JPS63149565U - - Google Patents
Info
- Publication number
- JPS63149565U JPS63149565U JP4085987U JP4085987U JPS63149565U JP S63149565 U JPS63149565 U JP S63149565U JP 4085987 U JP4085987 U JP 4085987U JP 4085987 U JP4085987 U JP 4085987U JP S63149565 U JPS63149565 U JP S63149565U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- land portion
- hole land
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例に係わるプリント配
線板接続前の状態を示す断面図、第２図は同実施
例のプリント配線板接続後の状態を示す断面図、
第３図は他の実施例に係わるプリント配線板接続
後の状態を示す断面図、第４図はプリント配線板
同士を接続して一体構造とした場合の平面図、第
５図は従来のプリント配線板におけるプリント配
線板接続後の状態を示す断面図、第６図は半田付
けした従来のプリント配線板におけるプリント配
線板接続後の状態を示す断面図である。
２１……硬質プリント配線板、２２……軟質プ
リント配線板、２３……スルーホールランド部、
２４……導電性材料、２５……スルーホールラン
ド部、２６……配線パターン、２７……ソルダー
レジスト、２８……配線パターン、２９……カバ
ーレイ、３０……接着剤。
FIG. 1 is a sectional view showing the state before connection of a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the state after connection of the printed wiring board of the same embodiment.
Fig. 3 is a sectional view showing the state after connecting printed wiring boards according to another embodiment, Fig. 4 is a plan view when printed wiring boards are connected to form an integrated structure, and Fig. 5 is a conventional printed wiring board. FIG. 6 is a cross-sectional view showing the state of a soldered conventional printed wiring board after the printed wiring board is connected. 21... Rigid printed wiring board, 22... Soft printed wiring board, 23... Through-hole land portion,
24... Conductive material, 25... Through-hole land portion, 26... Wiring pattern, 27... Solder resist, 28... Wiring pattern, 29... Coverlay, 30... Adhesive.
Claims (1)
有したプリント配線板において、上記スルーホー
ルランド部の表面に導電性材料を塗布したことを
特徴とするプリント配線板。 1. A printed wiring board having a through-hole land portion for connection positioning, characterized in that a conductive material is coated on the surface of the through-hole land portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987040859U JPH0727648Y2 (en) | 1987-03-23 | 1987-03-23 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987040859U JPH0727648Y2 (en) | 1987-03-23 | 1987-03-23 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63149565U true JPS63149565U (en) | 1988-10-03 |
| JPH0727648Y2 JPH0727648Y2 (en) | 1995-06-21 |
Family
ID=30855322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987040859U Expired - Lifetime JPH0727648Y2 (en) | 1987-03-23 | 1987-03-23 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727648Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014027222A (en) * | 2012-07-30 | 2014-02-06 | Kyocera Corp | Connection structure and thermal printer having the same |
| JP2019041019A (en) * | 2017-08-25 | 2019-03-14 | 株式会社フジクラ | Printed wiring board and manufacturing method of the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122375U (en) * | 1982-12-23 | 1983-08-20 | 株式会社ニコン | connection circuit board |
| JPS60101775U (en) * | 1983-12-14 | 1985-07-11 | 日本ビクター株式会社 | Printed circuit board connection structure |
| JPS61192476U (en) * | 1985-05-22 | 1986-11-29 |
-
1987
- 1987-03-23 JP JP1987040859U patent/JPH0727648Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122375U (en) * | 1982-12-23 | 1983-08-20 | 株式会社ニコン | connection circuit board |
| JPS60101775U (en) * | 1983-12-14 | 1985-07-11 | 日本ビクター株式会社 | Printed circuit board connection structure |
| JPS61192476U (en) * | 1985-05-22 | 1986-11-29 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014027222A (en) * | 2012-07-30 | 2014-02-06 | Kyocera Corp | Connection structure and thermal printer having the same |
| JP2019041019A (en) * | 2017-08-25 | 2019-03-14 | 株式会社フジクラ | Printed wiring board and manufacturing method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727648Y2 (en) | 1995-06-21 |