JPH0632387B2 - Multi-layer board - Google Patents
Multi-layer boardInfo
- Publication number
- JPH0632387B2 JPH0632387B2 JP63015567A JP1556788A JPH0632387B2 JP H0632387 B2 JPH0632387 B2 JP H0632387B2 JP 63015567 A JP63015567 A JP 63015567A JP 1556788 A JP1556788 A JP 1556788A JP H0632387 B2 JPH0632387 B2 JP H0632387B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- dielectric constant
- resin layer
- layer
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 claims description 82
- 229920005989 resin Polymers 0.000 claims description 82
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 55
- 239000003990 capacitor Substances 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000009719 polyimide resin Substances 0.000 description 6
- 239000011162 core material Substances 0.000 description 5
- 239000005062 Polybutadiene Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 239000004135 Bone phosphate Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） この発明は電気機器用配線板に有用な多層板に関するも
のである。さらに詳しくは、この発明は、拘束信号処理
用配線基板として有用であり、また電源用配線基板とし
てコンデンサ機能も持たせることのできる多機能な多層
板に関するものである。The present invention relates to a multilayer board useful as a wiring board for electric equipment. More specifically, the present invention relates to a multifunctional multi-layer board that is useful as a wiring board for binding signal processing and can also have a capacitor function as a wiring board for power supply.
（従来の技術） 精密機器、電子計算機、通信機等に用いられる配線板に
おいては、演算処理速度の高速化、回路の高密度化の要
求が高まっており、これらの要請に対応するために配線
板の多層化が急速に進んでいる。従来、このような多層
板には、それを構成する樹脂として、エポキシ樹脂、ポ
リイミド樹脂や、低誘電率樹脂としフッ素樹脂あるいは
ポリブタジエン樹脂等が用いられてきており、その特性
の改善も精力的に進められている。(Prior Art) With regard to wiring boards used in precision equipment, electronic computers, communication equipment, etc., there is an increasing demand for higher processing speed and higher circuit density. To meet these requirements, wiring is required. The multilayering of plates is progressing rapidly. Hitherto, for such a multilayer board, epoxy resin, polyimide resin, or low dielectric constant resin such as fluorocarbon resin or polybutadiene resin has been used as a resin constituting the multilayer board, and the improvement of its characteristics has been vigorously performed. It is being advanced.
また一方、配線板の実装技術においては、従来よりディ
ジタルＩＣを搭載する場合には誤動作やノイズ防止のた
めに多量のコンデンサをＩＣの各ピンに取付け、電源安
定化のためのローパスフィルタを回路形成しているが、
高密度実装化の観点からこの高誘電率コンデンサについ
ても実装上の改良が進められてきている。On the other hand, in the wiring board mounting technology, when a digital IC is conventionally mounted, a large amount of capacitors are attached to each pin of the IC to prevent malfunction and noise, and a low-pass filter for stabilizing the power source is formed into a circuit. But
From the viewpoint of high-density packaging, improvements in packaging have been made for this high dielectric constant capacitor.
（発明が解決しようとする課題） しかしながら。このような従来の多層板用の樹脂は、多
層配線板に要求されている種々の特性を十分に満足させ
ることはできていない。たとえば、エポキシ樹脂、ポリ
イミド樹脂を多層板用樹脂として使用する場合には、加
工性には優れているものの誘電率および誘電損失がとも
に大きいため、信号処理速度の高速化に対応することは
できない。(Problems to be Solved by the Invention) Such conventional resins for multilayer boards have not been able to sufficiently satisfy various characteristics required for multilayer wiring boards. For example, when an epoxy resin or a polyimide resin is used as a resin for a multi-layer board, it is not possible to cope with an increase in signal processing speed because it has excellent workability but has a large dielectric constant and a large dielectric loss.
一方、弗素樹脂やポリブタジエン樹脂については、誘電
率は低いものの加工性に劣り、スルーホールめっきが困
難であって、寸法安定性も劣るという欠点があった。さ
らにまた、これら樹脂の場合にはコスト高にもなるとい
う問題があった。On the other hand, the fluororesin and the polybutadiene resin have the drawbacks that they have a low dielectric constant but are poor in workability, difficult to through-hole plating, and poor in dimensional stability. Furthermore, in the case of these resins, there is a problem that the cost becomes high.
このため、耐熱性、加工性、寸法安定性とともに、多層
化が容易で、低誘電率で高速信号処理を安定して行うこ
とのできる新しい多層板用樹脂とそれを用いた多層板の
実現が強く望まれていた。Therefore, in addition to heat resistance, processability, and dimensional stability, it is possible to realize a new resin for multilayer boards that can be easily multilayered and that can stably perform high-speed signal processing with a low dielectric constant, and a multilayer board using the same. It was strongly desired.
