JP7145201B2 - フォトセンサーにおける高強度光を検出すること - Google Patents
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- 238000009792 diffusion process Methods 0.000 claims description 76
- 239000000758 substrate Substances 0.000 claims description 53
- 238000000034 method Methods 0.000 claims description 32
- 230000004044 response Effects 0.000 claims description 12
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 238000010408 sweeping Methods 0.000 claims 1
- 101000806846 Homo sapiens DNA-(apurinic or apyrimidinic site) endonuclease Proteins 0.000 description 14
- 101000835083 Homo sapiens Tissue factor pathway inhibitor 2 Proteins 0.000 description 14
- 102100026134 Tissue factor pathway inhibitor 2 Human genes 0.000 description 14
- 101100219315 Arabidopsis thaliana CYP83A1 gene Proteins 0.000 description 9
- 101100269674 Mus musculus Alyref2 gene Proteins 0.000 description 9
- 101100140580 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) REF2 gene Proteins 0.000 description 9
- 101100152598 Arabidopsis thaliana CYP73A5 gene Proteins 0.000 description 8
- 238000005286 illumination Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 101100041125 Arabidopsis thaliana RST1 gene Proteins 0.000 description 4
- 101100443250 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) DIG1 gene Proteins 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 101100443251 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) DIG2 gene Proteins 0.000 description 3
- 101100041128 Schizosaccharomyces pombe (strain 972 / ATCC 24843) rst2 gene Proteins 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
- H04N25/621—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for the control of blooming
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- H10F39/10—Integrated devices
- H10F39/12—Image sensors
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Description
によって決定され得る。
図1は、一実施形態による、電子デバイス100を示す高レベルブロック図である。一実施形態では、電子デバイス100は、構成要素の中でも、通信可能に結合されたプロセッサ102とフォトセンサー104とを含む。電子デバイス100は、メモリおよび様々な他のセンサーなど、図1に示されていない他の構成要素を含み得る。
図3は、一実施形態による、積層フォトセンサーアセンブリ300を示す断面図である。一実施形態では、積層フォトアセンブリは、第2の基板340に結合された第1の基板310を含む。第1の基板310は、反転された裏面照射302センサーであり得、構成要素の中でも、第1のn+拡散ウェル312と、フォトダイオード314と、トランジスタAB313と、トランジスタTX316と、第2のn+拡散ウェル320とを含む。
図4は、一実施形態による、フォトセンサー104のピクセル400を示す回路図である。図4の実施形態では、第1の基板310は、構成要素の中でも、フォトダイオード314と、トランジスタTXと、第1のリセットトランジスタTRST1と、増幅器TSとを含む。寄生キャパシタンスは、トランジスタTXと第1のリセットトランジスタTRST1との間の、第1の基板310中の第1のキャパシタCS1中に存在する。フォトダイオード314とトランジスタTXとの動作は、図3を参照しながら上記で説明されている。
本開示のピクセル構造は、異なる段階(すなわち、露出段階および検知段階)中に異なる機構を使用して高強度光と低強度光とを測定するように設定される。露出段階中に、ピクセル構造は高強度光を測定するが、同じピクセル構造はより低い強度の光を測定する。
Claims (16)
- フォトセンサー中のピクセルであって、
該ピクセルは、第1の基板の一部分において、
フォトダイオードと、
浮遊拡散ポイントと、
前記フォトダイオードと前記浮遊拡散ポイントとの間のトランジスタであって、前記トランジスタのゲートは、露出段階中に前記フォトダイオードに入射した光の強度がしきい値強度を超えたことに応答して、前記フォトダイオードから前記浮遊拡散ポイントに電荷を転送するために前記トランジスタのターンオフ電圧と前記トランジスタのターンオン電圧との間の中間電圧が印加され、前記トランジスタの前記ゲートは、前記フォトダイオードから前記浮遊拡散ポイントに前記電荷を転送するために、前記露出段階の後の検知段階において前記ターンオン電圧が印加される、トランジスタと、
前記浮遊拡散ポイントに接続された入力端子、および信号電圧を出力するためにピクセルレベル相互接続に接続された出力端子を有する増幅器と
を備え、かつ
前記ピクセルは、第2の基板において、
前記ピクセルレベル相互接続に接続された入力端子を有するアナログデジタル変換器(ADC)
を備え、
前記ADCは、前記露出段階中、前記中間電圧が前記トランジスタの前記ゲートに印加されたときに前記ピクセルレベル相互接続における前記信号電圧の上昇または低下のレートを決定し、かつ前記ADCは、前記検知段階中、前記ターンオン電圧が前記トランジスタの前記ゲートに印加されたときに前記ピクセルレベル相互接続における前記信号電圧を決定する、
