JPH01189998A - Lcr multilayer board - Google Patents

Abstract

PURPOSE:To combine resin layers having different dielectric constants properly from layers having low dielectric constants to layers having high dielectric constants according to application, and to improve the function of an LCR wiring board by laminating and unifying an LCR multilayer board by the resin layers, inner layers of which have LCRs and which have the different dielectric constants. CONSTITUTION:The dielectric constants of multilayer board resin layers 2 are made to differ while being made to correspond to the functions of coils L, capacitors C and resistors R in each element of LCRs formed to inner layers. A layer 3 composed of a resin having a high dielectric constant is disposed to a resin layer corresponding to the capacitor, and, on the other hand, layers 5-10 consisting of resins having low dielectric constants are arranged to resin layers in a circuit section regarding high- speed signal processing. The resin layer 3 having the high dielectric constant is given the function of a stabilized capacitor, and a power supply can be stabilized. Accordingly, the characteristics of the resins constituting a multilayer board and an LCR function for increasing density are related, and the dielectric constants of layers of the multilayer board are controlled, thus allowing high-speed signal processing and the increase of density as well as improvement in the functions of the LCRs.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to an LCR multilayer board.

More specifically, the present invention relates to an LCR multilayer board having an LCR inside 71, which enables higher speed signal processing, higher wiring density, and higher functionality of the LCR.

(Conventional technology) There are increasing demands for higher signal processing speeds, higher wiring density, smaller packaging, etc. for wiring boards used in electrical and electronic equipment, and it is necessary to meet these demands. Therefore, studies are rapidly progressing on the material composition of wiring boards and their multilayer structure.

Conventionally, multilayer boards, which are at the forefront of technological progress, have been made of epoxy resins, polyimide resins, and low dielectric constant resins such as fluorine resins and polybutadiene resins. In addition, efforts are being made to improve the properties of the resin material.

On the other hand, the trend toward higher density and miniaturization of circuits and packaging through multilayering has led to the development of multilayer boards in which LCR, which is a circuit element consisting of a coil (L), a capacitor (C), and a resistor (R), is formed on the inner layer. It is also developing.

<Problems to be Solved by the Invention> However, the conventional multilayer board technology has not yet reached the stage where it fully satisfies various required characteristics and performances.

For example, conventional epoxy resins and polyimide resins are excellent in processability for the resins that make up multilayer boards, but they have large dielectric constants and dielectric losses.
On the other hand, although fluororesin and polybutadiene resin have a low dielectric constant, they have disadvantages such as poor processability, difficulty in through-hole plating, and poor dimensional stability. . Furthermore, these resins have the problem of high cost.

There is a need for a new resin for multilayer boards that has good heat resistance, processability, and dimensional stability, is easy to form into multiple layers, has a low dielectric constant, and can stably perform high-speed signal processing. was.

In addition to this material-related constraint, many issues remain in terms of high density. For example, when mounting a digital IC, a large number of capacitors are attached to each pin of the IC to prevent malfunction and noise, and it is now possible to provide this capacitor function to the resin layer of a multilayer board. Even in the current situation where LCR multilayer boards have been proposed, coils (L) and capacitors (C
) is still an open question as to how to form the structure into a multilayer board.

For this reason, it has become an extremely important issue how to realize advanced functions in multilayer boards, which are moving toward a new dimension as LCR multilayer boards.

(Means for Solving the Problems) This invention has been made in view of the above-mentioned matters = li, and solves the problems of conventional multilayer boards, and improves the characteristics and high density of the resin constituting the multilayer board. The purpose is to provide a new LCR multilayer board that enables high-speed signal processing, high density, and functional advancement of LCR by linking the LCFt machine frW for multilayer processing and controlling the permittivity of each layer of the multilayer board. It is said that

In order to achieve this object, the present invention provides an LCR multilayer board having one or more LCRs in the inner layer and integrally laminated with resin layers having different dielectric constants.

The multilayer board of this invention includes each element of LCR formed in the inner layer,
In other words, coil (L), capacitor (C), resistor (R)
It is characterized by making the dielectric constants of the resin layers of the multilayer board different while corresponding to the functions of the multilayer board. For example, the resin layer corresponding to the capacitor is made of a resin with a high dielectric constant,
On the other hand, a layer made of a low dielectric constant resin is disposed in the resin layer of the circuit section related to high-speed signal processing. In this way, the high dielectric constant resin layer can function as a stabilizing capacitor, thereby stabilizing the power supply.

In order to make each resin layer have the required dielectric constant, the resin constituting the resin layers of such a multilayer board is not limited to a single type of resin as in the past, but can have a predetermined dielectric constant. These resins are used in various combinations.

Examples of such resins include epoxy resins, polyimide resins, or fluorocarbon resins, which have traditionally been used alone as resin layers in multilayer boards, modified polyimide resins, polyester resins, BT resins, polybutadiene resins, and even polyphenylene oxide resins. can be used.