また一方で、前述のようなコンデンサの配線板への取り
付けは、高密度実装が必要になっている配線板に余分な
取り付け面積を増すことになり、部品やその取付けコス
トを低減することを難しくし、さらに、コンデンサの取
り付けのために形成したリード回路の浮遊容量が、新た
なノイズを発生させる原因にもなっていた。On the other hand, mounting the capacitor on the wiring board as described above increases the extra mounting area on the wiring board that requires high-density mounting, making it difficult to reduce the components and their mounting costs. Moreover, the stray capacitance of the lead circuit formed for mounting the capacitor also causes a new noise.
このようなコンデンサの取付け上の問題を解消するため
の方策として、積層板そのものの構成によってコンデン
サ機能を実現しようとの試みも提案されている（特開昭
６２−１２８５９７号、特開昭５６−７９４２５号）。
しかしながら、これら提案にもかかわらず、コンデンサ
機能として充分なものはいまだ実現されていないのが実
情であって、特に高速信号処理のための低誘電率樹脂層
との一体構成として良好なコンデンサ機能を実現するた
めの多層板はいまだ知られていない。As a measure for solving such a problem in mounting the capacitor, an attempt to realize a capacitor function by the constitution of the laminated plate itself has been proposed (Japanese Patent Laid-Open Nos. 62-128597 and 56-56). 79425).
However, in spite of these proposals, the fact that a sufficient capacitor function has not yet been realized has been found, and in particular, a good capacitor function as an integrated structure with a low dielectric constant resin layer for high-speed signal processing has been achieved. The multilayer board to realize it is not known yet.
（課題を解決するための手段） この発明は、以上のような、従来の多層板における問題
点を解決するためになされたものであり、耐熱性、寸法
安定性、耐薬品性等に優れているとともに、低誘電率な
樹脂を多層板の樹脂層形成に採用して高速信号処理に適
し、さらに樹脂層の誘電率を制御してコンデンサ機能を
樹脂層に持たせることができる新しい多層板を提供する
ことを目的としている。(Means for Solving the Problem) The present invention has been made to solve the problems in the conventional multilayer board as described above, and is excellent in heat resistance, dimensional stability, chemical resistance and the like. In addition, a new multi-layer board that uses a resin with a low dielectric constant to form a resin layer of a multi-layer board is suitable for high-speed signal processing, and further controls the dielectric constant of the resin layer to give the resin layer a capacitor function. It is intended to be provided.
この発明は、上記の目的を実現するために、電気配線板
用の多層板であって、高誘電率樹脂層とその上下層とし
ての低誘電率樹脂層とを有し、低誘電率樹脂層は、少く
ともポリフェニレンオキサイド樹脂を含有していること
を特徴とする多層板を提供する。In order to achieve the above object, the present invention is a multi-layer board for an electric wiring board, comprising a high dielectric constant resin layer and low dielectric constant resin layers as upper and lower layers thereof, and a low dielectric constant resin layer. Provides a multi-layer board characterized by containing at least a polyphenylene oxide resin.
この多層板を図面に沿って説明すると、たとえば、第１
図に示した例のように構成することができる。This multilayer board will be described with reference to the drawings.
It can be configured as in the example shown.
この第１図に示した例においては、多層板（１）は三層
の樹脂層を有し、上下両面の低誘電率の樹脂層（２）
と、中間の高誘電率の樹脂層（３）と、各樹脂層間と表
面に配設した回路（４ａ）（４ｂ）（４ｃ）とによって
構成されている。In the example shown in FIG. 1, the multi-layer board (1) has three resin layers, and resin layers (2) of low dielectric constant on both upper and lower surfaces.
And an intermediate high-dielectric constant resin layer (3), and circuits (4a) (4b) (4c) disposed on and between the resin layers.
この例の場合には、多層板（１）を構成する低誘電率の
樹脂層（２）と高誘電率の樹脂層（３）は、各々、必要
とされる誘電率を有している。In the case of this example, the low dielectric constant resin layer (2) and the high dielectric constant resin layer (3) constituting the multilayer board (1) each have a required dielectric constant.
この構成において、高速信号伝達に対応できる低誘電率
の樹脂層（２）を使用して信号の遅延を防止し、また、
誘電率の高い高誘電率の樹脂層（３）を使用し、これに
より、その高誘電率の樹脂層（３）に安定化コンデンサ
の機能を持たせて電源の安定化を図る。In this structure, a resin layer (2) having a low dielectric constant capable of supporting high-speed signal transmission is used to prevent signal delay, and
A high dielectric constant resin layer (3) having a high dielectric constant is used, whereby the high dielectric constant resin layer (3) functions as a stabilizing capacitor to stabilize the power supply.
