JP6249650B2 - Method for correcting pitch, component mounting apparatus, and component mounting system - Google Patents

Description

The present invention relates to a method for correcting a pitch in a process of extracting an arbitrary component from a tray in which components are accommodated in cavities arranged at a predetermined pitch, a component mounting apparatus for extracting a component using the method of correcting the pitch , and The present invention relates to a component mounting system.

  Conventionally, a tape feeder, a tray feeder, a bulk feeder, or the like is known as a feeder that supplies components to a component mounting apparatus. Among these, for example, the tray of the tray feeder has cavities formed in a matrix shape (a grid pattern) at a predetermined pitch in a rectangular tray in plan view, and a package such as a QFP (Quad Flatpack Package) in each cavity. Some of them house electronic mold parts (for example, Patent Document 1). The component mounting apparatus disclosed in Patent Document 1 moves a head having a suction nozzle to suck and take out an electronic component in a cavity by the suction nozzle, and transports and mounts the electronic component to a predetermined coordinate position on a circuit board.

  Here, the tray of the tray feeder may vary in the overall position of the area where the cavity occupies the tray, the pitch of the cavity, and the like due to accuracy in the manufacturing process. Therefore, even if the component mounting device performs processing based on position information set in advance according to the model number of the tray, etc., the position where the suction nozzle sucks the electronic component may be greatly shifted, causing problems such as suction failure Occurs. In order to cope with such a problem, in the component mounting apparatus disclosed in Patent Document 1, a controller that controls the head is provided with positional information (in the literature, component arrangement information) of each cavity in the tray in advance. After the electronic component is picked up, the amount of displacement of the picked-up position is detected from the picked-up state of the electronic component picked up by the parts camera, and the position information of the other cavities is corrected according to the amount of deviation.

Japanese Patent Laying-Open No. 2008-10594 (FIG. 5)

  However, in the component mounting apparatus disclosed in Patent Document 1, in order to correct the position information of the cavities, various amounts such as displacement amounts are associated with the coordinate positions in the X-axis direction and the Y-axis direction for each of the cavities in the tray. It is necessary to have data. For this reason, as the number of electronic components accommodated in the tray, the type of tray to be handled, and the like increase, the amount of data that the component mounting apparatus should have in the process of correcting the cavity position information may increase. It becomes a problem.

The present invention has been made in view of the above-described problems. By correcting the pitch in the process of taking out a part from the cavity of the tray, the part can be taken out with high accuracy, and the amount of data to be retained during the taking out operation can be reduced. It is an object of the present invention to provide a method for correcting a pitch that can be achieved, a component mounting apparatus, and a component mounting system.

Method of correcting the pitch of the technology disclosed herein is a method of correcting the pitch in the process of taking out by sequentially component take-out device from the cavity of the tray cavities at a predetermined pitch is disposed along the first direction A step of taking out the nth part (n ≧ 2) from the cavity and detecting the amount of deviation of the removed part in the first direction in the takeout device as the pitch deviation amount; and the (n + 1) th part Upon taking out, it possesses a step of correcting the pitch based on the pitch shift amount, a step of correcting the pitch, (n + 1) -th Upon taking out parts, using a pitch shift amount of the component taken out to the n-th Then, the corrected pitch is calculated based on the following equation: (Pitch after correction) = (Pitch before correction) + (Pitch deviation amount / n) .

In addition, the component mounting apparatus according to the technique disclosed in the present application includes an extraction apparatus that sequentially extracts components from a cavity of a tray in which cavities are arranged at a predetermined pitch along the first direction, and mounts the components on a circuit board. When taking out a part to be taken out (integer of n ≧ 2) from the cavity and detecting a deviation amount in the first direction in the take-out device of the taken out part as a pitch deviation amount, and taking out the (n + 1) th part, It possesses a correction means for correcting the pitch based on the pitch shift amount, and correction means, the pitch of the corrected using pitch deviation amounts of components Upon, taken out n-th retrieve the (n + 1) th component The calculation is based on the following equation: (Pitch after correction) = (Pitch before correction) + (Pitch deviation amount / n)) .

Further, in the component mounting system according to the technique disclosed in the present application, a plurality of component mounting apparatuses are connected. This component mounting apparatus takes out components from a tray cavity in which cavities are arranged at a predetermined pitch along a first direction, and then mounts the components on a circuit board, and takes them out nth (n ≧ 2). Taking out the part from the cavity and detecting the amount of deviation in the first direction in the take-out device of the removed part as a pitch deviation amount, and correcting the pitch based on the pitch deviation amount when taking out the (n + 1) th part And a correcting means. When taking out the (n + 1) -th component, the correction means uses the pitch deviation amount of the n-th component to calculate the corrected pitch as follows: (Pitch after correction) = (Pitch before correction) + ( Calculation is based on pitch deviation / n)). The component mounting system includes a general control device that stores data related to the pitch in accordance with the type of the tray and transmits the data related to the pitch to each of the component mounting devices.

According to the technology disclosed in the present application, accurately retrieve parts from the tray cavity by correcting the pitch in the process of taking out the parts, and a pitch that can be taken out aim to reduce the amount of data to be held during the working A correction method, a component mounting apparatus, and a component mounting system can be provided.

