CN101126883A - 液晶显示装置 - Google Patents
液晶显示装置 Download PDFInfo
- Publication number
- CN101126883A CN101126883A CNA2007101616330A CN200710161633A CN101126883A CN 101126883 A CN101126883 A CN 101126883A CN A2007101616330 A CNA2007101616330 A CN A2007101616330A CN 200710161633 A CN200710161633 A CN 200710161633A CN 101126883 A CN101126883 A CN 101126883A
- Authority
- CN
- China
- Prior art keywords
- liquid crystal
- terminal
- printed circuit
- circuit board
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 65
- 239000010408 film Substances 0.000 claims abstract description 99
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 239000010409 thin film Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000007639 printing Methods 0.000 description 44
- 239000003990 capacitor Substances 0.000 description 35
- 102100036464 Activated RNA polymerase II transcriptional coactivator p15 Human genes 0.000 description 16
- 101000713904 Homo sapiens Activated RNA polymerase II transcriptional coactivator p15 Proteins 0.000 description 16
- 229910004444 SUB1 Inorganic materials 0.000 description 16
- 239000010410 layer Substances 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 229910004438 SUB2 Inorganic materials 0.000 description 6
- 101100311330 Schizosaccharomyces pombe (strain 972 / ATCC 24843) uap56 gene Proteins 0.000 description 6
- 230000005684 electric field Effects 0.000 description 6
- 230000004438 eyesight Effects 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 101150018444 sub2 gene Proteins 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- OSDXSOSJRPQCHJ-XVNBXDOJSA-N methyl 3-(3,4-dihydroxyphenyl)-3-[(E)-3-(3,4-dihydroxyphenyl)prop-2-enoyl]oxypropanoate Chemical compound C=1C=C(O)C(O)=CC=1C(CC(=O)OC)OC(=O)\C=C\C1=CC=C(O)C(O)=C1 OSDXSOSJRPQCHJ-XVNBXDOJSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 102100035712 Serrate RNA effector molecule homolog Human genes 0.000 description 1
- 108010036039 Serrate-Jagged Proteins Proteins 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J41/00—Thermally-insulated vessels, e.g. flasks, jugs, jars
- A47J41/0083—Accessories
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J45/00—Devices for fastening or gripping kitchen utensils or crockery
- A47J45/06—Handles for hollow-ware articles
- A47J45/062—Bowl handles
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J47/00—Kitchen containers, stands or the like, not provided for in other groups of this subclass; Cutting-boards, e.g. for bread
- A47J47/02—Closed containers for foodstuffs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134363—Electrodes characterised by their geometrical arrangement for applying an electric field parallel to the substrate, i.e. in-plane switching [IPS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Thermal Sciences (AREA)
- Food Science & Technology (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP053541/01 | 2001-02-28 | ||
JP2001053541A JP3756418B2 (ja) | 2001-02-28 | 2001-02-28 | 液晶表示装置及びその製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021066116A Division CN100351688C (zh) | 2001-02-28 | 2002-02-28 | 液晶显示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101126883A true CN101126883A (zh) | 2008-02-20 |
CN101126883B CN101126883B (zh) | 2010-07-28 |
Family
ID=18913992
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101616330A Expired - Lifetime CN101126883B (zh) | 2001-02-28 | 2002-02-28 | 液晶显示装置 |
CNB021066116A Expired - Lifetime CN100351688C (zh) | 2001-02-28 | 2002-02-28 | 液晶显示装置 |
CNB2007101616326A Expired - Lifetime CN100478743C (zh) | 2001-02-28 | 2002-02-28 | 液晶显示装置 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021066116A Expired - Lifetime CN100351688C (zh) | 2001-02-28 | 2002-02-28 | 液晶显示装置 |
CNB2007101616326A Expired - Lifetime CN100478743C (zh) | 2001-02-28 | 2002-02-28 | 液晶显示装置 |