たとえばこのような例として示すことのできるこの発明
の多層板の樹脂層を構成する樹脂については、低誘電率
樹脂層（２）としては少くともポリフェニレンオキサイ
ド樹脂を含有するものとし、各々の樹脂層を所要の誘電
率のものにするため、所定の誘電率を有する樹脂を種々
組合わせて使用する。For example, regarding the resin constituting the resin layer of the multilayer board of the present invention which can be shown as such an example, the low dielectric constant resin layer (2) contains at least a polyphenylene oxide resin, and each resin layer In order to obtain a desired dielectric constant, various combinations of resins having a predetermined dielectric constant are used.
このような樹脂としては、上記ポリフェニレンオキサイ
ド樹脂以外には、従来より多層板の樹脂層として単独に
使用されていたエポキシ樹脂、ポリイミド樹脂、あるい
は弗素樹脂や、変成ポリイミド樹脂、ポリエステル樹
脂、ＢＴレジン、ポリブタジエン樹脂等を使用すること
ができる。As such a resin, in addition to the polyphenylene oxide resin, an epoxy resin, a polyimide resin or a fluorine resin which has been conventionally used alone as a resin layer of a multilayer board, a modified polyimide resin, a polyester resin, a BT resin, Polybutadiene resin or the like can be used.
低誘電率の樹脂層には上記の通り、少くともポリフェニ
レンオキサイド樹脂を含有させるが、誘電率の調整のた
めには、さらに弗素樹脂、ポリブタジエン樹脂等を組合
わせて使用することができる。反対に、高誘電率の樹脂
層にはエポキシ樹脂、ポリイミド樹脂、変成ポリイミド
樹脂。ポリエステル樹脂等を使用することができる。As described above, the resin layer having a low dielectric constant contains at least a polyphenylene oxide resin, but a fluorine resin, a polybutadiene resin, or the like can be used in combination for adjusting the dielectric constant. On the other hand, epoxy resin, polyimide resin, and modified polyimide resin are used for the high dielectric constant resin layer. A polyester resin or the like can be used.
これらの樹脂の個々の種類に特段の制限はなく、耐熱
性、寸法安定性、耐薬品性等を考慮しながら適宜な誘電
率のものを用いることができる。There is no particular limitation on the kind of each of these resins, and those having an appropriate dielectric constant can be used in consideration of heat resistance, dimensional stability, chemical resistance and the like.
なお、各樹脂層を構成する樹脂は必ずしも異種の樹脂を
組み合わせて使用する必要はない。同種のものであって
も、充填剤の配合等により誘電率を各層で相異させるこ
とができる。所望の誘電率を有するものが得られる場合
には、、それら同種の樹脂を組み合わせて使用してもよ
い。Note that it is not always necessary to use different types of resins in combination as the resins forming the resin layers. Even if they are of the same type, the dielectric constant of each layer can be made different by blending a filler or the like. When a resin having a desired dielectric constant is obtained, these same resins may be used in combination.
この発明の多層板は、以上のように配線の用途に適合し
た種々の誘電率の樹脂層を有するが、この他、多層板を
構成する樹脂層であっても誘電率の厳密な制御が特に必
要とされない層においては、従来多層板の樹脂層として
用いていた樹脂からなる層を特段の制限なく使用するこ
ともできる。The multilayer board of the present invention has resin layers having various permittivities suitable for wiring applications as described above. In addition, strict control of the permittivity is particularly required even for resin layers constituting the multilayer board. In the layer which is not required, a layer made of a resin which has been conventionally used as a resin layer of a multilayer board can be used without particular limitation.
所定の誘電率の樹脂層、コア用樹脂層を多層板に積層す
るに際しては、それらの樹脂からシートまたはプリプレ
グを作成し、コア材または接着層の形態で積層すること
ができる。コア材としては、いずれの樹脂層を用いるこ
とができるが、接着プリプレグとして用いる樹脂は、樹
脂の種類によってその成形温度が表１に示すように異な
るので、接着するコア材との親和性が問題になる。この
ため、樹脂の組み合わせは成形温度考慮して選択するの
が好ましい。具体的な目安としては、プリプレグとコア
材との組み合わせの適合性は表２に示すことができる。When laminating a resin layer having a predetermined dielectric constant and a resin layer for a core on a multilayer board, a sheet or prepreg can be prepared from these resins and laminated in the form of a core material or an adhesive layer. Any resin layer can be used as the core material, but the resin used as the adhesive prepreg has a different molding temperature as shown in Table 1 depending on the type of resin, so that the compatibility with the core material to be adhered is a problem. become. Therefore, it is preferable to select the combination of resins in consideration of the molding temperature. As a concrete guide, the compatibility of the combination of the prepreg and the core material can be shown in Table 2.
