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WO2018194099A1 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
WO2018194099A1
WO2018194099A1 PCT/JP2018/016029 JP2018016029W WO2018194099A1 WO 2018194099 A1 WO2018194099 A1 WO 2018194099A1 JP 2018016029 W JP2018016029 W JP 2018016029W WO 2018194099 A1 WO2018194099 A1 WO 2018194099A1
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WIPO (PCT)
Prior art keywords
resin composition
layer
resin
component
mass
Prior art date
Application number
PCT/JP2018/016029
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English (en)
French (fr)
Japanese (ja)
Inventor
秀樹 大山
松村　恵理
栄一 林
Original Assignee
味の素株式会社
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Filing date
Publication date
Application filed by 味の素株式会社 filed Critical 味の素株式会社
Priority to CN201880024025.1A priority Critical patent/CN110494493B/zh
Priority to JP2019513669A priority patent/JP7287274B2/ja
Priority to KR1020197030498A priority patent/KR102500417B1/ko
Publication of WO2018194099A1 publication Critical patent/WO2018194099A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Definitions

  • the present invention relates to a resin composition. Furthermore, the present invention relates to an adhesive film, a cured product, a wiring board with a built-in inductor element, a chip inductor component, and a printed wiring board, which are obtained using the resin composition.
  • Inductor parts include a power supply system and a signal system, and the signal system requires a relative magnetic permeability (permeability) in a region of gigahertz or higher.
  • the adhesive film described in Patent Document 1 is premised on use in a signal system, and has a good relative magnetic permeability in the range of 1 GHz to 3 GHz.
  • the power supply system is required to have a high relative permeability in a lower frequency region than the signal system, and is generally used at a frequency of less than 10 MHz. Therefore, the conventional resin composition is optimized for a frequency of less than 10 MHz or 1 GHz or more.
  • the present inventors have paid attention to a new frequency range of 10 MHz to 200 MHz, and have found that if a high relative permeability can be realized in this frequency range, a new inductor component for a power supply system can be obtained. Obtained.
  • a resin composition as a magnetic layer in the interlayer insulating layer portion of the printed wiring board, it is difficult to warp after forming the magnetic layer, flame retardancy, and lamination Sex etc. are also required.
  • the object of the present invention is to obtain a cured product that is excellent in flame retardancy, suppresses the amount of warpage, and can improve the relative permeability particularly in the frequency range of 10 to 200 MHz.
  • Excellent resin composition To provide an adhesive film, a cured product, a wiring board with a built-in inductor element, a chip inductor component, and a printed wiring board obtained by using the resin composition.
  • a resin composition containing a magnetic filler has a low relative permeability in the frequency range of 10 to 200 MHz, and therefore is suitable for high frequency applications in the range of 1 GHz to 3 GHz or low frequency in the range of 0 to 10 MHz. It was limited to use.
  • the components contained in the resin composition were adjusted so that the elastic modulus at 23 ° C. of the cured product obtained by thermosetting the resin composition containing the magnetic filler was within a predetermined range.
  • the adhesive film obtained using the resin composition is excellent in laminating properties, and the cured product of the resin composition is excellent in flame retardancy and the amount of warpage is suppressed, particularly in the frequency range of 10 to 200 MHz.
  • the inventors have found that the magnetic permeability can be improved and have completed the present invention.
  • the present invention includes the following contents.
  • cured material which heat-cured the resin composition is 7 GPa or more and 18 GPa or less.
  • the component (B) is at least one curing agent selected from a phenolic curing agent and an active ester curing agent.
  • the component (C) is one or more thermoplastic resins selected from phenoxy resins, polyvinyl acetal resins, butyral resins, and acrylic resins having a weight average molecular weight of 30,000 to 1,000,000. [1] -The resin composition in any one of [8].
  • the cured product obtained by thermosetting the resin composition has a relative permeability of 5 to 20 at a frequency of 10 MHz, a relative permeability of 5 to 20 at a frequency of 100 MHz, and a relative permeability at a frequency of 1 GHz.
  • the resin composition according to any one of [1] to [16] which is used for forming a magnetic layer of a wiring board including an inductor element.
  • the resin composition according to [17] wherein the frequency at which the inductor element functions is 10 to 200 MHz.
  • An adhesive film comprising a support and a resin composition layer formed on the support and formed from the resin composition according to any one of [1] to [18].
  • a magnetic layer that is a cured product of the resin composition layer of the adhesive film according to [20], and a conductive structure that is at least partially embedded in the magnetic layer, Inductor element built-in wiring board including the conductive element and an inductor element that extends in the thickness direction of the magnetic layer and is configured by a part of the magnetic layer surrounded by the conductive structure .
  • a cured product that is excellent in flame retardancy, suppresses the amount of warpage, and can improve the relative permeability particularly in the frequency range of 10 to 200 MHz.
  • An excellent resin composition; an adhesive film, a cured product, a wiring board with a built-in inductor element, a chip inductor component, and a printed wiring board, which are obtained using the resin composition, can be provided.
  • FIG. 1 is a schematic plan view of an inductor element built-in wiring board according to the first embodiment as an example as seen from one side in the thickness direction.
  • FIG. 2 is a schematic diagram showing a cut end surface of the inductor element built-in wiring board according to the first embodiment cut at a position indicated by a dashed line II-II as an example.
  • FIG. 3 is a schematic plan view for explaining the configuration of the first wiring layer in the inductor element built-in wiring board according to the first embodiment as an example.
  • FIG. 4 is a schematic cross-sectional view for explaining a method of manufacturing the inductor element built-in wiring board according to the second embodiment as an example.
  • FIG. 5 is an enlarged photograph of the cross section of the resin composition of Example 10.
  • the resin composition of the present invention is a resin composition containing (A) a thermosetting resin, (B) a curing agent, (C) a thermoplastic resin, and (D) a magnetic filler.
  • the heat-cured cured product has an elastic modulus at 23 ° C. of 7 GPa or more and 18 GPa or less.
  • a resin composition containing a magnetic filler has a low relative permeability in a frequency range of 10 to 200 MHz, so that the resin composition is used for a high frequency in a range of 1 GHz to 3 GHz or 0 to 10 MHz. Limited to low frequency applications in the range.
  • the present invention by adjusting the content of the components (A) to (D) contained in the resin composition so that the elastic modulus at 23 ° C.
  • the adhesive film has excellent laminating properties.
  • the resin composition may further contain (E) an inorganic filler other than the magnetic filler, (F) a curing accelerator, (G) a flame retardant, and (H) an organic filler as necessary.
  • E an inorganic filler other than the magnetic filler
  • F a curing accelerator
  • G a flame retardant
  • H an organic filler
  • the resin composition contains (A) a thermosetting resin.
  • A) As a component the thermosetting resin used when forming the insulating layer of a wiring board can be used, and an epoxy resin is especially preferable.
  • the epoxy resin examples include bisphenol A type epoxy resin; bisphenol F type epoxy resin; bisphenol S type epoxy resin; bisphenol AF type epoxy resin; dicyclopentadiene type epoxy resin; trisphenol type epoxy resin; tert-butyl-catechol type epoxy resin; epoxy resin having a condensed ring structure such as naphthol novolac type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin; glycidylamine type epoxy resin; glycidyl ester type epoxy resin Cresol novolac type epoxy resin; biphenyl type epoxy resin (epoxy resin having biphenyl skeleton); linear aliphatic epoxy resin; butadiene structure Alicyclic epoxy resins; heterocyclic epoxy resin; spiro ring-containing epoxy resin; cyclohexanedimethanol type epoxy resins; trimethylol type epoxy resin; tetraphenyl ethane epoxy resins epoxy resin.
  • An epoxy resin may be used individually by 1 type, and may be used in combination of 2 or more type.
  • the epoxy resin is preferably at least one selected from a bisphenol A type epoxy resin, an epoxy resin having a biphenyl skeleton, a naphthalene type epoxy resin, and an epoxy resin having a condensed ring structure, an epoxy resin having a biphenyl skeleton, And more preferably one or more selected from epoxy resins having a condensed ring structure.
  • the epoxy resin preferably contains an epoxy resin having two or more epoxy groups in one molecule. Moreover, it is preferable that an epoxy resin has an aromatic structure, and when using 2 or more types of epoxy resins, it is more preferable that at least 1 type has an aromatic structure.
  • the nonvolatile component of the epoxy resin is 100% by mass, at least 50% by mass or more is preferably an epoxy resin having two or more epoxy groups in one molecule. Among them, it has two or more epoxy groups in one molecule, and has a liquid epoxy resin (hereinafter referred to as “liquid epoxy resin”) at a temperature of 20 ° C.
  • solid epoxy resin a solid epoxy resin
  • the aromatic structure is a chemical structure generally defined as aromatic, and includes polycyclic aromatics and aromatic heterocycles.
  • Liquid epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AF type epoxy resins, naphthalene type epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, phenol novolac type epoxy resins, and ester skeletons.
  • Preferred are cycloaliphatic epoxy resins, cyclohexanedimethanol type epoxy resins, glycidylamine type epoxy resins, and epoxy resins having a butadiene structure.
  • Glycidylamine type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AF Type epoxy resin and naphthalene type epoxy resin are more preferable.
  • liquid epoxy resin examples include “HP4032”, “HP4032D”, “HP4032SS” (naphthalene type epoxy resin) manufactured by DIC, “828US”, “jER828EL” (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation. "JER807” (bisphenol F type epoxy resin), “jER152” (phenol novolak type epoxy resin), “630", “630LSD” (glycidylamine type epoxy resin), “ZX1059” (bisphenol A) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.
  • Type epoxy resin and bisphenol F type epoxy resin “EX-721” (glycidyl ester type epoxy resin) manufactured by Nagase ChemteX, and “Celoxide 2021P” manufactured by Daicel (an alicyclic epoxy having an ester skeleton) resin), “PB-3600” (epoxy resin having a butadiene structure), “ZX1658", “ZX1658GS” (liquid 1,4-glycidylcyclohexane) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., "630LSD” (glycidylamine type epoxy resin manufactured by Mitsubishi Chemical Corporation) And “EP-3980S” (glycidylamine type epoxy resin) manufactured by ADEKA. These may be used alone or in combination of two or more.
  • Solid epoxy resins include naphthalene type tetrafunctional epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, Anthracene type epoxy resin, bisphenol A type epoxy resin, and tetraphenylethane type epoxy resin are preferable, and naphthalene type tetrafunctional epoxy resin, naphthol type epoxy resin, and biphenyl type epoxy resin are more preferable.
  • solid epoxy resin examples include “HP4032H” (naphthalene type epoxy resin), “HP-4700”, “HP-4710” (naphthalene type tetrafunctional epoxy resin), “N-690” (manufactured by DIC).
  • Cresol novolac type epoxy resin “N-695” (cresol novolac type epoxy resin), “HP-7200” (dicyclopentadiene type epoxy resin), “HP-7200HH”, “HP-7200H”, “EXA-7311” ”,“ EXA-7311-G3 ”,“ EXA-7311-G4 ”,“ EXA-7311-G4S ”,“ HP6000 ”(naphthylene ether type epoxy resin),“ EPPN-502H ”(manufactured by Nippon Kayaku Co., Ltd.) Trisphenol type epoxy resin), "NC7000L” (naphthol novolac type epoxy) Fat), “NC3000H”, “NC3000”, “NC3000L”, “NC3100” (biphenyl type epoxy resin), “ESN475V” (naphthalene type epoxy resin), “ESN485” (naphthol novolak type epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co
  • the amount ratio thereof is in a range of 1: 0.1 to 1: 4 by mass ratio. preferable.
  • the quantitative ratio of liquid epoxy resin to solid epoxy resin is 1: 0.3 to 1: 3.5 by mass ratio. Is more preferably in the range of 1: 0.6 to 1: 3, and particularly preferably in the range of 1: 0.8 to 1: 2.5.
  • the content (% by mass) of the component (A) is preferably 0.1 when the nonvolatile component in the resin composition is 100% by mass from the viewpoint of obtaining a magnetic layer exhibiting good mechanical strength and insulation reliability. It is at least 0.5% by mass, more preferably at least 0.5% by mass, even more preferably at least 1% by mass.