For example, polyphenylene oxide resin, fluororesin, polybutadiene resin, etc. can be used for the low dielectric constant resin layer. On the other hand, epoxy resin, polyimide resin, modified polyimide resin, polyester resin, etc. can be used for the high dielectric constant resin layer. There are no particular restrictions on the individual types of these resins, and resins with appropriate dielectric constants can be used while taking heat resistance, dimensional stability, chemical resistance, etc. into consideration.

Note that the resins constituting each resin layer do not necessarily need to be used in combination with different types of resins; even if the resins are of the same type, the dielectric constant can be made different for each layer by blending a filler or the like. If a resin having a desired dielectric constant can be obtained, a combination of resins of the same type may be used. For example, even if the same type of resin is used, the dielectric constant will change depending on the addition of a filler.

As described above, the multilayer board of the present invention has resin layers with various dielectric constants that are suitable for wiring applications. For layers that are not required, layers made of resin conventionally used as resin layers of multilayer boards can be used without particular restrictions.

When laminating a resin layer with a predetermined dielectric constant and a core resin layer on a multilayer board, sheets or prepregs can be made from these resins and laminated in the form of a core material or an adhesive layer. Any resin layer can be used as the core material, but the molding temperature of the resin used as the adhesive prepreg varies depending on the type of resin, as shown in Table 1, so compatibility with the core material to be bonded is an issue. become. It is preferable to consider this combination of resins in relation to the molding temperature. As a specific guide, the compatibility of the combination of prepreg and core material can be shown in Table 2.

A circuit is formed on the core material in advance to form the required structure of the LCR.

A predetermined combination of each resin layer is laminated together with a circuit-forming metal foil on the surface of the outermost layer, and the lamination is carried out in a conventional manner. Perform the required etching and through-hole processing to create an L on the inner layer.
A multilayer board with CR is obtained.

Table 1 The multilayer board of the present invention will be described below in accordance with the attached drawings.

FIG. 1 shows an example of the formation of a multilayer board according to the present invention. The multilayer board (2) in this example is equipped with an IC (1).
It has 8 resin layers. As shown in the figure, an LCR consisting of a large capacitor (A), a small capacitor (B), a coil (C), and a resistor (D) is formed on the inner layer of this multilayer board (2). .

Corresponding to this LCR configuration, a large capacity capacitor (A)
A high dielectric constant resin layer (3) is applied to the part, an applied electric constant resin layer (4) is applied to the small capacitor (B) part, and a low dielectric constant resin layer (5) is applied to the other parts. )(6)(7)(
8) (9) and (10) are provided.

FIG. 2 is an exploded perspective view showing another example of multilayer molding of the LCR multilayer board of the present invention.

From the bottom: low dielectric constant resin core material (11), high dielectric constant prepreg (12>), filling electric constant resin core material (13), low dielectric constant prepreg (14), low dielectric constant resin core material (15)
, a low dielectric constant prepreg (16) and a low dielectric constant resin core material (17) are arranged, and multilayer molding is performed. As shown in this figure, an inner layer circuit is formed in each core material, and L
Each element of CR is a large capacity capacitor circuit (A'), a medium capacity capacitor circuit 1n<B'), and a coil circuit (C'
) and a resistance circuit (D').

(Function) In the multilayer board of the present invention, a low dielectric constant resin layer can be provided for high-speed signal transmission, and a high dielectric constant resin layer can be provided for a capacitor. A stable power supply voltage can be supplied without being affected by noise associated with high-speed signal transmission. By varying the dielectric constants of the core material and the prepreg, the functionality of LCR is greatly improved.

Next, the present invention will be further explained with reference to Examples.

(a) Production of laminate for low dielectric constant layer and core material (Example 1)
) Polyphenylene oxide 1 in a reactor equipped with a pressure reduction device in 21
00g, styrene-butadiene copolymer (Asahi Kasei Corporation■
: Add 4Or of Solbrene T406), 40t of triallyl isocyanurate (Nippon Kasei @: TAIC), 2g of dicumyl peroxide, and further add 750g of trichlorethylene (Toagosei Chemical Industry ■: Triclene) and stir thoroughly until a homogeneous solution is obtained. did.

Thereafter, defoaming was performed, and the resulting resin composition solution was applied onto the PET film using a coating machine to a thickness of 500 μl.

After drying this at 50°C for about 10 minutes, the resulting film was
The mold was released from the ET film and dried at 120° C. for an additional 30 minutes to completely remove trichlorethylene to obtain a sheet made of a polyphenylene oxide resin composition. The thickness of this sheet was approximately 150 μl.

Stack 4 of these sheets and heat at 190℃, 501qr/
- It was pressed for 30 minutes and completely cured to produce a laminate.

(Example 2) 40 g of polyphenylene oxide, 40 g of styrene-butadiene copolymer, and 120 g of triallyl isocyanurate were added to 800 g of trichlorethylene (Toagosei Chemical Industry ■: Trichlene) placed in a reactor equipped with a vacuum device.
, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexyne-3 (>6 g of Perhexine 25B from NOF ■) was added and stirred thoroughly until a homogeneous solution was obtained.

