DE60230919D1 - Chip karte mit einem grossflächigen modul - Google Patents

Chip karte mit einem grossflächigen modul

Info

Publication number: DE60230919D1
Authority: DE; Germany
Prior art keywords: chip card; card; sized module; support; sized
Prior art date: 2001-12-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60230919T

Other languages

English (en)

Inventor

Laurent Oddou

Stephane Ottobon

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Thales DIS France SA

Original Assignee

Gemalto SA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-12-20

Filing date

2002-12-18

Publication date

2009-03-05

2002-12-18 Application filed by Gemalto SA filed Critical Gemalto SA

2009-03-05 Application granted granted Critical

2009-03-05 Publication of DE60230919D1 publication Critical patent/DE60230919D1/de

2022-12-19 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Theoretical Computer Science (AREA)
Credit Cards Or The Like (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

DE60230919T 2001-12-20 2002-12-18 Chip karte mit einem grossflächigen modul Expired - Lifetime DE60230919D1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
FR0117054A FR2834103B1 (fr)	2001-12-20	2001-12-20	Carte a puce a module de surface etendue
PCT/FR2002/004429 WO2003054790A1 (fr)	2001-12-20	2002-12-18	Carte a puce a module de surface etendue

Publications (1)

Publication Number	Publication Date
DE60230919D1 true DE60230919D1 (de)	2009-03-05

Family

ID=8871090

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60230919T Expired - Lifetime DE60230919D1 (de)	2001-12-20	2002-12-18	Chip karte mit einem grossflächigen modul

Country Status (10)

Country	Link
US (1)	US7686228B2 (de)
EP (1)	EP1459249B1 (de)
JP (3)	JP2005513654A (de)
CN (1)	CN100350426C (de)
AT (1)	ATE421129T1 (de)
AU (1)	AU2002364324A1 (de)
DE (1)	DE60230919D1 (de)
ES (1)	ES2321175T3 (de)
FR (1)	FR2834103B1 (de)
WO (1)	WO2003054790A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5163776B2 (ja) *	2010-07-13	2013-03-13	株式会社デンソー	カードキー
US8950681B2 (en)	2011-11-07	2015-02-10	Blackberry Limited	Universal integrated circuit card apparatus and related methods
USD691610S1 (en) *	2011-11-07	2013-10-15	Blackberry Limited	Device smart card
US8649820B2 (en)	2011-11-07	2014-02-11	Blackberry Limited	Universal integrated circuit card apparatus and related methods
USD703208S1 (en) *	2012-04-13	2014-04-22	Blackberry Limited	UICC apparatus
US8936199B2 (en)	2012-04-13	2015-01-20	Blackberry Limited	UICC apparatus and related methods
USD701864S1 (en) *	2012-04-23	2014-04-01	Blackberry Limited	UICC apparatus
CN104778492B (zh) *	2014-01-13	2018-03-23	全宏科技股份有限公司	智能型贴片安装卡及应用其的安装方法
WO2017030964A1 (en)	2015-08-14	2017-02-23	Matthew Stern	Two-piece transaction card construction
DE102016106698A1 (de) *	2016-04-12	2017-10-12	Infineon Technologies Ag	Chipkarte und Verfahren zum Herstellen einer Chipkarte
JP1647726S (de) *	2018-02-01	2019-12-09
WO2021116239A1 (en) *	2019-12-13	2021-06-17	Covestro Deutschland Ag	Layered structures with cutting lines