  • the upper limit of content of an epoxy resin is not specifically limited as long as the effect of this invention is show
  • the content (% by volume) of the component (A) is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more when the nonvolatile component in the resin composition is 100% by volume. It is. Although an upper limit is not specifically limited as long as the effect of this invention is show
  • the epoxy equivalent of the epoxy resin is preferably 50 to 5000, more preferably 50 to 3000, still more preferably 80 to 2000, and even more preferably 110 to 1000. By being in this range, the crosslink density of the cured product is sufficient, and a magnetic layer having a small surface roughness can be provided.
  • the epoxy equivalent can be measured according to JIS K7236, and is the mass of a resin containing 1 equivalent of an epoxy group.
  • the weight average molecular weight of the epoxy resin is preferably 100 to 5000, more preferably 250 to 3000, and still more preferably 400 to 1500.
  • the weight average molecular weight of the epoxy resin is a weight average molecular weight in terms of polystyrene measured by a gel permeation chromatography (GPC) method.
  • the resin composition contains (B) a curing agent.
  • the component (B) is not particularly limited as long as it has a function of curing the component (A).
  • the curing agent is an epoxy resin curing agent.
  • the epoxy resin curing agent include phenolic curing agents, naphthol curing agents, active ester curing agents, benzoxazine curing agents, and cyanate ester curing agents.
  • curing agent may be used individually by 1 type, or may use 2 or more types together. From the viewpoint of insulating reliability and heat resistance, the curing agent is preferably at least one selected from a phenolic curing agent and an active ester curing agent.
  • a phenol-based curing agent having a novolak structure or a naphthol-based curing agent having a novolak structure is preferable from the viewpoint of heat resistance and water resistance.
  • curing agent is preferable and a triazine frame
  • curing agent is more preferable.
  • a triazine skeleton-containing phenol novolac curing agent is preferable from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion to the conductor layer.
  • phenol-based curing agent and naphthol-based curing agent include “MEH-7700”, “MEH-7810”, “MEH-7785” manufactured by Meiwa Kasei Co., Ltd., “NHN”, “CBN” manufactured by Nippon Kayaku Co., Ltd.
  • the active ester curing agent is not particularly limited, but generally an ester group having high reaction activity such as phenol ester, thiophenol ester, N-hydroxyamine ester, heterocyclic hydroxy compound ester in one molecule.
  • a compound having two or more in the above is preferably used.
  • the active ester curing agent is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound.
  • an active ester curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable.
  • the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.
  • phenol compound or naphthol compound examples include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m- Cresol, p-cresol, catechol, ⁇ -naphthol, ⁇ -naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, Benzenetriol, dicyclopentadiene type diphenol compound, phenol novolac and the like can be mentioned.
  • the “dicyclopentadiene type diphenol compound” refers to a diphenol compound obtained by condensing two molecules of phenol with one molecule of dicyclopentadiene.
  • an active ester compound containing a dicyclopentadiene-type diphenol structure an active ester compound containing a naphthalene structure, an active ester compound containing an acetylated product of a phenol novolac, and an active ester compound containing a benzoylated product of a phenol novolac are preferred, Of these, active ester compounds having a naphthalene structure and active ester compounds having a dicyclopentadiene type diphenol structure are more preferred.
  • the “dicyclopentadiene type diphenol structure” represents a divalent structure composed of phenylene-dicyclopentylene-phenylene.
  • active ester curing agents include “EXB9451”, “EXB9460”, “EXB9460S”, “HPC-8000-65T”, “HPC-8000H— as active ester compounds containing a dicyclopentadiene type diphenol structure.
  • benzoxazine-based curing agent examples include “HFB2006M” manufactured by Showa Polymer Co., Ltd. and “Pd” and “Fa” manufactured by Shikoku Kasei Kogyo Co., Ltd.
  • cyanate ester curing agent examples include bisphenol A dicyanate, polyphenol cyanate, oligo (3-methylene-1,5-phenylene cyanate), 4,4′-methylenebis (2,6-dimethylphenyl cyanate), 4,4 '-Ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis (4-cyanate) phenylpropane, 1,1-bis (4-cyanatephenylmethane), bis (4-cyanate-3,5-dimethyl) Bifunctional cyanate resins such as phenyl) methane, 1,3-bis (4-cyanatephenyl-1- (methylethylidene)) benzene, bis (4-cyanatephenyl) thioether, and bis (4-cyanatephenyl) ether, phenol Novolac and Polyfunctional cyanate resin derived from resol novolac, these cyanate resins and partially triazine of prepolymer.
  • cyanate ester curing agent examples include “PT30” and “PT60” (both phenol novolac polyfunctional cyanate ester resins), “BA230”, “BA230S75” (part of bisphenol A dicyanate) manufactured by Lonza Japan. Or a prepolymer which is all triazine-modified into a trimer).
  • the amount ratio between the epoxy resin and the curing agent is a ratio of [total number of epoxy groups of the epoxy resin]: [total number of reactive groups of the curing agent] and should be in the range of 1: 0.2 to 1: 2. Is more preferable, and the range of 1: 0.3 to 1: 1.5 is more preferable, and the range of 1: 0.4 to 1: 1 is more preferable.
  • the reactive group of the curing agent is an active hydroxyl group, an active ester group or the like, and varies depending on the type of the curing agent.
  • the total number of epoxy groups of the epoxy resin is a value obtained by totaling the values obtained by dividing the mass of the nonvolatile component of each epoxy resin by the epoxy equivalent for all epoxy resins
  • the total number of reactive groups of the curing agent is The value obtained by dividing the mass of the non-volatile component of each curing agent by the reactive group equivalent is the total value for all curing agents.
  • the resin composition may include a mixture of a liquid epoxy resin and a solid epoxy resin as an epoxy resin, and at least one selected from the group consisting of a phenolic curing agent and an active ester curing agent as a curing agent. preferable.
  • the content of the component (B) is preferably 5% by mass or less, more preferably 3% by mass or less, and still more preferably 2% by mass or less when the nonvolatile component in the resin composition is 100% by mass.
  • the lower limit is not particularly limited but is preferably 0.1% by mass or more.
  • Thermoplastic resin contains (C) a thermoplastic resin.
  • C) By containing a component, an elasticity modulus can be reduced and curvature can be reduced.
  • thermoplastic resin examples include phenoxy resin, acrylic resin, polyvinyl acetal resin, butyral resin, polyimide resin, polyamide imide resin, polyether sulfone resin, and polysulfone resin. Phenoxy resin, polyvinyl acetal resin, butyral resin And at least one selected from acrylic resins.
  • a thermoplastic resin may be used individually by 1 type, or may use 2 or more types together.
  • the weight average molecular weight in terms of polystyrene of the thermoplastic resin is preferably 30,000 or more, more preferably 50,000 or more, and even more preferably 100,000 or more. Further, it is preferably 1 million or less, more preferably 750,000 or less, and further preferably 500,000 or less.
  • the weight average molecular weight in terms of polystyrene of the thermoplastic resin is measured by a gel permeation chromatography (GPC) method.
  • GPC gel permeation chromatography
  • the polystyrene-reduced weight average molecular weight of the thermoplastic resin is “LC-9A / RID-6A” manufactured by Shimadzu Corporation as a measuring device, and “Shodex K-800P / K-804L” manufactured by Showa Denko KK as a column. / K-804L ”can be calculated using a standard polystyrene calibration curve by measuring the column temperature at 40 ° C. using chloroform or the like as the mobile phase.
  • phenoxy resin examples include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenolacetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene
  • the terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group.
  • a phenoxy resin may be used individually by 1 type, or may use 2 or more types together.
  • Specific examples of the phenoxy resin include “1256” and “4250” (both bisphenol A skeleton-containing phenoxy resin), “YX8100” (bisphenol S skeleton-containing phenoxy resin), and “YX6954” (bisphenolacetophenone) manufactured by Mitsubishi Chemical Corporation.
  • “FX280” and “FX293” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. “YL7500BH30”, “YX6954BH30”, “YX7553”, “YX7553BH30”, “YL7769BH30” manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd. ”,“ YL6794 ”,“ YL7213 ”,“ YL7290 ”,“ YL7482 ”, and the like.
  • the acrylic resin is preferably a functional group-containing acrylic resin, more preferably an epoxy group-containing acrylic resin having a glass transition temperature of 25 ° C. or less, from the viewpoint of further reducing the thermal expansion coefficient and the elastic modulus.
  • the number average molecular weight (Mn) of the functional group-containing acrylic resin is preferably 10,000 to 1,000,000, more preferably 30,000 to 900,000.
  • the functional group equivalent of the functional group-containing acrylic resin is preferably 1000 to 50000, more preferably 2500 to 30000.
  • an epoxy group-containing acrylate copolymer resin having a glass transition temperature of 25 ° C. or lower is preferable. Specific examples thereof include “SG” manufactured by Nagase ChemteX Corporation.
  • polyvinyl acetal resin and butyral resin include electric butyral “4000-2”, “5000-A”, “6000-C”, “6000-EP” manufactured by Denki Kagaku Kogyo Co., Ltd., manufactured by Sekisui Chemical Co., Ltd.
  • Examples include ESREC BH series, BX series, KS series such as “KS-1”, BL series such as “BL-1”, and BM series.
  • polyimide resins include “Rika Coat SN20” and “Rika Coat PN20” manufactured by Shin Nippon Rika Co., Ltd.
  • Specific examples of the polyimide resin also include a linear polyimide obtained by reacting a bifunctional hydroxyl group-terminated polybutadiene, a diisocyanate compound and a tetrabasic acid anhydride (polyimide described in JP-A-2006-37083), a polysiloxane skeleton.
  • modified polyimides such as containing polyimide (polyimides described in JP-A Nos. 2002-12667 and 2000-319386).
  • polyamideimide resin examples include “Bilomax HR11NN” and “Vilomax HR16NN” manufactured by Toyobo.
  • polyamide-imide resin examples include modified polyamide-imides such as “KS9100” and “KS9300” (polysiloxane skeleton-containing polyamideimide) manufactured by Hitachi Chemical.
  • polyethersulfone resin examples include “PES5003P” manufactured by Sumitomo Chemical Co., Ltd.
  • polyphenylene ether resin include an oligophenylene ether / styrene resin “OPE-2St 1200” having a vinyl group manufactured by Mitsubishi Gas Chemical Company.
  • polysulfone resin examples include polysulfone “P1700” and “P3500” manufactured by Solvay Advanced Polymers.
  • thermoplastic resin is preferably at least one selected from phenoxy resins, polyvinyl acetal resins, butyral resins, and acrylic resins having a weight average molecular weight of 30,000 to 1,000,000.
  • the content (c1) of the component (C) is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, and still more preferably 0 when the nonvolatile component in the resin composition is 100% by mass. .3% by mass or more. Moreover, Preferably it is 10 mass% or less, More preferably, it is 9 mass% or less, More preferably, it is 8 mass% or less. By setting the content of the component (C) within such a range, the viscosity of the resin composition becomes appropriate, and a uniform resin composition layer having a thickness and a bulk property can be formed.
  • the content of the component (C) is such that (c1 / a1) ⁇ 100 is preferably 35 or more.
  • the amount is preferably adjusted, more preferably 45 or more, still more preferably 55 or more, 65 or more, or 70 or more.
  • the upper limit is preferably 80 or less, more preferably 78 or less, and still more preferably 77 or less.
  • the adhesive film obtained using the resin composition has excellent laminating properties.
  • the “resin component” means a component excluding the component (D) and the component (E) among the non-volatile components constituting the resin composition.
  • the resin composition contains (D) a magnetic filler.
  • the material of the magnetic filler is not particularly limited.
  • Fe-Si alloy powder Fe-Si-Al alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Ni-Cr alloy powder, Fe alloys containing at least one element selected from Si, Al, and Cr, such as Fe—Cr—Al alloy powder, are preferable.
  • Magnetic filler can be used as the magnetic filler.
  • Specific examples of commercially available magnetic fillers that can be used include “PST-S” manufactured by Sanyo Special Steel Co., Ltd., “AW2-08”, “AW2-08PF20F”, “AW2-08PF10F”, “AW2-” manufactured by Epson Atmix. 08PF3F “,” Fe-3.5Si-4.5CrPF20F “,” Fe-50NiPF20F “,” Fe-80Ni-4MoPF20F “,” LD-M “,” LD-MH “,” KNI-106 "manufactured by JFE Chemical Co., Ltd.
  • KNI-106GSM “KNI-106GS”, “KNI-106GS”, “KNI-109”, “KNI-109GSM”, “KNI-109GS”, “KNS-415”, “BSF-547”, “BSF-” manufactured by Toda Kogyo Co., Ltd.
