-08-26 | 2016-08-26 | A kind of manufacture method of gold finger plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106163138A true CN106163138A (en) | 2016-11-23 |
Family
ID=57343211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610737929.1A Pending CN106163138A (en) | 2016-08-26 | 2016-08-26 | A kind of manufacture method of gold finger plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106163138A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686913A (en) * | 2016-12-29 | 2017-05-17 | 安徽深泽电子科技有限公司 | Adhesive filling and laminating method for inner layer copper-less regions of PCB multilayered board |
| CN108012469A (en) * | 2017-12-25 | 2018-05-08 | 大连崇达电路有限公司 | A kind of production method and inner figure data of multilayer circuit inner cord production plate |
| CN108811376A (en) * | 2018-06-28 | 2018-11-13 | 广州兴森快捷电路科技有限公司 | The production method of the thick copper coin of high density interconnection and thick copper core plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203086841U (en) * | 2013-01-14 | 2013-07-24 | 广东生益科技股份有限公司 | A board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure |
| CN103957673A (en) * | 2014-05-21 | 2014-07-30 | 赣州市深联电路有限公司 | Method for preventing copper coil from wrinkling in multi-layer board pressing process |
| CN105072827A (en) * | 2015-07-17 | 2015-11-18 | 深圳崇达多层线路板有限公司 | Thick copper plate manufacturing method |
| CN105491787A (en) * | 2016-01-01 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Single-layer circuit board, high-layer circuit board and fabrication method of high-layer circuit board |
| CN105792547A (en) * | 2016-04-21 | 2016-07-20 | 黄石沪士电子有限公司 | Pre-laminating process for inner-layer core plate of thick-copper multilayer PCB |
-
2016
- 2016-08-26 CN CN201610737929.1A patent/CN106163138A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203086841U (en) * | 2013-01-14 | 2013-07-24 | 广东生益科技股份有限公司 | A board edge structure of a thick-copper multilayer printed circuit board and a printed circuit board containing the board edge structure |
| CN103957673A (en) * | 2014-05-21 | 2014-07-30 | 赣州市深联电路有限公司 | Method for preventing copper coil from wrinkling in multi-layer board pressing process |
| CN105072827A (en) * | 2015-07-17 | 2015-11-18 | 深圳崇达多层线路板有限公司 | Thick copper plate manufacturing method |
| CN105491787A (en) * | 2016-01-01 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Single-layer circuit board, high-layer circuit board and fabrication method of high-layer circuit board |
| CN105792547A (en) * | 2016-04-21 | 2016-07-20 | 黄石沪士电子有限公司 | Pre-laminating process for inner-layer core plate of thick-copper multilayer PCB |
Non-Patent Citations (2)
| Title |
|---|
| 孟庆龙: "《电器制造技术手册》", 31 December 1999 * |
| 车茂丰: "《现代实用印刷技术》", 30 June 2001 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686913A (en) * | 2016-12-29 | 2017-05-17 | 安徽深泽电子科技有限公司 | Adhesive filling and laminating method for inner layer copper-less regions of PCB multilayered board |
| CN108012469A (en) * | 2017-12-25 | 2018-05-08 | 大连崇达电路有限公司 | A kind of production method and inner figure data of multilayer circuit inner cord production plate |
| CN108811376A (en) * | 2018-06-28 | 2018-11-13 | 广州兴森快捷电路科技有限公司 | The production method of the thick copper coin of high density interconnection and thick copper core plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106163138A (en) | A kind of manufacture method of gold finger plate | |
| JP2013062314A5 (en) | ||
| CN103140058B (en) | The excessive glue control method of laminar structure | |
| CN105451428A (en) | Laminated circuit board processing method and laminated circuit board | |
| CN102883534A (en) | Method for solving problem of voltage loss in inner copper-free area of thick copper printed circuit board | |
| CN103729078B (en) | Touch screen and its manufacturing method | |
| CN102548183A (en) | Multilayer circuit board and manufacturing method thereof | |
| CN101938886B (en) | Method for adhering multi-layer dry films to manufacture circuit boards | |
| US20180336994A1 (en) | Embedded coil assembly and method of making | |
| CN105142363A (en) | High-speed PCB laminating method | |
| CN105072319A (en) | Camera module and circuit board thereof | |
| CN105491787A (en) | Single-layer circuit board, high-layer circuit board and fabrication method of high-layer circuit board | |
| JP2016131233A (en) | Cover film with high dimensional stability and manufacturing method of flexible printed circuit board | |
| WO2012087059A3 (en) | Printed circuit board and method for manufacturing the same | |
| RU2016110919A (en) | METHOD FOR PRODUCING NON-METAL SELF-HEATING CASTING FORMS | |
| US10743414B2 (en) | Resin multilayer substrate and method of manufacturing the same | |
| US20160181004A1 (en) | Embedded coil assembly and production method | |
| CN104965612B (en) | A kind of touch screen mould group and preparation method thereof | |
| CN107529294A (en) | A kind of manufacturing method of PCB and PCB | |
| CN105101625A (en) | Uniform board edge gumming structure for PCB (Printed Circuit Board) inner-layer boards | |
| CN103539366A (en) | Cofferdam type glue sticking process | |
| CN102573336B (en) | The preparation method of multilayer circuit board and for the pressing structure of layers of multilayer circuit board | |
| US20140144685A1 (en) | Printed circuit board with circuit visible and method for manufacturing same | |
| JP2010232230A5 (en) | ||
| CN205029959U (en) | Stromatolite banding structure of high frequency board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |
|
| RJ01 | Rejection of invention patent application after publication |