JPS62128597A - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPS62128597A JPS62128597A JP60269011A JP26901185A JPS62128597A JP S62128597 A JPS62128597 A JP S62128597A JP 60269011 A JP60269011 A JP 60269011A JP 26901185 A JP26901185 A JP 26901185A JP S62128597 A JPS62128597 A JP S62128597A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- multilayer printed
- wiring board
- conductor
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 17
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 235000003385 Diospyros ebenum Nutrition 0.000 description 1
- 241000792913 Ebenaceae Species 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は多層印刷配線板にｒＩＪるものである。[Detailed description of the invention] (Industrial application field) The present invention applies to multilayer printed wiring boards.
（従来の技術）
機器の小型化に住い、３層以上の多層印刷配線板のス°
ｊ要が増加している。(Conventional technology) In order to miniaturize equipment, the speed of multilayer printed wiring boards with three or more layers has increased.
The number of j-points is increasing.
従来、多層印刷配線板にＪ３いて、導体ｍ間をコンデン
サにより接続する回路、例えばグランドや電源に対づる
パスコン等を用いる場合がある。これは、基板の内層と
外層とを接続するためにスルー ｊｊ、−ルをＸ２ ＋
Ｊるどとｂに接続パッドを設【ノ、ｆ−ップクイブのコ
ンデンリを半田付けする（に成となっている。Conventionally, a circuit such as a bypass capacitor connected to a ground or a power source is sometimes used in a multilayer printed wiring board to connect the conductors m using a capacitor. This is done by connecting the inner and outer layers of the board through the x2 +
Install the connection pads on J-rudo and b.
（発明が解決しようとする問題点）
しかし、このような構成の回路では、他の電子部品の実
装面積が縮少し、また、（を碩［生も低い１ぺ点があっ
た。(Problems to be Solved by the Invention) However, in a circuit with such a configuration, the mounting area of other electronic components is reduced, and there is also a low 1 point.
本発明は、以上の欠点を改良し、高密度１ヒか容易で信
頼性を向［しうる多膚印計り配線板の１ヱ（１ζを目的
とするものである。The object of the present invention is to improve the above-mentioned drawbacks, and to create a multi-print measuring wiring board that is easy to use and has improved reliability.
（１１１１題点を解決づろ］；めの手段）本発明は、上
記の目的を達成でるために、？８ ’Ｊ層を介して導体
を３層以上に積層した多層印刷配線板にＪ３いて、＄８
縁否の一部を形成づるｌＯ誘電゛競の物質と、該物質を
挟持する導７ｒ１層とからなるコンデン奮すを設けるこ
とを特徴とする多層印刷配線板を提供するものである。(Means for solving the 1111 problem) In order to achieve the above object, the present invention has the following features. 8' J3 is a multilayer printed wiring board in which three or more layers of conductors are laminated via the J layer, $8
The present invention provides a multilayer printed wiring board characterized in that it is provided with a condenser layer consisting of a lO dielectric material forming a part of the border and a conductor layer sandwiching the material.
（作用）
本発明は、外部からコンデン）Ｊを取り付（）ることな
く、絶１１層の一部を形成する高誘電率の物買と、該動
７１を挟持する導電苦とにより」ンデンリを形成してい
るため、他の１子部品の実装面（＾を拡大でき、（ε・
１１↑１も向上ザる。(Function) The present invention provides a high dielectric constant material that forms a part of the absolute layer 11 and a conductive material that sandwiches the conductive layer 71 without attaching the condenser layer 71 from the outside. , it is possible to enlarge the mounting surface (^) of another single child component, and (ε・
11↑1 also improved.
（実帷（？１） 以下、本発明を図示の実施例に基づいて説明する。(Actual mail (?1) Hereinafter, the present invention will be explained based on illustrated embodiments.
１は、スルーホールであり、モの周面に無電解めっき等
により導体２が形成されている。３及び４は基１反５の
表面に設置）られた信号用の導体である。６及び７は基
板５の表面に設けられた半田レジストである。）８及び
９は基板５の内部に設【プられた電源用及びグランド用
の導体である。１０及び１１はｊ９１４３と導体８及び
導体４と導体９の間にｆａ層されたシート状等の絶縁層
である。１２は待に導体３と導体８との間に設けられた
円形や角形状の高誘電率シートあるいは印刷物からなる
絶縁層である。１３は内層の導体８及び９間を絶縁しう
る紙フエノール樹脂積層板や紙エボヤシ樹脂積項（反、
ガラスエポキシ樹脂積層板等からなる絶縁層である。1 is a through hole, and a conductor 2 is formed on the circumferential surface of the hole by electroless plating or the like. 3 and 4 are signal conductors installed on the surface of the base 1 and 5. 6 and 7 are solder resists provided on the surface of the substrate 5. ) 8 and 9 are conductors for power supply and ground provided inside the board 5. Reference numerals 10 and 11 are sheet-like insulating layers formed between the j9143 and the conductor 8, and between the conductor 4 and the conductor 9. Reference numeral 12 denotes an insulating layer formed between the conductor 3 and the conductor 8 and made of a circular or angular high dielectric constant sheet or printed material. 13 is a paper phenol resin laminate or a paper ebony resin product term (reverse,
This is an insulating layer made of a glass epoxy resin laminate or the like.
