JPH0614600B2 - LCR multilayer board - Google Patents

Description

TECHNICAL FIELD The present invention relates to an LCR multilayer board. More specifically, the present invention relates to an LCR multilayer board having an LCR as an inner layer, which enables high-speed signal processing, high-density wiring, and high functionality of the LCR.

(Prior Art) With respect to a mounting plate used in electric and electronic devices, demands for higher signal processing speed, higher wiring density, and smaller mounting size are increasing. In order to achieve this, the study of the material composition of wiring boards and their multilayering is progressing rapidly.

Conventionally, for a multilayer board on the front line of such technological progress, epoxy resin, polyimide resin, or fluorine resin, polybutadiene resin, etc. have been used as a low dielectric constant resin as a material resin constituting the multilayer board. The improvement of the characteristics corresponding to the material resin has been vigorously promoted.

On the other hand, the trend toward high-density and miniaturization of circuits and packaging due to multi-layering has led to the development of multi-layer boards in which an LCR, which is a circuit element composed of a coil (L), a capacitor (C) and a resistor (R), is formed as an inner layer. It is developing.

(Problems to be Solved by the Invention) However, the conventional multilayer board technology has not reached the stage where the various required characteristics and performances are sufficiently satisfied.

For example, regarding the resin that constitutes the multi-layer board, conventional epoxy resin and polyimide resin have excellent workability, but since both the dielectric constant and the dielectric loss are large, it is not possible to cope with high signal processing speed. Can not. On the other hand, although the fluorine resin and the polybutadiene resin have a low induction rate, they have drawbacks that they are inferior in workability, difficult to through-hole plating, and inferior in dimensional stability. Furthermore, in the case of these resins, there is a problem that the cost becomes high.

Therefore, it has been demanded to realize a new resin for a multilayer board which has good heat resistance, processability, and dimensional stability, can be easily multilayered, and has a low dielectric constant and can stably perform high-speed signal processing. It was

In addition to this restriction on the material, many problems remain in terms of high density. For example, when a digital IC is mounted, it is the actual situation that a large amount of capacitors are attached to each pin of the IC in order to prevent malfunction and noise, and the capacitor function is provided by a copper plate as a resin layer on the laminated plate. Has also been proposed (JP-A-62-128597, JP-A-56-79425).
However, in reality, it is completely unsatisfactory, and there are many restrictions on the configuration, and the fact that the resin layer of the multilayer board has the capacitor function has not been realized yet. Even in the present situation where an LCR multilayer board is proposed, how to form the structure of the coil (L) and the capacitor (C) in the multilayer board is still an unsolved problem.

For this reason, what kind of advanced function is to be realized in a multi-layered board which is going to a new dimension as an LCR multi-layered board is an extremely important issue.

(Means for Solving the Problems) The present invention has been made in view of the circumstances as described above, and solves the problems of the conventional multilayer board, and improves the characteristics and density of the resin constituting the multilayer board. The purpose of the present invention is to provide a new LCR multilayer board which is capable of enhancing the function of the LCR while controlling the dielectric constant of each layer of the multilayer board in order to realize high-speed signal processing and high density, by associating with the LCR function.

In order to achieve this object, the present invention has an inner layer having one or more LCRs, and a high dielectric constant layer and a low dielectric constant layer containing at least a polyphenine oxide resin. And LCR multilayer board.

That is, the multilayer board of the present invention has an LCR formed on the inner layer.
Each element of the coil (L), capacitor (C),
Corresponding to the function of resistance (R), the dielectric constants of the multilayer resin layers are made different, the high dielectric constant layer and the low dielectric constant layer are integrally disposed, and the low dielectric constant layer is at least It is characterized by containing a polyphenylene oxide resin. For example, a resin layer corresponding to a capacitor is provided with a layer made of a resin having a high dielectric constant so as to have a function of a stabilizing capacitor to stabilize the power supply and, on the other hand, a circuit section related to high-speed signal processing. As described above, as the resin layer, a layer made of a resin having a low dielectric constant containing at least a polyphenylene oxide resin is provided.

Examples of the resin constituting the resin layer of such a multilayer board include the above-mentioned polyphenylene oxide resin, an epoxy resin which has been conventionally used alone as a resin layer of a multilayer board,
Polyimide resin, fluorine resin, modified polyimide resin, polyester resin, BT resin, polybudadiene resin, and polyphenylene oxide resin can be used.

For example, at least a ponyphenylene oxide resin is used for the resin layer having a low dielectric constant, and a fluororesin, a polybutadiene resin, or the like can be commonly used for adjusting the dielectric constant. An epoxy resin, a polyimide resin, a modified polyimide resin, a polyester resin, or the like can be used for the resin layer having a high dielectric constant. There is no particular limitation on the type of each of these resins, and those having an appropriate dielectric constant can be used in consideration of heat resistance, dimensional stability, chemical resistance, and the like.

