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JPH0511667B2 - - Google Patents

Info

Publication number
JPH0511667B2
JPH0511667B2 JP61170215A JP17021586A JPH0511667B2 JP H0511667 B2 JPH0511667 B2 JP H0511667B2 JP 61170215 A JP61170215 A JP 61170215A JP 17021586 A JP17021586 A JP 17021586A JP H0511667 B2 JPH0511667 B2 JP H0511667B2
Authority
JP
Japan
Prior art keywords
insulating film
resistor
polycrystalline silicon
layer
input protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61170215A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327044A (ja
Inventor
Masahiko Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61170215A priority Critical patent/JPS6327044A/ja
Publication of JPS6327044A publication Critical patent/JPS6327044A/ja
Publication of JPH0511667B2 publication Critical patent/JPH0511667B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP61170215A 1986-07-18 1986-07-18 半導体装置 Granted JPS6327044A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61170215A JPS6327044A (ja) 1986-07-18 1986-07-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61170215A JPS6327044A (ja) 1986-07-18 1986-07-18 半導体装置

Publications (2)

Publication Number Publication Date
JPS6327044A JPS6327044A (ja) 1988-02-04
JPH0511667B2 true JPH0511667B2 (it) 1993-02-16

Family

ID=15900803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61170215A Granted JPS6327044A (ja) 1986-07-18 1986-07-18 半導体装置

Country Status (1)

Country Link
JP (1) JPS6327044A (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009278078A (ja) * 2008-04-18 2009-11-26 Semiconductor Energy Lab Co Ltd 半導体装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2739004B2 (ja) * 1992-01-16 1998-04-08 三菱電機株式会社 半導体装置
JP2006086211A (ja) * 2004-09-14 2006-03-30 Denso Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009278078A (ja) * 2008-04-18 2009-11-26 Semiconductor Energy Lab Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPS6327044A (ja) 1988-02-04

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Legal Events

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