Country Status (5)
Country | Link |
---|---|
US (6) | US6961110B2 (zh) |
JP (1) | JP3756418B2 (zh) |
KR (2) | KR100517877B1 (zh) |
CN (3) | CN101126883B (zh) |
TW (1) | TW567383B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107680948A (zh) * | 2016-08-02 | 2018-02-09 | 联咏科技股份有限公司 | 半导体装置、显示面板总成、半导体结构 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100538328B1 (ko) * | 2003-06-20 | 2005-12-22 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 및 그 제조방법 |
JP2005241852A (ja) * | 2004-02-25 | 2005-09-08 | Hitachi Displays Ltd | 表示装置 |
CN100414404C (zh) * | 2005-09-06 | 2008-08-27 | 群康科技(深圳)有限公司 | 电路元件连接结构及液晶显示面板 |
KR101304901B1 (ko) | 2007-01-26 | 2013-09-05 | 삼성디스플레이 주식회사 | 표시 장치 |
JP5091513B2 (ja) * | 2007-03-19 | 2012-12-05 | 株式会社ジャパンディスプレイイースト | 液晶表示装置 |
US8450753B2 (en) * | 2008-09-29 | 2013-05-28 | Sharp Kabushiki Kaisha | Board module and method of manufacturing same |
US9595222B2 (en) | 2012-10-09 | 2017-03-14 | Joled Inc. | Image display apparatus |
US9773450B2 (en) * | 2012-10-17 | 2017-09-26 | Joled Inc. | EL display panel with gate driver circuits mounted on flexible board including terminal connection lines connecting connection parts and control terminals |
US9734757B2 (en) | 2012-10-17 | 2017-08-15 | Joled Inc. | Gate driver integrated circuit, and image display apparatus including the same |
KR20150095988A (ko) * | 2014-02-13 | 2015-08-24 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
CN104951156A (zh) * | 2014-03-31 | 2015-09-30 | 宸盛光电有限公司 | 电容式触控装置 |
US11415844B2 (en) * | 2019-08-14 | 2022-08-16 | Himax Technologies Limited | Liquid crystal display |
CN113012566A (zh) * | 2019-12-19 | 2021-06-22 | 群创光电股份有限公司 | 可挠性显示装置以及其制作方法 |
CN111432552A (zh) * | 2020-03-25 | 2020-07-17 | 西安易朴通讯技术有限公司 | 电路板组件及电子设备 |
Family Cites Families (36)
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US4766426A (en) * | 1985-02-14 | 1988-08-23 | Matsushita Electric Industrial Co., Ltd. | Display panel assembly having a plurality of film carrier tapes on each of which a semiconductor divice is mounted |
JPH05100239A (ja) | 1991-10-09 | 1993-04-23 | Toshiba Corp | 液晶表示装置およびその製造方法 |
JP3205373B2 (ja) * | 1992-03-12 | 2001-09-04 | 株式会社日立製作所 | 液晶表示装置 |
JP2967560B2 (ja) | 1992-04-28 | 1999-10-25 | ソニーケミカル株式会社 | フィルムキャリアの接続構造体 |
JPH05323348A (ja) | 1992-05-22 | 1993-12-07 | Alps Electric Co Ltd | 液晶表示装置及びその製造方法 |
JP2857537B2 (ja) | 1992-05-22 | 1999-02-17 | アルプス電気株式会社 | 液晶表示装置 |
JP3096169B2 (ja) * | 1992-09-11 | 2000-10-10 | 株式会社日立製作所 | 半導体装置 |
JPH07161771A (ja) | 1993-12-02 | 1995-06-23 | Toshiba Corp | フィルムキャリア、電子部品および離型紙剥離方法 |
TW340192B (en) * | 1993-12-07 | 1998-09-11 | Sharp Kk | A display board having wiring with three-layered structure and a display device including the display board |
JPH0878471A (ja) | 1994-08-31 | 1996-03-22 | Toshiba Corp | 半導体パッケ−ジ |
JP3243684B2 (ja) | 1995-09-12 | 2002-01-07 | シャープ株式会社 | デバイスの実装構造 |
JPH09305121A (ja) * | 1996-03-15 | 1997-11-28 | Canon Inc | 回路接続構造、この回路接続構造を有する表示装置及びtcp構造体 |
US6738123B1 (en) | 1996-03-15 | 2004-05-18 | Canon Kabushiki Kaisha | Drive circuit connection structure including a substrate, circuit board, and semiconductor device, and display apparatus including the connection structure |
JPH10261853A (ja) | 1997-03-18 | 1998-09-29 | Seiko Epson Corp | 基板端子の構造およびそれを具備したテープキャリアパッケージ、プリント配線板 |
US6562217B1 (en) * | 1997-04-17 | 2003-05-13 | Sekisui Chemical Co., Ltd. | Method and device for manufacturing conductive particles |
KR100476525B1 (ko) * | 1997-10-15 | 2005-08-29 | 삼성전자주식회사 | 탭아이.시와이를채용한액정표시소자모듈및그제조방법 |
JPH11121893A (ja) * | 1997-10-20 | 1999-04-30 | Canon Inc | 回路接続構造および回路接続方法 |
KR100476524B1 (ko) * | 1997-12-31 | 2005-08-29 | 삼성전자주식회사 | 엘씨디모듈용테이프캐리어패키지 |
JPH11209713A (ja) | 1998-01-20 | 1999-08-03 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