このようにして定めた各樹脂層の組み合わせを最外層表
面の回路形成用金属箔と共に所定の順に重ね合わせ、常
法の加熱圧縮により接着、積層一体化する。次いで、エ
ッチング、スルーホール加工によって多層配線板を作製
する。The combination of the respective resin layers determined in this manner is laminated in a predetermined order with the metal foil for forming a circuit on the outermost layer surface, and adhered and laminated integrally by heat compression according to a conventional method. Then, a multilayer wiring board is manufactured by etching and through hole processing.
（作 用） この発明の多層板においては、少くともポリフェニレン
オキサイド樹脂を含有する低誘電率の樹脂層を利用する
ことにより信号は遅延することなく高速に伝達させるこ
とができる。一方電源安定化のためのコンデンサとして
は、上下層として低誘電率層を有する高誘電率の樹脂層
を同一の配線板で利用できる。高速信号伝達に伴うノイ
ズに影響されることなく安定した電源電圧を供給するこ
とができる。実装規模の小型化が実現される。 (Operation) In the multilayer board of the present invention, a signal can be transmitted at high speed without delay by using a resin layer having a low dielectric constant containing at least a polyphenylene oxide resin. On the other hand, as a capacitor for stabilizing the power supply, a resin layer having a high dielectric constant having lower dielectric constant layers as upper and lower layers can be used in the same wiring board. A stable power supply voltage can be supplied without being affected by noise accompanying high-speed signal transmission. The implementation scale can be reduced.
（実施例） 次に実施例として、第１図に示した多層板の例について
具体的に説明する。Example Next, an example of the multilayer board shown in FIG. 1 will be specifically described as an example.
低誘電率の樹脂層（２）としては、次のような配合の組
成物から作製した厚さ約１５０μｍのポリフェニレンオ
キサイド樹脂のフィルムを、銅箔とともに４枚積層した
ものを使用した。As the resin layer (2) having a low dielectric constant, a film was prepared by laminating four films of a polyphenylene oxide resin having a thickness of about 150 μm, which was prepared from the composition having the following composition, together with a copper foil.
ポリフェニレンオキサイド樹脂 100 重量部 スチレンブタジエンコポリマー 40 トリアリルイソシアネート 40 ジクミルパーオキサイド 2 また、高誘電率の樹脂層（３）としては、次のような組
成からなるエポキシ樹脂組成物を、乾燥後の樹脂量が５
０重量％となるように厚さ２００μｍのガラスクロスに
含浸させたプリプレグを５枚重ねて接着層として使用し
た。Polyphenylene oxide resin 100 parts by weight Styrene butadiene copolymer 40 Triallyl isocyanate 40 Dicumyl peroxide 2 Further, as the resin layer (3) having a high dielectric constant, an epoxy resin composition having the following composition is used as a resin after drying. Quantity 5
Five prepregs impregnated with a glass cloth having a thickness of 200 μm so as to be 0% by weight were stacked and used as an adhesive layer.
エポキシ樹脂 50重量部 （エピコート＃１００１．シェル化学製） ジシアンジアミド 2 ベンジルジメチルアミン 0.1 メチルオキシトール 47.85 三塩基性硫酸塩 0.05 ポリフェニレンオキサイド樹脂を含有する低誘電率の樹
脂層（２）と高誘電率の樹脂層（３）のプリプレグとは
１９０℃、５０kg／cm2で９０分間加圧して硬化させ、
多層板（１）とした。Epoxy resin 50 parts by weight (Epicote # 1001. Shell Chemical Co., Ltd.) Dicyandiamide 2 Benzyldimethylamine 0.1 Methyloxitol 47.85 Tribasic sulfate 0.05 Low dielectric constant resin layer (2) containing polyphenylene oxide resin and high dielectric constant The prepreg of the resin layer (3) is pressed at 190 ° C. and 50 kg / cm 2 for 90 minutes to cure,
It was a multilayer board (1).
この多層板（１）を電源回路を備えた高速信号伝達回路
に使用したところ、電源電圧のゆらぎや信号の乱れもな
く、良好な結果が得られた。When this multilayer board (1) was used in a high-speed signal transmission circuit equipped with a power supply circuit, good results were obtained without fluctuations in the power supply voltage or signal disturbance.
