JPS63121474U - - Google Patents
Info
- Publication number
- JPS63121474U JPS63121474U JP1252287U JP1252287U JPS63121474U JP S63121474 U JPS63121474 U JP S63121474U JP 1252287 U JP1252287 U JP 1252287U JP 1252287 U JP1252287 U JP 1252287U JP S63121474 U JPS63121474 U JP S63121474U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- conductor land
- electrode
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案に係るプリント配線板の一例
を示す要部の断面図、第２図は面実装部品を実装
した状態の断面図、第３図及び第４図は夫々両面
電極の電子部品を使用したときの実装状態を示す
断面図、第５図及び第６図は夫々底面電極を有す
る面実装部品の一例を示す側面図と底面図、第７
図は同様に底面電極を有する面実装部品の一例を
示す底面図、第８図は底面電極を実装した状態で
のプリント配線板の断面図である。
１……面実装部品、２，３……側面電極、４…
…プリント基板、６……導体ランド、７……半田
層、８……底面電極、１０……プリント配線板、
２０……透孔。
Figure 1 is a sectional view of the main parts of an example of a printed wiring board according to this invention, Figure 2 is a sectional view of a state in which surface-mounted components are mounted, and Figures 3 and 4 are electronic components with double-sided electrodes. 5 and 6 are a side view and a bottom view showing an example of a surface mount component having a bottom electrode, respectively.
Similarly, the figure is a bottom view showing an example of a surface mount component having a bottom electrode, and FIG. 8 is a sectional view of the printed wiring board with the bottom electrode mounted thereon. 1...Surface mount component, 2, 3...Side electrode, 4...
...Printed circuit board, 6...Conductor land, 7...Solder layer, 8...Bottom electrode, 10...Printed wiring board,
20...Through hole.
Claims (1)
が設けられた電子部品を実装するプリント配線板
において、 実装されるべき電子部品の各電極に対応するご
とく複数の導体ランドが形成され、 夫々の導体ランド上に溶融半田層が塗布される
と共に、 上記底面部の電極に対応した上記導体ランド近
傍には、熱伝導用の透孔が穿設されてなることを
特徴とするプリント配線板。 (2) 実装すべき電子部品の大きさに応じて、上
記透孔の孔径、形状、形成位置などが選定されて
なることを特徴とする実用新案登録請求の範囲第
１項記載のプリント配線板。[Scope of Claim for Utility Model Registration] (1) In a printed wiring board on which electronic components are mounted, electrodes are provided at both left and right ends and on the bottom of the component body, a plurality of electrodes corresponding to each electrode of the electronic component to be mounted. A conductor land is formed, a molten solder layer is applied on each conductor land, and a through hole for heat conduction is bored in the vicinity of the conductor land corresponding to the electrode on the bottom surface. A printed wiring board featuring: (2) The printed wiring board according to claim 1 of the utility model registration claim, characterized in that the diameter, shape, formation position, etc. of the through-hole are selected according to the size of the electronic component to be mounted. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1252287U JPS63121474U (en) | 1987-01-30 | 1987-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1252287U JPS63121474U (en) | 1987-01-30 | 1987-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63121474U true JPS63121474U (en) | 1988-08-05 |
Family
ID=30800729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1252287U Pending JPS63121474U (en) | 1987-01-30 | 1987-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63121474U (en) |
-
1987
- 1987-01-30 JP JP1252287U patent/JPS63121474U/ja active Pending
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