The schematic diagram which shows the electronic circuit assembly line of the electronic component mounting system containing the mounting work machine which is an Example of this invention. The figure which shows the mounting work machine shown in FIG. 1 in the viewpoint from upper direction. Side surface sectional drawing of the mounting work machine shown in FIG. The block diagram of the electronic component mounting system shown in FIG. The figure which shows the components tray mounted on the support plate. The figure which shows the positional information data memorize | stored in the memory of a controller. The schematic diagram for demonstrating the arrangement | sequence of the cavity of a component tray, and an electronic component. 5 is a flowchart for explaining correction processing of position information data by an image processing unit. The schematic diagram for comparing the position of the electronic component in a cavity, and an adsorption position.

  FIG. 1 shows an electronic component mounting system (hereinafter sometimes abbreviated as “mounting system”) 10 according to an embodiment of the present invention. The mounting system 10 includes an electronic circuit assembly line in which a plurality of mounting work machines 12 are drivingly connected to each other, and each of the mounting work machines 12 includes an individual control device 14. The mounting system 10 is controlled by a control system including an individual control device 14 of each mounting work machine 12 and an overall control device 16 that controls the individual control device 14 in an integrated manner. In each of the mounting work machines 12, the individual control device 14 is connected to the overall control device 16 via the communication cable 20, and information and commands can be transmitted to and received from the overall control device 16.

  Each of the mounting work machines 12 performs mounting work of the electronic component P (see FIG. 5) on the circuit board 22, and as shown in FIG. 2, a transport device 24, a work head 26, and a moving device. 28 and a pair of supply devices 30 and 32. The transport device 24 has a pair of guide rails 34 provided in parallel on the base 33, and a conveyor belt (not shown) stretched to the side of the pair of guide rails 34. The circuit board 22 supported by the guide rail 34 is transported by rotating the circuit board. In addition, the transport device 24 is provided with a lifting platform 39 at a predetermined position, and the lifting device 39 is lifted by an air cylinder so as to be provided above each of the lifting platform 39 and the pair of guide rails 34. The circuit board 22 is sandwiched and fixed between the collar (not shown). In this embodiment, the transport direction of the circuit board 22 by the transport device 24 (the left-right direction in FIG. 2) is the X-axis direction, and the direction parallel to the substrate plane of the circuit board 22 to be transported is perpendicular to the X-axis direction. This will be described as the Y-axis direction.

  The work head 26 mounts the electronic component P (see FIG. 5) on the circuit board 22 held by the transport device 24, and has a suction nozzle 40 that sucks the electronic component P on the lower surface. The suction nozzle 40 communicates with negative pressure air and a positive pressure air passage via an electromagnetic control valve of a positive / negative pressure supply device 42 (see FIG. 4), and sucks and holds the electronic component P at a negative pressure. The structure is such that the held electronic component P is detached by supplying pressure. Further, the working head 26 includes a nozzle lifting device 44 (see FIG. 4) that lifts and lowers the suction nozzle 40 and a nozzle rotation device 46 (see FIG. 4) that rotates the suction nozzle 40 about its axis. The vertical position of the electronic component P to be held and the holding posture of the electronic component P can be changed.

  The work head 26 can be moved to an arbitrary position on the base 33 by the moving device 28. More specifically, the moving device 28 includes an X-axis direction slide mechanism 50 for moving the work head 26 in the X-axis direction, and a Y-axis direction slide mechanism 52 for moving the work head 26 in the Y-axis direction. ing. The X-axis direction slide mechanism 50 has an X-axis slider 54 provided on the base 33 so as to be movable in the X-axis direction, and an electromagnetic motor 56 (see FIG. 4). 54 is movable to an arbitrary position in the X-axis direction. The Y-axis direction slide mechanism 52 includes a Y-axis slider 58 provided so as to be movable in the Y-axis direction, and an electromagnetic motor 60 (see FIG. 4). The Y-axis slider 58 is attached to a pair of guide rails 59 provided on the side surface of the X-axis slider 54 and is moved to an arbitrary position in the Y-axis direction when the electromagnetic motor 60 is driven. The work head 26 is attached to the Y-axis slider 58, so that the work head 26 can be moved to an arbitrary position on the base 33 by the moving device 28.

  The supply devices 30 and 32 are connected to both sides of the base 33 in the Y-axis direction so as to sandwich the transport device 24. The supply device 30 is a tape feeder type supply device, and has a plurality of tape feeders 70 for feeding taped electronic components P one by one, and supplies the electronic components P to the supply position to the work head 26. It is structured. The supply device 32 is a tray feeder type supply device, and a support plate 74 is detachably supported by a slider (not shown) fitted to a pair of guide rails 72 provided along the Y-axis direction. A plurality of component trays 76 are supported by the support plate 74. Each of the component trays 76 accommodates a plurality of electronic components P. The supply device 32 drives the slider drive unit 78 (see FIG. 4) to move the slider along the Y-axis direction, thereby moving the support plate 74 mounted on the slider to the supply position or the retraction position of the electronic component P. Move. The configuration of the supply device 32 is merely an example, and a configuration in which a plurality of support plates 74 are provided and the support plate 74 (component tray 76) used by the lifting device or the like is switched may be used.

  Further, the mounting work machine 12 is provided with a mark camera 80 and a parts camera 82 (see FIG. 3). The mark camera 80 is fixed to the lower surface of the Y-axis slider 58 so as to face downward, and is moved by the moving device 28 so that the surface of the circuit board 22 can be imaged at an arbitrary position. ing.