  • a magnetic filler may be used individually by 1 type, or may use 2 or more types together.
  • the component (D) is preferably spherical.
  • the value (aspect ratio) obtained by dividing the long side length of the powder of component (D) by the short side length is preferably 2 or less, more preferably 1.5 or less, and even more preferably 1.2 or less. It is. In general, it is easier to improve the relative magnetic permeability when the magnetic filler has a flat shape that is not spherical. However, in order to achieve a predetermined elastic modulus by combining the components (A) to (C), it is easier to obtain a resin composition having desired characteristics, particularly when the spherical component (D) is used. Can do.
  • the average particle diameter of the component (D) is preferably 0.01 ⁇ m or more, more preferably 0.5 ⁇ m or more, and further preferably 1 ⁇ m or more. Further, it is preferably 8 ⁇ m or less, more preferably 5 ⁇ m or less, and further preferably 4 ⁇ m or less.
  • the average particle diameter of a component can be measured by the method similar to the average particle diameter of the (E) component mentioned later.
  • the relative magnetic permeability when using a magnetic filler having an average particle diameter exceeding 25 ⁇ m is used when the frequency is 0 to 10 MHz. Somewhat inferior. However, even if the frequency exceeds 10 MHz, the relative permeability does not rapidly decrease, and a high relative permeability can be maintained in the range of 0 to 200 MHz. That is, the magnetic loss is usually reduced while maintaining a high relative permeability in a wide range of 0 to 200 MHz, particularly 10 MHz to 200 MHz.
  • the content (% by volume) of component (D) is preferably 10% by volume or more, more preferably 100% by volume or more, more preferably from the viewpoint of improving the relative magnetic permeability and flame retardancy. Is 20% by volume or more, more preferably 30% by volume or more. Moreover, it is preferably 85% by volume or less, more preferably 75% by volume or less, and still more preferably 65% by volume or less.
  • the content (mass%: d1) of the component (D) is preferably 75 mass% or more when the nonvolatile component in the resin composition is 100 mass% from the viewpoint of improving the relative magnetic permeability and flame retardancy. More preferably, it is 76 mass% or more, More preferably, it is 77 mass% or more. Further, it is preferably less than 95% by mass, more preferably 94% by mass or less, and further preferably 93% by mass or less.
  • the active ester curing agent is used as the component (B) and / or when the acrylic resin is used as the component (C)
  • the compatibility of the components (A) to (C) may be lowered.
  • the resin composition forms a sea-island structure composed of a matrix phase (sea) and a dispersed phase (island), and the component (D) may be unevenly distributed on the matrix phase side.
  • the matrix phase is preferably a mixed component of component (A) and component (B)
  • the dispersed phase is preferably component (C).
  • a frequency of 10 MHz to The relative magnetic permeability can be 5 or more when the frequency is 200 MHz, particularly 10 MHz to 100 MHz, and the magnetic loss can be usually 0.05 or less when the frequency is 10 MHz to 100 MHz.
  • the resin composition may contain (E) an inorganic filler other than the magnetic filler.
  • E an inorganic filler other than the magnetic filler.
  • the material of component (E) is not particularly limited as long as it is an inorganic compound.
  • Examples include bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate.
  • silica is particularly preferred.
  • examples of the silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica.
  • spherical silica is preferable as the silica.
  • a component may be used individually by 1 type and may be used in combination of 2 or more type.
  • the average particle diameter of the inorganic filler is preferably 0.01 ⁇ m in order to improve the fluidity and moldability of the resin composition, and to improve the relative magnetic permeability and magnetic loss when cured, and the initial resistance value. Above, more preferably 0.05 ⁇ m or more, still more preferably 0.1 ⁇ m or more, 0.3 ⁇ m or more. Further, it is preferably 5 ⁇ m or less, more preferably 2.5 ⁇ m or less, further preferably 1.5 ⁇ m or less, and 1 ⁇ m or less.
  • the average particle diameter of the inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory.
  • the particle size distribution of the inorganic filler can be prepared on a volume basis by a laser diffraction / scattering particle size distribution measuring apparatus, and the median diameter can be measured as the average particle diameter.
  • an inorganic filler dispersed in methyl ethyl ketone by ultrasonic waves can be preferably used.
  • a laser diffraction / scattering particle size distribution measuring apparatus “LA-500” manufactured by Horiba, Ltd., “SALD-2200” manufactured by Shimadzu, etc. can be used.
  • Inorganic fillers are fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes from the viewpoint of improving moisture resistance and dispersibility. It is preferably treated with one or more surface treatment agents such as an organosilazane compound and a titanate coupling agent. Examples of commercially available surface treatment agents include “KBM403” (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., “KBM803” (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu.
  • “KBE903” (3-aminopropyltriethoxysilane) manufactured by Chemical Industry Co., Ltd.
  • “KBM573” N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.
  • “SZ-31” manufactured by Shin-Etsu Chemical Co., Ltd. ( Hexamethyldisilazane)
  • “KBM103” phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.
  • “KBM-4803” long-chain epoxy silane coupling agent) manufactured by Shin-Etsu Chemical Co., Ltd.
  • the degree of the surface treatment with the surface treatment agent is surface-treated with 0.2 to 5 parts by mass of the surface treatment agent with respect to 100 parts by mass of the inorganic filler from the viewpoint of improving the dispersibility of the inorganic filler. It is preferable that the surface treatment is performed at 0.2 to 3 parts by mass, and it is preferable that the surface treatment is performed at 0.3 to 2 parts by mass.
  • the degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler.
  • Carbon content per unit surface area of the inorganic filler from the viewpoint of improving dispersibility of the inorganic filler is preferably 0.02 mg / m 2 or more, 0.1 mg / m 2 or more preferably, 0.2 mg / m 2 The above is more preferable.
  • 1 mg / m 2 or less is preferable, 0.8 mg / m 2 or less is more preferable, and 0.5 mg / m 2 or less is more preferable from the viewpoint of suppressing an increase in the melt viscosity of the resin varnish and the sheet form. preferable.
  • the amount of carbon per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with the surface treatment agent and ultrasonically cleaned at 25 ° C. for 5 minutes. After removing the supernatant and drying the solid, the carbon amount per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, “EMIA-320V” manufactured by HORIBA, Ltd. can be used.
  • EMIA-320V manufactured by HORIBA, Ltd.
  • the content (mass%: e1) of the component (E) is a viewpoint that improves the insulation reliability and flame retardancy when the resin composition is a cured product. Therefore, when the non-volatile component in the resin composition is 100% by mass, it is preferably 1% by mass or more, more preferably 1.5% by mass or more, and further preferably 2% by mass or more. Further, it is preferably 25% by mass or less, more preferably 20% by mass or less, and further preferably 15% by mass or less.
  • the content (volume%) of the component (E) is preferably 1% by volume or more, more preferably 3% by volume or more, and further preferably 5% by volume or more.
  • the upper limit is preferably 30% by volume or less, more preferably 25% by volume or less, and still more preferably 20% by volume or less.
  • E1 / d1 is preferably 0 from the viewpoints of making the relative permeability and magnetic loss in the range of 10 to 200 MHz in a favorable range, suppressing the thermal expansion of the magnetic layer, and improving the reliability. 0.02 or more, more preferably 0.025 or more, and still more preferably 0.03 or more.
  • the upper limit is preferably 0.19 or less, more preferably 0.185 or less, and more preferably 0.18 or less.
  • the average particle size of the component (E) is preferably smaller than the average particle size of the component (D). If the content ratio of the component (D) and the component (E) is as described above, and the average particle size of the component (E) is smaller than the average particle size of the component (D), the magnetic filler particles are surrounded. Thus, the inorganic filler can be effectively arranged. As a result, the magnetic filler particles can be prevented from aggregating and coming into contact with each other, and the magnetic filler particles can be separated from each other. Can be realized.
  • the resin composition may contain (F) a curing accelerator.
  • the curing accelerator include a phosphorus-based curing accelerator, an amine-based curing accelerator, an imidazole-based curing accelerator, a guanidine-based curing accelerator, a metal-based curing accelerator, and the like.
  • a curing accelerator, an imidazole curing accelerator, and a metal curing accelerator are preferable, and an imidazole curing accelerator is more preferable.
  • a hardening accelerator may be used individually by 1 type, and may be used in combination of 2 or more type.
  • Examples of phosphorus curing accelerators include triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, and (4-methylphenyl) triphenylphosphonium thiocyanate.
  • Tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate and the like, and triphenylphosphine and tetrabutylphosphonium decanoate are preferable.
  • amine curing accelerators examples include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6, -tris (dimethylaminomethyl) phenol, and 1,8-diazabicyclo. (5,4,0) -undecene and the like, and 4-dimethylaminopyridine and 1,8-diazabicyclo (5,4,0) -undecene are preferable.
  • imidazole curing accelerator examples include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl- -Phenylimidazolium trimellitate, 2,4
  • imidazole curing accelerator Commercially available products may be used as the imidazole curing accelerator, and examples thereof include “P200-H50” manufactured by Mitsubishi Chemical Corporation.
  • guanidine curing accelerator examples include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, Tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] dec-5-ene, 7-methyl-1,5,7-triazabicyclo [4.4.0] Deca-5-ene, 1-methyl biguanide, 1-ethyl biguanide, 1-n-butyl biguanide, 1-n-octadecyl biguanide, 1,1-dimethyl biguanide, 1,1-diethyl biguanide, 1-cyclohexyl biguanide, 1 -Allyl biguanide, 1-phenyl biguanide, 1- o- tolyl) biguanide
  • the metal-based curing accelerator examples include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin.
  • organometallic complex examples include organic cobalt complexes such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, organic copper complexes such as copper (II) acetylacetonate, and zinc (II) acetylacetonate.
  • Organic zinc complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, and organic manganese complexes such as manganese (II) acetylacetonate.
  • organic metal salt include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.
  • the content of the curing accelerator is preferably 0.001% by mass to 1% by mass when the non-volatile component in the resin composition is 100% by mass, 0.001 More preferred is from 0.1% by weight to 0.1% by weight, and even more preferred is 0.005% by weight to 0.05% by weight.
  • the resin composition may contain (G) a flame retardant.
  • the flame retardant include an organic phosphorus flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a silicone flame retardant, and a metal hydroxide.
  • a flame retardant may be used individually by 1 type, or may use 2 or more types together.
  • flame retardant commercially available products may be used, and examples thereof include “HCA-HQ” manufactured by Sanko Co., Ltd. and “PX-200” manufactured by Daihachi Chemical Industry Co., Ltd.
  • a flame retardant may be used individually by 1 type, or may use 2 or more types together.
  • the content of the flame retardant is preferably in the range of 0.5% by mass to 10% by mass when the nonvolatile component in the resin composition is 100% by mass, The range is more preferably 1% by mass to 9% by mass, and still more preferably 1.5% by mass to 8% by mass.
  • the resin composition may contain (H) an organic filler.
  • the organic filler include rubber particles.
  • rubber particles that are organic fillers for example, rubber particles that are not soluble in the organic solvent described later and are not compatible with the components (A) to (C) are used.
  • Such rubber particles are generally prepared by increasing the molecular weight of the rubber particle components to such an extent that they do not dissolve in organic solvents or resins, and making them into particles.
  • Examples of rubber particles that are organic fillers include core-shell type rubber particles, cross-linked acrylonitrile butadiene rubber particles, cross-linked styrene butadiene rubber particles, and acrylic rubber particles.
  • the core-shell type rubber particles are rubber particles having a core layer and a shell layer.
  • a two-layer structure in which an outer shell layer is made of a glassy polymer and an inner core layer is made of a rubbery polymer or Examples thereof include a rubber particle having a three-layer structure in which an outer shell layer is made of a glassy polymer, an intermediate layer is made of a rubbery polymer, and an inner core layer is made of a glassy polymer.
  • the glassy polymer layer is made of, for example, methyl methacrylate polymer
  • the rubbery polymer layer is made of, for example, butyl acrylate polymer (butyl rubber).
  • examples of rubber particles that can be used include “STAPHYLOID AC3816N” manufactured by Ganz. A rubber particle may be used individually by 1 type, or may use 2 or more types together.
