JPH03109366U - - Google Patents
Info
- Publication number
- JPH03109366U JPH03109366U JP1757390U JP1757390U JPH03109366U JP H03109366 U JPH03109366 U JP H03109366U JP 1757390 U JP1757390 U JP 1757390U JP 1757390 U JP1757390 U JP 1757390U JP H03109366 U JPH03109366 U JP H03109366U
- Authority
- JP
- Japan
- Prior art keywords
- close
- conductive structure
- circuit board
- printed circuit
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Elimination Of Static Electricity (AREA)
Description
第1図はこの考案によるプリント基板の一実施
例を機器取付け状態で示す側面図、第2図は同じ
くその要部についての拡大断面図、第3図は他の
実施例のプリント基板を第2図に準じて示す拡大
断面図、第4図は従来例としてのプリント基板を
機器取付け状態で示した説明図である。図におい
て、1は機器本体、2はリード線、3はプリント
パターン、5は導電性構造部、6は穴、7は半田
膜ランド、8は静電気導路構造、9はジヤンパー
線である。なお、図中同一符号は、同一又は相当
部分を示す。
Fig. 1 is a side view showing one embodiment of the printed circuit board according to this invention in a state where equipment is attached, Fig. 2 is an enlarged cross-sectional view of the main parts, and Fig. 3 is a side view showing the printed circuit board of another embodiment. FIG. 4 is an explanatory view showing a conventional printed circuit board in a state where equipment is attached. In the figure, 1 is the main body of the device, 2 is a lead wire, 3 is a printed pattern, 5 is a conductive structure, 6 is a hole, 7 is a solder film land, 8 is an electrostatic conductor structure, and 9 is a jumper wire. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
を機器における導電性構造部の近くにまで配設し
、このプリントパターンの上記導電性構造部に近
接する部分に穴及び半田膜ランドによる静電気導
路構造を設けたことを特徴とするプリント基板。 (2) 機器に接続される自らのプリントパターン
を機器における導電性構造部の近くにまで配設し
、このプリントパターンの上記導電性構造部に近
接する部分に穴及び半田膜ランドとこれらに接続
された導電材よりなるジヤンパー線とによる静電
気導路構造を設けたことを特徴とするプリント基
板。[Claims for Utility Model Registration] (1) A printed pattern to be connected to a device is placed close to a conductive structure in the device, and a hole is formed in a portion of the printed pattern close to the conductive structure. and a printed circuit board characterized by having an electrostatic conduction structure formed by a solder film land. (2) Arrange the own printed pattern to be connected to the device close to the conductive structure of the device, and connect holes and solder film lands to the portions of this print pattern close to the conductive structure. A printed circuit board characterized in that an electrostatic conductor structure is provided with a jumper wire made of a conductive material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1757390U JPH03109366U (en) | 1990-02-23 | 1990-02-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1757390U JPH03109366U (en) | 1990-02-23 | 1990-02-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03109366U true JPH03109366U (en) | 1991-11-11 |
Family
ID=31520765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1757390U Pending JPH03109366U (en) | 1990-02-23 | 1990-02-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03109366U (en) |
-
1990
- 1990-02-23 JP JP1757390U patent/JPH03109366U/ja active Pending