RU2015129312A - Электронные устройства, содержащие бутилкаучук - Google Patents
Электронные устройства, содержащие бутилкаучук Download PDFInfo
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- RU2015129312A RU2015129312A RU2015129312A RU2015129312A RU2015129312A RU 2015129312 A RU2015129312 A RU 2015129312A RU 2015129312 A RU2015129312 A RU 2015129312A RU 2015129312 A RU2015129312 A RU 2015129312A RU 2015129312 A RU2015129312 A RU 2015129312A
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- Prior art keywords
- monomer
- vinyl
- polyolefin
- sealing layer
- hours
- Prior art date
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- 239000000178 monomer Substances 0.000 claims 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 5
- 229920000098 polyolefin Polymers 0.000 claims 5
- 238000007789 sealing Methods 0.000 claims 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 4
- 229920005549 butyl rubber Polymers 0.000 claims 4
- 239000012038 nucleophile Substances 0.000 claims 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 3
- 229910052757 nitrogen Inorganic materials 0.000 claims 3
- 229910052698 phosphorus Inorganic materials 0.000 claims 3
- 239000011574 phosphorus Substances 0.000 claims 3
- 229920002554 vinyl polymer Polymers 0.000 claims 3
- FRPLKHQCXVNBNO-UHFFFAOYSA-N (4-ethenylphenyl)-diphenylphosphane Chemical compound C1=CC(C=C)=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 FRPLKHQCXVNBNO-UHFFFAOYSA-N 0.000 claims 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims 2
- 230000026030 halogenation Effects 0.000 claims 2
- 238000005658 halogenation reaction Methods 0.000 claims 2
- 229910017604 nitric acid Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 2
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 claims 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 claims 1
- QDZXSLUJYIHQDN-UHFFFAOYSA-N 2-ethenyl-9-ethylcarbazole Chemical compound C1=C(C=C)C=C2N(CC)C3=CC=CC=C3C2=C1 QDZXSLUJYIHQDN-UHFFFAOYSA-N 0.000 claims 1
- IGDLZDCWMRPMGL-UHFFFAOYSA-N 2-ethenylisoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(C=C)C(=O)C2=C1 IGDLZDCWMRPMGL-UHFFFAOYSA-N 0.000 claims 1
- LPIQIQPLUVLISR-UHFFFAOYSA-N 2-prop-1-en-2-yl-4,5-dihydro-1,3-oxazole Chemical compound CC(=C)C1=NCCO1 LPIQIQPLUVLISR-UHFFFAOYSA-N 0.000 claims 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 claims 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 1
- -1 aliphatic diene Chemical class 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- PDDYFPPQDKRJTK-UHFFFAOYSA-N diphenyl(prop-2-enyl)phosphane Chemical compound C=1C=CC=CC=1P(CC=C)C1=CC=CC=C1 PDDYFPPQDKRJTK-UHFFFAOYSA-N 0.000 claims 1
- AJVBXLXLODZUME-UHFFFAOYSA-N ethenyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C=C)C1=CC=CC=C1 AJVBXLXLODZUME-UHFFFAOYSA-N 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910003437 indium oxide Inorganic materials 0.000 claims 1
- 229920000554 ionomer Polymers 0.000 claims 1
- NFWSQSCIDYBUOU-UHFFFAOYSA-N methylcyclopentadiene Chemical compound CC1=CC=CC1 NFWSQSCIDYBUOU-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 125000002950 monocyclic group Chemical group 0.000 claims 1
- FLEBNGWAHUAGKT-UHFFFAOYSA-N n,n-bis(prop-2-enyl)butan-1-amine Chemical compound CCCCN(CC=C)CC=C FLEBNGWAHUAGKT-UHFFFAOYSA-N 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- NDIFDGDMWAZLDH-UHFFFAOYSA-N phenyl-bis(prop-2-enyl)phosphane Chemical compound C=CCP(CC=C)C1=CC=CC=C1 NDIFDGDMWAZLDH-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 150000003440 styrenes Chemical class 0.000 claims 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 1
- 229910001887 tin oxide Inorganic materials 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/18—Layered products comprising a layer of natural or synthetic rubber comprising butyl or halobutyl rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Claims (23)
1. Электрическое устройство, содержащее слой подложки, проводящий слой и герметизирующий слой, причем, по меньшей мере, герметизирующий слой содержит вулканизированный бутилкаучук.
2. Устройство по п. 1, в котором устройство характеризуется увеличением электрического сопротивления на менее чем 360% после подвергания действию пара азотной кислоты в течение 12 часов или пара хлористоводородной кислоты в течение 10 часов.
3. Устройство по п.п. 1 или 2, в котором устройство характеризуется изменением коэффициента оптического пропускания при 365 нм на менее чем 15% после подвергания действию пара азотной кислоты в течение 12 часов или пара хлористоводородной кислоты в течение 10 часов.