丈なわら、上記実施例にＪ、れば、（ご８用の・り休３
と電源用の導体８との間に部分的に高誘Ｉπ十のシート
を；２けているために、この間で］ンデン寸が形成され
る。それ故に、外部からコンデンリを接続することなく
、実技面積の拡大がはかれ、（３頼性が向［する。If the above example is J, (for
Since a sheet of high dielectric constant Iπ0 is partially placed between the conductor 8 and the power supply conductor 8, a gap is formed between the conductor 8 and the conductor 8 for power supply. Therefore, the practical area can be expanded without connecting condensers from the outside, and reliability can be improved.
なお、上記実施例では４層の多層１反を示したが３層あ
るいは５層以上でもよい。In addition, in the above embodiment, a multi-layer structure of 4 layers was shown, but 3 layers or 5 or more layers may be used.
（発明の効果）
以上の通り、本発明によれば、外部からコンデン１ｆを
取り付けることなく、コンデンサを内蔵させているため
に他の電子部品の実技面積を拡大でき、信頼性を向上し
つる多層印刷配線数がＩＩＰられる。(Effects of the Invention) As described above, according to the present invention, since the capacitor 1f is built-in without attaching the capacitor 1f from the outside, the practical area of other electronic components can be expanded, reliability can be improved, and multilayer The number of printed wiring is IIP.
図は本考案実施例の断面図を示す。
２、 ３． ４． ８． ９ ・・・ 導
体 、 ５ ・・・ 基 １反 、１０．１１，
１２．１３・・・絶縁層。The figure shows a sectional view of an embodiment of the present invention. 2, 3. 4. 8. 9... Guidance
Body, 5...Group 1 anti, 10.11,
12.13...Insulating layer.
Claims (1)
刷配線板において、絶縁層の一部を形成する高誘電率の
物質と、該物質を挟持する導電層とからなるコンデンサ
を設けることを特徴とする多層印刷配線板。(1) In a multilayer printed wiring board in which three or more layers of conductors are laminated with an insulating layer interposed therebetween, a capacitor consisting of a material with a high dielectric constant forming part of the insulating layer and a conductive layer sandwiching the material is provided. A multilayer printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60269011A JPS62128597A (en) | 1985-11-29 | 1985-11-29 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60269011A JPS62128597A (en) | 1985-11-29 | 1985-11-29 | Multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62128597A true JPS62128597A (en) | 1987-06-10 |
Family
ID=17466423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60269011A Pending JPS62128597A (en) | 1985-11-29 | 1985-11-29 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62128597A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01189998A (en) * | 1988-01-26 | 1989-07-31 | Matsushita Electric Works Ltd | Lcr multilayer board |
| JPH02116195A (en) * | 1988-10-26 | 1990-04-27 | Matsushita Electric Ind Co Ltd | Multilayer thick film hybrid integrated circuit |
| JP2001015928A (en) * | 1999-07-02 | 2001-01-19 | Ibiden Co Ltd | Multilayer printed wiring board and its manufacture |
| US6214445B1 (en) | 1998-12-25 | 2001-04-10 | Ngk Spark Plug Co., Ltd. | Printed wiring board, core substrate, and method for fabricating the core substrate |
| JP2008205457A (en) * | 2007-02-16 | 2008-09-04 | Samsung Electronics Co Ltd | Multilayer printed circuit board |
-
1985
- 1985-11-29 JP JP60269011A patent/JPS62128597A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01189998A (en) * | 1988-01-26 | 1989-07-31 | Matsushita Electric Works Ltd | Lcr multilayer board |
| JPH02116195A (en) * | 1988-10-26 | 1990-04-27 | Matsushita Electric Ind Co Ltd | Multilayer thick film hybrid integrated circuit |
| US6214445B1 (en) | 1998-12-25 | 2001-04-10 | Ngk Spark Plug Co., Ltd. | Printed wiring board, core substrate, and method for fabricating the core substrate |
| JP2001015928A (en) * | 1999-07-02 | 2001-01-19 | Ibiden Co Ltd | Multilayer printed wiring board and its manufacture |
| JP2008205457A (en) * | 2007-02-16 | 2008-09-04 | Samsung Electronics Co Ltd | Multilayer printed circuit board |
| JP4675387B2 (en) * | 2007-02-16 | 2011-04-20 | 三星電子株式会社 | Multilayer printed circuit board |
| US8194416B2 (en) | 2007-02-16 | 2012-06-05 | Samsung Electronics Co., Ltd. | Multilayer printed circuit board having electromagnetic wave reduction member |
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