Crow cloth (100sr/
rrr) to be impregnated with this solution, taken out, and dried at 50°C for about 1 minute and at 80°C for about 5 minutes to obtain a prepreg.

In addition, the four prepregs obtained were laminated and molded using a molding press at 195°C, 10 +r/cj for 60 minutes,
A laminate was obtained.

(Examples 3 to 7) In the same manner as in Example 2, prepregs as shown in Table 3 were obtained.

Table 3 (8) Styrene-butadiene copolymer (Asahi Kasei (Tama, Tufden 2003) (B) (Asahi Kasei ■, Turuprene 120
6) fc) Tie 2 (Nippon Kasei ■, “rAIC) (D) Tac (Musashino Kagakukan, TAC>([) Perhexine 2
5B (NOF ■) ([) Barbutyl D (I+) (G) Trichlene 1 ll) l-Luene glass cloth: WE116B (Example 8) The laminates and copper foil of Example 1 and Examples 2 to 6, Each was pressurized at 65 kg/c+a at a temperature of 190° C. to produce a double-sided copper-clad laminate, and then etched by a conventional method to form a circuit to obtain a low dielectric constant core material.

(b) Preparation of a laminate for a high/applied current rate layer (Example 9) Polyphenylene oxide 1 in a reactor equipped with a pressure reduction device
00g, styrene-butadiene copolymer (Asahi Kasei Corporation■
: Solprene T406) 30g, triallylisocyanurate (Nippon Kasei NiTAIC) 40g, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexyne-3 (NOF@: Verhexin 25B) 2+r
was added, and further 750 g of trichlorethylene (Toagosei Kagaku Kogyo ■: Trichlene) was added, and the mixture was thoroughly stirred until a homogeneous solution was obtained. After this, 150 g of barium titanate (BaTi03) ceramic powder with an average particle size of 1 to 2 μl
was added and stirred using a ball mill for about 24 hours to uniformly disperse the mixture. Thereafter, defoaming was performed, and the resulting polyphenylene oxide resin composition solution was coated onto the PET film using a coating machine to a thickness of 500 μm.

After drying this at 50°C for about 10 minutes, the resulting film was
The mold was released from the ET film and dried at 170°C for an additional 20 minutes to completely remove trichlorethylene and form polyphenylene oxide I! A sheet made of a l-fat composition was obtained.

The thickness of this sheet was approximately 150 μm. Four of these sheets were stacked together and heated at 220°C and 50 min.
It was pressed for 0 minutes to completely cure, and a laminate was produced.

(Examples 10 to 13) The laminates shown in Table 4 were produced in the same manner as in Example 7.

Table 4 jJ fish (gG truffles) I saw a change in the appearance of a man who had been inseminated for a period of time.

(Example 14) As a high dielectric constant resin layer, an epoxy resin composition having the following composition was used to a thickness of 200LL so that the resin layer after drying was 50% by weight! Five sheets of prepreg impregnated with glass cloth were stacked and used as an adhesive layer.

Epoxy resin 50g (Epicote #1001, manufactured by Shell Chemical) dicyandiamide
2benzyldimethylamine
0.1 Methyloxytol 47.8
5 Tribasic sulfate O,0S(C)
Production of multilayer board (Example 15) Next, the low dielectric constant polyphenylene oxide resin core material obtained in Example 8 and the adhesive layer made of the high electric constant resin obtained in Examples 9 and 14 were combined. 190℃, 50kz/
- for 90 minutes to harden and obtain an LCR multilayer board.

Through-hole processing and treatment were carried out using a conventional method to obtain the LCR multilayer wiring board shown in FIG.

When this multilayer wiring board was used in a high-speed signal transmission circuit equipped with a power supply circuit, good results were obtained without fluctuations in the power supply voltage or signal disturbance.

Heat resistance and dimensional stability were also good.

(Effects of the Invention) The LCR multilayer board made of resin layers with different dielectric constants of the present invention can be appropriately combined from low dielectric constant layers to high dielectric constant layers depending on the application, so LCR wiring The functionality of the board will improve dramatically.

Furthermore, it is not necessary to install a large number of capacitors to prevent noise caused by high-speed signal processing, and thereby it is possible to achieve higher wiring density, smaller size, and lower cost.

[Brief explanation of the drawing]

1 and 2 are a sectional view and an exploded perspective view, respectively, showing an embodiment of the present invention. 1... IC 2... Multilayer board 3... High dielectric constant resin layer 4... Application electric constant resin layer 5.6, 7, 8, 9.10... Low dielectric constant resin layer A. ...Large capacity capacitor B...Small capacity capacitor C...Coil D...Resistance agent Patent attorney Toshi Nishizawa Big box 2
figure

Claims (2)

[Claims] (1) An LCR multilayer board having one or more LCRs in the inner layer and integrally laminated with resin layers having different dielectric constants. (2) The LCR multilayer according to claim (1), wherein the resin layer is made of thermosetting polyphenylene oxide resin, epoxy resin, polyimide resin, fluororesin, polyester resin, modified polyimide resin, BT resin, or polybutadiene resin. Board.