JPS6219776U - - Google Patents
Info
- Publication number
- JPS6219776U JPS6219776U JP11076985U JP11076985U JPS6219776U JP S6219776 U JPS6219776 U JP S6219776U JP 11076985 U JP11076985 U JP 11076985U JP 11076985 U JP11076985 U JP 11076985U JP S6219776 U JPS6219776 U JP S6219776U
- Authority
- JP
- Japan
- Prior art keywords
- package
- circuit boards
- soldered
- component
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る高周波部品のパツケージ
の一実施例を示す斜視図、第２図は第１図のパツ
ケージを基板に実装した平面図、第３図は第１図
の同タイプの従来の高周波部品のパツケージの斜
視図である。
１……高周波部品のパツケージ、２……板状の
リード、３……穴、４……基板、５……ハンダ、
６……パターン。
Fig. 1 is a perspective view showing an embodiment of a high-frequency component package according to the present invention, Fig. 2 is a plan view of the package shown in Fig. 1 mounted on a board, and Fig. 3 is a conventional package of the same type as shown in Fig. 1. FIG. 2 is a perspective view of a package of high-frequency components. 1... High-frequency component package, 2... Plate-shaped lead, 3... Hole, 4... Board, 5... Solder,
6...pattern.
Claims (1)
ダ付けされる高周波部品のパツケージに於いて、
前記高周波部品のハンダ付けを行う板状リードに
１ないし複数の穴を設ける事を特徴とする部品パ
ツケージ。 In the package of high-frequency components soldered to the pattern of printed circuit boards and film circuit boards,
A component package cage characterized in that one or more holes are provided in a plate-shaped lead to which the high-frequency component is soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11076985U JPS6219776U (en) | 1985-07-18 | 1985-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11076985U JPS6219776U (en) | 1985-07-18 | 1985-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6219776U true JPS6219776U (en) | 1987-02-05 |
Family
ID=30990076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11076985U Pending JPS6219776U (en) | 1985-07-18 | 1985-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6219776U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0360100A (en) * | 1989-07-27 | 1991-03-15 | Nec Corp | Surface mounting component |
-
1985
- 1985-07-18 JP JP11076985U patent/JPS6219776U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0360100A (en) * | 1989-07-27 | 1991-03-15 | Nec Corp | Surface mounting component |