  Further, as shown in FIGS. 2 and 3, reflecting mirrors 83A and 83B are fixed to the X-axis slider 54 by a casing (not shown). The reflecting mirror 83A is inclined about 45 degrees with respect to a vertical plane including the center line of the suction nozzle 40 just below the movement path of the working head 26 in the Y-axis direction, and an end portion on the side close to the X-axis slider 54 is formed. It has a reflective surface located below. The reflecting mirror 83B is inclined symmetrically with respect to the reflecting surface of the reflecting mirror 83A on the opposite side of the X-axis slider 54 and the end close to the X-axis slider 54 is positioned below. Has a reflective surface. These reflecting mirrors 83A and 83B are positioned above the ball screw 81 for moving the X-axis slider 54, and between the supply device 30 and the circuit board 22 and between the supply device 32 and the circuit board 22. Is provided. The outer surface of the reflecting surface of the reflecting mirror 83A is subjected to a half mirror process, so that most of the light emitted from the work head 26 side is reflected while the light emitted from below is transmitted.

  A parts camera 82 that images the electronic component P held by the work head 26 is fixed to the X-axis slider 54 at a position opposite to the work head 26 and above the reflecting mirror 83B. The parts camera 82 is a CCD camera, for example, and images the electronic component P reflected by the reflecting mirrors 83A and 83B. The working head 26 is provided with a backlight 85A that forms a bright background of the electronic component P sucked and held by the suction nozzle 40. In addition, the X-axis slider 54 is provided with a front light 85B used when taking a surface image of the electronic component P under the reflecting mirror 83A. Light that forms a silhouette image of the electronic component P with the backlight 85A as a bright background or light that forms an image of the surface of the electronic component P illuminated by the front light 85B is reflected by the reflecting mirrors 83A and 83B. Reflected upward toward the parts camera 82.

  As shown in FIG. 4, the individual control device 14 of the mounting work machine 12 includes a controller 86 mainly composed of a computer having a CPU, a ROM, a RAM and the like, a transport device 24, the electromagnetic motors 56 and 60, and positive / negative pressure supply. The apparatus 42, the nozzle raising / lowering apparatus 44, the nozzle rotation apparatus 46, the tape feeder 70, and the several drive circuit 88 corresponding to each of the slider drive part 78 are provided. The controller 86 can control the operations of the transport device 24, the moving device 28, and the like via each drive circuit 88. The controller 86 also includes an image processing unit 84 that processes image data captured by the mark camera 80 and the part camera 82. The image processing unit 84 processes image data obtained by the mark camera 80 and detects information related to the circuit board 22. Further, the image processing unit 84 detects an error in the holding position of the electronic component P by the suction nozzle 40 based on the processing result of the image data obtained by the parts camera 82 and the position information data stored in the memory 90. Execute corrections. Further, the controller 86 is connected to the overall control device 16, and a detection result, a command, and the like are transmitted to and received from the overall control device 16. The overall control device 16 includes a display device 89 such as a touch panel, and can display various information and can be confirmed by an operator.

  The mounting work machine 12 having the above-described configuration performs the mounting operation of the electronic component P by the work head 26 on the circuit board 22 held by the transport device 24. Specifically, in the individual control device 14 of the mounting work machine 12, first, the controller 86 drives and controls the transport device 24 via the drive circuit 88 to transport the circuit board 22 to the mounting work position. The circuit board 22 is fixedly held. Next, the controller 86 drives the moving device 28 via the drive circuit 88, moves the work head 26 onto the circuit board 22, and images the circuit board 22 with the mark camera 80. The image processing unit 84 detects the type of the circuit board 22 and the holding position error of the circuit board 22 by the transport device 24 from the image data captured by the mark camera 80. The controller 86 drives the supply devices 30 and 32 having the electronic component P corresponding to the type of the circuit board 22 detected by the image processing unit 84, and causes the work head 26 to move to the supply position of the electronic component P. The work head 26 changes the vertical position of the suction nozzle 40 based on the control from the controller 86 and sucks and holds the electronic component P by the suction nozzle 40. The controller 86 moves the work head 26 holding the electronic component P from the supply position of the electronic component P to the mounting position of the circuit board 22 on which the electronic component P is mounted by the moving device 28. At this time, the work head 26 passes above the reflecting mirror 83A (see FIGS. 2 and 3) provided at a position between the supply position and the mounting position. The controller 86 images the electronic component P by the parts camera 82 fixed on the reflecting mirror 83B when the work head 26 passes over the reflecting mirror 83A. The image processing unit 84 detects an error in the holding position of the electronic component P from the image data captured by the parts camera 82. Then, the controller 86 moves the work head 26 to the mounting position on the circuit board 22 and rotates the suction nozzle 40 based on the error between the holding positions of the circuit board 22 and the electronic component P. Mounted on the substrate 22.

  Here, the image processing unit 84 of the present embodiment performs a process of correcting the position information data of the electronic component P to be taken out next time based on the error of the holding position of the electronic component P detected from the image data of the parts camera 82. Run. Below, the process which correct | amends the positional information data of the electronic component P which the tray type supply apparatus 32 supplies by the image process part 84 is demonstrated.

