JPH0412678U - - Google Patents
Info
- Publication number
- JPH0412678U JPH0412678U JP5445990U JP5445990U JPH0412678U JP H0412678 U JPH0412678 U JP H0412678U JP 5445990 U JP5445990 U JP 5445990U JP 5445990 U JP5445990 U JP 5445990U JP H0412678 U JPH0412678 U JP H0412678U
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuits
- electrodes
- holes
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図乃至第３図は本考案の一実施例を示し、
第１図はプリント基板の表面の回路と裏面の回路
とを接続した部位の断面図、第２図は同平面図、
第３図は同裏面図、第４図及び第５図は従来例を
示し、第４図はプリント基板のスルーホール部位
の断面図、第５図はプリント基板の表面の回路と
裏面の回路とを接続した部位の断面図である。
２０……プリント基板、２１……基板、２２，
２３……孔、２４，２５……電極、２６……リー
ド線、２７，２８……端部、２９……ハンダ。
1 to 3 show an embodiment of the present invention,
Figure 1 is a cross-sectional view of the part where the circuit on the front side of the printed circuit board and the circuit on the back side are connected, Figure 2 is a plan view of the same,
Figure 3 is a back view of the same, Figures 4 and 5 show the conventional example, Figure 4 is a cross-sectional view of the through hole part of the printed circuit board, and Figure 5 shows the circuits on the front and back sides of the printed circuit board. FIG. 20... Printed circuit board, 21... Board, 22,
23... Hole, 24, 25... Electrode, 26... Lead wire, 27, 28... End, 29... Solder.
Claims (1)
於て、基板の両面の回路を接続する部位に二つの
孔を開穿し、一方の孔の周縁部に表面の回路の電
極を設けると共に、他方の孔の周縁部に裏面の回
路の電極を設け、更に、基板の夫々の孔にリード
線の両端部を挿入して該リード線の両端部を夫々
の電極にハンダ付したことを特徴とするプリント
基板における両面回路の接続装置。 In a printed circuit board that has circuits on both the front and back sides of the board, two holes are drilled at the parts where the circuits on both sides of the board are connected, and electrodes for the circuit on the front side are provided around the periphery of one hole, and The electrodes of the circuit on the back side are provided on the periphery of the holes of the board, and both ends of the lead wires are inserted into the respective holes of the board and both ends of the lead wires are soldered to the respective electrodes. Connection device for double-sided circuits on printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5445990U JPH0412678U (en) | 1990-05-24 | 1990-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5445990U JPH0412678U (en) | 1990-05-24 | 1990-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412678U true JPH0412678U (en) | 1992-01-31 |
Family
ID=31576541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5445990U Pending JPH0412678U (en) | 1990-05-24 | 1990-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412678U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54131263U (en) * | 1978-03-03 | 1979-09-11 |
-
1990
- 1990-05-24 JP JP5445990U patent/JPH0412678U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54131263U (en) * | 1978-03-03 | 1979-09-11 |
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