Note that it is not always necessary to use different types of resins in combination as the resins forming the resin layers. Even if they are of the same type, the layers having different dielectric constants can be made different by blending fillers and the like. When a resin having a desired dielectric constant is obtained, these same resins may be used in combination. For example, even if the same kind of resin is used, the dielectric constant will be changed by blending a machine-made filler.

The multilayer board of the present invention has resin layers of various dielectric constants suitable for the use of wiring as described above. In addition to this, strict control of the dielectric constant is particularly required even for the resin layers constituting the multilayer board. In the layer not required, a layer made of a resin which has been conventionally used as a resin layer of a multilayer board can be used without particular limitation.

When laminating a resin layer and a core resin layer having a predetermined dielectric constant on a multilayer board, a sheet or prepreg can be produced from these resins and laminated in the form of a core material or an adhesive layer. Any resin layer can be used as the core material, but the resin used as the adhesive prepreg has a different molding temperature as shown in Table 1 depending on the type of resin, so that the compatibility with the core material to be adhered is a problem. become. Therefore, it is preferable to consider the combination of resins in relation to the molding temperature. As a concrete guide, the compatibility of the combination of the prepreg and the core material can be shown in Table 2.

A circuit is formed in advance in the core material so that the required structure for LCR is obtained.

A predetermined combination of the resin layers is laminated with the metal foil for forming a circuit on the outermost layer surface, and laminated and integrated by a conventional method. L on the inner layer after required etching and through hole processing
A multilayer board having CR is obtained.

The multilayer board of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows one structural example of the multilayer board of the present invention. The multilayer board (2) of this example equipped with the IC (1) is
It has eight resin layers. On the inner layer of the multilayer board (2), as shown in the figure, an LCR including a large capacity capacitor (A), a small capacity capacitor (B), a coil (C) and a resistor (D) is formed. .

Corresponding to this LCR configuration, a large-capacity capacitor (A)
Part contains a high dielectric constant resin layer (3), the small capacity capacitor (B) part contains a medium dielectric constant resin layer (4), and the other part contains at least a polyphenylene oxide resin. Low dielectric constant resin layer (5) (6) (7) (8)
(9) and (10) are provided.

FIG. 2 is an exploded perspective view showing another example of multi-layer molding of the LCR multi-layer plate of the present invention.

From the bottom, a low dielectric constant resin core material (11), a high dielectric constant prepreg (12), a medium dielectric constant resin core material (13), a low dielectric constant prepreg (14), and a low dielectric constant resin core material (1
5), the low dielectric constant prepreg (16) and the low dielectric constant resin core material (17) are arranged for multi-layer molding. As shown in this figure, an inner layer circuit is formed in each core material, and as each element of LCR, a large capacity capacitor circuit (A '), a medium capacity capacitor circuit (B') and a coil circuit (C '). , A resistance circuit (D ').

(Function) In the multilayer board of the present invention, it is possible to provide a low dielectric constant resin layer containing a polyphenylene oxide resin for high speed signal transmission and a high dielectric constant resin layer for a capacitor. . A stable power supply voltage can be supplied without being affected by noise accompanying high-speed signal transmission.
By making the dielectric constants of the core material and the prepreg different, the function of the LCR is greatly improved.

Next, the present invention will be further described with reference to examples.

Examples 1 to 7 (Preparation of laminated plate for low dielectric constant layer) (Example 1) 100 g of polyphenylene oxyside, styrene butadiene diene copolymer (Asahi Kasei Engineering Co., Ltd.)
(Co): Sorbrene T406) 40 g, triallyl isocyanurate (Nippon Kasei Co., Ltd .: TAIC) 40 g, dicumyl peroxide 2 g, trichloroethylene (Toagosei Kagaku Kogyo Co., Ltd .: triculene) 750 g, Stir well until a homogeneous solution is obtained.

Thereafter, defoaming was performed, and the obtained resin composition solution was applied onto a PET film using a coating machine so as to have a thickness of 500 μm.

After drying this at 50 ° C for about 10 minutes, the formed film was
It was released from the ET film and dried at 120 ° C. for an additional 30 minutes to completely remove trichlorethylene to obtain a sheet made of the polyphenylene oxide resin composition. The thickness of this sheet was about 150 μm.

4 sheets are piled up, 190 ℃, 50kg / cm ²
Then, it was pressed for 30 minutes under the conditions described above and completely cured to produce a laminated plate.

(Example 2) In 800 g of trichlorethylene (Toagosei Kagaku Kogyo Co., Ltd .: trichlene) placed in the reactor with a decompression device of 2,
40 g of polyphenylene oxide, 40 g of styrene butadiene copolymer, 120 triallyl isocyanurate
6 g of 2,5-diethyl-2,5-di- (tert-putylperoxy) hexyne-3 (Phehexin 25B of NOF CORPORATION) were added and thoroughly stirred until a uniform solution was obtained.

Glass resin (100 g /
m ₂ ) is dipped in to impregnate this solution and then removed,
It was dried at 50 ° C. for about 1 minute and at 80 ° C. for about 5 minutes to obtain a prepreg.