(About the structure of the support plate 74 and the component tray 76)
As shown in FIG. 2, the support plate 74 of the tray type supply device 32 has a rectangular shape in a plan view in which the X-axis direction is the longitudinal direction, and various large and small component trays 76 are horizontal on the support plate 74. It is placed in. As shown in FIG. 5, the support plate 74 is surrounded on four sides by the guide bar 100, and a plurality of component trays 76 are arranged along the X-axis direction inside the guide bar 100. FIG. 5 is a view showing the component tray 76 placed on the support plate 74, and the upper side in the figure is the main body side connected to the base 33 (see FIG. 2). The component tray 76 has a rectangular shape in plan view, and is formed in a size corresponding to the number of electronic components P to be accommodated. The component tray 76 is positioned by an L-shaped positioning member 102 provided on the support plate 74. The support plate 74 has a surface layer portion including a support surface on which the component tray 76 is placed, for example, made of a magnetic material, and the L-shaped positioning member 102 in which a permanent magnet is embedded is detachably fixed at an arbitrary position. . The L-shaped positioning member 102 is positioned in a state where one side of the L-shaped positioning member 102 is in close contact with the guide bar 100 on one side (the upper side in the illustrated example) with respect to the Y-axis direction on the support plate 74. Further, the upper (main body side) guide bar 100 in FIG. 5 is provided with a scale 104 along the X-axis direction. The operator determines the position in the X-axis direction while confirming the numerical value instructed from the mounting work machine 12 on the scale 104, for example, and attaches the L-shaped positioning member 102. Further, after attaching the L-shaped positioning member 102 to the support plate 74, the operator supports the component tray 76 on the support plate 74. The operator positions the two sides of the component tray 76 that are orthogonal to the L-shaped positioning member 102, and positions and fixes the other side of the component tray 76 with the restraining member 107 in which the permanent magnet is embedded.

  The component tray 76 has a plurality of recessed cavities 201 formed at a predetermined pitch along the X-axis direction and the Y-axis direction, and the cavities 201 are formed in a matrix. Each of the cavities 201 accommodates an electronic component P and is supported in a state where the accommodated electronic components P are arranged on the same plane by a component tray 76. The shape and dimensions of the component tray 76, the number of electronic components P that can be accommodated, and the like are appropriately changed. The electronic component P is, for example, a component that forms an electronic circuit, and is a package-type electronic component such as a QFP (Quad Flatpack Package).

(About the image processing unit 84)
As shown in FIG. 4, the image processing unit 84 includes a calculation unit 92 and a correction unit 93. The calculating means 92 calculates the error of the holding position of the electronic component P from the image data captured by the parts camera 82 after the suction nozzle 40 of the work head 26 sucks the electronic component P. The correction unit 93 corrects the position information data stored in the memory 90 based on the calculation result of the calculation unit 92. The calculation unit 92 and the correction unit 93 may be realized by software such as a program executed on the CPU of the image processing unit 84, or may be configured by hardware as a dedicated processing circuit. The memory 90 stores position information data related to the electronic component P. For example, position information data 300 shown in FIG. 6 is stored for each of the X-axis direction and the Y-axis direction. The position information Sx and Sy is position information related to the cavity 201 of the electronic component P that is first taken out from the component tray 76. The coordinate positions Nx and Ny are coordinate positions in the X-axis direction and the Y-axis direction of the cavity 201 of the electronic component P to be extracted next. The pitches Px and Py are distances between the centers of adjacent cavities 201 in each of the X-axis direction and the Y-axis direction. The number of parts Ex, Ey is the number of electronic parts P (cavities 201) accommodated in a line along each of the X-axis direction and the Y-axis direction of the part tray 76. For example, as shown in FIG. 7, the position information data 300 includes the cavity 201 of the component tray 76 and the electronic components P accommodated in the cavity 201 along the X-axis direction and Ex pieces at a pitch Px along the Y-axis direction. It represents that only Ey pieces are arranged at the pitch Py.

(About correction processing)
Next, position information data correction processing by the image processing unit 84 will be described.
First, as shown in FIG. 7, the component tray 76 is positioned by the L-shaped positioning member 102 at two sides including the upper left corner in the drawing. The controller 86 of the mounting work machine 12 controls the work head 26 so that the electronic components P shown in FIG. 7 are sequentially taken out from the top to the bottom ((1, 1) to (1, Ey)). To do. Further, the controller 86 controls to take out the electronic components P in other rows adjacent in the X-axis direction in the same order when one row along the Y-axis direction is completed, and from left to right ((1 , 1) to (Ex, 1)). In the L-shaped positioning member 102, a first reference mark 109 is formed at a corner portion where two L-shaped sides intersect, and a second reference mark 110 is formed at a tip portion of the side along the Y-axis direction. The operator attaches the L-shaped positioning member 102 based on the numerical value instructed from the mounting work machine 12, and then sets the value of the scale 104 (see FIG. 5) of the actually installed position to the operating means of the mounting work machine 12. Input (not shown). When the mounting operation is started and the first reference mark 109 is detected, the controller 86 sets the first reference mark 109 by the mark camera 80 based on the information on the mounting position of the L-shaped positioning member 102 input by the operator. Take an image. Further, the controller 86 images the second reference mark 110 based on the position obtained from the mounting position information input by the operator and the design dimensions of the L-shaped positioning member 102. The computing means 92 of the image processing unit 84 detects the position of each mark from the image data of the first and second reference marks 109 and 110 captured by the mark camera 80. When there are a plurality of component trays 76 (L-shaped positioning members 102), the mounting work machine 12 images the first and second reference marks 109 and 110 for each of the L-shaped positioning members 102.