フォトセンサー中のピクセル。 - 導電線に結合された回路を含む前記第2の基板の一部分であって、前記回路は、
前記信号電圧が第1のしきい値に達する第1の時間と、前記信号電圧が、前記第1のしきい値とは異なる第2のしきい値に達する第2の時間との間の時間差を検出することであって、前記信号電圧が、前記浮遊拡散ポイントにおける電圧の増幅されたバージョンを表す、時間差を検出することと、
前記検知段階中に、時間とともに上昇する基準電圧が前記信号電圧に達する時間を検出することであって、前記基準電圧が、最小予想信号電圧値から最大信号電圧値まで掃引するランプ信号である、時間を検出することと
を行うように設定された、前記第2の基板の一部分と、
前記信号電圧を送信するための、前記浮遊拡散ポイントと前記導電線との間の前記ピクセルレベル相互接続と
をさらに備える、請求項1に記載のピクセル。 - 前記第1の基板が、
第1のリセットトランジスタであって、前記露出段階の後に前記第1のリセットトランジスタをオンにしたことに応答して、前記浮遊拡散ポイントにおける電圧をリセットするように設定された、第1のリセットトランジスタ
をさらに備える、請求項2に記載のピクセル。 - 前記増幅器がソースフォロワトランジスタである、請求項1に記載のピクセル。
- 前記第2の基板が、
前記ピクセルレベル相互接続に結合された電流源
をさらに備える、請求項1に記載のピクセル。 - 前記ADCが、
前記信号電圧が第1の基準電圧に対応する第1の時間における第1の出力と、前記信号電圧が、前記第1の基準電圧よりも低い第2の基準電圧に対応する第2の時間における第2の出力とを生成するように設定された比較器と、
前記第1の出力と前記第2の出力とを受信するために前記比較器に結合されたカウンタであって、前記カウンタが、前記第1の時間と前記第2の時間との間のクロックパルスの数を計数するように設定された、カウンタと
を備える、請求項1に記載のピクセル。 - 前記電流源は、前記検知段階の一部中にバイアス電圧が印加されるゲートを有する別のトランジスタを備える、請求項5に記載のピクセル。
- 前記浮遊拡散ポイントが、前記検知段階の後にリセット電圧にリセットするように設定された、請求項1に記載のピクセル。
- 第1の基板の一部分において、フォトダイオード、浮遊拡散ポイント、および前記フォトダイオードと前記浮遊拡散ポイントとの間のトランジスタを備えたピクセルを動作させるための方法であって、前記方法が、
露出段階中に前記フォトダイオードに入射した光の強度がしきい値強度を超えたことに応答して、前記フォトダイオードから前記浮遊拡散ポイントに電荷を転送するために、前記露出段階において前記トランジスタのゲートに、前記トランジスタのターンオフ電圧と前記トランジスタのターンオン電圧との間の中間電圧を印加することと、
前記フォトダイオードから前記浮遊拡散ポイントに電荷を転送するために、前記露出段階の後の検知段階において前記トランジスタの前記ゲートにターンオン電圧を印加することと、
を含み、
前記ピクセルは、前記浮遊拡散ポイントに接続された入力端子、および信号電圧を出力するためにピクセルレベル相互接続に接続された出力端子を有する増幅器をさらに備え、かつ
前記ピクセルは、第2の基板において、前記ピクセルレベル相互接続に接続された入力端子を有するアナログデジタル変換器(ADC)を備え、
前記方法は、
前記ADCが、前記露出段階中、前記中間電圧が前記トランジスタの前記ゲートに印加されたときに前記ピクセルレベル相互接続における前記信号電圧の上昇または低下のレートを決定することと、
前記ADCが、前記検知段階中、前記ターンオン電圧が前記トランジスタの前記ゲートに印加されたときに前記ピクセルレベル相互接続における前記信号電圧を決定することと、
をさらに含む、方法。 - 前記方法は、
前記ピクセルレベル相互接続によって、前記第1の基板から第2の基板に前記信号電圧を送信することであって、前記信号電圧が、前記浮遊拡散ポイントにおける電圧の増幅されたバージョンを表す、前記信号電圧を送信すること
をさらに含む、請求項9に記載の方法。 - 前記信号電圧の上昇または低下の前記レートは、前記信号電圧が第1のしきい値に達する第1の時間と、前記信号電圧が、前記第1のしきい値とは異なる第2のしきい値に達する第2の時間との間の時間差を決定することによって検出される、請求項9に記載の方法。
- 前記時間差は、
前記第2の基板中の比較器によって、前記信号電圧が第1の基準電圧に対応する第1の時間における第1の出力を生成することと、
前記第1の時間において前記第1の出力を前記比較器からカウンタに送信することと、
前記比較器によって、前記信号電圧が、前記第1の基準電圧よりも高い第2の基準電圧に対応する第2の時間における第2の出力を生成することと、
前記第2の時間において前記第2の出力を前記比較器から前記カウンタに送信することと、
前記カウンタによって、前記第1の時間と前記第2の時間との間のクロックパルスの数を計数することと
によって決定される、請求項11に記載の方法。 - 前記方法が、
前記露出段階の後に第1のリセットトランジスタをオンにしたことに応答して、前記浮遊拡散ポイントにおける電圧をリセットすること
をさらに含む、請求項9に記載の方法。 - 前記検知段階の一部中に、前記第2の基板内の電流源のゲートにバイアス電圧を印加すること
をさらに含み、前記電流源は、前記ピクセルレベル相互接続に結合される、請求項9に記載の方法。 - 前記検知段階の後に前記浮遊拡散ポイントをリセットすること
をさらに含む、請求項9に記載の方法。 - 前記検知段階中に、変動する基準電圧の電圧レベルが前記信号電圧の電圧レベルと一致する時間を検出することをさらに含み、前記基準電圧が、最小予想信号電圧値から最大信号電圧値まで掃引するランプ信号である、請求項9に記載の方法。
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- 2018-08-09 KR KR1020207005921A patent/KR20200033318A/ko not_active Ceased
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- 2018-08-09 CN CN201880056211.3A patent/CN111033193B/zh active Active
- 2018-08-17 TW TW107128759A patent/TWI803506B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
KR20200033318A (ko) | 2020-03-27 |
US20200217714A1 (en) | 2020-07-09 |
TW201920909A (zh) | 2019-06-01 |
WO2019036280A1 (en) | 2019-02-21 |
CN111033193B (zh) | 2022-03-29 |
CN111033193A (zh) | 2020-04-17 |
US20190056264A1 (en) | 2019-02-21 |
JP2020532165A (ja) | 2020-11-05 |
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US11927475B2 (en) | 2024-03-12 |
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