  • the average particle diameter of the rubber particles as the organic filler is preferably in the range of 0.005 ⁇ m to 1 ⁇ m, more preferably in the range of 0.2 ⁇ m to 0.6 ⁇ m.
  • the average particle diameter of the rubber particles can be measured using a dynamic light scattering method. For example, rubber particles are uniformly dispersed in an appropriate organic solvent by ultrasonic waves, etc., and a particle size distribution of the rubber particles is created on a mass basis using a concentrated particle size analyzer (“FPAR-1000” manufactured by Otsuka Electronics Co., Ltd.). The median diameter can be measured by setting it as the average particle diameter.
  • the content of the organic filler is preferably 0.1 to 20% by mass, and preferably 0.2 to 10% when the nonvolatile component in the resin composition is 100% by mass. % By mass is more preferable, and 0.3 to 5% by mass, or 0.5 to 3% by mass is more preferable.
  • the resin composition may further contain other additives as necessary.
  • other additives include organic copper compounds, organic zinc compounds, and organic cobalt compounds.
  • organic additives such as thickeners, antifoaming agents, leveling agents, adhesion-imparting agents, and color additives.
  • the elastic modulus at 23 ° C. of a cured product obtained by thermosetting the resin composition of the present embodiment is 7 GPa or more, preferably 7.5 GPa or more, more preferably 8 GPa or more.
  • an upper limit is 18 GPa or less, Preferably it is 17 GPa or less, More preferably, it is 16 GPa or less.
  • the adhesive film obtained using the resin composition has excellent laminating properties.
  • the elastic modulus can be set within such a range by adjusting the components (A) to (D).
  • the elastic modulus can be measured according to the method described in ⁇ Measurement of Elastic Modulus> described later.
  • a cured product obtained by thermosetting the resin composition (for example, a cured product obtained by thermosetting at 180 ° C. for 90 minutes) has a characteristic of high relative permeability at a frequency of 10 MHz.
  • the relative permeability at a frequency of 10 MHz is preferably 5 or more, more preferably 6 or more, and even more preferably 7 or more. Moreover, Preferably it is 20 or less, More preferably, it is 18 or less, More preferably, it is 15 or less.
  • the relative permeability can be measured according to the method described in ⁇ Measurement of relative permeability and magnetic loss> described later.
  • a cured product obtained by thermosetting the resin composition (for example, a cured product obtained by thermosetting at 180 ° C. for 90 minutes) has a characteristic of high relative permeability at a frequency of 100 MHz.
  • the relative permeability at a frequency of 100 MHz is preferably 5 or more, more preferably 6 or more, and even more preferably 7 or more.
  • the cured product obtained by thermosetting the resin composition may have a low relative permeability at a frequency of 1 GHz.
  • the relative permeability at a frequency of 1 GHz is preferably 4 or more, more preferably 5 or more, and still more preferably 6 or more. Moreover, it is preferably 16 or less, more preferably 15 or less, and still more preferably 14 or less.
  • the cured product obtained by thermally curing the resin composition may have a low relative magnetic permeability at a frequency of 3 GHz.
  • the relative magnetic permeability at a frequency of 3 GHz is preferably 2 or more, more preferably 3 or more, and further preferably 4 or more.
  • it is 10 or less, More preferably, it is 9 or less, More preferably, it is 8 or less.
  • a cured product obtained by thermosetting a resin composition exhibits a characteristic that magnetic loss at a frequency of 10 MHz is low.
  • the magnetic loss at a frequency of 10 MHz is preferably 0.05 or less, more preferably 0.04 or less, and still more preferably 0.03 or less.
  • the lower limit is not particularly limited, but may be 0.0001 or more.
  • the magnetic loss can be measured according to the method described in ⁇ Measurement of relative permeability and magnetic loss> described later.
  • a cured product obtained by thermosetting the resin composition (for example, a cured product obtained by thermosetting at 180 ° C. for 90 minutes) has a characteristic that magnetic loss at a frequency of 100 MHz is low.
  • the magnetic loss at a frequency of 100 MHz is preferably 0.05 or less, more preferably 0.04 or less, and still more preferably 0.03 or less.
  • the lower limit is not particularly limited, but may be 0.0001 or more.
  • a cured product obtained by thermosetting the resin composition exhibits a characteristic that the amount of warpage is reduced.
  • the amount of warp is preferably 10 mm or less, more preferably 9 mm or less, and still more preferably 8 mm or less.
  • the upper limit is not particularly limited, but may be 0.1 mm or more.
  • the amount of warpage can be measured according to the method described in ⁇ Measurement of warpage amount> described later.
  • a cured product obtained by thermosetting the resin composition exhibits excellent flame retardancy.
  • flame retardancy it is preferable that the UL94 vertical flame retardant test is performed 5 times, and there are five unburned samples after 10 seconds of indirect flame. The evaluation of flame retardancy can be measured according to the method described in ⁇ Flame retardance evaluation> described later.
  • the resin composition of this embodiment is excellent in fluidity when forming a magnetic layer, and excellent in sealing performance of a wiring layer when it is used as a magnetic layer (cured product). Further, if the magnetic layer formed using the resin composition of the present invention is formed, the relative permeability in the frequency range of 10 MHz to 200 MHz, particularly the frequency range of 10 MHz to 100 MHz can be improved, and the magnetic loss can be reduced. it can. Moreover, the magnetic layer (cured product) obtained by thermosetting the resin composition of the present embodiment is also excellent in insulation.
  • the resin composition of the present embodiment has a magnetic property of a wiring board including an inductor element having a so-called film structure in which a coil is formed within the thickness of a magnetic layer (a magnetic body portion in which a plurality of magnetic layers are laminated). It can be suitably used as the material of the layer, and can be more suitably used particularly when the frequency at which the inductor element functions is 10 MHz to 200 MHz.
  • the cured product of the present invention is obtained by thermally curing the resin composition of the present invention.
  • the cured product of the present invention has an elastic modulus at 23 ° C. of 7 GPa or more and 18 GPa or less when thermally cured at 180 ° C. for 90 minutes, and the preferred range is as described above.
  • thermosetting conditions of the resin composition are not particularly limited, and for example, the conditions of the thermosetting process in the first magnetic layer forming process described later may be used. Moreover, you may preheat at the temperature lower than thermosetting temperature before making it thermoset.
  • the thickness of the cured product varies depending on the application, but when used as the magnetic layer of the inductor element built-in wiring board, it is preferably 100 ⁇ m or less, more preferably 80 ⁇ m or less, still more preferably 60 ⁇ m or less, and even more preferably 40 ⁇ m or less. is there. Although the minimum of the thickness of hardened
  • the adhesive film of the present invention includes a support and a resin composition layer formed of the resin composition of the present invention provided on the support.
  • the thickness of the resin composition layer is not particularly limited.
  • the resin composition layer preferably has a thickness of 0.5 ⁇ m to 80 ⁇ m, and more preferably 10 ⁇ m to 60 ⁇ m.
  • Examples of the support include a film made of a plastic material, a metal foil, and release paper, and a film made of a plastic material and a metal foil are preferable.
  • plastic material having a high glass transition temperature examples include polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”), polyethylene naphthalate (hereinafter sometimes abbreviated as “PEN”), and the like.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PC polycarbonate
  • acrylic such as polymethyl methacrylate (PMMA)
  • PMMA polymethyl methacrylate
  • TAC triacetyl cellulose
  • PES polyether sulfide
  • polyimide etc. Is mentioned.
  • polyethylene terephthalate, polyethylene naphthalate, and polyimide are preferable, and inexpensive polyethylene terephthalate is particularly preferable.
  • examples of the metal foil include a copper foil and an aluminum foil, and a copper foil is preferable.
  • a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.). It may be used.
  • the support may be subjected to mat treatment or corona treatment on the surface to be bonded to the resin composition layer.
  • a support with a release layer having a release layer on the surface to be bonded to the resin composition layer may be used.
  • the release agent used for the release layer of the support with a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. .
  • SK-1 SK-1
  • PET film having a release layer mainly composed of an alkyd resin release agent AL-5 "," AL-7 “,” Lumirror T60 "manufactured by Toray Industries,” Purex “manufactured by Teijin Ltd.,” Unipeel “manufactured by Unitika, and the like.
  • the thickness of the support is not particularly limited, but is preferably in the range of 5 ⁇ m to 75 ⁇ m, and more preferably in the range of 10 ⁇ m to 60 ⁇ m.
  • the thickness of the whole support body with a release layer is the said range.
  • the resin composition used in the resin composition layer is prepared by appropriately mixing the above-described components, and, if necessary, kneading means (three rolls, ball mill, bead mill, sand mill, etc.) or stirring means (super mixer, planetary) It can be prepared by kneading or mixing with a Lee mixer or the like.
  • the production method of the adhesive film having the resin composition layer is not particularly limited.
  • a resin varnish in which the resin composition is dissolved in an organic solvent is prepared, and this resin varnish is applied to a support using a die coater or the like. And it can produce by drying the coating film of the apply
  • organic solvent examples include ketones such as acetone, methyl ethyl ketone and cyclohexanone, acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate, and carbitols such as cellosolve and butyl carbitol.
  • ketones such as acetone, methyl ethyl ketone and cyclohexanone
  • acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate, and carbitols such as cellosolve and butyl carbitol.
  • Aromatic hydrocarbons such as toluene and xylene
  • amide solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone.
  • Drying may be performed by a known method such as heating or hot air blowing.
  • the drying conditions are not particularly limited, but the drying is performed so that the content of the organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less.
  • the boiling point of the organic solvent in the resin varnish for example, when using a resin varnish containing 30% by mass to 60% by mass of the organic solvent, for example, by drying at 80 ° C. to 150 ° C. for 3 minutes to 15 minutes.
  • a resin composition layer can be formed.
  • a protective film according to the support can be further laminated on the surface of the resin composition layer that is not bonded to the support (that is, the surface opposite to the support).
  • the thickness of the protective film is not particularly limited, but is, for example, 1 ⁇ m to 40 ⁇ m.
  • the adhesive film of the present invention has a component (A) such that the elastic modulus at 23 ° C. of a cured product obtained by thermosetting the resin composition (for example, a cured product thermally cured at 180 ° C. for 90 minutes) is 7 GPa or more and 18 GPa or less. Since the content of the component (D) is adjusted, it exhibits excellent laminating properties. Even if the adhesive film is laminated on the wiring board, there is usually no void in the circuit portion of the wiring board, and the resin composition derived from the adhesive film is sufficiently flowing.
  • a component (A) such that the elastic modulus at 23 ° C. of a cured product obtained by thermosetting the resin composition (for example, a cured product thermally cured at 180 ° C. for 90 minutes) is 7 GPa or more and 18 GPa or less. Since the content of the component (D) is adjusted, it exhibits excellent laminating properties. Even if the adhesive film is laminated on the wiring board, there is usually no void in
  • FIG. 1 is a schematic plan view of a wiring board with a built-in inductor element as viewed from one side in the thickness direction.
  • FIG. 2 is a schematic diagram showing a cut end face of the inductor element built-in wiring board cut at a position indicated by a dashed line II-II.
  • FIG. 3 is a schematic plan view for explaining the configuration of the first wiring layer in the inductor element built-in wiring board.
  • the inductor element built-in wiring board may be simply referred to as “wiring board”.
  • the wiring board has a magnetic layer that is a cured body of the resin composition (resin composition layer), and a conductive structure at least partially embedded in the magnetic layer, and the conductive structure;
  • the inductor element includes a part of the magnetic layer extending in the thickness direction of the magnetic layer and surrounded by the conductive structure.
  • the frequency at which the inductor element included in the wiring board of the present embodiment can function is assumed to be 10 MHz to 200 MHz.
  • a power supply system is assumed for the inductor element provided in the wiring board of the present embodiment.
  • the wiring board 10 is a build-up wiring board having a build-up magnetic layer.
  • the wiring board 10 includes a core substrate 20.
  • the core substrate 20 has a first main surface 20a and a second main surface 20b opposite to the first main surface 20a.
  • the core base material 20 is an insulating substrate.
  • the core base material 20 may be an inner layer circuit board in which wiring or the like is formed within the thickness.
  • Examples of the material of the core base material 20 include insulating base materials such as a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate.
  • the core substrate 20 has a first wiring layer 42 provided on the first main surface 20a and an external terminal 24 provided on the second main surface 20b.
  • the first wiring layer 42 and the second wiring layer 44 include a plurality of wirings. In the example shown in the figure, only the wiring constituting the coiled conductive structure 40 of the inductor element is shown.
