JPS63182575U - - Google Patents
Info
- Publication number
- JPS63182575U JPS63182575U JP7481287U JP7481287U JPS63182575U JP S63182575 U JPS63182575 U JP S63182575U JP 7481287 U JP7481287 U JP 7481287U JP 7481287 U JP7481287 U JP 7481287U JP S63182575 U JPS63182575 U JP S63182575U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- sides
- conductive patterns
- incorporated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案による電子回路装置の一実施例
における接続専用の補助プリント基板を両面プリ
ント基板に挿入しようとしている状態を示す斜視
図、第２図は同断面図、第３図は本考案による接
続専用の補助プリント基板を両面プリント基板に
挿入し、半田付した状態を示す断面図、第４図は
同斜視図、第５図は従来のスルホール基板のメツ
キ前の状態を示す断面図、第６図は同メツキ後の
状態を示す断面図、第７図は従来例のリード線を
使う場合のランド、孔位置を示す断面図、第８図
は同リード線の挿入後、半田付した状態を示す断
面図である。
１……両面プリント基板、２……補助プリント
基板、３，３′，３″……ランド、４，４′，４
″……角孔、５，５′，５″……突起、６，６′
，６″……両面接続用ランド、７，７′，７″，
７……半田。
Fig. 1 is a perspective view showing a state in which an auxiliary printed circuit board for connection is about to be inserted into a double-sided printed circuit board in an embodiment of an electronic circuit device according to the present invention, Fig. 2 is a cross-sectional view of the same, and Fig. 3 is a schematic diagram of the electronic circuit device according to the present invention. FIG. 4 is a perspective view of the same, and FIG. 5 is a cross-sectional view of a conventional through-hole board before plating. Figure 6 is a cross-sectional view showing the state after plating, Figure 7 is a cross-sectional view showing the land and hole positions when using the conventional lead wire, and Figure 8 is the soldering state after inserting the lead wire. It is a sectional view showing a state. 1...Double-sided printed circuit board, 2...Auxiliary printed circuit board, 3, 3', 3''...Land, 4, 4', 4
″……Square hole, 5,5′,5″……Protrusion, 6,6′
, 6″...Land for double-sided connection, 7, 7′, 7″,
7...Solder.
Claims (1)
面に組込んだ主プリント基板に、片面あるいは両
面に導通パターンを有する補助プリント基板を組
込み、主プリント基板の両面の導通パターンの電
気的導通を補助プリント基板の導通パターンで行
つた電子回路装置。 The main printed circuit board has conductive patterns on both sides and various electronic components are incorporated on both sides, and an auxiliary printed circuit board with conductive patterns on one or both sides is incorporated to assist the electrical continuity of the conductive patterns on both sides of the main printed circuit board. An electronic circuit device using a conductive pattern on a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7481287U JPS63182575U (en) | 1987-05-19 | 1987-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7481287U JPS63182575U (en) | 1987-05-19 | 1987-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63182575U true JPS63182575U (en) | 1988-11-24 |
Family
ID=30920378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7481287U Pending JPS63182575U (en) | 1987-05-19 | 1987-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63182575U (en) |
-
1987
- 1987-05-19 JP JP7481287U patent/JPS63182575U/ja active Pending
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