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SE9904240L - Täckande element för modul - Google Patents

Täckande element för modul

Info

Publication number
SE9904240L
SE9904240L SE9904240A SE9904240A SE9904240L SE 9904240 L SE9904240 L SE 9904240L SE 9904240 A SE9904240 A SE 9904240A SE 9904240 A SE9904240 A SE 9904240A SE 9904240 L SE9904240 L SE 9904240L
Authority
SE
Sweden
Prior art keywords
module
lid
enable
modules
handling
Prior art date
Application number
SE9904240A
Other languages
Unknown language ( )
English (en)
Other versions
SE9904240D0 (sv
SE521646C2 (sv
Inventor
Roger Hoffstroem
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9904240A priority Critical patent/SE521646C2/sv
Publication of SE9904240D0 publication Critical patent/SE9904240D0/sv
Priority to US09/493,610 priority patent/US6504095B1/en
Priority to AU19078/01A priority patent/AU1907801A/en
Priority to PCT/SE2000/002271 priority patent/WO2001039564A1/en
Publication of SE9904240L publication Critical patent/SE9904240L/sv
Publication of SE521646C2 publication Critical patent/SE521646C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
SE9904240A 1999-11-23 1999-11-23 Täckande element för modul SE521646C2 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9904240A SE521646C2 (sv) 1999-11-23 1999-11-23 Täckande element för modul
US09/493,610 US6504095B1 (en) 1999-11-23 2000-01-28 Module cover element
AU19078/01A AU1907801A (en) 1999-11-23 2000-11-17 A module cover element
PCT/SE2000/002271 WO2001039564A1 (en) 1999-11-23 2000-11-17 A module cover element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9904240A SE521646C2 (sv) 1999-11-23 1999-11-23 Täckande element för modul

Publications (3)

Publication Number Publication Date
SE9904240D0 SE9904240D0 (sv) 1999-11-23
SE9904240L true SE9904240L (sv) 2001-05-24
SE521646C2 SE521646C2 (sv) 2003-11-18

Family

ID=20417828

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9904240A SE521646C2 (sv) 1999-11-23 1999-11-23 Täckande element för modul

Country Status (4)

Country Link
US (1) US6504095B1 (sv)
AU (1) AU1907801A (sv)
SE (1) SE521646C2 (sv)
WO (1) WO2001039564A1 (sv)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6607308B2 (en) * 2001-02-12 2003-08-19 E20 Communications, Inc. Fiber-optic modules with shielded housing/covers having mixed finger types
US7522886B2 (en) * 2002-10-03 2009-04-21 Amplus Communication Pte. Ltd. Radio frequency transceivers
US6900389B2 (en) * 2003-01-10 2005-05-31 Fci Americas Technology, Inc. Cover for ball-grid array connector
US6870735B2 (en) * 2003-03-25 2005-03-22 Jds Uniphase Corporation Heat sink with visible logo
US7129623B2 (en) * 2004-07-13 2006-10-31 Zippy Technology Corp. Piezoelectric blade protection structure
US7170165B2 (en) * 2005-02-02 2007-01-30 Agilent Technologies, Inc. Circuit board assembly with a brace surrounding a ball-grid array device
US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7787250B2 (en) * 2007-12-28 2010-08-31 Universal Scientific Industrial (Shanghai) Co., Ltd. Metallic cover of miniaturization module
US8276268B2 (en) 2008-11-03 2012-10-02 General Electric Company System and method of forming a patterned conformal structure
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
TWI487838B (zh) * 2010-04-26 2015-06-11 鴻準精密工業股份有限公司 散熱裝置及其氣流產生器
US8622278B1 (en) * 2012-06-29 2014-01-07 Intel Corporation Socket cover with heat flow for surface mount solder reflow
US10108234B1 (en) * 2017-06-09 2018-10-23 Nzxt Inc. Shielded motherboard
US10834839B1 (en) * 2019-08-27 2020-11-10 International Business Machines Corporation Barrier for hybrid socket movement reduction
JP7260662B2 (ja) * 2019-10-29 2023-04-18 京セラ株式会社 蓋体、電子部品収納用パッケージ及び電子装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US777847A (en) * 1904-05-16 1904-12-20 Francis De Fontes Barber's chair.
JPS56152254A (en) * 1980-04-25 1981-11-25 Toshiba Corp Heat radiator for electronic equipment
US5166772A (en) * 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
US5285350A (en) * 1992-08-28 1994-02-08 Aavid Engineering, Inc. Heat sink plate for multiple semi-conductors
JP3056960B2 (ja) * 1993-12-27 2000-06-26 株式会社東芝 半導体装置及びｂｇａパッケージ
US5557064A (en) * 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same
US5639989A (en) * 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
JP2636777B2 (ja) * 1995-02-14 1997-07-30 日本電気株式会社 マイクロプロセッサ用半導体モジュール
DE19516548A1 (de) * 1995-05-05 1996-11-14 Blaupunkt Werke Gmbh Abdeckkappe für elektronisches Bauelement
JP3401990B2 (ja) * 1995-05-16 2003-04-28 富士通株式会社 半導体装置とその収納キャリア
US5991468A (en) * 1995-08-03 1999-11-23 Canon Kabushiki Kaisha Card-type image sensor
US5838551A (en) * 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package
JPH1084011A (ja) * 1996-09-06 1998-03-31 Hitachi Ltd 半導体装置及びこの製造方法並びにその実装方法
JPH10173107A (ja) * 1996-12-09 1998-06-26 Hitachi Ltd 半導体集積回路装置
US5907474A (en) * 1997-04-25 1999-05-25 Advanced Micro Devices, Inc. Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package
US6104608A (en) * 1997-10-30 2000-08-15 Emc Corporation Noise reduction hood for an electronic system enclosure
US6044304A (en) * 1998-04-29 2000-03-28 Medtronic, Inc. Burr ring with integral lead/catheter fixation device
JPH11354954A (ja) * 1998-06-10 1999-12-24 Fujitsu Ltd 電子装置
JP3517118B2 (ja) * 1998-07-24 2004-04-05 富士通株式会社 システムボード装置及びこれが組み込まれている機器
FR2793350B1 (fr) * 1999-05-03 2003-08-15 St Microelectronics Sa Protection d'une puce semiconductrice

Also Published As

Publication number Publication date
SE9904240D0 (sv) 1999-11-23
SE521646C2 (sv) 2003-11-18
WO2001039564A1 (en) 2001-05-31
AU1907801A (en) 2001-06-04
US6504095B1 (en) 2003-01-07

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Legal Events

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