  • the external terminal 24 is a terminal for electrically connecting to an external device or the like not shown.
  • the external terminal 24 can be configured as a part of a wiring layer provided on the second main surface 20b.
  • the conductive material that can constitute the first wiring layer 42, the second wiring layer 44, the external terminal 24, and other wiring for example, gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel,
  • metals selected from the group consisting of titanium, tungsten, iron, tin, and indium are included.
  • the first wiring layer 42, the second wiring layer 44, the external terminal 24, and other wirings may be made of a single metal or an alloy, and the alloy is selected from the above group, for example. And alloys of two or more metals (for example, nickel chromium alloy, copper nickel alloy, and copper titanium alloy).
  • chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel chromium alloy is more preferably used, and copper is further preferably used.
  • first wiring layer 42, the second wiring layer 44, the external terminal 24, and other wirings have a single-layer structure, a single metal layer or an alloy layer composed of two or more different types of metals or alloys is laminated. It may be a layered structure.
  • the layer in contact with the magnetic layer is a single metal layer of chromium, zinc, or titanium, or an alloy of a nickel chromium alloy A layer is preferred.
  • the thicknesses of the first wiring layer 42, the second wiring layer 44, the external terminal 24, and other wirings are generally 3 ⁇ m to 35 ⁇ m, preferably 5 ⁇ m to 30 ⁇ m, depending on the desired multilayer printed wiring board design.
  • the thickness of the first wiring layer 42 and the external terminal 24 included in the core base material 20 is not particularly limited.
  • the thickness of the first wiring layer 42 and the external terminal 24 is preferably 70 ⁇ m or less, more preferably 60 ⁇ m or less, still more preferably 50 ⁇ m or less, even more preferably 40 ⁇ m or less, particularly preferably from the viewpoint of thinning. Is 30 ⁇ m or less, 20 ⁇ m or less, 15 ⁇ m or less, or 10 ⁇ m or less.
  • the lower limit of the thickness of the external terminal 24 is not particularly limited, but is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, and further preferably 5 ⁇ m or more.
  • the line (L) / space (S) ratio of the first wiring layer 42 and the external terminal 24 is not particularly limited, but is usually 900/900 ⁇ m or less from the viewpoint of obtaining a magnetic layer with excellent surface smoothness by reducing surface irregularities.
  • the thickness is preferably 700/700 ⁇ m or less, more preferably 500/500 ⁇ m or less, still more preferably 300/300 ⁇ m or less, and even more preferably 200/200 ⁇ m or less.
  • the lower limit of the line / space ratio is not particularly limited, but is preferably 1/1 ⁇ m or more from the viewpoint of improving the embedding of the resin composition in the space.
  • Examples of the core base material 20 include a wiring board formed as a wiring layer by patterning a copper layer using “R1515A” manufactured by Panasonic Corporation which is a glass cloth base material epoxy resin double-sided copper-clad laminate.
  • the core base material 20 has a plurality of through holes 22 that penetrate the core base material 20 so as to extend from the first main surface 20a to the second main surface 20b.
  • the through-hole 22 is provided with a through-hole wiring 22a.
  • the through-hole wiring 22 a electrically connects the first wiring layer 42 and the external terminal 24.
  • the first wiring layer 42 includes a spiral wiring portion for constituting the coiled conductive structure 40 and a rectangular land 42a electrically connected to the through-hole wiring 22a.
  • the spiral wiring portion includes a bent portion that bends at right angles to the linear portion and a bypass portion that bypasses the land 42a.
  • the spiral wiring portion of the first wiring layer 42 has a generally rectangular outline, and has a shape that is wound counterclockwise from the center side toward the outside.
  • the first magnetic layer 32 covers the first wiring layer 42 and the first main surface 20a exposed from the first wiring layer 42. Is provided.
  • the first magnetic layer 32 is a layer derived from the adhesive film described above, the first wiring layer 42 is excellent in sealing performance. Further, since the first magnetic layer 32 is formed using the adhesive film, the relative magnetic permeability in the frequency range of 10 MHz to 200 MHz is improved, and usually the magnetic loss is reduced.
  • the first magnetic layer 32 is provided with a via hole 36 that penetrates the first magnetic layer 32 in the thickness direction.
  • a second wiring layer 44 is provided in the first magnetic layer 32.
  • the second wiring layer 44 includes a spiral wiring portion for constituting the coiled conductive structure 40.
  • the spiral wiring portion includes a linear portion and a bent portion bent at a right angle.
  • the spiral wiring portion of the second wiring layer 44 has a generally rectangular outline, and has a shape that is wound clockwise from the center side toward the outside.
  • a via hole wiring 36a is provided in the via hole 36.
  • One end on the center side of the spiral wiring portion of the second wiring layer 44 is electrically connected to one end on the center side of the spiral wiring portion of the first wiring layer 42 by the via hole wiring 36a.
  • the other end on the outer peripheral side of the spiral wiring portion of the second wiring layer 44 is electrically connected to the land 42a of the first wiring layer 42 by the via hole wiring 36a. Therefore, the other end on the outer peripheral side of the spiral wiring portion of the second wiring layer 44 is electrically connected to the external terminal 24 via the via-hole wiring 36a, the land 42a, and the through-hole wiring 22a.
  • the coiled conductive structure 40 includes a spiral wiring part that is a part of the first wiring layer 42, a spiral wiring part that is a part of the second wiring layer 44, and a spiral wiring part of the first wiring layer 42. And a via-hole wiring 36a that electrically connects the spiral wiring portion of the second wiring layer 44 to each other.
  • the first magnetic layer 32 provided with the second wiring layer 44 is provided with a second magnetic layer 34 so as to cover the second wiring layer 44 and the first magnetic layer 32 exposed from the second wiring layer 44.
  • the second magnetic layer 34 is a layer derived from the adhesive film already described in the same manner as the first magnetic layer 32, and the resin composition layer of the adhesive film is excellent in fluidity when the magnetic layer is formed.
  • the sealing property of the wiring layer 44 is excellent. Further, since the second magnetic layer 34 is formed using the adhesive film, the relative magnetic permeability in the frequency range of 10 MHz to 200 MHz is improved, and usually the magnetic loss is reduced.
  • the first magnetic layer 32 and the second magnetic layer 34 constitute a magnetic part 30 that can be viewed as an integral magnetic layer. Therefore, the coiled conductive structure 40 is provided so as to be at least partially embedded in the magnetic part 30. That is, in the wiring board 10 of this embodiment, the inductor element extends in the thickness direction of the coiled conductive structure 40 and the magnetic part 30 and is surrounded by the coiled conductive structure 40. It is comprised by the core part which is a part of them.
  • the coiled conductive structure 40 includes the two wiring layers of the first wiring layer 42 and the second wiring layer 44 has been described.
  • the wiring layer has three or more wiring layers (and three or more layers).
  • the coiled conductive structure 40 can also be constituted by the build-up magnetic layer.
  • the spiral wiring portion of the wiring layer (not shown) arranged so as to be sandwiched between the uppermost wiring layer and the lowermost wiring layer is arranged at the nearest side with one end on the uppermost layer side.
  • One end of the spiral wiring portion of the wiring layer that is electrically connected to one end of the spiral wiring portion of the wiring layer and the other end is the lowest layer side and is disposed nearest Electrically connected to the part.
  • the magnetic layer is formed by the adhesive film, the relative magnetic permeability and flame retardancy of the formed magnetic layer can be increased, and the amount of warpage can be reduced.
  • the method for manufacturing a wiring board according to the present embodiment includes a magnetic part including a first magnetic layer and a second magnetic layer, and a coiled conductive structure at least partially embedded in the magnetic part.
  • a method of manufacturing a wiring board including an inductor element composed of a conductive structure and a part of a magnetic part, the core substrate provided with the adhesive film according to the present embodiment and the first wiring layer A step of laminating a resin composition layer of an adhesive film on a core substrate, a step of thermosetting the resin composition layer to form a first magnetic layer, and forming a via hole in the first magnetic layer A step of roughening the first magnetic layer in which the via hole is formed, a second wiring layer is formed on the first magnetic layer, and the first wiring layer and the second wiring layer are electrically connected to each other.
  • a core substrate (inner layer) provided with a first wiring layer 42 provided on the first main surface 20a, an external terminal 24 provided on the second main surface 20b, a through hole 22, and an inner wiring 22a in the through hole.
  • Circuit board 20 and an adhesive film are prepared.
  • the first magnetic layer 32 is formed. First, a laminating step of laminating the resin composition layer of the adhesive film so as to come into contact with the first wiring layer 42 of the core base material is performed.
  • the conditions for the laminating step are not particularly limited, and conditions used for forming a magnetic layer (build-up magnetic layer) using an adhesive film can be employed.
  • it can be performed by pressing a heated metal plate such as a stainless steel mirror plate from the support side of the adhesive film.
  • a heated metal plate such as a stainless steel mirror plate
  • it is preferable not to press the metal plate directly, but to press through an elastic member made of heat-resistant rubber or the like so that the adhesive film sufficiently follows the irregularities on the surface of the core substrate 20.
  • the pressing temperature is preferably in the range of 70 ° C. to 140 ° C.
  • the pressing pressure is preferably in the range of 1 kgf / cm 2 to 11 kgf / cm 2 (0.098 MPa to 1.079 MPa)
  • the pressing time is preferably 5 The range is from 2 seconds to 3 minutes.
  • the laminating step is preferably performed under a reduced pressure of 20 mmHg (26.7 hPa) or less.
  • the laminating step can be performed using a commercially available vacuum laminator.
  • Examples of the commercially available vacuum laminator include a vacuum pressurizing laminator manufactured by Meiki Seisakusho, a vacuum applicator manufactured by Nikko Materials, and the like.
  • a smoothing step of heating and pressurizing the adhesive film laminated on the core substrate 20 may be performed.
  • the smoothing step is generally carried out by heating and pressurizing the adhesive film laminated to the core substrate 20 with a heated metal plate or metal roll under normal pressure (atmospheric pressure).
  • the conditions for the heating and pressure treatment can be the same as the conditions for the laminating step.
  • the laminating step and the smoothing step can also be carried out continuously using the same vacuum laminator.
  • the process which peels the support body derived from an adhesive film at the arbitrary timings after implementation of the said lamination process or the said smoothing process is performed.
  • the process of peeling a support body can be mechanically implemented with a commercially available automatic peeling apparatus, for example.
  • thermosetting process is performed in which the resin composition layer laminated on the core substrate 20 is thermoset to form a magnetic layer (build-up magnetic layer).
  • the conditions for the thermosetting process are not particularly limited, and conditions usually employed when forming the insulating layer of the multilayer printed wiring board can be applied.
  • the conditions of the thermosetting step can be arbitrarily selected depending on the composition of the resin composition used for the resin composition layer.
  • the conditions of the heat curing step are, for example, a curing temperature in a range of 120 ° C. to 240 ° C. (preferably in a range of 150 ° C. to 210 ° C., more preferably in a range of 170 ° C. to 190 ° C.), and a curing time of 5 minutes to 90 minutes. (Preferably 10 minutes to 75 minutes, more preferably 15 minutes to 60 minutes).
  • a step of preheating the resin composition layer at a temperature lower than the curing temperature may be performed.
  • the resin composition layer Prior to carrying out the thermosetting step, the resin composition layer is kept at a temperature of, for example, 50 ° C. or more and less than 120 ° C. (preferably 60 ° C. or more and 110 ° C. or less, more preferably 70 ° C. or more and 100 ° C. or less) for 5 minutes or more (preferably May be preheated for 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes).
  • Preheating is preferably performed under atmospheric pressure (normal pressure).
  • the first magnetic layer 32 provided on the core base material 20 can be formed by the above steps.
  • the second magnetic layer 32 is provided in the first magnetic layer 32 by repeating the laminating step, the thermosetting step, and the wiring layer forming step described later once or more with respect to the core substrate 20 on which the magnetic layer is formed.
  • the magnetic part 34 including the magnetic layer 34 and the laminated magnetic layer can be formed.
  • the step of forming the first magnetic layer 32 on the core substrate 20 can be performed using a general vacuum hot press machine. For example, it can carry out by pressing from the support body side using metal plates, such as a heated SUS board.
  • the pressing condition is that the degree of vacuum is usually 1 ⁇ 10 ⁇ 2 MPa or less, preferably 1 ⁇ 10 ⁇ 3 MPa or less.