4. Устройство по п. 1 или 2, в котором проводящий слой содержит серебро.
5. Устройство по п. 1 или 2, в котором проводящий слой содержит оксид индия и олова.
6. Устройство по п. 1 или 2, в котором слой подложки содержит стекло.
7. Устройство по п. 1 или 2, в котором герметизирующий слой содержит наполнитель.
8. Устройство по п. 1 или 2, в котором герметизирующий слой содержит бутилкаучук, содержащий повторяющиеся звенья, полученные из по меньшей мере одного изоолефинового мономера, и повторяющиеся звенья, полученные из одного или нескольких полиолефиновых мономеров.
9. Устройство по п. 8, в котором герметизирующий слой содержит бутилкаучук, содержащий повторяющиеся звенья, полученные из по меньшей мере одного изоолефинового мономера, и повторяющиеся звенья, полученные из продукта реакции, после галогенирования, одного или нескольких полиолефиновых мономеров и по меньшей мере одного нуклеофила на основе азота или фосфора, содержащего боковую винильную группу.
10. Устройство по п. 8, в котором изоолефиновый мономер содержит С4-С8-изомоноолефиновый мономер.
11. Устройство по п. 10, в котором изоолефиновый мономер содержит изобутилен.
12. Устройство по п. 8, в котором полиолефиновый мономер содержит С5-С11 сопряженный алифатический диеновый мономер.
13. Устройство по п. 12, в котором полиолефиновый мономер содержит изопрен.
14. Устройство по п. 8, в котором полиолефиновый мономер находится в количестве всего 0,5-2,5 мольн. % перед галогенированием.
15. Устройство по п. 8, в котором иономер на основе бутилкаучука дополнительно содержит один или несколько сополимеризуемых алкилзамещенных винильных ароматических сомономеров.
16. Устройство по п. 15, в котором сомономер содержит С1-C4-алкилзамещенный стирол.
17. Устройство по п. 16, в котором сомономер содержит α-метилстирол, п-метилстирол, хлорстирол, циклопентадиен или метилциклопентадиен.
18. Устройство по п. 9, в котором нуклеофил на основе азота или фосфора выбран согласно формуле,
где А представляет собой азот или фосфор; и
R1, R2 и R3 независимо выбраны и содержат: линейные или разветвленные C1-C18-алкильные заместители; арильный заместитель, который является моноциклическим или состоит из сконденсированных С4-С8-колец; или их комбинаций, причем по меньшей мере один из R1, R2 или R3 содержит боковую винильную группу.
19. Устройство по п. 18, в котором нуклеофил выбран из группы, состоящей из дифенилфосфиностирола, аллилдифенилфосфина, диаллилфенилфосфина, дифенилвинилфосфина, триаллилфенилфосфина, N-винилкапролактама, N-винилфталимида, 9-винилкарбазола, N-[3-(диметиламино)пропил]метакриламида, дифенилвинилфосфинметил-N-винилацетамида, N-аллил-N-бутил-2-пропен-1-амина, 1-винил-2-пирролидона, 2-изопропенил-2-оксазолина, 2-винилпирид-4-винилпиридина, N-этил-2-винилкарбазола и их смесей.
20. Устройство по п. 19, в котором нуклеофил содержит дифенилфосфиностирол.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261738707P | 2012-12-18 | 2012-12-18 | |
| US61/738,707 | 2012-12-18 | ||
| PCT/CA2013/001043 WO2014094120A1 (en) | 2012-12-18 | 2013-12-17 | Electronic devices comprising butyl rubber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2015129312A true RU2015129312A (ru) | 2017-01-26 |
| RU2654030C2 RU2654030C2 (ru) | 2018-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| RU2015129312A RU2654030C2 (ru) | 2012-12-18 | 2013-12-17 | Электронные устройства, содержащие бутилкаучук |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US20150319875A1 (ru) |
| EP (1) | EP2936946A4 (ru) |
| JP (1) | JP6359557B2 (ru) |
| KR (1) | KR102201099B1 (ru) |
| CN (1) | CN105359628B (ru) |
| CA (1) | CA2894631C (ru) |
| RU (1) | RU2654030C2 (ru) |
| SA (1) | SA515360647B1 (ru) |
| SG (1) | SG11201504722UA (ru) |
| TW (1) | TWI623428B (ru) |
| WO (1) | WO2014094120A1 (ru) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10103037B2 (en) * | 2014-05-09 | 2018-10-16 | Intel Corporation | Flexible microelectronic systems and methods of fabricating the same |
| KR102381617B1 (ko) | 2015-09-07 | 2022-03-31 | 삼성전자주식회사 | 반도체 장치의 동작 방법 및 반도체 시스템 |