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS60252992A (ja) *	1984-05-30	1985-12-13	Toshiba Corp	Ｉｃカ−ド
FR2625000B1 (fr) *	1987-12-22	1991-08-16	Sgs Thomson Microelectronics	Structure de carte a puce
DE59205116D1 (de) *	1991-05-10	1996-02-29	Gao Ges Automation Org	Verfahren und vorrichtung zum herstellen von kunststoff-formstücken mit bereichsweise reduzierter wandstärke
DE4218923A1 (de) *	1992-06-10	1992-10-22	Haiss Ulrich	Wertkarte mit elektronik-wert-chip
JPH0789277A (ja) *	1993-09-24	1995-04-04	Canon Inc	複合カードの製造方法
EP0786357A4 (de) *	1994-09-22	2000-04-05	Rohm Co Ltd	Kontaktlose chipkarte und verfahren zur herstellung derselben
US5671525A (en) *	1995-02-13	1997-09-30	Gemplus Card International	Method of manufacturing a hybrid chip card
DE29503249U1 (de) *	1995-03-08	1995-11-02	Hafner, Thomas, 78048 Villingen-Schwenningen	Chipkarte mit Wechselchip
WO1996032696A1 (fr) *	1995-04-13	1996-10-17	Dai Nippon Printing Co., Ltd.	Carte et module de circuit integre
CN2268276Y (zh) *	1996-11-11	1997-11-19	深圳市艾柯电子有限公司	超大容量ic卡
JP3960645B2 (ja) *	1996-12-27	2007-08-15	ローム株式会社	回路チップ搭載カードおよび回路チップモジュール
DE19703122C1 (de) *	1997-01-29	1998-05-20	Orga Kartensysteme Gmbh	Verfahren zur Herstellung von Datenträgern
JP4212068B2 (ja) *	1997-05-19	2009-01-21	ローム株式会社	Ｉｃカードおよびｉｃチップモジュール
KR100330651B1 (ko) *	1997-06-23	2002-03-29	사토 게니치로	Ｉｃ카드용 모듈, ｉｃ카드, 및 ｉｃ카드용 모듈의 제조방법
JPH1134553A (ja) *	1997-07-18	1999-02-09	Rohm Co Ltd	Ｉｃモジュール、およびその製造方法、ならびにこれを備えたｉｃカード
US6106317A (en) *	1997-09-26	2000-08-22	Thomas & Betts International, Inc.	IC chip card connector with pivotally and linearly movable cover
US6651891B1 (en) *	1997-11-04	2003-11-25	Elke Zakel	Method for producing contactless chip cards and corresponding contactless chip card
IL122250A (en) *	1997-11-19	2003-07-31	On Track Innovations Ltd	Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
FR2773900B1 (fr) *	1998-01-22	2000-02-18	Gemplus Card Int	Carte a circuit(s) integre(s) a contact, comportant une minicarte detachable
US6193163B1 (en) *	1998-08-31	2001-02-27	The Standard Register Company	Smart card with replaceable chip
JP4053667B2 (ja) *	1998-09-14	2008-02-27	大日本印刷株式会社	板状枠体付きｉｃキャリアおよびその製造方法
FR2783750B1 (fr) *	1998-09-29	2000-10-13	Schlumberger Ind Sa	Carte a module secable
JP2000172814A (ja) *	1998-12-02	2000-06-23	Toppan Printing Co Ltd	複合ｉｃモジュール及び複合ｉｃカード
FR2788646B1 (fr) *	1999-01-19	2007-02-09	Bull Cp8	Carte a puce munie d'une antenne en boucle, et micromodule associe
DE19906570A1 (de) *	1999-02-17	2000-08-24	Giesecke & Devrient Gmbh	Tragbarer Datenträger mit herausnehmbarer Minichipkate
FR2794264B1 (fr) *	1999-05-27	2001-11-02	Gemplus Card Int	Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte
US6634565B2 (en) *	2001-11-06	2003-10-21	Litronic, Inc.	Smart card having additional connector pads
US20030085288A1 (en) *	2001-11-06	2003-05-08	Luu Deniel V.H.	Contactless SIM card carrier with detachable antenna and carrier therefore

2001
- 2001-12-20 FR FR0117054A patent/FR2834103B1/fr not_active Expired - Fee Related
2002
- 2002-12-18 DE DE60230919T patent/DE60230919D1/de not_active Expired - Lifetime
- 2002-12-18 WO PCT/FR2002/004429 patent/WO2003054790A1/fr active Application Filing
- 2002-12-18 JP JP2003555433A patent/JP2005513654A/ja active Pending
- 2002-12-18 US US10/498,550 patent/US7686228B2/en not_active Expired - Fee Related
- 2002-12-18 CN CNB028254244A patent/CN100350426C/zh not_active Expired - Fee Related
- 2002-12-18 ES ES02799098T patent/ES2321175T3/es not_active Expired - Lifetime
- 2002-12-18 AT AT02799098T patent/ATE421129T1/de not_active IP Right Cessation
- 2002-12-18 AU AU2002364324A patent/AU2002364324A1/en not_active Abandoned
- 2002-12-18 EP EP02799098A patent/EP1459249B1/de not_active Expired - Lifetime
2009
- 2009-03-31 JP JP2009088155A patent/JP2009187564A/ja active Pending
2012
- 2012-11-22 JP JP2012256477A patent/JP5840115B2/ja not_active Expired - Fee Related