  • heating and pressurization can be carried out in one stage, it is preferable to carry out by changing the pressing conditions as two or more stages from the viewpoint of controlling the oozing of the resin.
  • the first stage pressing condition is a temperature of 70 ° C.
  • the pressure is 1 kgf / cm 2 to 15 kgf / cm 2
  • the second stage pressing condition is a temperature of 150 ° C. to 200 ° C. , preferably carried out at a pressure of range of 1kgf / cm 2 ⁇ 40kgf / cm 2.
  • the time for each stage is preferably 30 minutes to 120 minutes.
  • Examples of commercially available vacuum hot presses include “MNPC-V-750-5-200” manufactured by Meiki Seisakusho, “VH1-1603” manufactured by Kitagawa Seiki Co., Ltd., and the like.
  • a via hole 36 is formed in the formed first magnetic layer 32.
  • the via hole 36 becomes a path for electrically connecting the first wiring layer 42 and the second wiring layer 44.
  • the via hole 36 can be formed by a known method using a drill, laser, plasma or the like in consideration of the characteristics of the first magnetic layer 32. For example, if the protective film remains at this point, the via hole 36 can be formed by irradiating the first magnetic layer 32 with laser light through the protective film.
  • Examples of the laser light source that can be used for forming the via hole 36 include a carbon dioxide laser, a YAG laser, and an excimer laser. Among these, a carbon dioxide laser is preferable from the viewpoint of processing speed and cost.
  • the via hole 36 can be formed using a commercially available laser device.
  • commercially available carbon dioxide laser devices include “LC-2E21B / 1C” manufactured by Hitachi Via Mechanics, “ML605GTWII” manufactured by Mitsubishi Electric, and a substrate drilling laser processing machine manufactured by Matsushita Welding Systems.
  • a roughening process for roughening the first magnetic layer 32 in which the via hole 36 is formed is performed.
  • the procedure and conditions of the roughening step are not particularly limited, and known procedures and conditions that are usually used in the method for producing a multilayer printed wiring board can be employed.
  • the roughening step for example, the first magnetic layer 32 can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.
  • the swelling liquid that can be used in the roughening step is not particularly limited, and examples thereof include an alkaline solution and a surfactant solution, and an alkaline solution is preferable.
  • an alkaline solution which is a swelling liquid a sodium hydroxide solution and a potassium hydroxide solution are more preferable.
  • Examples of the commercially available swelling liquid include “Swelling Dip Securigans P”, “Swelling Dip Securigans SBU” manufactured by Atotech Japan.
  • the swelling treatment with the swelling liquid is not particularly limited, and can be performed, for example, by immersing the core substrate 20 provided with the first magnetic layer 32 in the swelling liquid at 30 ° C. to 90 ° C. for 1 minute to 20 minutes. .
  • the first magnetic layer 32 is preferably immersed in a swelling liquid at 40 ° C. to 80 ° C. for 5 minutes to 15 minutes.
  • the oxidizing agent that can be used for the roughening treatment with the oxidizing agent is not particularly limited, and examples thereof include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide.
  • the roughening treatment with an oxidizing agent such as an alkaline permanganic acid solution is preferably performed by immersing the first magnetic layer 32 in an oxidizing agent solution heated to 60 ° C. to 80 ° C. for 10 to 30 minutes.
  • the concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass.
  • Examples of commercially available oxidants include alkaline permanganate solutions such as “Concentrate Compact P” and “Dosing Solution Securigans P” manufactured by Atotech Japan.
  • an acidic aqueous solution is preferable, and as a commercially available product, for example, “Reduction Solution Securigans P” manufactured by Atotech Japan Co., Ltd. can be mentioned.
  • the neutralization treatment with the neutralizing solution can be performed by immersing the treated surface, which has been subjected to the roughening treatment with the oxidizing agent solution, in the neutralizing solution at 30 to 80 ° C. for 5 to 30 minutes. From the viewpoint of workability and the like, a method of immersing the first magnetic layer 32 that has been roughened with an oxidant solution in a neutralizing solution at 40 ° C. to 70 ° C. for 5 to 20 minutes is preferable.
  • the roughening process described above may also serve as a so-called desmear process for removing smear of the via hole 36 formed in the first magnetic layer 32.
  • a desmear process may be performed on the via hole 36 separately from the roughening process.
  • the desmear process may be a wet desmear process or a dry desmear process.
  • the specific process of the desmear process is not particularly limited, and for example, known processes and conditions that are normally used when forming an insulating layer of a multilayer printed wiring board can be employed.
  • Examples of the dry desmear process include plasma treatment, and examples of the wet desmear process include a swelling process using a swelling liquid, a process using an oxidizing agent, and a process using a neutralizing liquid in the same order as the roughening process. The method of performing is mentioned.
  • the second wiring layer 44 is formed on the first magnetic layer 32 that has been subjected to the roughening process (and the desmear process).
  • the second wiring layer 44 can be formed by plating.
  • the second wiring layer 44 is formed by a conventionally known technique such as a semi-additive method including a non-electrolytic plating process, a mask pattern forming process, an electrolytic plating process, and a flash etching process, or a full additive method. It can be formed as a wiring layer including a pattern.
  • the via hole wiring 36 a is also formed in the via hole 36 by the formation process of the second wiring layer 44.
  • the wiring board of this embodiment requires one or more build-up layers. For this, the series of steps already described from the step of forming the first magnetic layer 32 to the step of forming the second wiring layer 44 may be repeated one more time.
  • the second magnetic layer 34 is formed on the first magnetic layer 32 in which the second wiring layer 44 and the via-hole wiring 36a are formed.
  • the second magnetic layer 34 may be formed by the same process using the same material as the first magnetic layer 32 forming process including the adhesive film laminating process, smoothing process, and thermosetting process already described.
  • the coil-shaped conductive structure 40 is embedded at least in part in the magnetic part 30, and a part of the first wiring layer 42, a part of the second wiring layer 44, and the via-hole wiring 36a are connected.
  • Wiring board 10 including an inductor element including a coiled conductive structure 40 and a portion of magnetic part 30 extending in the thickness direction of magnetic part 30 and surrounded by coiled conductive structure 40. Can be manufactured.
  • the wiring board 11 has a magnetic layer that is a cured body of the resin composition (resin composition layer) and a conductive structure that is at least partially embedded in the magnetic layer.
  • the conductive element includes an inductor element that is configured by a part of the magnetic layer that extends in the thickness direction of the magnetic layer and is surrounded by the conductive structure.
  • the wiring board 11 is a build-up wiring board having a build-up magnetic layer.
  • the wiring board 11 is different from the wiring board 10 of the first embodiment in that it does not have a core base material.
  • the frequency at which the inductor element included in the wiring board 11 can function is assumed to be 10 MHz to 200 MHz. Further, the inductor element provided in the wiring board 11 is assumed to be a power supply system.
  • the wiring board 11 includes a first wiring layer 42, a second wiring layer 44, and a third wiring layer 46.
  • the first wiring layer 42, the second wiring layer 44, and the third wiring layer 46 usually include a plurality of wirings. In the example shown in the figure, only the wiring constituting the coiled conductive structure 40 of the inductor element is shown.
  • the first wiring layer 42, the second wiring layer 44, the external terminal 24, and other wirings are the same as the first wiring layer 42, the second wiring layer 44, the external terminal 24, and other wirings in the first embodiment. It is.
  • the conductor material that can constitute the third wiring layer 46 is the same as the conductor material that can constitute the first wiring layer 42 in the first embodiment.
  • the thickness of the third wiring layer 46 is the same as the thickness of the first wiring layer 42 in the first embodiment.
  • the third wiring layer 46 may have a single layer structure or a multilayer structure in which two or more single metal layers or alloy layers made of different kinds of metals or alloys are stacked.
  • the layer in contact with the magnetic layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of a nickel chromium alloy.
  • the first magnetic layer 32, the second magnetic layer 34, and the third magnetic layer 38 constitute a magnetic part 30 that can be viewed as an integral magnetic layer.
  • the first magnetic layer 32 and the second magnetic layer 34 are the same as the first magnetic layer 32 and the second magnetic layer 34 in the first embodiment.
  • the third magnetic layer 38 is a layer derived from the adhesive film already described, and the resin composition layer of the adhesive film is excellent in fluidity when forming the magnetic layer. Are better. Further, since the third magnetic layer 38 is formed using the adhesive film, the relative magnetic permeability in the frequency range of 10 MHz to 200 MHz is improved, and usually the magnetic loss is reduced.
  • a via hole wiring 36a is provided in the via hole 36.
  • the first wiring layer 42, the second wiring layer 44, and the third wiring layer 46 are electrically connected to each other by via-hole wiring 36a and the like.
  • the coiled conductive structure 40 includes three wiring layers of the first wiring layer 42, the second wiring layer 44, and the third wiring layer 46 has been described.
  • the coiled conductive structure 40 can also be constituted by a wiring layer (and four or more buildup magnetic layers).
  • the spiral wiring portion of the wiring layer (not shown) arranged so as to be sandwiched between the uppermost wiring layer and the lowermost wiring layer is arranged at the nearest side with one end on the uppermost layer side.
  • One end of the spiral wiring portion of the wiring layer that is electrically connected to one end of the spiral wiring portion of the wiring layer and the other end is the lowest layer side and is disposed nearest Electrically connected to the part.
  • the magnetic layer is formed by the adhesive film, the relative magnetic permeability and flame retardancy of the formed magnetic layer can be increased, and the amount of warpage can be reduced.
  • the manufacturing method of the wiring board according to the present embodiment is as follows: (1) The process of preparing the base material 50 with a carrier with a metal layer which has the base material 51 and the metal layer with a carrier 52 provided in the at least one surface of this base material 51, (2) A step of laminating a resin composition layer of an adhesive film on the substrate 50 with a metal layer with a carrier, and thermosetting the resin composition layer to form the first magnetic layer 32; (3) forming a first wiring layer 42 on the first magnetic layer 32; (4) laminating a resin composition layer of an adhesive film on the first wiring layer 42 and the first magnetic layer 32, and thermosetting the resin composition layer to form the second magnetic layer 34; (5) A step of forming a via hole 36 in the second magnetic layer 34 and roughening the second magnetic layer 34 in which the via hole 36 is formed,
  • Step (9) and step (10) may be performed in the reverse order, or may be performed simultaneously.
  • a process (11) and a process (12) may be performed by changing order, and may be performed simultaneously.
  • Step (1) is a step of preparing a substrate 50 with a metal layer with a carrier having a substrate 51 and a metal layer with a carrier 52 provided on at least one surface of the substrate 51.
  • the substrate 50 with a metal layer with a carrier is usually provided with a substrate 51 and a metal layer 52 with a carrier on at least one surface of the substrate 51.
  • the metal layer 52 with a carrier is a structure provided in order of the 1st metal layer 521 and the 2nd metal layer 522 from the base material 51 side from a viewpoint of improving workability
  • the material of the base material 51 is the same as that of the core base material in the first embodiment.
  • Examples of the material of the metal layer 52 with a carrier include a copper foil with a carrier and a metal foil with a support that can be peeled.
  • a commercially available product can be used for the base material 50 with a metal layer with a carrier. Examples of commercially available products include MT-EX manufactured by Mitsui Kinzoku Co., Ltd.
  • step (2) as shown in FIG. 4B, the resin composition layer of the adhesive film is laminated on the base material 50 with the metal layer with carrier, and the resin composition layer is thermoset to cause the first magnetic property. This is a step of forming the layer 32.
  • the formation of the first magnetic layer 32 in the step (2) can be performed by the same method as the formation of the first magnetic layer in the first embodiment.
  • a roughening step may be performed on the formed first magnetic layer as necessary.
  • the roughening step can be performed by the same method as the roughening step performed on the first magnetic layer in the first embodiment.
  • Step (3) is a step of forming the first wiring layer 42 on the first magnetic layer 32 as shown in FIG. 4C as an example.
  • the first wiring layer 42 can be formed by plating.
  • the first wiring layer 42 can be formed by the same method as the formation of the second wiring layer 44 in the first embodiment.
  • the first wiring layer 42 can be made of the same conductive material as that of the first wiring layer in the first embodiment.
  • step (4) as shown in FIG. 4D, an adhesive film resin composition layer is laminated on the first wiring layer 42 and the first magnetic layer 32, and the resin composition layer is thermoset. In this step, the second magnetic layer 34 is formed.