| EP3518278A1 (en) | 2018-01-30 | 2019-07-31 | Infineon Technologies AG | Power semiconductor module and method for producing the same |
| RU2750384C2 (ru) * | 2019-11-08 | 2021-06-28 | Ирина Александровна Косырихина | Способ усиления защиты и устранения вредящих факторов установки дополнительного защитного стекла |
| CN113621163A (zh) * | 2021-08-17 | 2021-11-09 | 南方科技大学 | 一种柔性封装材料及其制备方法 |
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| US6069185A (en) * | 1998-11-25 | 2000-05-30 | Dow Corning Asia, Ltd. | Radiation curable compositions containing alkenyl ether functional polyisobutylenes |
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| US7687119B2 (en) * | 2005-04-04 | 2010-03-30 | Henkel Ag & Co. Kgaa | Radiation-curable desiccant-filled adhesive/sealant |
| CA2578583C (en) * | 2006-03-14 | 2014-06-03 | Lanxess Inc. | Butyl ionomer having improved surface adhesion |
| US7696621B2 (en) * | 2006-07-05 | 2010-04-13 | Microstrain, Inc. | RFID tag packaging system |
| CA2593510A1 (en) * | 2006-08-24 | 2008-02-24 | Lanxess Inc. | Butyl adhesive containing maleic anhydride and optional nanoclay |
| CA2604409C (en) | 2006-12-22 | 2015-04-07 | Lanxess Inc. | Butyl rubber ionomer nanocomposites |
| US7722786B2 (en) * | 2007-02-23 | 2010-05-25 | Henkel Ag & Co. Kgaa | Conductive materials |
| EP2291477B1 (en) * | 2008-06-02 | 2016-03-23 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
| EP2343327B1 (en) | 2008-10-22 | 2013-07-24 | DIC Corporation | Curable resin composition and cured product thereof, printed circuit board, and epoxy resin and method for producing same |
| JP2012516061A (ja) * | 2009-01-22 | 2012-07-12 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 太陽電池モジュール用のキレート剤を含むポリ（ビニルブチラール）封止材 |
| US8969717B2 (en) * | 2010-08-12 | 2015-03-03 | Aeris Capital Sustainable Ip Ltd. | Thermoelectric stack coating for improved solar panel function |
| US9045626B2 (en) * | 2010-08-13 | 2015-06-02 | LANXESS International S.A. | Butyl ionomer latex |
| WO2012040637A2 (en) * | 2010-09-24 | 2012-03-29 | The Regents Of The University Of California | Nanowire-polymer composite electrodes |
| TW201235359A (en) * | 2010-11-24 | 2012-09-01 | Lanxess Inc | Ionomers comprising pendant vinyl groups and processes for preparing same |
| US8629209B2 (en) * | 2010-12-02 | 2014-01-14 | 3M Innovative Properties Company | Moisture curable isobutylene adhesive copolymers |
-
2013
- 2013-12-17 SG SG11201504722UA patent/SG11201504722UA/en unknown
- 2013-12-17 WO PCT/CA2013/001043 patent/WO2014094120A1/en active Application Filing
- 2013-12-17 EP EP13865318.3A patent/EP2936946A4/en not_active Withdrawn
- 2013-12-17 CN CN201380073314.8A patent/CN105359628B/zh not_active Expired - Fee Related
- 2013-12-17 CA CA2894631A patent/CA2894631C/en active Active
- 2013-12-17 RU RU2015129312A patent/RU2654030C2/ru active
- 2013-12-17 US US14/651,507 patent/US20150319875A1/en not_active Abandoned
- 2013-12-17 JP JP2015548119A patent/JP6359557B2/ja not_active Expired - Fee Related
- 2013-12-17 TW TW102146507A patent/TWI623428B/zh not_active IP Right Cessation
- 2013-12-17 KR KR1020157019037A patent/KR102201099B1/ko not_active Expired - Fee Related
-
2015
- 2015-06-18 SA SA515360647A patent/SA515360647B1/ar unknown
-
2020
- 2020-01-10 US US16/739,772 patent/US11013133B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN105359628B (zh) | 2019-11-15 |
| JP2016504765A (ja) | 2016-02-12 |
| JP6359557B2 (ja) | 2018-07-18 |
| US20200154587A1 (en) | 2020-05-14 |
| CA2894631A1 (en) | 2014-06-26 |
| KR102201099B1 (ko) | 2021-01-11 |
| RU2654030C2 (ru) | 2018-05-15 |
| CA2894631C (en) | 2021-06-08 |
| SA515360647B1 (ar) | 2017-05-31 |
| TWI623428B (zh) | 2018-05-11 |
| US11013133B2 (en) | 2021-05-18 |
| US20150319875A1 (en) | 2015-11-05 |
| KR20150126342A (ko) | 2015-11-11 |
| TW201437021A (zh) | 2014-10-01 |
| SG11201504722UA (en) | 2015-07-30 |
| EP2936946A4 (en) | 2016-08-17 |
| WO2014094120A1 (en) | 2014-06-26 |
| CN105359628A (zh) | 2016-02-24 |
| EP2936946A1 (en) | 2015-10-28 |
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