KR930016489A - 결정성 폴리프로필렌 수지 조성물 및 아미드 화합물 - Google Patents
결정성 폴리프로필렌 수지 조성물 및 아미드 화합물 Download PDFInfo
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- KR930016489A KR930016489A KR1019930000839A KR930000839A KR930016489A KR 930016489 A KR930016489 A KR 930016489A KR 1019930000839 A KR1019930000839 A KR 1019930000839A KR 930000839 A KR930000839 A KR 930000839A KR 930016489 A KR930016489 A KR 930016489A
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- amide compound
- dicyclohexyl
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0083—Nucleating agents promoting the crystallisation of the polymer matrix
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C233/00—Carboxylic acid amides
- C07C233/64—Carboxylic acid amides having carbon atoms of carboxamide groups bound to carbon atoms of six-membered aromatic rings
- C07C233/65—Carboxylic acid amides having carbon atoms of carboxamide groups bound to carbon atoms of six-membered aromatic rings having the nitrogen atoms of the carboxamide groups bound to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/06—Systems containing only non-condensed rings with a five-membered ring
- C07C2601/08—Systems containing only non-condensed rings with a five-membered ring the ring being saturated
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/14—The ring being saturated
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/18—Systems containing only non-condensed rings with a ring being at least seven-membered
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/18—Systems containing only non-condensed rings with a ring being at least seven-membered
- C07C2601/20—Systems containing only non-condensed rings with a ring being at least seven-membered the ring being twelve-membered
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
Claims (21)
- 결정성 폴리프로필렌 수지; 및 하기 식(1)의 아미드 화합물, 하기 식(2)의 아미드 화합물 및 하기 식(3)의 아미드 화합물로 구성된 군에서 선택된 1종 이상이며 β-형 결정의 비율을 증대시키기 위한 유효량으로 조성물내에 존재하는 β-핵제를 함유함을 특징으로 하는 결정성 폴리프로필렌 수지 조성물.R2-NHCO-R1-CONH-R3(1)[상기 식중, R1은 C3~20포화 또는 불포화 지방족 디카르복실산 잔기, C|8~30포화 또는 불포화 지환족 디카르복실산 잔기 또는 C8~30방향족 디카르복실산 잔기이고; R2및 R3은 동일하거나 상이하며, 각각은 C3~12시클로알킬기, C3~12시클로알케닐기 또는 식(식중, R4은 수소원자, C1~12직쇄 또는 측쇄 알킬기, C2~12직쇄 또는 측쇄 알케닐기, C6~10시클로알킬기 또는 페닐기이고; R5은 C1~12직쇄 또는 측쇄 알킬기, C2~C|12직쇄 또는 측쇄 알케닐기, C8~C10시클로알킬기 또는 페닐기이며; R6및 R7은 각각 C1~C4직쇄 또는 측쇄 알킬렌기이고; 단 R4가 수소원자, C1~12알킬기 또는 C6~10시클로알킬기일 경우 R1은 C6또는 C8포화 지방족 디카르복실산 잔기이다)의 기이다]R9-CONH-R8-NHCO-R10(2)[상기 식중, R8은 C4~28지환족 디아민 잔기, C4~14복소환 디아민 잔기 또는 C6~28방향족 디아민 잔기이고; R9및 R10은 동일하거나 상이하며, 각각은 C3~12시클로알킬기, C3~12시클로알케닐기 또는 식(식중, R11은 수소원자, C1~12직쇄 또는 측쇄 알킬기, C2~12직쇄 또는 측쇄 알케닐기, C6~10시클로알킬기 또는 페닐기이고; R12은 C1~12직쇄 또는 측쇄 알킬기, C2~12알케닐기, C6~10시클로알킬기 또는 페닐기이며; R13및 R14은 각각 C1~4직쇄 또는 측쇄 알킬렌기이고; 단 R8은는 아니다)의 기이다]R16-CONH-R15-CONH-R17(3)[상기 식중, R15은 C2~29포화 또는 불포화 지방족 아미노산 잔기, C7~13포화 또는 불포화 지환족 아미노산 잔기 또는 C7~15방향족 아미노산 잔기이고; R16및 R17동일하거나 상이하며, R16은 식(2)의 R9또는 R10과 동일한 의미를 갖고 R17은 식(1)의 R2또는 R3과 동일한 의미를 갖는다]
- 제1항에 있어서, β-핵제가 식(1)의 아미드 화합물인 조성물.
- 제2항에 있어서, β-핵제가 식중 R1은 -(CH2)4-,이고; R2및 R3은 동일하거나 상이하며, 각각은 C6~8시클로알킬이거나 또는 C1~4알킬 또는 시클로헥실기로 치환된 페닐기인 식(1)의 아미드화합물인 조성물.