  • the second magnetic layer 34 can be formed by the same method as in step (2) described above.
  • the adhesive film for forming the second magnetic layer 34 may be the same as the adhesive film used when forming the first magnetic layer 32, or a different adhesive film may be used.
  • Step (5) is a step of forming a via hole 36 in the second magnetic layer 34 and roughening the second magnetic layer 34 in which the via hole 36 is formed, as shown in FIG. 4E. is there.
  • a via hole wiring 36 a is provided in the via hole 36.
  • the via hole 36 becomes a path for electrically connecting the first wiring layer 42 and the second wiring layer 44.
  • the via hole 36 can be formed by the same method as the via hole forming step in the first embodiment. Further, the roughening treatment can be performed by the same method as the roughening step performed on the first magnetic layer in the first embodiment.
  • Step (6) is a step of forming the second wiring layer 44 on the second magnetic layer 34 as shown in FIG. 4 (e) as an example.
  • the second wiring layer 44 is formed on the via hole 36 in the second magnetic layer 34.
  • the second wiring layer 44 can be formed by plating.
  • the second wiring layer 44 can be formed by the same method as the formation of the second wiring layer 44 in the first embodiment.
  • the second wiring layer 44 can be made of the same conductive material as that of the second wiring layer in the first embodiment.
  • step (7) as shown in FIG. 4F, an adhesive film resin composition layer is laminated on the second wiring layer 44 and the second magnetic layer 34, and the resin composition layer is thermoset. In this step, the third magnetic layer 38 is formed.
  • the third magnetic layer 38 can be formed by the same method as in step (2) described above.
  • the adhesive film for forming the third magnetic layer 38 may be the same as the adhesive film used when forming the first magnetic layer 32 and the second magnetic layer 34, or may be different.
  • a process (8) is a process of removing the base material 50 with a metal layer with a carrier so that an example may be shown in FIG.4 (g).
  • the removal method of the base material 50 with a metal layer with a carrier is not specifically limited.
  • the substrate 51 and the first metal layer 521 are peeled off at the interface between the first metal layer 521 and the second metal layer 522, and the second metal layer 522 is removed by etching with, for example, an aqueous copper chloride solution.
  • Step (9) is a step of forming a via hole (not shown in FIG. 4) in the third magnetic layer 38 and subjecting the third magnetic layer 38 with the via hole to a roughening treatment.
  • a via hole wiring in the via hole is provided.
  • the via hole serves as a path for electrically connecting the second wiring layer 44 and the third wiring layer 46.
  • This via hole can be formed by the same method as the via hole forming step in the first embodiment.
  • the roughening treatment can be performed by the same method as the roughening step performed on the first magnetic layer in the first embodiment.
  • Step (10) is a step of forming a via hole 36 in the first magnetic layer 32 and roughening the first magnetic layer 32 in which the via hole 36 is formed, as shown in FIG. is there.
  • the via hole 36 is formed on the surface side of the first magnetic layer 32 from which the substrate 50 with the metal layer with carrier is removed, and the external terminal 24 is formed on the via hole 36.
  • a via hole wiring 36 a is provided in the via hole 36.
  • the via hole 36 serves as a path for electrically connecting the first wiring layer 42 and the external terminal 24.
  • the via hole 36 can be formed by the same method as the via hole forming step in the first embodiment.
  • the roughening treatment can be performed by the same method as the roughening step performed on the first magnetic layer in the first embodiment.
  • Step (11) is a step of forming the third wiring layer 46 on the third magnetic layer 38 as shown in FIG. 4 (h) as an example. More specifically, after roughening a via hole (not shown) formed in the third magnetic layer 38, the third wiring layer 46 is formed on the via hole.
  • the third wiring layer 46 can be formed by the same method as the second wiring layer 44 in the first embodiment, and the same conductive material as that of the first and second wiring layers in the first embodiment is used. Can do.
  • Step (12) is a step of forming the external terminals 24 on the first magnetic layer 32 as shown in FIG. 4 (h) as an example. More specifically, after the via hole 36 formed in the first magnetic layer 32 is roughened, the external terminal 24 is connected to the via hole 36.
  • This inductor element includes a coiled conductive structure 40 and a part of the magnetic part 30 extending in the thickness direction of the magnetic part 30 and surrounded by the coiled conductive structure 40.
  • the coiled conductive structure 40 includes a part of the first wiring layer 42, a part of the second wiring layer 44, a part of the third wiring layer 46, and the via hole wiring 36a.
  • the wiring board of this embodiment requires one or more build-up layers. For this, the series of steps already described from the step of forming the first magnetic layer 32 to the step of forming the second wiring layer 44 may be repeated one more time.
  • the adhesive film of the present invention By using the adhesive film of the present invention, it is possible to improve the relative magnetic permeability at a frequency of 10 MHz to 200 MHz, and to form a magnetic layer with excellent flame retardancy and reduced warpage.
  • a wiring board in which a higher performance inductor element for a low frequency band including a core portion constituted by a part of a magnetic layer is formed without using a core structure can be provided by a simpler process.
  • the wiring board according to the present embodiment can be used as a wiring board for mounting electronic components such as semiconductor chips, and can also be used as a (multilayer) printed wiring board using such a wiring board as an inner layer substrate. Further, such a wiring board can be used as a chip inductor component obtained by dividing the wiring board into pieces, and can also be used as a printed wiring board on which the chip inductor component is surface-mounted. In addition, using such a wiring board, various types of semiconductor devices can be manufactured. A semiconductor device including such a wiring board can be suitably used for electrical products (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircrafts). .
  • electrical products for example, computers, mobile phones, digital cameras, and televisions
  • vehicles for example, motorcycles, automobiles, trains, ships, and aircrafts.
  • Example 1 Preparation of resin composition 1> “ZX1059” (mixed product of bisphenol A type epoxy resin and bisphenol F type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) 7 parts by mass, “HP-4700” (naphthalene type tetrafunctional epoxy resin, manufactured by DIC) 7 parts by mass, 35 parts by mass of “YX7553” (phenoxy resin, nonvolatile content 30% by mass, manufactured by Mitsubishi Chemical), 30 parts by mass of “KS-1” (polyvinyl acetal resin, manufactured by Sekisui Chemical Co., Ltd.), 10 parts by mass of MEK, 10 parts by mass of cyclohexanone The solution was dissolved in 40 parts by mass of ethanol and 40 parts by mass of toluene while stirring.
  • ZX1059 mixed product of bisphenol A type epoxy resin and bisphenol F type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.
  • HP-4700 naphthalene type t
  • Example 2 Preparation of resin composition 2> "ZX1059” (mixed product of bisphenol A type epoxy resin and bisphenol F type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) 14 parts by mass, "HP-4700” (naphthalene type tetrafunctional epoxy resin, manufactured by DIC) 14 parts by mass, 35 parts by mass of “YX7553” (phenoxy resin, non-volatile content 30% by mass, manufactured by Mitsubishi Chemical Corporation), 23 parts by mass of “KS-1” (polyvinyl acetal resin, manufactured by Sekisui Chemical Co., Ltd.) 10 parts by mass of MEK, 10 parts by mass of cyclohexanone The mixture was dissolved in 30 parts by mass of ethanol and 30 parts by mass of toluene while stirring.
  • ZX1059 mixed product of bisphenol A type epoxy resin and bisphenol F type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.
  • HP-4700 naphthalene type
  • Example 3 Preparation of resin composition 3>
  • KS-1 polyvinyl acetal resin, manufactured by Sekisui Chemical Co., Ltd.
  • SG-P3 epoxy group-containing acrylate copolymer resin, manufactured by Nagase ChemteX Corporation, number average molecular weight Mn: 850000 g / mol, epoxy value 0.21 eq / kg, glass transition temperature 12 ° C., nonvolatile content 15% by mass
  • a resin composition 3 was prepared in the same manner as in Example 1 except for the above items.
  • Example 4 Preparation of resin composition 4>
  • KS-1 polyvinyl acetal resin, manufactured by Sekisui Chemical Co., Ltd.
  • BL-1 butyral resin, manufactured by Sekisui Chemical Co., Ltd.
  • Example 5 Preparation of resin composition 5>
  • the amount of YX7553 phenoxy resin, nonvolatile content 30% by mass, manufactured by Mitsubishi Chemical Corporation
  • KS-1 polyvinyl acetal resin, manufactured by Sekisui Chemical Co., Ltd.
  • a resin composition 5 was prepared in the same manner as in Example 1 except for the above items.
  • Example 6 Preparation of resin composition 6>
  • the amount of AW2-08PF3F manufactured by Epson Atmix
  • a resin composition 6 was prepared in the same manner as in Example 1 except for the above items.
  • Example 7 Preparation of resin composition 7>
  • the amount of AW2-08PF3F manufactured by Epson Atmix
  • the amount of SO-C2 manufactured by Admatex
  • a resin composition 7 was prepared in the same manner as in Example 1 except for the above items.
  • Example 8 Preparation of resin composition 8>
  • the amount of SO-C2 manufactured by Admatechs
  • a resin composition 8 was prepared in the same manner as in Example 1 except for the above items.
  • Example 9 Preparation of resin composition 9>
  • the amount of AW2-08PF3F manufactured by Epson Atmix
  • SO-C2 manufactured by Admatex
  • a resin composition 9 was prepared in the same manner as in Example 1.
  • Example 10 Preparation of resin composition 10>
  • the amount of LA-7054 (phenolic curing agent, nonvolatile content 60% by mass, manufactured by DIC) was changed from 14 parts by mass to 7 parts by mass, and HPC-8000-65T (active ester curing agent, nonvolatile content) 65 parts by mass (manufactured by DIC Corporation) was included.
  • a resin composition 10 was prepared in the same manner as in Example 3. The surface of the prepared resin composition 10 was measured using a scanning electron microscope (SEM). An enlarged photograph of the surface of the resin composition 10 is shown in FIG.
  • Example 1 Preparation of resin composition 11>
  • the amount of KS-1 polyvinyl acetal resin, manufactured by Sekisui Chemical Co., Ltd.
  • a resin composition 11 was prepared in the same manner as in Example 1 except for the above items.
  • Example 2 Preparation of resin composition 12>
  • KS-1 polyvinyl acetal resin, manufactured by Sekisui Chemical Co., Ltd.
  • a resin composition 12 was prepared in the same manner as in Example 1.
  • Example 3 Preparation of resin composition 13>
  • the amount of KS-1 polyvinyl acetal resin, manufactured by Sekisui Chemical Co., Ltd.
  • AW2-08PF3F manufactured by Epson Atmix
  • the amount was changed to 1800 parts by mass.
  • a resin composition 13 was prepared in the same manner as in Example 1.
  • Example 4 Preparation of resin composition 14>
  • the amount of AW2-08PF3F manufactured by Epson Atmix
  • the amount of SO-C2 manufactured by Admatex
  • a resin composition 14 was prepared in the same manner as in Example 1.
  • ⁇ Comparative Example 5 Preparation of resin composition 15>
  • KS-1 polyvinyl acetal resin, manufactured by Sekisui Chemical Co., Ltd.
  • SG-P3 epoxy group-containing acrylate copolymer resin, manufactured by Nagase ChemteX Corporation, number average molecular weight Mn: 850000 g / mol, epoxy value 0.21 eq / kg, glass transition temperature 12 ° C., non-volatile content 15% by mass
  • AW2-08PF3F manufactured by Epson Atmix
  • a resin composition 15 was prepared in the same manner as in Example 9.
  • Example 6 Preparation of resin composition 16>
  • AW2-08PF3F manufactured by Epson Atmix
  • HQ carbonyl iron, manufactured by BASF
  • PET film (thickness: 38 ⁇ m) was prepared as a support.
  • the resin composition prepared in each example and each comparative example was uniformly applied on a PET film with a die coater so that the thickness of the resin composition layer after drying was 50 ⁇ m, and 70 ° C. to 120 ° C. (average) (100 ° C.) for 7 minutes so that the residual solvent amount in the resin composition layer is about 0.4% by mass to obtain an adhesive film.
