JPS61131868U - - Google Patents
Info
- Publication number
- JPS61131868U JPS61131868U JP1515085U JP1515085U JPS61131868U JP S61131868 U JPS61131868 U JP S61131868U JP 1515085 U JP1515085 U JP 1515085U JP 1515085 U JP1515085 U JP 1515085U JP S61131868 U JPS61131868 U JP S61131868U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hole
- melting point
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の印刷回路板の一実施例を示す
断面図、第２図は、印刷回路板の一例を示す平面
図、第３図は易除去性の導電体により電気的接続
を形成したスルーホールの一例を示す拡大断面図
である。
９……導電層、１０……スルーホール、１１…
…ピン、１２……つば、１３……低融点の導電物
、１５……基板。
Fig. 1 is a cross-sectional view showing an embodiment of the printed circuit board of the present invention, Fig. 2 is a plan view showing an example of the printed circuit board, and Fig. 3 is an electrical connection formed by an easily removable conductor. FIG. 3 is an enlarged cross-sectional view showing an example of a through hole. 9... Conductive layer, 10... Through hole, 11...
...Pin, 12...Brim, 13...Low melting point conductive material, 15...Substrate.
Claims (1)
板において、各種の回路の境界に相当するスルー
ホールに易除去性の導電体を設けて電気的接続と
したことを特徴とする印刷回路板。 (2) 易除去性の導電体が、スルーホールに差し
込まれたピンと該ピンをスルーホール内に固定す
る低融点の導電物である実用新案登録請求の範囲
第１項記載の印刷回路板。 (3) 低融点の導電物が、半田もしくは導電性ペ
ーストである実用新案登録請求の範囲第１項また
は第２項記載の印刷回路板。[Claims for Utility Model Registration] (1) In a printed circuit board configured by aggregating various circuits, easily removable conductors are provided in through holes corresponding to the boundaries of the various circuits to establish electrical connections. A printed circuit board characterized by: (2) The printed circuit board according to claim 1, wherein the easily removable conductor is a pin inserted into the through-hole and a conductor with a low melting point that fixes the pin in the through-hole. (3) The printed circuit board according to claim 1 or 2, wherein the low melting point conductive material is solder or conductive paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1515085U JPS61131868U (en) | 1985-02-05 | 1985-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1515085U JPS61131868U (en) | 1985-02-05 | 1985-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61131868U true JPS61131868U (en) | 1986-08-18 |
Family
ID=30500729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1515085U Pending JPS61131868U (en) | 1985-02-05 | 1985-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61131868U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007208083A (en) * | 2006-02-02 | 2007-08-16 | Sumitomo Wiring Syst Ltd | Printed circuit board |
-
1985
- 1985-02-05 JP JP1515085U patent/JPS61131868U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007208083A (en) * | 2006-02-02 | 2007-08-16 | Sumitomo Wiring Syst Ltd | Printed circuit board |
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