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JPH0328775U - - Google Patents

Info

Publication number
JPH0328775U
JPH0328775U JP8940989U JP8940989U JPH0328775U JP H0328775 U JPH0328775 U JP H0328775U JP 8940989 U JP8940989 U JP 8940989U JP 8940989 U JP8940989 U JP 8940989U JP H0328775 U JPH0328775 U JP H0328775U
Authority
JP
Japan
Prior art keywords
conductor pattern
circuit board
land portion
chip
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8940989U
Other languages
Japanese (ja)
Other versions
JP2501678Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989089409U priority Critical patent/JP2501678Y2/en
Publication of JPH0328775U publication Critical patent/JPH0328775U/ja
Application granted granted Critical
Publication of JP2501678Y2 publication Critical patent/JP2501678Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す要部斜視図で
、第2図はその半田付状態の要部断面図で、第3
図は他の実施例を示す要部斜視図で、第4図は従
来例の要部斜視図で、第5図はその要部断面図で
ある。 10……回路基板装置、11……チツプ状回路
部品、11a……電極、12……導体パターン、
13……ランド部、14……半田レジスト層、1
5,17……非レジスト溝部、16……リード線
穴、18……半田。
Fig. 1 is a perspective view of the main part showing one embodiment of the present invention, Fig. 2 is a sectional view of the main part in the soldered state, and Fig.
The figure is a perspective view of a main part showing another embodiment, FIG. 4 is a perspective view of a main part of a conventional example, and FIG. 5 is a sectional view of the main part. 10... Circuit board device, 11... Chip-shaped circuit component, 11a... Electrode, 12... Conductor pattern,
13...Land part, 14...Solder resist layer, 1
5, 17...Non-resist groove portion, 16...Lead wire hole, 18...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導体パターンと、該導体パターンに形成された
チツプ状回路部品が装着される電極用ランド部と
、該ランド部に連接し導体パターン形成部以外の
回路基板レジスト面に形成した溝部を備えたこと
を特徴とする回路基板装置。
A conductor pattern, an electrode land portion to which a chip-shaped circuit component formed on the conductor pattern is mounted, and a groove portion connected to the land portion and formed on the resist surface of the circuit board other than the conductor pattern forming portion. Characteristic circuit board device.
JP1989089409U 1989-07-29 1989-07-29 Circuit board device Expired - Lifetime JP2501678Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989089409U JP2501678Y2 (en) 1989-07-29 1989-07-29 Circuit board device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989089409U JP2501678Y2 (en) 1989-07-29 1989-07-29 Circuit board device

Publications (2)

Publication Number Publication Date
JPH0328775U true JPH0328775U (en) 1991-03-22
JP2501678Y2 JP2501678Y2 (en) 1996-06-19

Family

ID=31638988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989089409U Expired - Lifetime JP2501678Y2 (en) 1989-07-29 1989-07-29 Circuit board device

Country Status (1)

Country Link
JP (1) JP2501678Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH075362U (en) * 1993-06-26 1995-01-27 ダイワ精工株式会社 Double-bearing reel with braking device to prevent backlash
JP2010123654A (en) * 2008-11-18 2010-06-03 Stanley Electric Co Ltd Optical semiconductor apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049667U (en) * 1983-09-14 1985-04-08 松下電器産業株式会社 Flexible printed wiring device
JPS6247170U (en) * 1985-09-11 1987-03-23
JPS63162568U (en) * 1987-04-10 1988-10-24

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049667U (en) * 1983-09-14 1985-04-08 松下電器産業株式会社 Flexible printed wiring device
JPS6247170U (en) * 1985-09-11 1987-03-23
JPS63162568U (en) * 1987-04-10 1988-10-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH075362U (en) * 1993-06-26 1995-01-27 ダイワ精工株式会社 Double-bearing reel with braking device to prevent backlash
JP2010123654A (en) * 2008-11-18 2010-06-03 Stanley Electric Co Ltd Optical semiconductor apparatus

Also Published As

Publication number Publication date
JP2501678Y2 (en) 1996-06-19

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