  In the mounting system 10 of this embodiment, the overall control device 16 (see FIGS. 1 and 4) uses the initial value of the position information data 300 shown in FIG. 6 as the model number, ID, and type of the electronic component P of the component tray 76. The position information data 300 necessary for each mounting work machine 12 is centrally managed. For example, the overall control device 16 manages the production of circuit boards 22 of different board types for each production job, and transmits the position information data 300 to each of the mounting work machines 12 according to each production job. The controller 86 of each mounting work machine 12 stores the position information data 300 received from the overall control device 16 in the memory 90. The controller 86 images the component tray 76 by the mark camera 80 as the first and second reference marks 109 and 110 are imaged. The image processing unit 84 of the controller 86 detects the model number of the component tray 76 based on the image data of the component tray 76 captured by the mark camera 80. The controller 86 determines the consistency between the information such as the model number detected by the image processing unit 84 and the position information data 300 stored in the memory 90. When the model numbers and the like match, the controller 86 performs the mounting operation while referring to and correcting the position information data 300 stored in the memory 90. Further, the overall control device 16 receives, for example, the position information data 300 corrected by the mounting work machines 12 in the mounting work, and updates the held position information data 300 for each model number of the component tray 76. Note that the controller 86 may be configured to notify an operator of an error and prompt confirmation work when the position information data 300 does not match the information such as the model number detected by the image processing unit 84. The information such as the model number of the component tray 76 may be previously input by the worker from the mounting work machine 12 or the like.

  In step S1 shown in FIG. 8, the controller 86 uses the positions of the first and second reference marks 109 and 110 detected by the calculation unit 92 of the image processing unit 84 as a reference for the position information of the position information data 300 (see FIG. 6). Based on Sx and Sy, the operations of the working head 26 and the suction nozzle 40 are controlled so as to take out the electronic component P of the first cavity 201 ((1, 1) in FIG. 7).

  In step 2, the controller 86 moves the reflecting head 83A when moving the work head 26 from the position of the first cavity 201 to the mounting position of the circuit board 22, and the electronic component sucked and held by the suction nozzle 40. P is imaged by the parts camera 82. The calculation unit 92 calculates the amount of deviation of the center of the electronic component P from the center of the suction nozzle 40 from the image data captured by the parts camera 82 in each of the X-axis direction and the Y-axis direction. The correction means 93 corrects the position information Sx, Sy based on the holding position deviation amount (ΔX, ΔY) detected by the calculation means 92 and updates the data.

  Here, in the component tray 76, the overall position of the cavity 201 and the pitches Px and Py may vary for each component tray 76 due to the accuracy in the manufacturing process. For example, the component trays 76A and 76B shown in FIG. 9 have the same outer size and the number of formed cavities 201 in plan view. However, as compared with the component tray 76B, the component tray 76A has a region where the cavity 201 is formed spreading on both sides in the Y-axis direction (up and down in the drawing). Therefore, the distance Ly between the outermost cavity 201 in the Y-axis direction (located on the outermost side in the vertical direction in the drawing) and the end in the Y-axis direction of each of the component trays 76A and 76B is larger than that of the component tray 76B. The component tray 76A is short. Further, the distance L2y between the ends of the cavities 201 in the Y-axis direction is longer for the component tray 76A than for the component tray 76B. For this reason, the pitch Py of the cavities 201 of the component tray 76A is larger than that of the component tray 76B. Similarly, in the X-axis direction, the distance Lx between the outermost cavity 201 and the end is shorter in the component tray 76A than in the component tray 76B. Further, the distance L2x (pitch Px) between the end portions of the cavities 201 is longer in the component tray 76A than in the component tray 76B. The difference between the distances Lx and Ly and the distances L2x and L2y (pitch Px and Py) is that the component trays 76A and 76B conform to the standard in which the size of the outer shape and the number of cavities 201 are the same. However, differences may occur due to different manufacturers. Therefore, even if the mounting work machine 12 performs the processing based on the pitches Px and Py set in advance according to the model numbers of the component trays 76A and 76B, the position where the suction nozzle 40 sucks the electronic component P is shifted. There is a case.

  A black circle “●” in FIG. 9 indicates a position where the suction nozzle 40 sucks the electronic component P, and an alternate long and short dash line indicates a position where the electronic component P of the component tray 76B is sucked. When the electronic component P of the component tray 76A is taken out without being corrected without correcting the position where the electronic component P of the component tray 76B is taken out, it is along the Y-axis direction as shown by comparison with a dashed line (FIG. The position where the electronic components P are taken out in order (from the top to the bottom) gradually shifts, causing a problem that the electronic components P cannot be sucked. For this reason, the controller 86 of this embodiment first corrects the position information Sx and Sy using the displacement detected by sucking the first electronic component P, thereby occupying the area occupied by the electronic component P in the component tray 76. To correct the overall position shift.

When the next electronic component P is supplied, the controller 86 performs a process of taking out the second electronic component P (the components (1, 2) shown in FIG. 7). In step S3 of FIG. 8, the calculation means 92 of the image processing unit 84 corresponds to the position information Sx, Sy corrected by the shift amount of the electronic component P first taken out in step S2, and the model number of the component tray 76 in advance. Using the pitches Px and Py set in this way, position information X and Y in the X-axis direction and Y-axis direction of the electronic component P to be taken out second and later are calculated by the following equations (1) and (2).
Position information X = Sx + Px × (Nx−1) (Equation 1)
Position information Y = Sy + Py × (Ny−1) (Equation 2)
The coordinate positions Nx and Ny shown in FIG. 6 are set to (1, 2) as initial values. In addition, the calculation means 92 reads out the initial values of the pitches Px and Py of the position information data 300 received from the overall control device 16 from the memory 90 and processes them. The controller 86 controls the work head 26 to take out the second electronic component P based on the calculation result of the calculation means 92. In addition, the calculation unit 92 increments the coordinate position Ny and updates the coordinate positions Nx and Ny to values (1, 3) advanced by one in the Y-axis direction.

