JPH03116067U - - Google Patents
Info
- Publication number
- JPH03116067U JPH03116067U JP2567690U JP2567690U JPH03116067U JP H03116067 U JPH03116067 U JP H03116067U JP 2567690 U JP2567690 U JP 2567690U JP 2567690 U JP2567690 U JP 2567690U JP H03116067 U JPH03116067 U JP H03116067U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- soldering land
- flexible printed
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 239000003779 heat-resistant material Substances 0.000 claims 1
Description
第１図は本考案の一実施例を示す要部断面図、
第２図は従来の多層プリント配線基板を示す要部
断面図である。
図中、１……半田付用ランド、２……プリント
配線基板、３……配線用導電パターン、４……貫
通孔、５……フレキシブルプリント配線基板、６
……半田付である。
FIG. 1 is a cross-sectional view of essential parts showing an embodiment of the present invention;
FIG. 2 is a sectional view of essential parts of a conventional multilayer printed wiring board. In the figure, 1... Land for soldering, 2... Printed wiring board, 3... Conductive pattern for wiring, 4... Through hole, 5... Flexible printed wiring board, 6
...It is soldered.
Claims (1)
なる半田付用ランドを備えたプリント配線基板と
、配線用導電パターンを内包し、絶縁性膜で被覆
され、前記半田付用ランドに対応する所に貫通孔
を備えたフレキシブルプリント配線基板とでなり
、前記プリント配線基板の一面にフレキシブルプ
リント配線基板を重ね合わせ、前記半田付用ラン
ドと貫通孔とを半田付するようにした多層プリン
ト配線基板。 (2) 前記フレキシブルプリント配線基板が耐熱
材料にして成る請求項(1)記載の多層プリント配
線基板。[Claims for Utility Model Registration] (1) A printed wiring board having a soldering land connected to a conductive pattern for wiring on at least one surface, and a printed wiring board that includes a conductive pattern for wiring and is covered with an insulating film, The flexible printed wiring board is provided with a through hole at a location corresponding to the soldering land, and the flexible printed wiring board is superimposed on one surface of the printed wiring board, and the soldering land and the through hole are soldered. multilayer printed wiring board. (2) The multilayer printed wiring board according to claim 1, wherein the flexible printed wiring board is made of a heat-resistant material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2567690U JPH03116067U (en) | 1990-03-14 | 1990-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2567690U JPH03116067U (en) | 1990-03-14 | 1990-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03116067U true JPH03116067U (en) | 1991-12-02 |
Family
ID=31528598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2567690U Pending JPH03116067U (en) | 1990-03-14 | 1990-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03116067U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007136473A (en) * | 2005-11-15 | 2007-06-07 | Jfe Metal Products & Engineering Inc | Portable type embossing machine |
| JP2007211448A (en) * | 2006-02-08 | 2007-08-23 | Nippon Steel & Sumikin Metal Products Co Ltd | Road guard fence connection structure and beam member for road guard fence |
-
1990
- 1990-03-14 JP JP2567690U patent/JPH03116067U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007136473A (en) * | 2005-11-15 | 2007-06-07 | Jfe Metal Products & Engineering Inc | Portable type embossing machine |
| JP2007211448A (en) * | 2006-02-08 | 2007-08-23 | Nippon Steel & Sumikin Metal Products Co Ltd | Road guard fence connection structure and beam member for road guard fence |