JPS60167365U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS60167365U JPS60167365U JP5490484U JP5490484U JPS60167365U JP S60167365 U JPS60167365 U JP S60167365U JP 5490484 U JP5490484 U JP 5490484U JP 5490484 U JP5490484 U JP 5490484U JP S60167365 U JPS60167365 U JP S60167365U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- land
- leadless
- conductor patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂは何れも従来のプリント配線板にリード
レス部品を取付けた状態を示す斜視図、第２図ａはプリ
ント配線板の他の従来例を示す平面図、第２図すはそれ
にリードレス部品を取付ケた状態を示す断面図、第３図
は本考案プリント配線板の一実施例を示す平面図である
。
１：絶縁基板、２，３，４：導体パターン、２ａ？
３ ａｙ ４ ａ ：−ハンダ付は用ランド部、２ｂ
：接着用ランド部、５：接着剤、６：リードレス部品。Figures 1a and 1b are both perspective views showing a state in which leadless components are attached to a conventional printed wiring board, Figure 2a is a plan view showing another conventional example of a printed wiring board, and Figure 2b is a perspective view showing a conventional printed wiring board with leadless components attached. FIG. 3 is a sectional view showing a state in which a leadless component is attached thereto, and FIG. 3 is a plan view showing an embodiment of the printed wiring board of the present invention. 1: Insulating substrate, 2, 3, 4: Conductor pattern, 2a?
3 ay 4 a: - Land part for soldering, 2b
: Adhesive land part, 5: Adhesive, 6: Leadless parts.
Claims (1)
り一ドレス部品のハンダ付は用の一対のランド部の一方
を他方のランド部方向に延出させて接着用ランド部を形
成し、この接着用ランド部の上に接着剤を塗布して前記
リードレス部品を接着仮固定するようにしたことを特徴
とするプリント配線板。For soldering of conductor patterns on conductor patterns on an insulating substrate, or for soldering parts, one of a pair of lands is extended in the direction of the other land to form an adhesive land. 1. A printed wiring board characterized in that said leadless component is temporarily adhesively fixed by applying an adhesive onto the leadless land portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5490484U JPS60167365U (en) | 1984-04-13 | 1984-04-13 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5490484U JPS60167365U (en) | 1984-04-13 | 1984-04-13 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60167365U true JPS60167365U (en) | 1985-11-06 |
Family
ID=30577085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5490484U Pending JPS60167365U (en) | 1984-04-13 | 1984-04-13 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60167365U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005347459A (en) * | 2004-06-02 | 2005-12-15 | Nec Corp | Mounting structure of electronic component for surface mounting |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726379U (en) * | 1980-07-23 | 1982-02-10 |
-
1984
- 1984-04-13 JP JP5490484U patent/JPS60167365U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726379U (en) * | 1980-07-23 | 1982-02-10 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005347459A (en) * | 2004-06-02 | 2005-12-15 | Nec Corp | Mounting structure of electronic component for surface mounting |
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