As described above, the position of the cavity 201 differs not only in the overall position of each of the component trays 76 but also in the pitches Px and Py. For this reason, the controller 86 corrects the pitches Px and Py using the deviation amount detected by sucking the second and subsequent electronic components P.
In step S <b> 4, the calculation unit 92 shifts the center of the electronic component P in the Y-axis direction from the center of the suction nozzle 40 from the image data captured by the parts camera 82 with the suction nozzle 40 sucking the second electronic component P. Calculate the quantity. The correction unit 93 corrects the pitch Py by the following equation (4) using the shift amount of the holding position detected by the calculation unit 92, in this case, the shift amount (ΔY) in the Y-axis direction. The expression (3) in the X-axis direction will be described later.
Corrected pitch Px = Uncorrected pitch Px + (deviation amount (ΔX) / (Nx−1)) (Equation 3)
Pitch after correction Py = Pitch Py before correction + (deviation amount (ΔY) / (Ny−1)) (Equation 4)
The image processing unit 84 takes out the second electronic component P based on the position information Sx and Sy corrected by taking out the first electronic component P, and uses the shift amount detected from the second and subsequent electronic components P to make a pitch. Correct Py. Accordingly, as shown by a black circle “●” on the component tray 76A in FIG. 9, the error of the position where the suction nozzle 40 sucks the electronic component P taken out after the third is corrected, and the electronic component P is accurately picked up. Can do.

  Next, in step S5, the computing means 92 compares the coordinate position Ny with the value of (number of parts Ey + 1), and if the coordinate position Ny is small, repeats the processing of step S3 and step S4. The calculation means 92 and the correction means 93 correct the pitch Py by the above formula (4) using the deviation amount (ΔY) detected every time the electronic component P is taken out.

  As described above, the calculation unit 92 uses the position information Sx, Sy, the pitches Px, Py, and the coordinate positions Nx, Ny as shown in the above formulas (1), (2). Calculate the position. On the other hand, the correction means 93 corrects the pitches Px and Py using the detected deviation amounts (ΔX, ΔY) and the coordinate positions Nx, Ny as shown in (3) and (4) above. As a result, it is possible to perform both the extraction position calculation processing by the calculation unit 92 and the pitch Px and Py correction processing by the correction unit 93, while saving in the memory 90 as compared with the technique disclosed in Patent Document 1 described above. The amount of necessary data to be reduced is greatly reduced (see FIG. 6).

  Here, as shown in FIG. 7, an extremely small gap 203 is provided between the inner wall of the cavity 201 and the outer peripheral portion of the electronic component P for the purpose of facilitating removal of the electronic component P by the suction nozzle 40. Is provided. For this reason, the position of the center of the electronic component P may be shifted from the position of the center of the cavity 201 by the size of the gap 203, and the position of the electronic component P in each cavity 201 is different from each other. The amount of deviation caused by the gap 203 is included in the amount of deviation (ΔX, ΔY) between the extracted electronic component P and the suction nozzle 40, and is included in the corrected pitches Px, Py. When a relatively small electronic component P is handled, the gap 203 becomes relatively large with respect to the electronic component P, and the influence of the errors in the pitches Px and Py generated by the gap 203 becomes large. Proper treatment is preferred. For this reason, the correction means 93 corrects the pitches Px and Py each time the electronic component P is taken out, thereby averaging the deviation due to the gap 203.

  More specifically, as shown in the above formulas (1) and (2), the calculation unit 92 multiplies the position of the electronic component P to be extracted next by the pitch Px and the coordinate position Nx or the pitch Py and the coordinate position Ny. It calculates by. That is, the calculation unit 92 executes a process of multiplying the pitches Px and Py including the deviation amount generated by the gap 203. On the other hand, the correction means 93 corrects the pitches Px and Py using a value obtained by dividing the detected shift amount (ΔX, ΔY) by the coordinate positions Nx, Ny as shown in the above equation (4). As a result, the pitch Py is corrected by using the shift amount of each of the electronic components P arranged along the Y-axis direction of the component tray 76, whereby the gap 203 between the electronic components P arranged in the same row is used. The deviation amount can be averaged and reflected on the pitch Py. That is, the pitch Py after taking out all of the electronic components P in the same row while repeating the correction process for an arbitrary row along the Y-axis direction using the above formulas (1), (2), and (4) is: The amount of deviation due to the gap 203 is an averaged value. Accordingly, the image processing unit 84 takes the first row (parts (1, 1) to (1, Ex)) of the part tray 76 shown in FIG. 7 and averages the pitch Py in the other Y-axis directions. By applying it to the extraction of the electronic components P in the line along the line (such as the line along each Y-axis direction from (2, 1) to (Ex, 1)), the correction process is repeatedly performed in the process after the second line. Thus, the electronic component P can be accurately adsorbed without being performed. In this case, in the process after the second column in the X-axis direction, which will be described later, the process of correcting the pitch Py in step S4 is omitted.