- 제2항에 있어서, β-핵제가 N,N'-디시클로헥실테레프탈아미드, N,N'-디시클로헥실-2,6-나프탈렌디카르복스아미드, N,N'-디시클로옥틸-2,6-나프탈렌디카르복스아미드, N,N'-디시클로헥실-1,4-시클로헥산디카르복스아미드, N,N'-디시클로헥실-4,4'-비페닐디카르복스아미드, N,N-비스(p-메탈페닐) 헥산디아미드, N,N'-비스(p-에틸페닐) 헥산디아미드, N,N'-비스(4-시클로헥실페닐) 헥산디아미드, N,N'-디페닐헥산디아미드 및 N,N'-디페닐옥탄디아미드로 구성된 군에서 선택된 1종 이상의 아미드 화합물인 조성물.
- 제2항에 있어서, β-핵제가 N,N'-디시클로헥실테레프탈아미드, N,N'-디시클로헥실-2,6-나프탈렌디카르복스아미드 및 N,N'-디시클로헥실-4,4'-비페닐디카르복스아미드로 구성된 군에서 선택된 1종 이상의 아미드 화합물인 조성물.
- 제1항에 있어서, β-핵제가 식(2)의 아미드 화합물인 조성물.
- 제6항에 있어서, β-핵제가 식중 R8은또는이고; R9및 R10은 동일하거나 상이하며, 각각은 시클로헥실기 또는 페닐기인 식(2)의 아미드 화합물인 조성물.
- 제6항에 있어서, β-핵제가 N,N'-1,4-페닐렌비스-시클로헥산카르복스아미드, N,N'-1,5-나프탈렌비스-벤즈아미드, N,N'-1,4-시클로헥산비스-벤즈아미드 및 N,N'-1,4-시클로헥산비스-시클로헥산카르복스아미드로 구성된 군에서 선택된 1종 이상의 화합물인 조성물.
- 제1항에 있어서, β-핵제가 식(3)의 아미드 화합물인 조성물.
- 제9항에 있어서, β-핵제가 N-시클로헥실-4-(N-시클로헥실 카르보닐아미노)-벤즈아미드 및 N-페닐-5(N-벤조일아미노)-펜탄아미드로 구성된 군에서 선택된 1종 이상의 화합물인 조성물.
- 결정성 폴리프로필렌 수지 및 β-형 결정의 비율을 증대시키기 위한 유효량으로 제1항의 식(1), (2) 및 (3)의 아미드 화합물로 구성된 군에서 선택된 1종 이상의 β-핵제를 함유하는 결정성 폴리프로필렌 수지 조성물을 성형함을 특징으로 하는 결정성 폴리프로필렌 수지 성형물내의 β-형 결정의 비율을 증대시키는 방법.
- 제11항에 있어서, β-핵제가 식(1)의 아미드 화합물인 방법.
- 제12항에 있어서, β-핵제가 식중 R1-(CH2)4-,또는이고; R2및 R3은 동일하거나 상이하며; 각각은 C6~8시클로알킬이거나 또는 C1~4알킬 또는 시클로헥실기로 치환된 페닐기인 식(1)의 아미드화합물인 방법.
- 제12항에 있어서, β-핵제가 N,N'-디시클로헥실테레프탈아미드, N,N'-디시클로헥실-2,6-나프탈렌디카르복스아미드, N,N'-디시클로옥틸-2,6-나프탈렌디카르복스아미드, N,N'-디시클로헥실-1,4-시클로헥산디카르복스아미드, N,N'-디시클로헥실-4,4'-비페닐디카르복스아미드, N,N-비스(p-메탈페닐) 헥산디아미드, N,N'-비스(p-에틸페닐) 헥산디아미드, N,N'-비스(4-시클로헥실페닐) 헥산디아미드, N,N'-디페닐헥산디아미드 및 N,N'-디페닐옥탄디아미드로 구성된 군에서 선택된 1종 이상의 아미드 화합물인 방법.
- 제12항에 있어서, β-핵제가 N,N'-디시클로헥실테레프탈아미드, N,N'-디시클로헥실-2,6-나프탈렌디카르복스아미드 및 N,N'-디시클로헥실-4,4'-비페닐다카르복스아미드로 구성된 군에서 선택된 1종 이상의 아미드 화합물인 조성물.
- 제11항에 있어서, β-핵제가 식(2)의 아미드 화합물인 조성물.
