JPS59121175U - terminal mounting device - Google Patents
terminal mounting deviceInfo
- Publication number
- JPS59121175U JPS59121175U JP1983014571U JP1457183U JPS59121175U JP S59121175 U JPS59121175 U JP S59121175U JP 1983014571 U JP1983014571 U JP 1983014571U JP 1457183 U JP1457183 U JP 1457183U JP S59121175 U JPS59121175 U JP S59121175U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- terminal
- mounting device
- terminal mounting
- prevention layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の端子取付装置の平面図、第２図は本考案
の一実施例における端子取付装置の平面図、第３図は同
装置のＡ−Ａ断面図、第４図は同装置の半田付は後のＡ
−Ａ断面図、第５図は同装置の印刷配線基板の平面図で
ある。。
１１・・・・・・印刷配線基板、１２・・・・・・導体
箔、１３゜１４・・・・・・半田付は防止層、１５・・
・・・・端子、１６・・・・・・半田付は部、１６ａ・
・・・・・透孔。Fig. 1 is a plan view of a conventional terminal attachment device, Fig. 2 is a plan view of a terminal attachment device according to an embodiment of the present invention, Fig. 3 is a sectional view taken along line A-A of the same device, and Fig. 4 is a plan view of the same device. Soldering is done in A later.
-A sectional view and FIG. 5 are plan views of the printed wiring board of the same device. . 11... Printed wiring board, 12... Conductor foil, 13° 14... Soldering prevention layer, 15...
...Terminal, 16... Soldering part, 16a.
...Through hole.
Claims (1)
端子の半田付は部より大きい面積の導体箔を有する印刷
配線基板を備えてなり、上記印刷配線基板の導体箔に上
記端子の半田付は部の形状に合致する形状の半田付は防
止層を設け、この半田付は防止層を基準として上記端子
を上記印刷配線基板に半田付けするように構成したこと
を特徴とする端子取付装置。The soldering terminal has a through hole in the center and a printed circuit board having a conductive foil having an area larger than the soldering terminal. The soldering terminal is characterized in that a soldering prevention layer having a shape that matches the shape of the part is provided, and the terminal is configured to be soldered to the printed wiring board using the soldering prevention layer as a reference. Mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983014571U JPS59121175U (en) | 1983-02-02 | 1983-02-02 | terminal mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983014571U JPS59121175U (en) | 1983-02-02 | 1983-02-02 | terminal mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59121175U true JPS59121175U (en) | 1984-08-15 |
Family
ID=30145926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983014571U Pending JPS59121175U (en) | 1983-02-02 | 1983-02-02 | terminal mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59121175U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02204979A (en) * | 1989-02-01 | 1990-08-14 | Mitsubishi Electric Corp | Semiconductor device |
| JP2003036908A (en) * | 2001-07-25 | 2003-02-07 | Nec Corp | Contact terminal for surface mounting, printed circuit board using this terminal, and portable information terminal |
-
1983
- 1983-02-02 JP JP1983014571U patent/JPS59121175U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02204979A (en) * | 1989-02-01 | 1990-08-14 | Mitsubishi Electric Corp | Semiconductor device |
| JP2003036908A (en) * | 2001-07-25 | 2003-02-07 | Nec Corp | Contact terminal for surface mounting, printed circuit board using this terminal, and portable information terminal |
| JP4613457B2 (en) * | 2001-07-25 | 2011-01-19 | 日本電気株式会社 | Contact terminal for surface mounting, printed circuit board using the terminal, and portable information terminal device |
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