Also Published As

Publication number	Publication date
JP2009187564A (ja)	2009-08-20
ATE421129T1 (de)	2009-01-15
FR2834103A1 (fr)	2003-06-27
CN100350426C (zh)	2007-11-21
AU2002364324A1 (en)	2003-07-09
JP2005513654A (ja)	2005-05-12
EP1459249B1 (de)	2009-01-14
CN1605085A (zh)	2005-04-06
JP2013058252A (ja)	2013-03-28
EP1459249A1 (de)	2004-09-22
WO2003054790A1 (fr)	2003-07-03
US7686228B2 (en)	2010-03-30
WO2003054790A8 (fr)	2005-04-07
FR2834103B1 (fr)	2004-04-02
ES2321175T3 (es)	2009-06-03
US20050001039A1 (en)	2005-01-06
JP5840115B2 (ja)	2016-01-06

Publication	Publication Date	Title
ATE362656T1 (de)	2007-06-15	Photovoltaisches modul
DE60128110D1 (de)	2007-06-06	Quartzkristall Sensorzelle
DE60230919D1 (de)	2009-03-05	Chip karte mit einem grossflächigen modul
DE69830883D1 (de)	2005-08-25	Halbleiterbauelement und mit diesem Bauelement bestückte Leiterplatte
KR910007401A (ko)	1991-04-30	Ic 실장장치
DE69635603D1 (de)	2006-01-26	Höckerkontakt für eine Leiterplatte und Halbleitermodul mit derselben
DE69839841D1 (de)	2008-09-18	Chipkarte mit anwendungsinhaltsverzeichnis
NO990099D0 (no)	1999-01-11	Integrert kretskort, samt relatert applikasjonsmodul
SG89299A1 (en)	2002-06-18	Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument
DE69813208D1 (de)	2003-05-15	Chipkarte mit datenumsetzer
ATE231635T1 (de)	2003-02-15	Verfahren zum herstellen einer kontaktlosen chipkarte
DE50015826D1 (de)	2010-02-04	Display zur Integration in kartenförmige Trägermedien
BR9808062A (pt)	2000-03-08	Módulo eletrônico para cartão de microplaqueta
DE60227890D1 (de)	2008-09-11	Umgossene Leiterplatte mit unterfülltem oberflächenmontierten Bauelement und Herstellungsverfahren
DE50005482D1 (de)	2004-04-08	Chipmodul zum Einbau in einen Chipkartenträger
ATE341799T1 (de)	2006-10-15	Datenträger mit transponderspule
MY129266A (en)	2007-03-30	Integrated circuit package with a capacitor
DE59914917D1 (de)	2009-01-15	Chipkarte mit integrierter Schaltung
ATE550734T1 (de)	2012-04-15	Chipkarte
DE69013646D1 (de)	1994-12-01	Integrierte Halbleiterschaltungsvorrichtung mit Kontaktierungsflächen am Rande des Halbleiterchips.
DE60226076D1 (de)	2008-05-21	Kühlungseinrichtung mit direkter kühlung von aktiven elektronischen komponenten
ATE267694T1 (de)	2004-06-15	Vorrichtung zur klebemittelübertragung
BR9714203A (pt)	2000-03-28	Módulo de cartão de chip
SE9900962L (sv)	2000-09-18	Förfarande och anordning för komponentkontaktering
FR2770962B1 (fr)	2003-10-24	Dispositif de maintien pour panneaux de circuit imprime

Legal Events

Date	Code	Title	Description
2010-02-04	8364	No opposition during term of opposition