  In addition, the image processing unit 84 performs the same processing as the processing in the Y-axis direction described above also in the X-axis direction. When the coordinate position Ny is larger than (the number of parts Ey + 1) in step S5, the calculation unit 92 is an electronic part in the first row (parts (1, 1) to (1, Ex)) of the part tray 76. When the extraction of P is completed, the coordinate position Ny is set to “1”, the coordinate position Nx is incremented, and the coordinates of the first cavity 201 in the next row are added to the coordinate positions Nx, Ny (in this case, ( 2, 1)) is set (step 6).

  Next, in step S7, the calculation means 92 calculates the position information X, Y in the X-axis direction and the Y-axis direction of the electronic component P to be taken out using the above formulas (1), (2). The controller 86 controls the work head 26 so as to take out the electronic component P of the first cavity 201 in the second row based on the calculation result of the calculation means 92. The computing means 92 updates the coordinate positions Nx and Ny to values (2, 2) advanced by one in the Y-axis direction.

  In step S7, the calculation unit 92 uses the electronic data for the suction nozzle 40 based on the image data captured by the parts camera 82 to indicate that the suction nozzle 40 has sucked the first (2,1) electronic component P in the second row. A deviation amount (ΔX) of P in the X-axis direction is calculated. The correcting unit 93 corrects the pitch Px using the amount of deviation calculated by the calculating unit 92, in this case, the amount of deviation (ΔX) in the X-axis direction and the above equation (3). The process of correcting the pitch Px in step S7 is performed by electrons in the first cavities 201 ((1, 1), (2, 1)... (Ex, 1)) in each row along the Y-axis direction. It is executed at the timing when the component P is taken out.

  Next, in step S8, the computing unit 92 compares the coordinate position Nx with (the number of parts Ex + 1), and when the coordinate position Nx is small, repeats the processing from step S3 to step S7. In this manner, the mounting work machine 12 executes a process of sequentially taking out the electronic component P at coordinates (1, 1) to (Ex, Ey) while repeating the process of correcting the pitches Px and Py.

As mentioned above, according to this embodiment mentioned above, there exist the following effects.
<Effect 1> The computing means 92 included in the controller 86 uses the position information data 300 (position information Sx, Sy, pitch Px, Py, coordinate position Nx, Ny) stored in the memory 90 to be extracted next. Is calculated (see equations (1) and (2)). In addition, the calculation unit 92 calculates the amount of deviation in the Y-axis direction of the center of the electronic component P with respect to the center of the suction nozzle 40 from the image data captured by the parts camera 82 in a state where the suction nozzle 40 sucks the second and subsequent electronic components P. Is calculated. The correcting means 93 of the controller 86 corrects the pitch Py using the deviation amount in the Y-axis direction detected by the calculating means 92 (see Expression (4)). In the controller 86 having such a configuration, an error in the position where the suction nozzle 40 picks up the electronic component P picked up after the third is corrected so that the electronic component P can be picked up accurately, and calculation processing of the pick-up position by the calculation means 92 is performed. In addition, the data amount of information to be stored in the memory 90 necessary for the correction processing of the pitches Px and Py by the correction unit 93 can be reduced.

<Effect 2> The controller 86 receives the initial values of the pitches Px and Py corresponding to the model number of the component tray 76 from the overall control device 16 and stores them in the memory 90. The calculation means 92 reads the initial values of the pitches Px and Py from the memory 90 and processes them, thereby calculating the position of the second electronic component P with high accuracy in accordance with the change in the type of the component tray 76 or the electronic component P. it can.
<Effect 3> The correction means 93 is set to correct the pitches Px and Py using the above equations (3) and (4), and can reduce the amount of data to be referred to in the correction processing.

  <Effect 4> The computing unit 92 computes the position of the electronic component P to be extracted next by multiplication using the pitches Px and Py including the shift amount generated by the gap 203 (see equations (1) and (2)). On the other hand, the correction means 93 corrects the pitches Px and Py using a value obtained by dividing the detected deviation amount (ΔX, ΔY) by the coordinate positions Nx, Ny. As a result, the pitch Py after taking out all of the electronic components P in the same row while repeating the correction process in an arbitrary row along the Y-axis direction is a value obtained by averaging the deviation amounts due to the gaps 203. The controller 86 takes out the first row (components (1, 1) to (1, Ex)) of the component tray 76 shown in FIG. 7 and averages the pitch Py along the other Y-axis direction ( By applying to the extraction of the electronic component P from (2, 1) to (Ex, 1) along each Y-axis direction), it is possible to perform the electronic process without repeatedly performing the correction process in the second and subsequent columns. The component P can be adsorbed accurately.

  <Effect 5> The controller 86 corrects the position information Sx, Sy by using the amount of displacement detected by sucking the electronic component P in the first cavity 201 in the component tray 76, so that the cavity in the component tray 76 is corrected. It is possible to correct the overall position shift of the area occupied by 201 (electronic component P).

  <Effect 6> The overall control device 16 has an initial value of the position information data 300 corresponding to the model number of the component tray 76. The overall control device 16 transmits the position information data 300 corresponding to the model number of the component tray 76 received from each of the mounting work machines 12 to each of the mounting work machines 12 in accordance with the mounting work. The controller 86 of the mounting work machine 12 stores the position information data 300 received from the overall control device 16 in the memory 90, and performs the mounting work while referring to and correcting the position information data 300. Further, the overall control device 16 receives the position information data 300 corrected by the mounting work machines 12 in the mounting work, and updates the held position information data 300 for each model number. In such a configuration, for example, when a component tray 76 having the same or a corresponding model number as that used in any mounting work machine 12 is used in another mounting work machine 12, the corrected position information data 300 (pitch Px, Py) can be used for processing. As a result, the mounting work machine 12 that uses the corrected position information data 300 can appropriately take out the electronic component P without performing the correction process.