JPH11330154A (ja) | 1998-03-09 | 1999-11-30 | Toshiba Corp | フレキシブル基板およびこれを用いたテープキャリアパッケージとそれらの実装方法 |
JP2000031636A (ja) * | 1998-07-14 | 2000-01-28 | Matsushita Electric Ind Co Ltd | 電子部品実装方法および電子部品実装体 |
US6515729B1 (en) * | 1998-07-29 | 2003-02-04 | Citizen Watch Co., Ltd. | Reflection-type color liquid crystal display device |
KR100297369B1 (ko) * | 1998-08-26 | 2001-08-07 | 윤종용 | 액정표시장치용테이프캐리어패키지 |
JP3139549B2 (ja) * | 1999-01-29 | 2001-03-05 | 日本電気株式会社 | アクティブマトリクス型液晶表示装置 |
JP3826605B2 (ja) * | 1999-03-08 | 2006-09-27 | セイコーエプソン株式会社 | 半導体装置の実装構造の製造方法、液晶装置、および電子機器 |
KR100304261B1 (ko) * | 1999-04-16 | 2001-09-26 | 윤종용 | 테이프 캐리어 패키지, 그를 포함한 액정표시패널 어셈블리,그를 채용한 액정표시장치 및 이들의 조립 방법 |
JP2001007128A (ja) * | 1999-04-22 | 2001-01-12 | Sharp Corp | 基板間の接続方法及び基板間接続装置 |
JP4253931B2 (ja) * | 1999-06-18 | 2009-04-15 | 日立化成工業株式会社 | 電極の接続方法 |
JP2001033762A (ja) * | 1999-07-15 | 2001-02-09 | Toshiba Corp | 平面表示装置 |
KR100699694B1 (ko) * | 2000-02-25 | 2007-03-26 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 |
JP3533519B2 (ja) * | 2000-03-09 | 2004-05-31 | 株式会社アドバンスト・ディスプレイ | Tft基板、フィルムキャリアおよび液晶表示素子の製法 |
JP2001298057A (ja) * | 2000-04-17 | 2001-10-26 | Matsushita Electric Ind Co Ltd | Tcpアウターリード部の電極構造およびtcpを用いた表示装置 |
KR100715942B1 (ko) * | 2000-11-27 | 2007-05-08 | 삼성전자주식회사 | 얼라인미스 개량을 위한 인쇄회로기판의 제조방법 및 이를채용한 액정표시장치 |
JP3781967B2 (ja) * | 2000-12-25 | 2006-06-07 | 株式会社日立製作所 | 表示装置 |
KR100391843B1 (ko) * | 2001-03-26 | 2003-07-16 | 엘지.필립스 엘시디 주식회사 | 액정 표시 장치의 실장 방법 및 그 구조 |
JP4742441B2 (ja) * | 2001-04-16 | 2011-08-10 | 日本電気株式会社 | フレキシブルプリント回路と配線基板との接続構造、その接続方法、液晶表示装置及びその製造方法 |
-
2001
- 2001-02-28 JP JP2001053541A patent/JP3756418B2/ja not_active Expired - Lifetime
-
2002
- 2002-01-31 TW TW091101666A patent/TW567383B/zh not_active IP Right Cessation
- 2002-02-14 US US10/073,967 patent/US6961110B2/en not_active Expired - Lifetime
- 2002-02-22 KR KR10-2002-0009425A patent/KR100517877B1/ko not_active Expired - Fee Related
- 2002-02-28 CN CN2007101616330A patent/CN101126883B/zh not_active Expired - Lifetime
- 2002-02-28 CN CNB021066116A patent/CN100351688C/zh not_active Expired - Lifetime
- 2002-02-28 CN CNB2007101616326A patent/CN100478743C/zh not_active Expired - Lifetime
-
2004
- 2004-03-23 US US10/806,097 patent/US7106408B2/en not_active Expired - Lifetime
-
2005
- 2005-02-11 KR KR10-2005-0011687A patent/KR100510810B1/ko not_active Expired - Fee Related
- 2005-03-10 US US11/075,797 patent/US7352427B2/en not_active Expired - Lifetime
-
2006
- 2006-09-05 US US11/514,960 patent/US7206055B2/en not_active Expired - Lifetime
-
2007
- 2007-09-24 US US11/860,017 patent/US20080024424A1/en not_active Abandoned
-
2009
- 2009-06-10 US US12/481,892 patent/US8300035B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107680948A (zh) * | 2016-08-02 | 2018-02-09 | 联咏科技股份有限公司 | 半导体装置、显示面板总成、半导体结构 |
CN107680948B (zh) * | 2016-08-02 | 2020-05-22 | 联咏科技股份有限公司 | 半导体装置、显示面板总成、半导体结构 |
Also Published As
Publication number | Publication date |
---|---|
TW567383B (en) | 2003-12-21 |
JP3756418B2 (ja) | 2006-03-15 |
CN101126883B (zh) | 2010-07-28 |
KR100517877B1 (ko) | 2005-09-29 |
CN100351688C (zh) | 2007-11-28 |
KR100510810B1 (ko) | 2005-08-26 |
KR20020070632A (ko) | 2002-09-10 |
US6961110B2 (en) | 2005-11-01 |
US7206055B2 (en) | 2007-04-17 |
US20070002254A1 (en) | 2007-01-04 |
US20050162604A1 (en) | 2005-07-28 |
US8300035B2 (en) | 2012-10-30 |
CN1373387A (zh) | 2002-10-09 |
US7352427B2 (en) | 2008-04-01 |
CN100478743C (zh) | 2009-04-15 |
US20080024424A1 (en) | 2008-01-31 |
US20020118332A1 (en) | 2002-08-29 |
US7106408B2 (en) | 2006-09-12 |
CN101131485A (zh) | 2008-02-27 |
KR20050037993A (ko) | 2005-04-25 |
JP2002258311A (ja) | 2002-09-11 |
US20040174486A1 (en) | 2004-09-09 |
US20090251446A1 (en) | 2009-10-08 |
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