  • Each adhesive film was laminated on both sides of the wiring board using a batch type vacuum pressure laminator “MVLP-500” manufactured by Meiki Seisakusho. Lamination was performed by reducing the pressure for 30 seconds to a pressure of 13 hPa or less, and then pressing at 100 ° C. and a pressing force of 0.74 MPa for 30 seconds. Evaluation was performed by inspecting the appearance of the obtained laminated structure according to the following evaluation criteria. The results are shown in the table below. Evaluation standard (circle): There is no void in the circuit part of a wiring board, and the resin composition derived from an adhesive film has flowed sufficiently. X: Void is generated in the circuit portion of the wiring board, and the fluidity at the time of laminating the resin composition derived from the adhesive film is insufficient.
  • a PET film (“Fluoroge RL50KSE” manufactured by Mitsubishi Plastics) treated with a fluororesin-based release agent (ETFE) was prepared.
  • the resin composition produced in each example and each comparative example was uniformly applied on the PET film with a die coater so that the thickness of the resin composition layer after drying was 50 ⁇ m. It was dried at an average temperature of 100 ° C. for 7 minutes so that the residual solvent amount in the resin composition layer was about 0.4% by mass to obtain an adhesive film.
  • the obtained adhesive film was heated at 180 ° C. for 90 minutes to thermally cure the resin composition layer, and the support was peeled off to obtain a sheet-like cured body.
  • the obtained cured body was cut into a test piece having a width of 5 mm and a length of 18 mm to obtain an evaluation sample.
  • This evaluation sample was measured using a 3-turn coil method with a measurement frequency of 10 MHz to 100 MHz using “HP 8362B” (trade name) manufactured by Agilent Technologies, and a relative permeability ( ⁇ ') And magnetic loss ( ⁇ '') were measured.
  • the relative permeability ( ⁇ ′) and magnetic loss ( ⁇ ′′) were measured at a room temperature of 23 ° C. with a measurement frequency in the range of 100 MHz to 10 GHz by the short-circuit stripline method.
  • the relative magnetic permeability when the measurement frequency is 10 MHz, 100 MHz, 1 GHz, and 3 GHz, and the magnetic loss when the measurement frequency is 10 MHz and 100 MHz are shown in the following table.
  • a PET film (“Fluoroge RL50KSE” manufactured by Mitsubishi Plastics) treated with a fluororesin-based release agent (ETFE) was prepared.
  • the resin composition produced in each example and each comparative example was uniformly applied on the PET film with a die coater so that the thickness of the resin composition layer after drying was 50 ⁇ m. It was dried at an average temperature of 100 ° C. for 7 minutes so that the residual solvent amount in the resin composition layer was about 0.4% by mass to obtain an adhesive film.
  • the obtained adhesive film was heated at 180 ° C. for 90 minutes to thermally cure the resin composition layer, and the support was peeled off to obtain a sheet-like cured body.
  • the obtained cured product was subjected to a tensile test using a Tensilon universal testing machine (manufactured by A & D) in accordance with Japanese Industrial Standard (JIS K7127), and the tensile modulus was measured.
  • a polyethylene terephthalate (hereinafter referred to as “PET”) film (thickness: 38 ⁇ m) was prepared as a support.
  • PET polyethylene terephthalate
  • the resin composition prepared in each example and each comparative example was uniformly applied on a PET film with a die coater so that the thickness of the resin composition layer after drying was 50 ⁇ m, and 70 ° C. to 120 ° C. (average) (100 ° C.) for 7 minutes so that the residual solvent amount in the resin composition layer is about 0.4% by mass to obtain an adhesive film.
  • the obtained adhesive film was punched into a 100 mm square, the support was peeled off, and eight resin composition layers were stacked, and a 100 mm square 200 ⁇ m glass cloth base epoxy resin double-sided copper-clad laminate made by Panasonic Corporation “ R1515A ”was laminated on one side using a batch type vacuum pressure laminator“ MVLP-500 ”manufactured by Meiki Seisakusho.
  • Lamination was performed by reducing the pressure for 30 seconds to a pressure of 13 hPa or less, and then pressing at 100 ° C. and a pressing force of 0.74 MPa for 30 seconds. Subsequently, thermosetting was performed at 180 ° C. for 30 minutes to obtain a laminated structure.
  • the laminated structure was placed on a horizontal table, the distance from the table to the end of the laminated structure was taken as the amount of warpage, and the evaluation was performed according to the following evaluation criteria.
  • PET film (thickness: 38 ⁇ m) was prepared as a support.
  • the resin composition prepared in each example and each comparative example was uniformly applied on a PET film with a die coater so that the thickness of the resin composition layer after drying was 50 ⁇ m, and 70 ° C. to 120 ° C. (average) (100 ° C.) for 7 minutes so that the residual solvent amount in the resin composition layer is about 0.4% by mass to obtain an adhesive film.
  • a batch type vacuum pressure laminator MVLP-500 was applied to both sides of a base material from which the copper foil of a copper clad laminate (“679-FG” manufactured by Hitachi Chemical Co., Ltd.) having a substrate thickness of 0.2 mm was removed by etching. (Made by Meiki Co., Ltd.) was laminated on both sides of the laminate. Lamination was performed by reducing the pressure for 30 seconds to a pressure of 13 hPa or less, and then pressing at 100 ° C. and a pressure of 0.74 MPa for 30 seconds. After peeling off the PET film of the support, the adhesive film was laminated on both surfaces of the resin composition layer under the laminating conditions described above.
  • the PET film was peeled off and thermally cured at 180 ° C. for 90 minutes to obtain a flame retardant test sample.
  • a width of 12.7 mm and a length of 127 mm were cut out, and the cut out surface was polished with a polishing machine (manufactured by Struers, RotoPol-22).
  • the above five samples were made into one set, and the flame retardant test was performed according to the UL94 vertical flame retardant test. The case where there were 5 unburned samples after the 10-second indirect flame was “ ⁇ ”, and the case where there were no unburned samples after the 10-second indirect flame was “ ⁇ ”.
  • Examples 1 to 10 are excellent in laminating properties, magnetic loss, relative magnetic permeability, elastic modulus, warpage amount, warpage test, and flame retardancy.
  • the relative permeability of 10 MHz to 200 MHz is remarkably improved and the magnetic loss is reduced.
  • the resin composition of Example 10 forms a sea-island structure composed of a matrix phase and a dispersed phase, and it can be seen that the component (D) is unevenly distributed on the matrix phase side.
  • D It is thought that the relative magnetic permeability of the cured product of the resin composition of Example 10 is improved because the component (D) is unevenly distributed on the matrix phase side.
  • Comparative Example 1 and Comparative Examples 4 to 6 having an elastic modulus of less than 7 GPa and Comparative Examples 2 to 3 having an elastic modulus of more than 18 GPa have laminate properties, relative magnetic permeability of 10 MHz to 200 MHz, magnetic loss, elastic modulus, warpage. Any of the amount, warpage test, and flame retardancy was worse than in Examples 1 to 10, and could not be used as a resin composition. In Comparative Examples 1 and 3, the amount of warpage was large, and the amount of warpage could not be measured because the measurement limit was exceeded. In addition, flame retardancy could not be evaluated.
  • Wiring board 20 Core substrate (inner layer circuit board) 20a First main surface 20b Second main surface 22 Through hole 22a Wiring in through hole 24 External terminal 30 Magnetic part 32 First magnetic layer 34 Second magnetic layer 36 Via hole 36a Wiring in via hole 38 Third magnetic layer 40 Coiled conductivity Structure 42 First wiring layer 42a Land 44 Second wiring layer 46 Third wiring layer 50 Substrate with metal layer with carrier 51 Substrate 52 Metal layer with carrier 521 First metal layer 522 Second metal layer

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CN113234407A (zh) * 2021-04-02 2021-08-10 广东美信科技股份有限公司 导磁胶及其制备方法
CN113113223A (zh) * 2021-04-13 2021-07-13 横店集团东磁股份有限公司 一种软磁合金磁片及其制备方法和应用
CN116179103A (zh) * 2023-01-29 2023-05-30 深圳雷曼光电科技股份有限公司 一种磁性各向异性导电胶膜及其制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222425A (ja) * 1986-03-24 1987-09-30 Hitachi Ltd 磁気記録媒体
JP2002363382A (ja) * 2001-06-08 2002-12-18 Sony Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2015187260A (ja) * 2014-03-11 2015-10-29 味の素株式会社 接着フィルム
JP2016172790A (ja) * 2015-03-16 2016-09-29 パナソニックＩｐマネジメント株式会社 樹脂シート、樹脂シートの製造方法、インダクタ部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7427909B2 (en) * 2003-06-12 2008-09-23 Nec Tokin Corporation Coil component and fabrication method of the same
JP2007154041A (ja) 2005-12-05 2007-06-21 Nissan Motor Co Ltd 熱硬化性樹脂組成物およびこれを発泡、硬化させた熱硬化性樹脂発泡体
JP2016108561A (ja) * 2014-12-04 2016-06-20 日東電工株式会社 軟磁性樹脂組成物および軟磁性フィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222425A (ja) * 1986-03-24 1987-09-30 Hitachi Ltd 磁気記録媒体
JP2002363382A (ja) * 2001-06-08 2002-12-18 Sony Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2015187260A (ja) * 2014-03-11 2015-10-29 味の素株式会社 接着フィルム
JP2016172790A (ja) * 2015-03-16 2016-09-29 パナソニックＩｐマネジメント株式会社 樹脂シート、樹脂シートの製造方法、インダクタ部品

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019065208A (ja) * 2017-10-02 2019-04-25 味の素株式会社 樹脂組成物
JP7031206B2 (ja) 2017-10-02 2022-03-08 味の素株式会社 樹脂組成物
JP7222228B2 (ja) 2018-11-29 2023-02-15 味の素株式会社 基板の製造方法
JP2020088285A (ja) * 2018-11-29 2020-06-04 味の素株式会社 基板の製造方法
WO2020175590A1 (ja) * 2019-02-27 2020-09-03 味の素株式会社 磁性フィルム
JP7563375B2 (ja) 2019-02-27 2024-10-08 味の素株式会社 磁性フィルム
JP2020178096A (ja) * 2019-04-22 2020-10-29 イビデン株式会社 インダクタ内蔵基板
JP7368693B2 (ja) 2019-04-22 2023-10-25 イビデン株式会社 インダクタ内蔵基板
KR102658326B1 (ko) 2019-04-26 2024-04-18 에스에이치피피 글로벌 테크놀러지스 비.브이. 레이저 도금가능한 열가소성 조성물
KR20220005023A (ko) * 2019-04-26 2022-01-12 에스에이치피피 글로벌 테크놀러지스 비.브이. 레이저 도금가능한 열가소성 조성물
JP7078016B2 (ja) 2019-06-17 2022-05-31 株式会社村田製作所 インダクタ部品
US11476036B2 (en) 2019-06-17 2022-10-18 Murata Manufacturing Co., Ltd. Inductor component
JP2020205341A (ja) * 2019-06-17 2020-12-24 株式会社村田製作所 インダクタ部品
CN114555739A (zh) * 2019-09-30 2022-05-27 富士胶片株式会社 粘接片及电子零件
CN114555739B (zh) * 2019-09-30 2024-05-14 富士胶片株式会社 粘接片及电子零件
JP7560245B2 (ja) 2019-10-24 2024-10-02 太陽誘電株式会社 コイル部品及びコイル部品の製造方法
JP7354774B2 (ja) 2019-11-01 2023-10-03 味の素株式会社 樹脂組成物
CN112778698A (zh) * 2019-11-01 2021-05-11 味之素株式会社 树脂组合物
JP7533695B2 (ja) 2019-11-01 2024-08-14 味の素株式会社 樹脂組成物
JP2021070795A (ja) * 2019-11-01 2021-05-06 味の素株式会社 樹脂組成物
EP3859757A1 (en) * 2020-01-24 2021-08-04 Ajinomoto Co., Inc. Resin composition
JP2021174943A (ja) * 2020-04-28 2021-11-01 株式会社豊田中央研究所 圧粉磁心及びその製造方法
JP7387528B2 (ja) 2020-04-28 2023-11-28 株式会社豊田中央研究所 圧粉磁心及びその製造方法
WO2022065183A1 (ja) 2020-09-24 2022-03-31 富士フイルム株式会社 組成物、磁性粒子含有硬化物、磁性粒子導入基板、電子材料
WO2023181742A1 (ja) * 2022-03-22 2023-09-28 味の素株式会社 磁性基板の製造方法
WO2024181005A1 (ja) * 2023-02-28 2024-09-06 味の素株式会社 硬化体

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