（発明の効果） この発明により、以上詳しく説明した通り誘電率の異な
る樹脂層を積層することにより、用途に応じて、低誘電
率の樹脂層から高誘電率の樹脂層まで、その組合わせを
適宜選択することができる。このため、この発明の多層
板は、高速信号処理用の配線の基板としても、また、電
源回路の配線基板としても好適なものとなる。(Effects of the Invention) According to the present invention, by laminating resin layers having different dielectric constants as described in detail above, a combination of a resin layer having a low dielectric constant to a resin layer having a high dielectric constant can be combined depending on the application. It can be appropriately selected. Therefore, the multilayer board of the present invention is suitable as a wiring board for high-speed signal processing and as a wiring board for a power supply circuit.
従って、この発明によれば、高速信号処理に伴うノイズ
の防止のための多量のコンデンサの取り付けを不要にす
ることができ、これにより配線の高密度化、実装規模の
小型化、低コスト化を図ることができる。Therefore, according to the present invention, it is possible to eliminate the need for mounting a large amount of capacitors for the purpose of preventing noise accompanying high-speed signal processing, which can achieve higher wiring density, smaller mounting scale, and lower cost. Can be planned.
【図面の簡単な説明】 第１図はこの発明の一例を示した断面図である。 １……多層板、 ２……低誘電率樹脂層、 ３……高誘電率樹脂層、 ４ａ，４ｂ，４ｃ……回路。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing an example of the present invention. 1 ... Multilayer board, 2 ... Low dielectric constant resin layer, 3 ... High dielectric constant resin layer, 4a, 4b, 4c ... Circuit.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 塀内 隆博 大阪府門真市大字門真1048番地 松下電工 株式会社内 (72)発明者 小関 高好 大阪府門真市大字門真1048番地 松下電工 株式会社内 (72)発明者 高木 光司 大阪府門真市大字門真1048番地 松下電工 株式会社内 (56)参考文献 特開 昭50−50667（ＪＰ，Ａ) 特開 昭56−79425（ＪＰ，Ａ) 特開 昭61−82496（ＪＰ，Ａ) 特開 昭62−128197（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Takahiro Fenceuchi 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd. (72) Takayoshi Koseki, 1048, Kadoma, Kadoma, Osaka Prefecture, Matsushita Electric Works, Ltd. ( 72) Inventor Koji Takagi, 1048, Kadoma, Kadoma, Osaka Prefecture, Matsushita Electric Works, Ltd. (56) References JP-A-50-50667 (JP, A) JP-A-56-79425 (JP, A) JP-A-61 -82496 (JP, A) JP-A-62-128197 (JP, A)
Claims (1)
樹脂層とその上下層としての低誘電率樹脂層とを有し、
低誘電率樹脂層は、少くともポリフェニレンオキサイド
樹脂を含有していることを特徴とする多層板。1. A multilayer board for an electric wiring board, comprising a high dielectric constant resin layer and low dielectric constant resin layers as upper and lower layers thereof.
The low dielectric constant resin layer contains at least a polyphenylene oxide resin, which is a multilayer board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63015567A JPH0632387B2 (en) | 1988-01-26 | 1988-01-26 | Multi-layer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63015567A JPH0632387B2 (en) | 1988-01-26 | 1988-01-26 | Multi-layer board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01189997A JPH01189997A (en) | 1989-07-31 |
| JPH0632387B2 true JPH0632387B2 (en) | 1994-04-27 |
Family
ID=11892321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63015567A Expired - Fee Related JPH0632387B2 (en) | 1988-01-26 | 1988-01-26 | Multi-layer board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632387B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0424996A (en) * | 1990-05-15 | 1992-01-28 | Matsushita Electric Works Ltd | Manufacture of multilayer printed board |
| JP4684483B2 (en) * | 2001-07-30 | 2011-05-18 | 富士通株式会社 | Multilayer circuit board manufacturing method |
| US6898070B2 (en) | 2002-12-19 | 2005-05-24 | Avx Corporation | Transmission line capacitor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5050667A (en) * | 1973-09-08 | 1975-05-07 | ||
| JPS5679425A (en) * | 1979-11-30 | 1981-06-30 | Matsushita Electric Works Ltd | Multilayer electric circuit board |
| JPS6182496A (en) * | 1984-09-28 | 1986-04-26 | 日立化成工業株式会社 | Multilayer wiring board |
| JPS62128197A (en) * | 1985-11-28 | 1987-06-10 | 日立コンデンサ株式会社 | Multilayer printed circuit board |
-
1988
- 1988-01-26 JP JP63015567A patent/JPH0632387B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01189997A (en) | 1989-07-31 |
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