Further, four obtained prepregs were laminated and molded by a molding press at 195 ° C., 10 kg / cm ² , 60 minutes to obtain a laminated plate.

(Examples 3 to 7) In the same manner as in Example 2, prepregs shown in Table 3 were obtained.

Example 8 (Preparation of core material of low dielectric constant layer) The laminated plate and copper foil of Example 1 and Examples 2 to 6 were each pressed at 65 kg / cm ² at a temperature of 190 ° C. to form a double-sided copper laminated plate. Then, a circuit was formed by etching by a usual method to obtain a low dielectric constant core material.

Examples 9 to 13 (Preparation of laminated plate for medium / high dielectric constant layer) (Example 9) Polyphenylene oxide 10 was added to the reactor of the depressurizing apparatus of Example 2.
0 g, styrene butadiene copolymer (Asahi Kasei
Co., Ltd .: Sorprene T406) 30 g, triallyl isocyanurate (Nippon Kasei Co., Ltd .: TAIC) 40 g, 2,5
-Dimethyl-2,5-di- (tert-butylperoxy)
Hexin-3 (NOF CORPORATION: Perhexin 25B) 2
750 g of trichlorethylene (Toagosei Kagaku Kogyo Co., Ltd .: trichlene) was added, and the mixture was sufficiently stirred until a uniform solution was obtained. Then, 150 g of barium titanate (BaTiO ₃ ) based ceramic powder having an average particle size of 1 to 2 μm was added, and the mixture was stirred by a ball mill for about 24 hours and uniformly dispersed. After that, defoaming was performed, and the obtained polyphenylene oxide resin composition solution was applied on a PET film using a coating machine so as to have a thickness of 500 μm.

After drying this at 50 ° C for about 10 minutes, the formed film was
The mold was released from the ET film and dried at 170 ° C. for another 20 minutes to completely remove trichloroethylene to obtain a sheet made of the polyphenylene oxide resin composition. The thickness of this sheet was about 150 μm. This sheet 4
The sheets were overlapped and pressed under the conditions of 200 ° C. and 50 kg / cm ² for 30 minutes to be completely cured, to prepare a laminated plate constituting a medium dielectric constant layer.

(Examples 10 to 13) In the same manner as in Example 9, the laminated plates shown in Table 4 were produced.

(Example 14) As a resin layer having a high dielectric constant, a prepreg obtained by impregnating a glass cloth having a thickness of 200 µm with an epoxy resin composition having the following composition so that the resin layer after drying was 50% by weight. 5 sheets were stacked.

Epoxy resin 50 g (Epicote # 1001, Shell Chemical Co.) dicyandiamide 2 benzyldimethylamine 0.1 methyloxitol 47.85 tribasic sulfate 0.05 Example 15 (preparation of LCR multilayer plate) Next, low dielectric constant obtained in Example 8 19 of the polyphenylene oxide resin core material of Example 1, the laminate of medium dielectric constant of Example 9 and the high dielectric constant resin prepreg laminate obtained in Example 14
LC was pressed at 0 ° C and 50 kg / cm ² for 90 minutes to cure and then LC
An R multilayer board was obtained.

Through-hole processing / treatment is performed by the usual method, and L
A CR multilayer wiring board was obtained. When this multilayer wiring board was used in a high-speed signal transmission circuit equipped with a power supply circuit, good results were obtained without fluctuations in the power supply voltage or signal disturbance.

The heat resistance and dimensional stability were also good.

Also, when the laminated plates of Examples 10 to 13 were used, the same excellent effect was obtained.

(Effects of the Invention) The LCR multilayer board made of resin layers having different dielectric constants of the present invention can be appropriately combined from a layer having a low dielectric constant to a layer having a high dielectric constant depending on the application, so that the LCR wiring The function of the board is dramatically improved.

Further, it is possible to eliminate the need to attach a large amount of capacitors for preventing noise accompanying high-speed signal processing, which can achieve high density wiring, downsizing, and cost reduction.

[Brief description of drawings]

1 and 2 are a sectional view and an exploded perspective view showing an embodiment of the present invention, respectively. 1 ... IC 2 ... Multilayer board 3 ... High dielectric constant resin layer 4 ... Medium dielectric constant resin layer 5,6,7,8,9,10 ... Low dielectric constant resin layer A ... Large-capacity capacitor B …… Small capacitor C …… Coil D …… Resistance

Front page continuation (72) Inventor Takahiro Fenceuchi 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd. (72) Takayoshi Koseki, 1048, Kadoma, Kadoma, Osaka Prefecture, Matsushita Electric Works, Ltd. (56) Reference References JP-A-50-50667 (JP, A) JP-A-56-79425 (JP, A) JP-A-61-82496 (JP, A) JP-A-62-128597 (JP, A)

Claims (1)

[Claims] 1. An LCR having an inner layer having one or more LCRs, wherein a high dielectric constant layer and a low dielectric constant layer containing at least a polyphenylene oxide resin are provided. Multi-layer board