In addition, this invention is not limited to the said embodiment, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art.
For example, the timing and the number of times of the correction process of the correction unit 93 of the above embodiment are examples, and may be changed as appropriate. For example, the correction unit 93 performs the process of correcting the pitch Py every time the electronic component P arranged along the Y-axis direction is taken out. However, the correction unit 93 in the second (coordinate (1, 2)) cavity 201 The setting may be such that the pitch Py is corrected only when the electronic component P is taken out.

In the above-described embodiment, the overall control device 16 centrally manages the position information data 300. However, each of the mounting work machines 12 may have the necessary position information data 300.
In the above embodiment, the position information data 300 is associated with the model number of the component tray 76, but may be associated with other information (ID, type of electronic component P).
In the above embodiment, the mounting work machine 12 may be configured to store a plurality of position information data 300 corresponding to each of the component trays 76 provided in the supply device 32 in the memory 90 of the controller 86.

  In the above embodiment, the mounting system 10 for mounting the electronic component P on the circuit board 22 has been described. However, the present application is not limited to this, and the present invention is applied to an automatic machine that operates in various other production lines. be able to. For example, in an automatic machine that performs assembly work such as a secondary battery (such as a solar battery or a fuel cell), the present invention may be applied to an apparatus in which each component is regularly arranged on a tray.

The correspondence with the terms in the claims is as follows.
The mounting system 10 is an example of a component mounting system, the mounting work machine 12 is an example of a component mounting device, the overall control device 16 is an example of an overall control device, and the circuit board 22 is an example of a circuit board. The head 26 and the suction nozzle 40 are examples of take-out devices, the component trays 76, 76A and 76B are examples of trays, the parts camera 82, the image processing unit 84, and the calculation means 92 are correction means as examples of detection means. 93 is an example of a correction unit, cavity 201 is an example of a cavity, position information data 300 including pitches Px and Py is an example of data, electronic component P is an example of electronic components, and pitches Px and Py are examples of electronic components. As an example of the pitch, the X-axis direction and the Y-axis direction are examples of the first and second directions.

DESCRIPTION OF SYMBOLS 10 mounting system, 12 mounting work machine, 16 integrated control apparatus, 22 circuit board, 26
Work head, 40 suction nozzle, 76, 76A, 76B parts tray, 82 parts camera, 92 calculation means, 93 correction means, 201 cavity, Px, Py pitch, 300 position information data, P electronic parts

Claims (7)

A method of correcting the pitch in a process of sequentially taking out components from the cavity of a tray in which cavities are arranged at a predetermined pitch along a first direction,
taking the n-th (n ≧ 2 integer) part to be taken out from the cavity, and detecting the amount of deviation of the removed part in the first direction in the take-out device as a pitch deviation amount;
A step of correcting the pitch based on the pitch deviation amount when taking out the (n + 1) -th component;
I have a,
The step of correcting the pitch includes:
When taking out the (n + 1) th part, the pitch after correction using the pitch deviation amount of the nth part taken out is expressed by the following equation:
(Pitch after correction) = (Pitch before correction) + (Pitch deviation / n)
A method for correcting a pitch , characterized in that the calculation is based on the above . The pitch is, how the initial value used for the process of taking out the second part, to correct the pitch according to claim 1, characterized in that it is set according to the type of the tray. In the tray, cavities are arranged in a matrix at a predetermined pitch along a second direction orthogonal to the first direction in addition to the first direction.
The part is taken out from the cavities in an arbitrary row arranged along the first direction, and arranged along the first direction based on the pitch corrected using the pitch deviation amount. how to correct the pitch of claim 1 or請 Motomeko 2 from the cavity of the column and having a step of taking out the parts. A take-out device that sequentially takes out components from the cavity of the tray in which the cavities are arranged at a predetermined pitch along the first direction and mounts it on a circuit board;
detecting means for taking out the part to be taken out n-th (n ≧ 2) from the cavity, and detecting a deviation amount of the removed part in the first direction in the take-out device as a pitch deviation amount;
Correction means for correcting the pitch based on the pitch deviation amount when taking out the (n + 1) -th component;
I have a,
The correction means includes
When taking out the (n + 1) th part, the pitch after correction using the pitch deviation amount of the nth part taken out is expressed by the following equation:
(Pitch after correction) = (Pitch before correction) + (Pitch deviation / n))
A component mounting apparatus that performs calculation based on the above . A component mounting system in which a plurality of the component mounting apparatuses according to claim 4 are connected,
A component mounting system comprising: an overall control device that stores data related to the pitch in accordance with a type of the tray and transmits the data related to the pitch to each of the component mounting devices.   A method of correcting the pitch in a process of sequentially taking out components from the cavity of a tray in which cavities are arranged at a predetermined pitch along a first direction,
  taking the n-th (n ≧ 2 integer) part to be taken out from the cavity, and detecting the amount of deviation of the removed part in the first direction in the take-out device as a pitch deviation amount;
  Correcting the pitch using the pitch deviation amount and the coordinate position of the cavity in the first direction when taking out the (n + 1) -th component;
A method for correcting a pitch, comprising:   The step of correcting the pitch includes:
  The pitch correction method according to claim 6, wherein the pitch is corrected using a value obtained by dividing the pitch deviation amount by the coordinate position.

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