JPS6217176U - - Google Patents
Info
- Publication number
- JPS6217176U JPS6217176U JP10749485U JP10749485U JPS6217176U JP S6217176 U JPS6217176 U JP S6217176U JP 10749485 U JP10749485 U JP 10749485U JP 10749485 U JP10749485 U JP 10749485U JP S6217176 U JPS6217176 U JP S6217176U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- mounting board
- soldered
- utility
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案実施例の要部斜視図、第２図は
同リードの拡大図、第３図、第４図は本考案実施
部品のリードのハンダ付けの良否による貫通孔の
状態の違いを示す断面図、第５図は従来例の実装
状態を示す断面図、第６図は同斜視図である。
１……本体、２……リード、３……導体パター
ン、４……実装ボード、５……ハンダ、８……貫
通孔。
Figure 1 is a perspective view of the main parts of the embodiment of the present invention, Figure 2 is an enlarged view of the same lead, and Figures 3 and 4 are differences in the condition of the through-hole depending on the quality of soldering of the lead of the parts implementing the present invention. FIG. 5 is a cross-sectional view showing the mounting state of a conventional example, and FIG. 6 is a perspective view thereof. 1... Body, 2... Lead, 3... Conductor pattern, 4... Mounting board, 5... Solder, 8... Through hole.
Claims (1)
に貫通孔を有することを特徴とする電子部品。 An electronic component characterized by having a through hole in an external lead portion that is soldered to a mounting board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10749485U JPS6217176U (en) | 1985-07-12 | 1985-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10749485U JPS6217176U (en) | 1985-07-12 | 1985-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6217176U true JPS6217176U (en) | 1987-02-02 |
Family
ID=30983827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10749485U Pending JPS6217176U (en) | 1985-07-12 | 1985-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6217176U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02152243A (en) * | 1988-12-02 | 1990-06-12 | Rohm Co Ltd | Semiconductor device |
-
1985
- 1985-07-12 JP JP10749485U patent/JPS6217176U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02152243A (en) * | 1988-12-02 | 1990-06-12 | Rohm Co Ltd | Semiconductor device |
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