- 제16항에 있어서, β-핵제가 식중 R8은또는이고; R9및 R10은 동일하거나 상이하며, 각각은 시클로헥실기 또는 페닐기인 식(2)의 아미드 화합물인 조성물.
- 제16항에 있어서, β-핵제가 N,N'-1,4-페닐렌비스-시클로헥산카르복스아미드, N,N'-1,5-나프탈렌비스-벤즈아미드, N,N'-1,4-시클로헥산비스-벤즈아미드 및 N,N'-1,4-시클로헥산비스-시클로헥산카르복스아미드로 구성된 군에서 선택된 1종 이상의 화합물인 방법.
- 제11항에 있어서, β-핵제가 식(3)의 아미드 화합물인 방법.
- 제19항에 있어서, β-핵제가 N-시클로헥실-4-(N-시클로헥실 카르보닐아미노)-벤즈아미드 및 N-페닐-5-(N-벤조일아미노)-펜탄아미드로 구성된 군에서 선택된 1종 이상의 화합물인 방법.
- 하기 식(4)의 아미드 화합물.R19-NHCO-R18-CONH-R20(4)[상기 식중, R18은또는이고; R19및 R20은 동일하거나 상이하며, 각각은 탄소수 5~12의 시클로 알킬기이다.]※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1019990028893A KR100266916B1 (ko) | 1992-01-24 | 1999-07-16 | 신규 아미드 화합물 |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
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JP3408892 | 1992-01-24 | ||
JP92-34088 | 1992-01-24 | ||
JP13589292A JP3243835B2 (ja) | 1992-04-27 | 1992-04-27 | 新規なアミド系化合物 |
JP92-135892 | 1992-04-27 | ||
JP28368992A JP3374419B2 (ja) | 1992-09-28 | 1992-09-28 | 結晶性ポリプロピレン系樹脂組成物 |
JP92-283689 | 1992-09-28 | ||
JP92-324807 | 1992-11-09 | ||
JP32480792A JP3374423B2 (ja) | 1992-01-24 | 1992-11-09 | 結晶性ポリプロピレン系樹脂組成物 |
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KR1019990028893A Division KR100266916B1 (ko) | 1992-01-24 | 1999-07-16 | 신규 아미드 화합물 |
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KR930016489A true KR930016489A (ko) | 1993-08-26 |
KR100242873B1 KR100242873B1 (ko) | 2000-02-01 |
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KR1019930000839A Expired - Fee Related KR100242873B1 (ko) | 1992-01-24 | 1993-01-21 | 결정성 폴리프로필렌 수지 조성물 및 아미드화합물 |
Country Status (4)
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US (1) | US6235823B1 (ko) |
EP (2) | EP0962489B1 (ko) |
KR (1) | KR100242873B1 (ko) |
DE (2) | DE69329508T2 (ko) |
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GB2323327A (en) * | 1997-03-18 | 1998-09-23 | Hoechst Trespaphan Gmbh | Polyolefin film |
CN1184256C (zh) * | 1997-08-19 | 2005-01-12 | 出光石油化学株式会社 | 丙烯聚合物组合物及由其制备的薄膜 |
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- 1993-01-13 US US08/003,659 patent/US6235823B1/en not_active Expired - Lifetime
- 1993-01-21 KR KR1019930000839A patent/KR100242873B1/ko not_active Expired - Fee Related
- 1993-01-22 DE DE69329508T patent/DE69329508T2/de not_active Expired - Lifetime
- 1993-01-22 EP EP99116744A patent/EP0962489B1/en not_active Expired - Lifetime
- 1993-01-22 EP EP93101000A patent/EP0557721B1/en not_active Expired - Lifetime
- 1993-01-22 DE DE69333629T patent/DE69333629T2/de not_active Expired - Lifetime
Cited By (1)
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KR100588244B1 (ko) * | 1997-03-18 | 2006-09-27 | 트레스파판 게엠베하 | 중합체성라벨의제조방법,라벨적재물및이의제조방법,및라벨링방법 |
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DE69329508T2 (de) | 2001-05-03 |
DE69333629T2 (de) | 2005-09-22 |
EP0962489A3 (en) | 2000-04-26 |
US6235823B1 (en) | 2001-05-22 |
EP0557721A3 (ko) | 1995-03-15 |
DE69333629D1 (de) | 2004-10-21 |
EP0557721B1 (en) | 2000-10-04 |
EP0962489B1 (en) | 2004-09-15 |
EP0557721A2 (en) | 1993-09-01 |
DE69329508D1 (de) | 2000-11-09 |
EP0962489A2 (en) | 1999-12-08 |
KR100242873B1 (ko) | 2000-02-01 |
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PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20121116 |
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P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |